CN113038695A - Carbon paste through hole circuit board and preparation method thereof - Google Patents
Carbon paste through hole circuit board and preparation method thereof Download PDFInfo
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- CN113038695A CN113038695A CN202110230455.2A CN202110230455A CN113038695A CN 113038695 A CN113038695 A CN 113038695A CN 202110230455 A CN202110230455 A CN 202110230455A CN 113038695 A CN113038695 A CN 113038695A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 148
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 128
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 68
- 239000011347 resin Substances 0.000 claims abstract description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000011889 copper foil Substances 0.000 claims abstract description 64
- 239000002002 slurry Substances 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000000835 fiber Substances 0.000 claims description 70
- 239000000853 adhesive Substances 0.000 claims description 50
- 230000001070 adhesive effect Effects 0.000 claims description 50
- 239000012784 inorganic fiber Substances 0.000 claims description 34
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 20
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000004744 fabric Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 15
- 238000000227 grinding Methods 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 10
- 229910021389 graphene Inorganic materials 0.000 claims description 10
- 239000005457 ice water Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- -1 polytetrafluoroethylene Polymers 0.000 claims description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 10
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 239000003365 glass fiber Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- 239000004917 carbon fiber Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 5
- 210000004177 elastic tissue Anatomy 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000002808 molecular sieve Substances 0.000 claims description 5
- 229920001778 nylon Polymers 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 238000010008 shearing Methods 0.000 claims description 5
- 238000007873 sieving Methods 0.000 claims description 5
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- WRDNCFQZLUCIRH-UHFFFAOYSA-N 4-(7-azabicyclo[2.2.1]hepta-1,3,5-triene-7-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=C1C=C2 WRDNCFQZLUCIRH-UHFFFAOYSA-N 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 238000007731 hot pressing Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a carbon paste through hole circuit board and a preparation method thereof, wherein the circuit board comprises a circuit substrate arranged in the middle, prepreg plates are attached to the upper and lower outer surfaces of the circuit substrate, honeycomb heat dissipation thin plates are attached to the upper and lower outer surfaces of the prepreg plates, copper foil plates are arranged on the upper and lower outer surfaces of the honeycomb heat dissipation thin plates and electrically connected through the carbon paste plates, carbon paste through holes penetrating through the carbon paste plates are formed in the carbon paste plates, heat dissipation holes are formed in the peripheries of the carbon paste through holes, and blind grooves are formed in the copper foil plates. According to the circuit board designed by the invention, the carbon slurry through hole is formed in the circuit board, the carbon slurry is poured and dried, so that the carbon slurry is attached to the inner wall surface of the through hole, the upper copper foil plate and the lower copper foil plate are communicated with the prepreg plate through the substrate, the heat dissipation plate and the prepreg plate, the heat dissipation effect is improved, the structure of the circuit board is prevented from being damaged due to heat collection of the circuit board, the substrate and the prepreg plate are made of resin with good elasticity, the flexibility of the circuit board is improved by additionally arranging the blind groove, and the elasticity and the flexibility of the.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a carbon paste through hole circuit board and a preparation method thereof.
Background
The name of the circuit board is ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, aluminum substrate, high frequency board, thick copper board, impedance board, rigid-flex board, ultra-thin circuit board, printed circuit board, etc., the circuit board makes the circuit miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances.
With the gradual requirements of light weight, thinness, shortness and miniaturization of electronic products, the printed board is developed towards the direction that an SMT assembling machine with high precision, fine lines and high density meets the environmental protection requirement, the printed board can be divided into a reverse side, a double side, a multilayer and the like, wherein the double side and the multilayer have a common point, namely the double side and the multilayer need to be connected with the layer surface of the printed board through conductors, and for the common process of interconnecting the conductors between the layer surfaces, the method is to punch or drill holes at each appointed point on the printed board, then form a conductor layer around the hole wall, and manufacture electric contacts between the layers through the conductor layer to form a loop.
In the prior art, a plurality of methods for forming interconnection are adopted, such as lead welding, rivet riveting, direct electroplating and the like, for plating conductor substances on hole walls, but the methods have the biggest defects of high manufacturing cost, long production period, more 'three wastes' pollution, environmental protection problem for treating the 'three wastes' pollution, increased weight of the printed board and insufficient lightness and thinness of the printed board.
In addition, the prior art has the disadvantages of insufficient structural strength and hardness, and poor impact resistance, wear resistance and moisture resistance.
Disclosure of Invention
In order to solve the technical problems, the invention provides a carbon paste through hole circuit board and a preparation method thereof.
In order to achieve the technical purpose, the technical scheme of the invention is realized as follows:
a carbon paste through hole circuit board comprises a circuit substrate arranged in the middle, wherein prepreg plates are attached to the upper outer surface and the lower outer surface of the circuit substrate, and honeycomb radiating thin plates are attached to the upper outer surface and the lower outer surface of the prepreg plates; the upper and lower surface of honeycomb heat dissipation sheet metal is provided with the copper foil board, and the copper foil board passes through carbon thick liquid board electric connection, carbon thick liquid through-hole that runs through carbon thick liquid board is seted up on the carbon thick liquid board, be provided with the louvre around the carbon thick liquid through-hole, set up blind groove on the copper foil board.
Preferably, a plurality of obliquely arranged glass fiber reinforcing ribs are arranged inside the circuit substrate, and the inclination angle is set to be 30-60 degrees.
Preferably, a copper foil bulge and a carbon slurry bulge are arranged at the joint of the copper foil plate and the carbon slurry plate.
Preferably, the copper foil protrusions are in an opposite orientation to the carbon paste protrusions, and the copper foil protrusions are disposed between the carbon paste protrusions.
Preferably, the inner wall surface of the carbon slurry through hole is provided with an occlusion thread.
Preferably, the circuit board is composed of resin adhesive and organic fibers, wherein the resin adhesive comprises 20-35% of polyimide, 15-30% of polytetrafluoroethylene, 10-20% of MDI modified bromine-free resin, 15-25% of graphene modified epoxy resin, 5-10% of modified graphene oxide, 20-40% of acetone and 2-5% of 4-methylimidazole.
Preferably, the organic fiber comprises 10-25% of polyester fiber, 10-20% of nylon fiber, 5-15% of polyvinyl formal fiber, 10-20% of poly-p-phenylene terephthalamide fiber, 15-30% of polyurethane elastic fiber, 10-15% of polyamide fiber and 20-35% of plant fiber.
Preferably, the prepreg board is composed of resin adhesive and inorganic fibers, the resin adhesive of the prepreg board is the same as the resin adhesive of the circuit substrate, and the inorganic fibers comprise 10-15% of metal fibers, 20-40% of ceramic fibers, 5-15% of carbon fibers, 15-25% of alumina fibers and 20-30% of glass fibers.
A preparation method of the carbon paste through hole circuit board comprises the following specific steps:
1) preparing a resin adhesive: and (3) starting an ice water circulating system of the glue mixing tank, and setting the temperature of ice water to be 0-10 ℃. Adding polyimide, polytetrafluoroethylene, MDI modified bromine-free resin and graphene modified epoxy resin, and stirring for 100-150 min until the resin is completely dissolved in acetone;
adding modified graphene oxide into the dissolved mixed material, starting a homogenizer and a shearing machine to circularly stir for 60-90 min, passing through a molecular sieve filter pressing barrel, and adsorbing and filtering large particles in the mixed material;
adding 4-methylimidazole into the filtered mixed material, circularly stirring for 45-90 min, and preparing to obtain a resin glue solution;
2) manufacturing a circuit substrate: placing organic fibers orderly, cutting off disordered organic fibers, pouring the resin adhesive obtained in the step (1) on the organic fibers, tabletting the organic fibers and the resin adhesive, and baking in an oven at the baking temperature of 60-120 ℃ for 5-20 min to obtain a circuit substrate;
3) preparing a prepreg sheet: stacking inorganic fibers in a seamless mode and pressing the inorganic fibers to obtain mixed inorganic fiber cloth, dipping the resin adhesive obtained in the step (1) on the inorganic fiber cloth through a vertical gluing machine, baking the inorganic fiber cloth dipped with the adhesive solution at the baking temperature of 60-120 ℃ for 5-20 min, and performing hot press molding at the temperature of 200-250 ℃ through a hot press to form a sheet shape to form a continuous prepreg plate;
4) manufacturing a circuit board: stacking the prepared circuit substrate, prepreg plate, honeycomb radiating thin plate and etched prepared copper foil plate, hot-pressing and molding at 200-250 ℃ by a hot press to obtain a circuit board, and forming a carbon slurry through hole, a copper foil bulge, a carbon slurry bulge, a blind groove and a radiating hole on the copper foil plate;
5) manufacturing a carbon slurry plate: grinding the carbon slurry by a grinding machine, sieving, filtering out large-particle carbon, pouring the carbon slurry into the carbon slurry through hole, and drying in an oven to solidify the carbon slurry and attach the carbon slurry to the hole wall, so that a copper foil bulge and a carbon slurry bulge are formed between the carbon slurry and the copper foil plate, the upper and lower copper foil plates are conducted, and an occlusion thread is arranged on the carbon slurry through hole, so that the carbon slurry through hole circuit board is finally obtained.
The invention has the beneficial effects that: according to the carbon paste through hole circuit board designed by the invention, the carbon paste through hole is formed in the circuit board, the carbon paste is poured and dried, so that the carbon paste is attached to the inner wall surface of the through hole, the upper copper foil plate and the lower copper foil plate are conducted through the substrate, the heat dissipation plate and the prepreg plate, the circuit board is conducted up and down, the heat dissipation effect of the circuit board is improved while the design area of the circuit board is saved, the damage to the structure of the circuit board due to heat collection of the circuit board is avoided, the substrate and the prepreg plate are made of resin with good elasticity, the flexibility of the circuit board is improved by additionally arranging the blind groove, the elasticity and the flexibility of the circuit board are changed, the service life of the circuit board is prolonged, the practicability and the creativity of the.
Drawings
FIG. 1 is a schematic cross-sectional view of a carbon paste through hole circuit board according to the present invention.
FIG. 2 is a schematic top view of a carbon paste through hole circuit board according to the present invention.
In the figure: 1. a circuit substrate; 2. a prepreg sheet; 3. a honeycomb heat dissipation sheet; 4. a copper foil plate; 5. glass fiber reinforcing ribs; 6. a carbon paste sheet; 7. carbon paste through holes; 8. copper foil bulges; 9. carbon slurry protrusions; 10. a blind groove; 11. engaging the threads; 12. and (4) heat dissipation holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1-2, a carbon paste through-hole circuit board includes a circuit substrate 1 disposed in the middle, prepreg sheets 2 attached to the upper and lower outer surfaces of the circuit substrate 1, and honeycomb heat dissipation sheets 3 attached to the upper and lower outer surfaces of the prepreg sheets 2.
Further, the upper and lower outer surfaces of the honeycomb heat dissipation sheet 3 are provided with copper foil plates 4, the copper foil plates 4 are electrically connected through carbon slurry plates 6, carbon slurry through holes 7 penetrating through the carbon slurry plates 6 are formed in the carbon slurry plates 6, heat dissipation holes 12 are formed around the carbon slurry through holes 7, and blind grooves 10 are formed in the copper foil plates 4.
Further, a plurality of glass fiber reinforcing ribs 5 are provided inside the circuit board 1, and the inclination angle is set to 60 °.
Furthermore, a copper foil bump 8 and a carbon paste bump 9 are arranged at the joint of the copper foil plate 4 and the carbon paste plate 6.
Further, the copper foil protrusions 8 are oriented opposite to the carbon paste protrusions 9, and the copper foil protrusions 8 are disposed between the carbon paste protrusions 9.
Furthermore, the inner wall surface of the carbon slurry through hole 7 is provided with an occlusion thread 11.
Furthermore, the circuit board 1 is composed of resin adhesive and organic fiber, wherein the resin adhesive comprises 20% of polyimide, 15% of polytetrafluoroethylene, 10% of MDI modified bromine-free resin, 15% of graphene modified epoxy resin, 5% of modified graphene oxide, 33% of acetone and 2% of 4-methylimidazole.
Further, the organic fiber comprises 10% of polyester fiber, 10% of nylon fiber, 5% of polyvinyl formal fiber, 10% of poly-p-phenylene terephthamide fiber, 20% of polyurethane elastic fiber, 10% of polyamide fiber and 35% of plant fiber.
Furthermore, the prepreg 2 is composed of resin adhesive and inorganic fiber, the resin adhesive of the prepreg 2 is the same as the resin adhesive of the circuit board 1, and the inorganic fiber includes 10% of metal fiber, 40% of ceramic fiber, 5% of carbon fiber, 15% of alumina fiber and 30% of glass fiber.
A preparation method of a carbon paste through hole circuit board comprises the following specific steps:
1) preparing a resin adhesive: and (3) starting an ice water circulating system of the glue mixing tank, and setting the temperature of ice water to be 0 ℃. Adding polyimide, polytetrafluoroethylene, MDI modified bromine-free resin and graphene modified epoxy resin, and stirring for 100min until the resin is completely dissolved in acetone;
adding modified graphene oxide into the dissolved mixed material, starting a homogenizer and a shearing machine to circularly stir for 60min, and filtering large particles in the mixed material through a molecular sieve filter pressing barrel;
adding 4-methylimidazole into the filtered mixed material, circularly stirring for 45min, and preparing to obtain a resin glue solution;
2) manufacturing a circuit substrate: placing organic fibers orderly, cutting off disordered organic fibers, pouring the resin adhesive obtained in the step (1) on the organic fibers, tabletting the organic fibers and the resin adhesive, and baking in an oven at the baking temperature of 60 ℃ for 20min to obtain a circuit substrate 1;
3) preparing a prepreg sheet: stacking inorganic fibers in a seamless manner, pressing to obtain mixed inorganic fiber cloth, dipping the resin adhesive obtained in the step (1) on the inorganic fiber cloth through a vertical gluing machine, baking the inorganic fiber cloth dipped with the adhesive solution at the baking temperature of 120 ℃ for 5min, and performing hot press molding at the temperature of 250 ℃ through a hot press to form a sheet-shaped body to form a continuous prepreg plate 2;
4) manufacturing a circuit board: stacking the prepared circuit substrate 1, the prepreg plate 2, the honeycomb radiating thin plate 3 and the etched prepared copper foil plate 4, hot-pressing and molding the stacked circuit substrate, prepreg plate 2, honeycomb radiating thin plate 3 and etched copper foil plate 4 at 250 ℃ by a hot press to obtain a circuit board, and forming a carbon paste through hole 7, a copper foil bulge 8, a carbon paste bulge 9, a blind groove 10 and a radiating hole 12 on the copper foil plate 4;
5) manufacturing a carbon slurry plate: grinding the carbon slurry by a grinding machine, sieving after grinding, filtering out large-particle carbon, pouring the carbon slurry into the carbon slurry through hole 7, and then drying in an oven, so that the carbon slurry is solidified and attached to the hole wall, and forms a copper foil bulge 8 and a carbon slurry bulge 9 with the copper foil plate 4, so that the upper and lower copper foil plates 4 are conducted, and an occlusion thread 11 is arranged on the carbon slurry through hole 7, and finally the carbon slurry through hole circuit board is obtained.
Example 2
The circuit substrate 1 is composed of resin adhesive and organic fiber, wherein the resin adhesive comprises 30% of polyimide, 15% of polytetrafluoroethylene, 10% of MDI modified bromine-free resin, 15% of graphene modified epoxy resin, 5% of modified graphene oxide, 20% of acetone and 5% of 4-methylimidazole.
Further, the organic fiber comprises 20% of polyester fiber, 20% of nylon fiber, 5% of polyvinyl formal fiber, 10% of poly-p-phenylene terephthamide fiber, 15% of polyurethane elastic fiber, 10% of polyamide fiber and 20% of plant fiber.
Furthermore, the prepreg 2 is composed of resin adhesive and inorganic fiber, the resin adhesive of the prepreg 2 is the same as the resin adhesive of the circuit board 1, and the inorganic fiber includes 15% of metal fiber, 25% of ceramic fiber, 15% of carbon fiber, 15% of alumina fiber and 30% of glass fiber.
A preparation method of a carbon paste through hole circuit board comprises the following specific steps:
1) preparing a resin adhesive: and (3) starting an ice water circulating system of the glue mixing tank, and setting the temperature of ice water to be 10 ℃. Adding polyimide, polytetrafluoroethylene, MDI modified bromine-free resin and graphene modified epoxy resin, and stirring for 150min until the resin is completely dissolved in acetone;
adding modified graphene oxide into the dissolved mixed material, starting a homogenizer and a shearing machine to circularly stir for 90min, passing through a molecular sieve filter pressing barrel, and adsorbing and filtering large particles in the mixed material;
adding 4-methylimidazole into the filtered mixed material, circularly stirring for 90min, and preparing to obtain a resin glue solution;
2) manufacturing a circuit substrate: placing organic fibers orderly, cutting off disordered organic fibers, pouring the resin adhesive obtained in the step (1) on the organic fibers, tabletting the organic fibers and the resin adhesive, and baking in an oven at the baking temperature of 120 ℃ for 5min to obtain a circuit substrate 1;
3) preparing a prepreg sheet: stacking inorganic fibers in a seamless manner, pressing to obtain mixed inorganic fiber cloth, dipping the resin adhesive obtained in the step (1) on the inorganic fiber cloth through a vertical gluing machine, baking the inorganic fiber cloth dipped with the adhesive solution at the baking temperature of 60 ℃ for 20min, and hot-pressing and molding the inorganic fiber cloth at the temperature of 200 ℃ through a hot press to form a sheet-shaped plate to form a continuous prepreg plate 2;
4) manufacturing a circuit board: stacking the prepared circuit substrate 1, the prepreg plate 2, the honeycomb radiating thin plate 3 and the etched prepared copper foil plate 4, hot-pressing and molding the stacked circuit substrate, the prepreg plate, the honeycomb radiating thin plate and the etched copper foil plate at 200 ℃ by a hot press to obtain a circuit board, and forming a carbon paste through hole 7, a copper foil bulge 8, a carbon paste bulge 9, a blind groove 10 and a radiating hole 12 on the copper foil plate 4;
5) manufacturing a carbon slurry plate: grinding the carbon slurry by a grinding machine, sieving after grinding, filtering out large-particle carbon, pouring the carbon slurry into the carbon slurry through hole 7, and then drying in an oven, so that the carbon slurry is solidified and attached to the hole wall, and forms a copper foil bulge 8 and a carbon slurry bulge 9 with the copper foil plate 4, so that the upper and lower copper foil plates 4 are conducted, and an occlusion thread 11 is arranged on the carbon slurry through hole 7, and finally the carbon slurry through hole circuit board is obtained.
Example 3
The circuit substrate 1 is composed of resin adhesive and organic fiber, wherein the resin adhesive comprises 20% of polyimide, 15% of polytetrafluoroethylene, 10% of MDI modified bromine-free resin, 15% of graphene modified epoxy resin, 5% of modified graphene oxide, 30% of acetone and 5% of 4-methylimidazole.
Further, the organic fiber comprises 10% of polyester fiber, 10% of nylon fiber, 5% of polyvinyl formal fiber, 20% of poly-p-phenylene terephthamide fiber, 25% of polyurethane elastic fiber, 10% of polyamide fiber and 20% of plant fiber.
Furthermore, the prepreg 2 is composed of resin adhesive and inorganic fiber, the resin adhesive of the prepreg 2 is the same as the resin adhesive of the circuit board 1, and the inorganic fiber includes 10% of metal fiber, 40% of ceramic fiber, 5% of carbon fiber, 25% of alumina fiber and 20% of glass fiber.
A preparation method of a carbon paste through hole circuit board comprises the following specific steps:
1) preparing a resin adhesive: and (4) starting an ice water circulating system of the glue mixing tank, and setting the temperature of ice water to be 5 ℃. Adding polyimide, polytetrafluoroethylene, MDI modified bromine-free resin and graphene modified epoxy resin, and stirring for 120min until the resin is completely dissolved in acetone;
adding modified graphene oxide into the dissolved mixed material, starting a homogenizer and a shearing machine to circularly stir for 75min, passing through a molecular sieve filter pressing barrel, and adsorbing and filtering large particles in the mixed material;
adding 4-methylimidazole into the filtered mixed material, circularly stirring for 60min, and preparing to obtain a resin glue solution;
2) manufacturing a circuit substrate: placing organic fibers orderly, cutting off disordered organic fibers, pouring the resin adhesive obtained in the step (1) on the organic fibers, tabletting the organic fibers and the resin adhesive, and baking in an oven at the baking temperature of 100 ℃ for 15min to obtain a circuit substrate 1;
3) preparing a prepreg sheet: stacking inorganic fibers in a seamless manner, pressing to obtain mixed inorganic fiber cloth, dipping the resin adhesive obtained in the step (1) on the inorganic fiber cloth through a vertical gluing machine, baking the inorganic fiber cloth dipped with the adhesive solution at the baking temperature of 80 ℃ for 20min, and hot-pressing and molding the inorganic fiber cloth at the temperature of 200 ℃ through a hot press to form a sheet-shaped plate to form a continuous prepreg plate 2;
4) manufacturing a circuit board: stacking the prepared circuit substrate 1, the prepreg plate 2, the honeycomb radiating thin plate 3 and the etched prepared copper foil plate 4, hot-pressing and molding the stacked circuit substrate, the prepreg plate, the honeycomb radiating thin plate and the etched copper foil plate at 200 ℃ by a hot press to obtain a circuit board, and forming a carbon paste through hole 7, a copper foil bulge 8, a carbon paste bulge 9, a blind groove 10 and a radiating hole 12 on the copper foil plate 4;
5) manufacturing a carbon slurry plate: grinding the carbon slurry by a grinding machine, sieving after grinding, filtering out large-particle carbon, pouring the carbon slurry into the carbon slurry through hole 7, and then drying in an oven, so that the carbon slurry is solidified and attached to the hole wall, and forms a copper foil bulge 8 and a carbon slurry bulge 9 with the copper foil plate 4, so that the upper and lower copper foil plates 4 are conducted, and an occlusion thread 11 is arranged on the carbon slurry through hole 7, and finally the carbon slurry through hole circuit board is obtained.
According to the carbon paste through hole circuit board, the carbon paste through hole is formed in the circuit board, the carbon paste is poured and dried, so that the carbon paste is attached to the inner wall surface of the through hole, the upper copper foil plate and the lower copper foil plate are conducted through the substrate, the heat dissipation plate and the prepreg plate, the circuit board is conducted up and down, the heat dissipation effect of the circuit board is improved while the design area of the circuit board is saved, the phenomenon that the structure of the circuit board is damaged due to heat collection of the circuit board is avoided, the substrate and the prepreg plate are made of resin with good elasticity, the flexibility of the circuit board is improved by additionally arranging the blind groove, the elasticity and the flexibility of the circuit board are changed, the service life of the circuit board is prolonged, the practicability and the creativity of the circuit board are improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A carbon paste through hole circuit board is characterized by comprising a circuit substrate (1) arranged in the middle, wherein prepreg plates (2) are attached to the upper outer surface and the lower outer surface of the circuit substrate (1), and honeycomb radiating thin plates (3) are attached to the upper outer surface and the lower outer surface of the prepreg plates (2);
the upper and lower surface of honeycomb heat dissipation sheet metal (3) is provided with copper foil board (4), and copper foil board (4) pass through carbon thick liquid board (6) electric connection, carbon thick liquid through hole (7) of running through carbon thick liquid board (6) are seted up on carbon thick liquid board (6), be provided with louvre (12) around carbon thick liquid through hole (7), blind groove (10) have been seted up on copper foil board (4).
2. The carbon paste through hole circuit board of claim 1, wherein a plurality of obliquely arranged glass fiber reinforced ribs (5) are arranged inside the circuit substrate (1), and the inclination angle is set to be 30-60 °.
3. The carbon paste through hole circuit board of claim 1, wherein a copper foil bump (8) and a carbon paste bump (9) are arranged at the joint of the copper foil plate (4) and the carbon paste plate (6).
4. The carbon paste via circuit board according to claim 3, wherein the copper foil protrusions (8) are oppositely oriented to the carbon paste bumps (9), and the copper foil bumps (8) are disposed between the carbon paste bumps (9).
5. The carbon paste through hole circuit board of claim 1, wherein an engaging thread (11) is provided on an inner wall surface of the carbon paste through hole (7).
6. The carbon paste through hole circuit board of claim 1, wherein the circuit substrate (1) is made of resin adhesive and organic fiber, and the resin adhesive comprises 20-35% of polyimide, 15-30% of polytetrafluoroethylene, 10-20% of MDI modified bromine-free resin, 15-25% of graphene modified epoxy resin, 5-10% of modified graphene oxide, 20-40% of acetone and 2-5% of 4-methylimidazole.
7. The carbon paste through hole circuit board of claim 6, wherein the organic fiber comprises 10-25% of polyester fiber, 10-20% of nylon fiber, 5-15% of polyvinyl formal fiber, 10-20% of poly-p-phenylene terephthalamide fiber, 15-30% of polyurethane elastic fiber, 10-15% of polyamide fiber and 20-35% of plant fiber.
8. The carbon paste through hole circuit board according to claim 1, wherein the prepreg board (2) is composed of a resin adhesive and an inorganic fiber, the resin adhesive of the prepreg board (2) is the same as the resin adhesive of the circuit substrate (1), and the inorganic fiber comprises 10-15% of a metal fiber, 20-40% of a ceramic fiber, 5-15% of a carbon fiber, 15-25% of an alumina fiber and 20-30% of a glass fiber.
9. A method for preparing a carbon paste through hole circuit board according to any one of claims 1 to 8, wherein the method comprises the following steps:
1) preparing a resin adhesive: and (3) starting an ice water circulating system of the glue mixing tank, and setting the temperature of ice water to be 0-10 ℃. Adding polyimide, polytetrafluoroethylene, MDI modified bromine-free resin and graphene modified epoxy resin, and stirring for 100-150 min until the resin is completely dissolved in acetone;
adding modified graphene oxide into the dissolved mixed material, starting a homogenizer and a shearing machine to circularly stir for 60-90 min, passing through a molecular sieve filter pressing barrel, and adsorbing and filtering large particles in the mixed material;
adding 4-methylimidazole into the filtered mixed material, circularly stirring for 45-90 min, and preparing to obtain a resin glue solution;
2) manufacturing a circuit substrate: putting organic fibers in order, cutting off disordered organic fibers, pouring the resin adhesive obtained in the step (1) on the organic fibers, tabletting the organic fibers and the resin adhesive for forming, and then baking in an oven at the baking temperature of 60-120 ℃ for 5-20 min to obtain a circuit substrate (1);
3) preparing a prepreg sheet: stacking inorganic fibers in a seamless mode and pressing the inorganic fibers to obtain mixed inorganic fiber cloth, dipping the resin adhesive obtained in the step (1) on the inorganic fiber cloth through a vertical gluing machine, baking the inorganic fiber cloth dipped with the adhesive solution at the baking temperature of 60-120 ℃ for 5-20 min, and performing hot press molding at the temperature of 200-250 ℃ through a hot press to form a sheet shape to form a continuous prepreg plate (2);
4) manufacturing a circuit board: stacking a prepared circuit substrate (1), a prepreg plate (2), a honeycomb radiating thin plate (3) and a copper foil plate (4) prepared after etching, carrying out hot press molding at 200-250 ℃ by a hot press to obtain a circuit board, and forming a carbon paste through hole (7), a copper foil bulge (8), a carbon paste bulge (9), a blind groove (10) and a radiating hole (12) on the copper foil plate (4);
5) manufacturing a carbon slurry plate: grinding the carbon slurry by a grinding machine, sieving after grinding, filtering out large-particle carbon, pouring the carbon slurry into the carbon slurry through hole (7), and then drying in a drying oven to enable the carbon slurry to be solidified and attached to the hole wall, and form a copper foil bulge (8) and a carbon slurry bulge (9) with the copper foil plate (4) to enable the copper foil plates (4) of the upper layer and the lower layer to be conducted, and forming an occlusion thread (11) on the carbon slurry through hole (7), thereby finally obtaining the carbon slurry through hole circuit board.
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| CN202110230455.2A CN113038695A (en) | 2021-03-02 | 2021-03-02 | Carbon paste through hole circuit board and preparation method thereof |
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| CN202110230455.2A CN113038695A (en) | 2021-03-02 | 2021-03-02 | Carbon paste through hole circuit board and preparation method thereof |
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Application publication date: 20210625 |