CN102155667A - LED (light emitting diode) lamp fitting with two sides capable of radiating heat and resisting dust - Google Patents
LED (light emitting diode) lamp fitting with two sides capable of radiating heat and resisting dust Download PDFInfo
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- CN102155667A CN102155667A CN2011100963689A CN201110096368A CN102155667A CN 102155667 A CN102155667 A CN 102155667A CN 2011100963689 A CN2011100963689 A CN 2011100963689A CN 201110096368 A CN201110096368 A CN 201110096368A CN 102155667 A CN102155667 A CN 102155667A
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Abstract
The invention provides an LED (light emitting diode) lamp fitting with two sides capable of radiating heat and resisting dust. The lamp fitting comprises a radiating base plate and radiating fins, and is characterized in that two side surfaces of the base plate are provided with the radiating fins. According to the invention, two sides of an aluminum plate are cut into the fins, the distance of a thermal loop is shortened, and the radiating effect is better. When in use, the aluminum plate is placed vertically, the technical scheme more confirms to the principle of air convection, and the flow speed of the hot air can be accelerated in the vertical direction; and the problems of bird droppings and dust covering can be solved through the radiating fins arranged vertically. According to the invention, because LEDs are installed close to the edge of the bottom surface or at the bottom part on one side surface of the aluminum plate, only a plane with smaller electroplating is required, and the process cost is lowered.
Description
Technical field
The present invention relates to the LED lamp, particularly, relate to both sides heat radiation and dustproof LED light fixture.
Background technology
LED is a kind of semiconductor that electric energy can be converted into visible light, and it has changed the luminous and luminous principle of electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, and adopts electroluminescence.LED have the life-span long, light efficiency is high, radiationless and low in power consumption.High-power LED generally has 0.5W, 1W, 3W, 5W, also have more high-power, but along with its heat radiation of the raising of LED power increases too, mostly to be all be single application to high-power LED now, and add very big fin.
Radiating fin of the prior art mostly just is arranged on the single side face of heat-radiating substrate, and another side of heat-radiating substrate is electroplated so that the LED lamp to be installed.But the hot loop of this mode distance is longer, and the basic whole side of dispelling the heat electroplated makes the cost of product increase.Therefore be necessary to develop a kind of product that can on the basis that guarantees radiating effect, reduce the plating area.
Summary of the invention
At defective of the prior art, the purpose of this invention is to provide heat radiation of a kind of both sides and dustproof LED light fixture.
According to an aspect of the present invention, provide both sides heat radiation and dustproof LED light fixture, comprise heat-radiating substrate, radiating fin, it is characterized in that, all be provided with described radiating fin on two sides of described heat-radiating substrate.
Preferably, the bottom surface of described heat-radiating substrate is a lamp pearl installed surface.
Preferably, being provided with reservation face near near the edge of bottom surface on the side of described heat-radiating substrate, described radiating fin is not set in described reservation face.
Preferably, described radiating fin and described heat-radiating substrate are in aggregates, and described radiating fin extends at perpendicular or transverse plane.
Preferably, also comprise the lamp pearl, wherein, be disposed with conductive solder material layer, copper foil layer, insulating barrier and heat conduction coating between described lamp pearl and the heat-radiating substrate.
Preferably, the positive and negative electrode pad of described lamp pearl is connected in the electric loop of described copper foil layer by described conductive solder material layer respectively.
Preferably, also be provided with the heat conduction weld material layer between described lamp pearl and the heat-radiating substrate, wherein, described lamp pearl has thermal land, wherein, described thermal land connects described heat conduction coating by described heat conduction weld material layer, described thermal land between described positive electrode pad and negative electrode pad or a side.
Preferably, described heat conduction coating comprises any coating in the following coating: silvering; Tin coating: silver-colored tin composite deposite, it comprises silver layer and tin layer, and wherein, described silver layer is plated on the described heat-radiating substrate, and described tin layer is plated on the described silver layer.
Preferably, the material of described insulating barrier is mica, PETG or polyimides.
Preferably, described radiating fin is formed by described heat-radiating substrate cutting, and described conductive solder material layer is the conductive silver glue-line, and described heat conduction weld material layer is a heat conduction elargol layer.
The present invention forms fin in the cutting of the both sides of an aluminium sheet, has shortened the distance of hot loop, and radiating effect is better.Aluminium sheet is vertically placed during use, and such technical scheme more meets the principle of air type of thermal communication, can quicken hot-air flowing velocity in vertical direction; Vertically disposed radiating fin can also solve the problem of birds droppings and dust covering.Because the present invention installs LED near the edge annex of bottom surface or in the bottom on aluminium sheet one side, so only need electroplate less plane, the technology cost reduces.
Description of drawings
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present invention will become:
Fig. 1 illustrates according to the first embodiment of the present invention, the bottom surface topology view of both sides heat radiation and dustproof LED light fixture;
Fig. 2 illustrates according to the first embodiment of the present invention, the side structure view of both sides heat radiation and dustproof LED light fixture;
Fig. 3 illustrates according to the first embodiment of the present invention, the syndeton view of both sides heat radiation and dustproof LED light fixture and lamp pearl;
Fig. 4 illustrates according to a specific embodiment of the present invention, and the LED lamp has each pad configuration schematic diagram;
Fig. 5 illustrates according to another specific embodiment of the present invention, and the LED lamp has each pad configuration schematic diagram.
The specific embodiment
Engage illustrated in figures 1 and 2, particularly, in the present embodiment, heat radiation of described both sides and dustproof LED light fixture comprise heat-radiating substrate 6, radiating fin (for example radiating fin 61 and 62), wherein, all be provided with described radiating fin on two of described heat-radiating substrate 6 sides.For example, radiating fin 61 is arranged on the side of described heat-radiating substrate 6, and radiating fin 62 is arranged on another side of described heat-radiating substrate 6.Preferably, the bottom surface of described heat-radiating substrate 6 is a lamp pearl installed surface, on described lamp pearl installed surface lamp pearl 9 is installed.Preferably, as shown in Figure 2,, in described reservation face 60, be not provided with described radiating fin, comprise not cutting forming described radiating fin being provided with reservation face 60 near near the edge of bottom surface on the side of described heat-radiating substrate.Preferably, described radiating fin 61,62 and described heat-radiating substrate 6 are in aggregates, and described radiating fin 61,62 extends in perpendicular or transverse plane.Described heat-radiating substrate 6 is preferably made by aluminium sheet.
Further, Fig. 3 illustrates according to the first embodiment of the present invention, the syndeton view of both sides heat radiation and dustproof LED light fixture and lamp pearl.Particularly, in the present embodiment, be disposed with conductive solder material layer 82, copper foil layer 3, insulating barrier 1 and heat conduction coating 5 between described lamp pearl 9 and the heat-radiating substrate 6.Wherein, described insulating barrier 1 is fixed on the described heat conduction coating 5 by epoxy resin layer 4, and this is a kind of both economical mode, can reduce the cost of described light fixture.Wherein, described copper foil layer 3 comprises electrical circuit 2.The positive and negative electrode pad 91,93 of described lamp pearl 9 is connected in the electric loop 2 of described copper foil layer 3 by described conductive solder material layer 82 respectively.
More specifically, also be provided with heat conduction weld material layer 81 between described lamp pearl 9 and the heat-radiating substrate 6, wherein, described lamp pearl 9 comprises some thermal lands 92, and wherein, described thermal land 92 connects described heat conduction coating 5 by described heat conduction weld material layer 81.Leave gap 901 between described thermal land 92 and the described positive electrode pad 91, leave gap 902 between described thermal land 92 and the described negative electrode pad 93, correspondingly, do not contact between described conductive solder material layer 82 and the described heat conduction weld material layer 81.The present invention is connected to copper foil layer with the electrode pad of lamp pearl by the conductive solder material layer, the thermal land of lamp pearl is connected on the heat conduction coating by the heat conduction weld material layer, and this non-mechanical connected mode makes heat conductivility greatly improve and structural strength is stablized.
Wherein, can there be multiple position relation in described thermal land 92, positive electrode pad 91 and negative electrode pad 93, and preferably, described thermal land 92 is between described positive electrode pad 91 and negative electrode pad 93.For example shown in Figure 4, described thermal land 92 is between described positive electrode pad 91 and negative electrode pad 93, leave gap 901 between described thermal land 92 and the described positive electrode pad 91, leave gap 902 between described thermal land 92 and the described negative electrode pad 93, correspondingly, do not contact between described conductive solder material layer 82 and the described heat conduction weld material layer 81.And change in the example at one, as shown in Figure 5, described thermal land 92 is positioned at a side of described positive electrode pad 91 and negative electrode pad 93.
In a preference of present embodiment, described heat conduction coating 5 can be silvering or tin coating; Described heat conduction coating 5 can also be silver-colored tin composite deposite, and it comprises silver layer and tin layer, and wherein, described silver layer is plated on the described heat-radiating substrate 6, and described tin layer is plated on the described silver layer.Described tin layer connects described thermal land 92 by described heat conduction weld material layer 81.More preferably, the material of described insulating barrier 1 is mica, PETG or polyimides.Further, described radiating fin is formed by described heat-radiating substrate 6 cuttings, and described conductive solder material layer 82 is the conductive silver glue-line, and described heat conduction weld material layer 81 is heat conduction elargol layer, the thickness and the cutting angle of material when wherein, the thickness of described radiating fin and area depend on cutting.
Though only at the less LED lamp of bottom surface installation, the present invention has shortened the distance of hot loop by forming fin in the cutting of the both sides of heat-radiating substrate in the present invention, radiating effect is better, therefore can use more high-power LED lamp pearl, realizes the effect of same brightness.Aluminium sheet is vertically placed during use, makes described radiating fin be positioned at vertical plane, and such technical scheme more meets the principle of air type of thermal communication, can quicken hot-air flowing velocity in vertical direction; Vertically disposed radiating fin can also solve the problem of birds droppings and dust covering.Because the present invention installs LED in the bottom of aluminium sheet, so only need electroplate less plane, the technology cost reduces.And in a specific embodiment, described radiating fin can also horizontally set, can reduce the processing cost of described LED light fixture like this.
More than specific embodiments of the invention are described.It will be appreciated that the present invention is not limited to above-mentioned specific implementations, those skilled in the art can make various distortion or modification within the scope of the claims, and this does not influence flesh and blood of the present invention.
Claims (10)
1. dispel the heat and dustproof LED light fixture in both sides, comprises heat-radiating substrate, radiating fin, it is characterized in that, all is provided with described radiating fin on two sides of described heat-radiating substrate.
2. LED light fixture according to claim 1 is characterized in that, being provided with reservation face near near the edge of bottom surface on the side of described heat-radiating substrate, described radiating fin is not set in described reservation face.
3. LED light fixture according to claim 2 is characterized in that, the bottom surface of described heat-radiating substrate is a lamp pearl installed surface.
4. LED light fixture according to claim 3 is characterized in that described radiating fin extends in perpendicular or transverse plane, and in aggregates with described heat-radiating substrate.
5. LED light fixture according to claim 4 is characterized in that, also comprises the lamp pearl, wherein, is disposed with conductive solder material layer, copper foil layer, insulating barrier and heat conduction coating between described lamp pearl and the heat-radiating substrate.
6. LED light fixture according to claim 5 is characterized in that, the positive and negative electrode pad of described lamp pearl is connected in the electric loop of described copper foil layer by described conductive solder material layer respectively.
7. LED light fixture according to claim 6, it is characterized in that, also be provided with the heat conduction weld material layer between described lamp pearl and the heat-radiating substrate, wherein, described lamp pearl has thermal land, wherein, described thermal land connects described heat conduction coating by described heat conduction weld material layer, described thermal land between described positive electrode pad and negative electrode pad or a side.
8. LED light fixture according to claim 7 is characterized in that, described heat conduction coating comprises any coating in the following coating:
Silvering;
Tin coating:
Silver tin composite deposite, it comprises silver layer and tin layer, and wherein, described silver layer is plated on the described heat-radiating substrate, and described tin layer is plated on the described silver layer.
9. LED light fixture according to claim 8 is characterized in that, the material of described insulating barrier is mica, PETG or polyimides.
10. according to each described LED light fixture in the claim 1 to 9, it is characterized in that described radiating fin is formed by described heat-radiating substrate cutting, described conductive solder material layer is the conductive silver glue-line, and described heat conduction weld material layer is a heat conduction elargol layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100963689A CN102155667A (en) | 2011-04-18 | 2011-04-18 | LED (light emitting diode) lamp fitting with two sides capable of radiating heat and resisting dust |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100963689A CN102155667A (en) | 2011-04-18 | 2011-04-18 | LED (light emitting diode) lamp fitting with two sides capable of radiating heat and resisting dust |
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| CN102155667A true CN102155667A (en) | 2011-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011100963689A Pending CN102155667A (en) | 2011-04-18 | 2011-04-18 | LED (light emitting diode) lamp fitting with two sides capable of radiating heat and resisting dust |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297409A (en) * | 2011-08-29 | 2011-12-28 | 吴江多艺纺织有限公司 | Heat radiator for LED (Light Emitting Diode) lamp |
| CN102519027A (en) * | 2011-11-21 | 2012-06-27 | 王振辉 | Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof |
| CN104566292A (en) * | 2013-10-29 | 2015-04-29 | 蔡鸿 | High-light-efficiency high-heat-conduction heat radiating structure of LED (light emitting diode) capable of emitting light in omnibearing way |
| CN105402662A (en) * | 2015-12-16 | 2016-03-16 | 江苏豪迈照明科技有限公司 | Streetlamp |
| CN111174112A (en) * | 2019-11-25 | 2020-05-19 | 苏州汉瑞森光电科技股份有限公司 | LED module structure |
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| CN201259194Y (en) * | 2008-10-08 | 2009-06-17 | 史杰 | LED packaged illumination circuit board of high thermal conductivity |
| CN201340859Y (en) * | 2008-12-24 | 2009-11-04 | 和谐光电科技（泉州）有限公司 | Slot type LED radiating module with high heat radiation |
| CN201615463U (en) * | 2010-03-16 | 2010-10-27 | 江苏史福特光电科技有限公司 | Novel LED light source heat-conduction structure |
| CN102003662A (en) * | 2010-11-18 | 2011-04-06 | 深圳市华星光电技术有限公司 | Edge type backlight module capable of strengthening local cooling |
| CN201983070U (en) * | 2011-04-18 | 2011-09-21 | 黄晓华 | Light-emitting diode (LED) lamp radiating and preventing dust on two sides |
-
2011
- 2011-04-18 CN CN2011100963689A patent/CN102155667A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201259194Y (en) * | 2008-10-08 | 2009-06-17 | 史杰 | LED packaged illumination circuit board of high thermal conductivity |
| CN201340859Y (en) * | 2008-12-24 | 2009-11-04 | 和谐光电科技（泉州）有限公司 | Slot type LED radiating module with high heat radiation |
| CN201615463U (en) * | 2010-03-16 | 2010-10-27 | 江苏史福特光电科技有限公司 | Novel LED light source heat-conduction structure |
| CN102003662A (en) * | 2010-11-18 | 2011-04-06 | 深圳市华星光电技术有限公司 | Edge type backlight module capable of strengthening local cooling |
| CN201983070U (en) * | 2011-04-18 | 2011-09-21 | 黄晓华 | Light-emitting diode (LED) lamp radiating and preventing dust on two sides |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297409A (en) * | 2011-08-29 | 2011-12-28 | 吴江多艺纺织有限公司 | Heat radiator for LED (Light Emitting Diode) lamp |
| CN102519027A (en) * | 2011-11-21 | 2012-06-27 | 王振辉 | Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof |
| CN104566292A (en) * | 2013-10-29 | 2015-04-29 | 蔡鸿 | High-light-efficiency high-heat-conduction heat radiating structure of LED (light emitting diode) capable of emitting light in omnibearing way |
| WO2015062135A1 (en) * | 2013-10-29 | 2015-05-07 | 蔡鸿 | Led light source heat dissipation structure and heat dissipation method thereof |
| CN104566292B (en) * | 2013-10-29 | 2017-06-16 | 蔡鸿 | A kind of specular removal high heat conduction radiator structure of the comprehensive light extractions of LED |
| CN105402662A (en) * | 2015-12-16 | 2016-03-16 | 江苏豪迈照明科技有限公司 | Streetlamp |
| CN111174112A (en) * | 2019-11-25 | 2020-05-19 | 苏州汉瑞森光电科技股份有限公司 | LED module structure |
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Application publication date: 20110817 |