CN205793625U - A kind of printed substrate with carbon slurry perforation - Google Patents
A kind of printed substrate with carbon slurry perforation Download PDFInfo
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- CN205793625U CN205793625U CN201620579843.6U CN201620579843U CN205793625U CN 205793625 U CN205793625 U CN 205793625U CN 201620579843 U CN201620579843 U CN 201620579843U CN 205793625 U CN205793625 U CN 205793625U
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- substrate
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- copper foil
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Abstract
The utility model discloses a kind of printed substrate with carbon slurry perforation, including substrate, substrate is provided with electronic component, substrate is respectively the solid lamella of upper half from top to bottom, core material layer and the solid lamella of lower half, the front and back of substrate is equipped with copper foil layer, and the Facad structure of substrate and structure setting symmetrical above and below, substrate is machined with some through holes, each through hole inwall is processed a circle carbon paste film, the welding resisting layer sealing against connection also it is machined with at copper foil layer side, peripheral cladding layer protective layer at carbon paste film, welding resisting layer that one end that is connected with copper foil layer is set to some isosceles trapezoidal structures, protective layer coincide with some isosceles trapezoidal structures of welding resisting layer and is connected；This utility model is without copper-plated double-clad board, and this carbon paste perforation plate low cost, three-waste free pollution, saves the resource such as water power, and printed board intensity is high, hardness is high, moistureproof, with short production cycle, and production technology is simple, and can accomplish the effect of internal heat dissipating.
Description
Technical field
This utility model relates to a kind of printed substrate with carbon slurry perforation.
Background technology
Light, thin, short, littleization is progressively required so that printed board is towards high accuracy, graph thinning, high density along with electronic product
SMT kludge meet the direction of environmental requirement and develop, printed board can be divided into reverse side, two-sided and multilamellar etc., the most two-sided and many
Layer has a common ground, it is simply that both need conductor to connect its aspect, for carrying out the common process of interconnection of conductors between aspect, just
Being each specified point elder generation punching in printed board or boring, then formation conductor layer around hole wall, this conductor layer will be
Manufacture electrical contact between each layer and form loop.
The method forming interconnection in prior art is a lot, and such as lead-in wire welding, rivet, Direct Electroplating etc. is by conductive species
It is plated in hole wall first-class, but the maximum shortcoming of these methods is exactly that manufacturing cost is expensive and the production cycle is long, and can produce more
" three wastes " pollute, and process the environmental issue of three-waste pollution, and the weight of printed board can be increased so that printed board is inadequate
Frivolous.
Additionally, the board structure intensity of prior art, hardness are not high enough, shock resistance, wear-resisting and humidity resistance is poor.
Utility model content
For the problem of above-mentioned existence, this utility model aims to provide a kind of printed substrate with carbon slurry perforation, should
Carbon paste perforation printed substrate is without copper-plated double-clad board, and this carbon paste perforation plate low cost, three-waste free pollution, saving
The resources such as water power, printed board intensity is high, hardness is high, moistureproof, with short production cycle, and production technology is simple, and can accomplish inside
The effect of heat radiation.
To achieve these goals, the technical scheme that this utility model is used is as follows:
A kind of printed substrate with carbon slurry perforation, including substrate, described substrate is provided with electronic component, described substrate
It is made up of three-decker, the most respectively the solid lamella of upper half, core material layer and the solid lamella of lower half, the front of described substrate
It is equipped with copper foil layer with the back side, and the Facad structure of described substrate and structure setting symmetrical above and below, on the substrate
It is machined with some through holes, each described through hole inwall is processed a circle carbon paste film, and forms conductive through hole, described carbon paste
The two ends of film all extend to, on the described copper foil layer of described substrate front side and back position setting, also add at described copper foil layer side
Work has the welding resisting layer sealing against connection, is all coated with layer protective layer in the periphery at the described upper and lower two ends of carbon paste film, described anti-welding
Layer that one end that is connected with described copper foil layer is set to the some etc. of some isosceles trapezoidal structures, described protective layer and described welding resisting layer
Waist trapezium structure coincide and connects.
Preferably, described substrate is additionally provided with louvre.
Preferably, the through described substrate of described louvre, substrate front side structure and substrate back structure.
Preferably, the upper and lower opening of described louvre is disposed as bowl structure.
Preferably, the thickness of described carbon paste film is 0.3-0.4mm.
Preferably, the thickness of described copper foil layer is 9-18 μm, and the thickness of described substrate is 30-100 μm.
Preferably, the solid lamella of described upper half lamella solid with lower half all uses glass cloth fabric.
The beneficial effects of the utility model are: compared with prior art, this utility model by existing rivet or
Being conductively connected of realizing of mode of person's plating is improved to through being conductively connected of carbon paste, strengthens its hardness, strong by three-decker
Degree and shock resistance and anti-wear performance, this carbon paste perforation with low cost, conductive effect is good, persistently, stable, and changes existing
Radiating mode, in the inside of substrate, louvre is set, the upper and lower side opening of louvre is all not configured to bowl structure, the most scattered
Hot bore increases, and the effect of heat radiation strengthens, and this louvre is provided in the vicinity of conductive through hole, improves dissipating within substrate
Thermal effect.
Accompanying drawing explanation
Fig. 1 is the piece cutting structure schematic diagram of this utility model carbon paste perforation plate.
Fig. 2 is the enlarged drawing of D part in Fig. 1.
Wherein: 1-substrate, the solid lamella of 101-upper half, 102-core material layer, the solid lamella of 103-lower half, 2-copper foil layer, 3-carbon paste
Film, 4-welding resisting layer, 5-protective layer, 6-louvre.
Detailed description of the invention
In order to make those of ordinary skill in the art be better understood on the technical solution of the utility model, below in conjunction with attached
The technical solution of the utility model is further described by figure and embodiment.
A kind of printed substrate with carbon slurry perforation shown in 1-2 referring to the drawings, including substrate 1, described substrate is by three
Rotating fields forms, the most respectively the solid lamella 101 of upper half, core material layer 102 and the solid lamella 103 of lower half, and described upper half is solid
Lamella 101 lamella 103 solid with lower half all uses glass cloth fabric, can improve printed substrate by the three-decker of substrate 1
Intensity, hardness, anti-pressure ability, it is also possible to by multiple structure design improve substrate 1 humidity resistance, on described substrate 1
Being provided with electronic component, the front and back of described substrate 1 is equipped with copper foil layer 2, and the Facad structure of described substrate 1 and the back side
Structure setting symmetrical above and below, the thickness of described copper foil layer 2 is 9-18 μm, and the thickness of described substrate 1 is 30-100 μm, at described base
It is machined with some through holes on plate 1, each described through hole inwall is processed a circle carbon paste film 3, and forms conductive through hole, institute
The thickness stating carbon paste film 3 is 0.3-0.4mm, and the two ends of described carbon paste film 3 all extend to described substrate 1 front and back position and set
On the described copper foil layer 2 put, also it is machined with the welding resisting layer 4 sealing against connection at described copper foil layer 2 side, at described carbon paste film
The periphery at about 3 two ends is all coated with layer protective layer 5, and described welding resisting layer 4 that one end that is connected with described copper foil layer 2 is set to some
Isosceles trapezoidal structure, described protective layer 5 coincide with some isosceles trapezoidal structures of described welding resisting layer 4 and is connected, by some isosceles
The shape of trapezium structure so that welding resisting layer 4 and protective layer 5 preferably combine, and some isosceles trapezoidal structures by
In there is bending around path, it is possible to achieve preferably sealing effectiveness, humidity resistance is good, protects preferably to the end of carbon paste film 3,
The slurry position of passing through of carbon paste film 3 of the present utility model is all to extend between protective layer and copper foil layer 2, by protective layer 5, copper foil layer
1 and welding resisting layer 4 its end is carried out seal protection, the mode of existing rivet or plating is realized by this utility model
Be conductively connected and be improved to being conductively connected of carbon paste perforation, this carbon paste perforation with low cost, conductive effect is good, persistently, stable.
In this utility model, described substrate 1 is additionally provided with louvre 6, the through described substrate 1 of described louvre 6, substrate
1 Facad structure and substrate 1 structure, the upper and lower opening of described louvre 6 is disposed as bowl structure, because of of the present utility model
Structure is double-decker, therefore a blind area of the always heat radiation of heat produced by the conductive path between bilayer, therefore the present invention
The louvre 6 through by arranging one, is outwards shed the heat of conductive path adnexa by louvre 6, improves heat radiation effect
Really, extend the service life of part in printed board, and thermovent is all provided with being set to bowl structure, can increase area of dissipation, will
Heat quickly distributes.
Claims (7)
1. having a printed substrate for carbon slurry perforation, including substrate, described substrate is provided with electronic component, and its feature exists
In: described substrate is made up of three-decker, and the most respectively the solid lamella of upper half, core material layer and the solid lamella of lower half, described
The front and back of substrate is equipped with copper foil layer, and the Facad structure of described substrate and structure setting symmetrical above and below,
It is machined with some through holes on described substrate, each described through hole inwall is processed a circle carbon paste film, and it is logical to form conduction
Hole, the two ends of described carbon paste film all extend on the described copper foil layer of described substrate front side and back position setting, at described copper
Layers of foil side is also machined with the welding resisting layer sealing against connection, is all coated with one layer of protection in the periphery at the described upper and lower two ends of carbon paste film
Layer, described welding resisting layer that one end that is connected with described copper foil layer is set to some isosceles trapezoidal structures, and described protective layer is prevented with described
Some isosceles trapezoidal structures of layer coincide and connect.
A kind of printed substrate with carbon slurry perforation the most according to claim 1, it is characterised in that: on described substrate also
It is provided with louvre.
A kind of printed substrate with carbon slurry perforation the most according to claim 2, it is characterised in that: described louvre passes through
Logical described substrate, substrate front side structure and substrate back structure.
A kind of printed substrate with carbon slurry perforation the most according to claim 3, it is characterised in that: described louvre
Upper and lower opening is disposed as bowl structure.
5. according to a kind of printed substrate with carbon slurry perforation described in any one of claim 1-4, it is characterised in that: described
The thickness of carbon paste film is 0.3-0.4mm.
A kind of printed substrate with carbon slurry perforation the most according to claim 5, it is characterised in that: described copper foil layer
Thickness is 9-18 μm, and the thickness of described substrate is 30-100 μm.
A kind of printed substrate with carbon slurry perforation the most according to claim 6, it is characterised in that: described upper semifastening sheet
Layer lamella solid with described lower half all uses glass cloth fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620579843.6U CN205793625U (en) | 2016-06-15 | 2016-06-15 | A kind of printed substrate with carbon slurry perforation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620579843.6U CN205793625U (en) | 2016-06-15 | 2016-06-15 | A kind of printed substrate with carbon slurry perforation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205793625U true CN205793625U (en) | 2016-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620579843.6U Active CN205793625U (en) | 2016-06-15 | 2016-06-15 | A kind of printed substrate with carbon slurry perforation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205793625U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN113038695A (en) * | 2021-03-02 | 2021-06-25 | 广德新三联电子有限公司 | Carbon paste through hole circuit board and preparation method thereof |
| CN113115522A (en) * | 2021-03-29 | 2021-07-13 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and hole plugging method thereof |
-
2016
- 2016-06-15 CN CN201620579843.6U patent/CN205793625U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN113038695A (en) * | 2021-03-02 | 2021-06-25 | 广德新三联电子有限公司 | Carbon paste through hole circuit board and preparation method thereof |
| CN113115522A (en) * | 2021-03-29 | 2021-07-13 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and hole plugging method thereof |
| CN113115522B (en) * | 2021-03-29 | 2022-03-15 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and hole plugging method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |