CN215617578U - Circuit board substrate clamp - Google Patents
Circuit board substrate clamp Download PDFInfo
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- CN215617578U CN215617578U CN202121824464.6U CN202121824464U CN215617578U CN 215617578 U CN215617578 U CN 215617578U CN 202121824464 U CN202121824464 U CN 202121824464U CN 215617578 U CN215617578 U CN 215617578U
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- clamp body
- groove
- clamping
- circuit board
- board substrate
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Abstract
The utility model discloses a circuit board substrate clamp which comprises a first clamp body, a second clamp body and a clamping mechanism, wherein the first clamp body and the second clamp body are both in a rectangular block shape, the end part of the first clamp body is connected with the end part of the second clamp body, the clamping mechanism comprises a first clamping part and a second clamping part, the first clamping part is arranged on the upper surface of the first clamp body, the second clamping part is arranged on the outer surface, facing the first clamp body, of the second clamp body, the first clamping part and the second clamping part are alternately arranged along the horizontal direction, the second clamping part and the third clamping part are alternately arranged along the vertical direction, and the first groove and the third groove are used for clamping a ceramic substrate. The circuit board substrate clamp provided by the utility model can conveniently place the ceramic substrate, saves space and can quickly dissipate heat.
Description
Technical Field
The utility model relates to the field of circuit board manufacturing, in particular to a circuit board substrate clamp.
Background
The ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single side or double sides) of an alumina or aluminum nitride ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, ceramic substrates have become the basic material for high power electronic circuit structure technology and interconnection technology. In the circuit board preparation flow, ceramic substrate temperature is than higher, needs better radiating environment, and now, a lot of ceramic substrates all dispel the heat through the mode of flattening or stacking, are difficult to dispel the heat like this and inconvenient ceramic substrate of placing to occupy great place.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides a circuit board substrate clamp which can conveniently place a ceramic substrate, save space and quickly dissipate heat.
The utility model also provides a circuit board comprising the circuit board substrate clamp.
The circuit board substrate clamp comprises a first clamp body, a second clamp body and a clamping mechanism, the first clamp body and the second clamp body are both in a rectangular block shape, the end part of the first clamp body is connected with the end part of the second clamp body, the clamping mechanism comprises a first clamping part and a second clamping part, the first clamping part is arranged on the upper surface of the first clamp body, the second clamping component is arranged on the outer surface of the second clamp body facing the first clamp body, the first clamping component is alternately provided with a first groove and a second groove along the horizontal direction, the second clamping component is alternately provided with a third groove and a fourth groove along the vertical direction, the extending direction of the third groove and the extending direction of the fourth groove are perpendicular to the extending direction of the first groove and the extending direction of the second groove, and the first groove and the third groove are used for clamping and connecting a ceramic substrate.
The circuit board substrate clamp provided by the embodiment of the utility model at least has the following beneficial effects: the circuit board substrate clamp provided by the embodiment of the utility model mainly comprises a first clamp body, a second clamp body and a clamping mechanism, is simple in structure, easy to produce and convenient for heat dissipation of a ceramic substrate, the first clamping component and the second clamping component are respectively provided with the first groove and the third groove for clamping the ceramic substrate, the ceramic substrate can be stably placed, the first clamping component is provided with the second groove, and the second clamping component is provided with the fourth groove, so that the heat dissipation of the ceramic substrate is facilitated.
According to some embodiments of the utility model, the first clamping member and the second clamping member are each provided with a plurality of through holes, and the second groove and the fourth groove are each in communication with the through holes.
According to some embodiments of the utility model, the first clamp body and the second clamp body are further provided with a plurality of positioning holes, and the positioning holes are arranged at the ends of the first clamp body and the second clamp body.
According to some embodiments of the utility model, the clamping mechanism is formed by bending a sheet of metal iron.
According to some embodiments of the utility model, the first clip body and the second clip body are both made of a metal material.
According to some embodiments of the utility model, the first groove and the third groove are each triangular in shape.
According to some embodiments of the utility model, the second groove and the fourth groove are each trapezoidal in shape.
According to some embodiments of the present invention, the circuit board substrate fixture further comprises a frame body connected to the ends of the first clamp body and the second clamp body.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
Additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a front view of a circuit board substrate fixture according to an embodiment of the present invention;
FIG. 2 is a top view of a circuit board substrate fixture in accordance with an embodiment of the present invention;
fig. 3 is a left side view of a circuit board substrate fixture in an embodiment of the utility model.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, if there are first and second described only for the purpose of distinguishing technical features, it is not understood that relative importance is indicated or implied or that the number of indicated technical features or the precedence of the indicated technical features is implicitly indicated or implied.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
The embodiments of the present invention will be further explained with reference to the drawings.
Referring to fig. 1 to 3, a circuit board substrate clamp according to an embodiment of the present invention includes a first clamping body 100, a second clamping body 110, and a clamping mechanism 120, where the first clamping body 100 and the second clamping body 110 are both rectangular blocks, an end of the first clamping body 100 is connected to an end of the second clamping body 110, the clamping mechanism 120 includes a first clamping member 121 and a second clamping member 122, the first clamping member 121 is disposed on an upper surface of the first clamping body 100, the second clamping member 122 is disposed on an outer surface of the second clamping body 110 facing the first clamping body 100, the first clamping member 121 is alternately provided with a first groove 1211 and a second groove 1212 along a horizontal direction, the second clamping member 122 is alternately provided with a third groove 1221 and a fourth groove 1222 along a vertical direction, and the first groove 1211 and the third groove 1221 are both used for clamping the ceramic substrate 130. The circuit board substrate clamp of the embodiment of the utility model mainly comprises a first clamp 100, a second clamp 110 and a clamping mechanism 120, and has the advantages of simple structure, easy production and convenience for heat dissipation of a ceramic substrate 130, wherein the first clamping part 121 and the second clamping part 122 are respectively provided with a first groove 1211 and a third groove 1221 for clamping the ceramic substrate 130, the ceramic substrate 130 can be stably placed, the first clamping part 121 is provided with a second groove 1212, and the second clamping part 122 is provided with a fourth groove 1222, so that the heat dissipation of the ceramic substrate 130 is facilitated.
According to some embodiments of the present invention, in order to further improve the heat dissipation performance of the circuit board substrate clamp, the first clamping member 121 and the second clamping member 122 are provided with a plurality of through holes 1213, and the second groove 1212 and the fourth groove 1222 are both communicated with the through holes 1213.
According to some embodiments of the present invention, in order to prevent the circuit board substrate clamp from turning over during the reproduction process, the first clamp body 100 and the second clamp body 110 are further provided with a plurality of positioning holes 101, the positioning holes 101 are disposed at the ends of the first clamp body 100 and the second clamp body 110, and during the production process, the fixing rod penetrates through the positioning holes 101 to fix the circuit board substrate clamp.
According to some embodiments of the present invention, the clamping mechanism 120 is formed by bending a metal iron sheet, and the metal iron sheet is bent to form alternate grooves, which are advantageous for heat dissipation on one hand and for placing the ceramic substrate 130 on the other hand.
According to some embodiments of the present invention, the first collet 100 and the second collet 110 are both made of a metallic material.
According to some embodiments of the present invention, the first groove 1211 and the third groove 1221 are each triangular in shape, so that the ceramic substrate 130 can be clamped more stably.
According to some embodiments of the present invention, the second groove 1212 and the fourth groove 1222 each have a trapezoidal shape.
According to some embodiments of the present invention, the circuit board substrate holder further comprises a frame body 140 for easy extraction, and the frame body 140 is connected to the ends of the first and second clamping bodies 100 and 110.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (8)
1. A circuit board substrate clamp is characterized by comprising a first clamp body, a second clamp body and a clamping mechanism, the first clamp body and the second clamp body are both in a rectangular block shape, the end part of the first clamp body is connected with the end part of the second clamp body, the clamping mechanism comprises a first clamping part and a second clamping part, the first clamping part is arranged on the upper surface of the first clamp body, the second clamping component is arranged on the outer surface of the second clamp body facing the first clamp body, the first clamping component is alternately provided with a first groove and a second groove along the horizontal direction, the second clamping component is alternately provided with a third groove and a fourth groove along the vertical direction, the extending direction of the third groove and the extending direction of the fourth groove are perpendicular to the extending direction of the first groove and the extending direction of the second groove, and the first groove and the third groove are used for clamping and connecting a ceramic substrate.
2. The circuit board substrate holder according to claim 1, wherein: the first clamping part and the second clamping part are provided with a plurality of through holes, and the second groove and the fourth groove are communicated with the through holes.
3. The circuit board substrate holder according to claim 1, wherein: the first clamp body and the second clamp body are further provided with a plurality of positioning holes, and the positioning holes are formed in the end portions of the first clamp body and the second clamp body.
4. The circuit board substrate holder according to claim 1, wherein: the circuit board substrate clamp further comprises a frame body, and the frame body is connected to the end portions of the first clamp body and the second clamp body.
5. The circuit board substrate holder according to claim 1, wherein: the clamping mechanism is formed by bending a metal iron sheet.
6. The circuit board substrate holder according to claim 1, wherein: the first clamp body and the second clamp body are both made of metal materials.
7. The circuit board substrate holder according to claim 1, wherein: the first groove and the third groove are both triangular.
8. The circuit board substrate holder according to claim 1, wherein: the second groove and the fourth groove are both trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121824464.6U CN215617578U (en) | 2021-08-05 | 2021-08-05 | Circuit board substrate clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121824464.6U CN215617578U (en) | 2021-08-05 | 2021-08-05 | Circuit board substrate clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215617578U true CN215617578U (en) | 2022-01-25 |
Family
ID=79895427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121824464.6U Active CN215617578U (en) | 2021-08-05 | 2021-08-05 | Circuit board substrate clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215617578U (en) |
-
2021
- 2021-08-05 CN CN202121824464.6U patent/CN215617578U/en active Active
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