CN205670880U - The circuit board through-hole construction that a kind of anti-plated film comes off - Google Patents

Abstract

The utility model discloses the circuit board through-hole construction that a kind of anti-plated film comes off, including substrate, substrate is provided with electronic component, substrate is respectively the solid lamella of upper half from top to bottom, core material layer and the solid lamella of lower half, upper semifastening sheet, all by teeth fastening structure and be tightly connected between lower both semifastening sheets and core material layer faying face, the front and back of substrate is equipped with copper foil layer, and the Facad structure of substrate and structure setting symmetrical above and below, through hole it is machined with on substrate, a circle elargol film is processed on each through hole inwall, the welding resisting layer sealing against connection also it is machined with at copper foil layer side, the peripheral cladding layer protective layer of elargol film, welding resisting layer that one end that is connected with copper foil layer is set to some isosceles trapezoidal structures, protective layer coincide with some isosceles trapezoidal structures of welding resisting layer and is connected；Wiring board through-hole construction is that intensity, hardness are high, moistureproof, with short production cycle, good heat dissipation effect without resources such as copper-plated double-clad board, low cost, three-waste free pollution, saving water power.

Description

The circuit board through-hole construction that a kind of anti-plated film comes off

Technical field

This utility model relates to the circuit board through-hole construction that a kind of anti-plated film comes off.

Background technology

Light, thin, short, littleization is progressively required so that printed board is towards high accuracy, graph thinning, high density along with electronic product SMT kludge meet the direction of environmental requirement and develop, printed board can be divided into reverse side, two-sided and multilamellar etc., the most two-sided and many Layer has a common ground, it is simply that both need conductor to connect its aspect, for carrying out the common process of interconnection of conductors between aspect, just Being each specified point elder generation punching in printed board or boring, then formation conductor layer around hole wall, this conductor layer will be Manufacture electrical contact between each layer and form loop.

The method forming interconnection in prior art is a lot, and such as lead-in wire welding, rivet, Direct Electroplating etc. is by conductive species It is plated in hole wall first-class, but the maximum shortcoming of these methods is exactly that manufacturing cost is expensive and the production cycle is long, and can produce more " three wastes " pollute, and process the environmental issue of three-waste pollution, and the weight of printed board can be increased so that printed board is inadequate Frivolous.

Additionally, the board structure intensity of prior art, hardness are not high enough, shock resistance, wear-resisting and humidity resistance is poor.

Utility model content

For the problem of above-mentioned existence, this utility model aims to provide the circuit board through-hole construction that a kind of anti-plated film comes off, This wiring board through-hole construction is without copper-plated double-clad board, and this elargol perforation plate low cost, three-waste free pollution, saving water The resources such as electricity, printed board intensity is high, hardness is high, moistureproof, with short production cycle, and production technology is simple, and can accomplish internal dissipating The effect of heat.

To achieve these goals, the technical scheme that this utility model is used is as follows:

The circuit board through-hole construction that a kind of anti-plated film comes off, including substrate, described substrate is provided with electronic component, described base Plate is made up of three-decker, the most respectively the solid lamella of upper half, core material layer and the solid lamella of lower half, described upper semifastening sheet Layer, lower half solid between lamella and described core material layer faying face all by teeth fastening structure and be tightly connected, described substrate is just Face and the back side are equipped with copper foil layer, and the Facad structure of described substrate and structure setting symmetrical above and below, at described substrate On be machined with some through holes, each described through hole inwall is processed a circle elargol film, and forms conductive through hole, described silver The two ends of glued membrane all extend on the described copper foil layer of described substrate front side and back position setting, at described copper foil layer side also It is machined with the welding resisting layer sealing against connection, is all coated with layer protective layer in the periphery at the described upper and lower two ends of elargol film, described anti- Layer that one end that is connected with described copper foil layer is set to some isosceles trapezoidal structures, and described protective layer is some with described welding resisting layer Isosceles trapezoidal structure coincide and connects.

Preferably, described substrate is additionally provided with louvre.

Preferably, the through described substrate of described louvre, substrate front side structure and substrate back structure.

Preferably, the upper and lower opening of described louvre is disposed as bowl structure.

Preferably, the thickness of described elargol film is 0.3-0.4mm.

Preferably, the thickness of described copper foil layer is 9-18 μm, and the thickness of described substrate is 30-100 μm.

Preferably, the solid lamella of described upper half lamella solid with described lower half all uses glass cloth fabric.

The beneficial effects of the utility model are: compared with prior art, this utility model by existing rivet or Being conductively connected that the mode of person's plating realizes is improved to through being conductively connected of elargol, and uses the substrate of three-decker, logical Cross three-decker and strengthen its hardness, intensity and shock resistance and anti-wear performance, this elargol perforation with low cost, conductive effect Good, persistently, stablize, and change existing radiating mode, louvre is set in the inside of substrate, the upper and lower side opening of louvre All being not configured to bowl structure, so heat radiation bore increases, and the effect of heat radiation strengthens, and this louvre is provided in conduction and leads to The vicinity in hole, improves the radiating effect within substrate.

Accompanying drawing explanation

Fig. 1 is the piece cutting structure schematic diagram of this utility model elargol perforation plate.

Fig. 2 is the enlarged drawing of D part in Fig. 1.

Wherein: 1-substrate, the solid lamella of 101-upper half, 102-core material layer, the solid lamella of 103-lower half, 2-copper foil layer, 3-elargol Film, 4-welding resisting layer, 5-protective layer, 6-louvre, 7-teeth structure.

Detailed description of the invention

In order to make those of ordinary skill in the art be better understood on the technical solution of the utility model, below in conjunction with attached The technical solution of the utility model is further described by figure and embodiment.

The circuit board through-hole construction that referring to the drawings a kind of anti-plated film shown in 1-2 comes off, including substrate 1, described substrate by Three-decker forms, the most respectively the solid lamella 101 of upper half, core material layer 102 and the solid lamella 103 of lower half, described upper half Gu lamella 101 lamella 103 solid with lower half all uses glass cloth fabric, the solid lamella 101 of described upper half, solid both the lamellas 103 of lower half And all being fastened by teeth structure 7 and be tightly connected between described core material layer 102 faying face, teeth structure is specially isosceles trapezoid Structure, by the connective stability arranged between can improving every layer of teeth structure and sealing between layers, enters And the intensity of printed substrate, hardness can be improved by this three-decker of substrate 1, anti-pressure ability, it is also possible to pass through multilamellar The design of structure improves the humidity resistance of substrate 1, and described substrate 1 is provided with electronic component, and the front and back of described substrate 1 is equal It is provided with copper foil layer 2, and the Facad structure of described substrate 1 and structure setting symmetrical above and below, the thickness of described copper foil layer 2 is 9-18 μm, the thickness of described substrate 1 is 30-100 μm, is machined with some through holes on described substrate 1, each described through Processing a circle elargol film 3 on the inwall of hole, and form conductive through hole, the thickness of described elargol film 3 is 0.3-0.4mm, described elargol The two ends of film 3 all extend on the described copper foil layer 2 that described substrate 1 front and back position is arranged, at described copper foil layer 2 side Also it is machined with the welding resisting layer 4 sealing against connection, at the peripheral cladding layer protective layer 5 of described elargol film 3, described welding resisting layer 4 That one end that is connected with described copper foil layer 2 is set to some isosceles trapezoidal structures, and described protective layer 5 is some with described welding resisting layer 4 Isosceles trapezoidal structure coincide and connects, by the shape of some isosceles trapezoidal structures so that welding resisting layer 4 and protective layer 5 are more preferable Combine, and some isosceles trapezoidal structures are owing to existing bending around path, it is possible to achieve preferably sealing effectiveness, anti- Tide performance is good, protects preferably to the end of elargol film 3, and the slurry position of passing through of elargol film 3 of the present utility model is all to extend to protection Between layer and copper foil layer 2, carry out sealing protection, this utility model to its end by protective layer 5, copper foil layer 1 and welding resisting layer 4 Being conductively connected of the mode of existing rivet or plating being realized is improved to being conductively connected of elargol perforation, and this elargol passes through Hole with low cost, conductive effect is good, persistently, stable.

In this utility model, described substrate 1 is additionally provided with louvre 6, the through described substrate 1 of described louvre 6, substrate 1 Facad structure and substrate 1 structure, the upper and lower opening of described louvre 6 is disposed as bowl structure, because of of the present utility model Structure is double-decker, therefore a blind area of the always heat radiation of heat produced by the conductive path between bilayer, therefore the present invention The louvre 6 through by arranging one, is outwards shed the heat of conductive path adnexa by louvre 6, improves heat radiation effect Really, extend the service life of part in printed board, and thermovent is all provided with being set to bowl structure, can increase area of dissipation, will Heat quickly distributes.

Claims (7)

1. the circuit board through-hole construction that anti-plated film comes off, including substrate, described substrate is provided with electronic component, and its feature exists In: described substrate is made up of three-decker, and the most respectively the solid lamella of upper half, core material layer and the solid lamella of lower half, described The solid lamella of upper half, lower half solid between lamella and described core material layer faying face all by teeth fastening structure and be tightly connected, described The front and back of substrate is equipped with copper foil layer, and the Facad structure of described substrate and structure setting symmetrical above and below, It is machined with some through holes on described substrate, each described through hole inwall is processed a circle elargol film, and it is logical to form conduction Hole, the two ends of described elargol film all extend on the described copper foil layer of described substrate front side and back position setting, at described copper Layers of foil side is also machined with the welding resisting layer sealing against connection, is all coated with one layer of protection in the periphery at the described upper and lower two ends of elargol film Layer, described welding resisting layer that one end that is connected with described copper foil layer is set to some isosceles trapezoidal structures, and described protective layer is prevented with described Some isosceles trapezoidal structures of layer coincide and connect.

The circuit board through-hole construction that a kind of anti-plated film the most according to claim 1 comes off, it is characterised in that: on described substrate It is additionally provided with louvre.

The circuit board through-hole construction that a kind of anti-plated film the most according to claim 2 comes off, it is characterised in that: described louvre Through described substrate, substrate front side structure and substrate back structure.

The circuit board through-hole construction that a kind of anti-plated film the most according to claim 3 comes off, it is characterised in that: described louvre Upper and lower opening be disposed as bowl structure.

5. the circuit board through-hole construction come off according to a kind of anti-plated film described in any one of claim 1-4, it is characterised in that: institute The thickness stating elargol film is 0.3-0.4mm.

The circuit board through-hole construction that a kind of anti-plated film the most according to claim 5 comes off, it is characterised in that: described copper foil layer Thickness be 9-18 μm, the thickness of described substrate is 30-100 μm.

The circuit board through-hole construction that a kind of anti-plated film the most according to claim 6 comes off, it is characterised in that: described upper half is solid Lamella lamella solid with described lower half all uses glass cloth fabric.