CN103757685A - Ceramic circuit board clamp used for electroplating - Google Patents
Ceramic circuit board clamp used for electroplating Download PDFInfo
- Publication number
- CN103757685A CN103757685A CN201410037041.8A CN201410037041A CN103757685A CN 103757685 A CN103757685 A CN 103757685A CN 201410037041 A CN201410037041 A CN 201410037041A CN 103757685 A CN103757685 A CN 103757685A
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- Prior art keywords
- clamp
- circuit board
- ceramic circuit
- clamping plate
- base plate
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- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a ceramic circuit board clamp used for electroplating. The key point of the technical scheme is that the ceramic circuit board clamp comprises a baseplate, wherein a plurality of clamp plates are vertically arranged on the baseplate; an edge strip clamping groove used for placing a conductive edge strip is formed in the upper end of each clamp plate; a vertical chuck plate shallow groove communicated with the edge strip clamping groove and used for allowing the side part of a ceramic circuit board to be inserted into is formed in the side surface of the clamp plate; threaded holes are formed in the clamp plates on two sides of edge strip clamping grooves; adjustable screws used for pressing the sides of the conductive edge strips to clamp the ceramic circuit board are arranged in the threaded holes; the clamp plate can be processed into a movable clamp plate moving along the baseplate, so that ceramic circuit boards with different sizes can be clamped; the structure is simple; the operation is convenient. According to the ceramic circuit board clamp, as the adjustable screws are used for pressing the conductive edge strips and the two conductive edge strips are adopted to clamp the ceramic circuit board, the clamping area is increased; the problems in an electroplating process that the ceramic circuit board is damaged by an electroplating clamp or broken and dropped into an electroplate liquid due to vibration of equipment in a product line can be prevented.
Description
[technical field]
The present invention relates to a kind of fixture of circuit card, the fixture of using when especially a kind of ceramic circuit board is electroplated.
[background technology]
Because ceramic circuit board has good heat conduction, heat radiation, the characteristic such as corrosion-resistant and high temperature resistant, can effectively reduce former because LED lamp is overheated, support plate is aging etc. thereby cause a large amount of light fixtures to scrap the solid waste of generation to the impact of environment, by people, be widely used in the fields such as LED TV, LED computer, LED street lamp/Tunnel Lamp, LED Landscape Lighting.As the high-heat-conductivity ceramic circuit board of LED lamp carrier, due to developing rapidly of LED industry, cause market also constantly to increase the demand of ceramic plate, the market outlook of ceramic circuit board are boundless.Therefore, PCB industry is also more and more paid attention to the processing and fabricating of ceramic circuit board, further strengthens dynamics of investment, expands the scale of production etc.
Traditional ceramic circuit board, no matter be alumina ceramic plate, or alumimium nitride ceramic sheet, all have the situations such as hardness is large, matter is crisp, and pottery is originally as non-hydroaropic substance, adopts general electroless copper plating liquid medicine cannot make its surface deposition and make ceramic copper-clad plate, therefore the surperficial Copper Foil of ceramic circuit board is mostly rolled copper foil or sintering Copper Foil, this Copper Foil is after clean, microetch, washing are processed, and from just seeing in appearance: copper foil surface is coarse, generally copper is thick does not reach requirement yet.Need again add plating to it, make it plated surface last layer electrolytic copper foil, thereby reach client to ceramic product outward appearance and the thick requirement of copper.But due to ceramic circuit board small volume, matter is crisp frangible, existing ceramic circuit board clamp is electroplated thickening and is prone to defects such as being caught broken circuit card during copper clamping circuit card.
[summary of the invention]
The present invention seeks to have overcome the deficiencies in the prior art, provide a kind of simple in structure, easy to operate, the plating that electroplating effect is good ceramic circuit board clamp, and can effectively reduce the cost that ceramic circuit board is caught broken when plating and scrap.
The present invention is achieved by the following technical solutions:
A kind of plating used ceramic circuit board clamp, it is characterized in that: include base plate 1, on described base plate 1, be vertically provided with polylith clamping plate 2, described clamping plate 2 upper ends are provided with the edge strip draw-in groove 3 for placing conduction edge strip 9, described clamping plate 1 side is provided with the vertical clamp shallow slot 6 that communicates with edge strip draw-in groove 3 and insert for ceramic circuit board 10 sidepieces, on the clamping plate 2 of described edge strip draw-in groove 3 both sides, be respectively equipped with threaded hole 4, in described threaded hole 4, be provided with top and press conduction edge strip 9 sides to clamp the adjustable screw 5 of ceramic circuit board 10.
Plating as above ceramic circuit board clamp, is characterized in that: described base plate 1 upper surface is provided with the horizontal clamp shallow slot 7 that communicates with described vertical clamp shallow slot 6 and insert for ceramic circuit board 10 bottoms.
Plating as above ceramic circuit board clamp, it is characterized in that: described clamping plate 2 comprise the stationary jaw 21 being fixed on described base plate 1 and are located at the removable clamping plate 22 that stationary jaw 21 1 sides can move horizontally along base plate 1, described stationary jaw 21 is provided with described vertical clamp shallow slot 6 towards the side of removable clamping plate 22, described removable clamping plate 22 two sides are equipped with described vertical clamp shallow slot 6.
Plating as above ceramic circuit board clamp, is characterized in that: described clamping plate 2 are the removable clamping plate 22 that can move horizontally along described base plate 1, and described removable clamping plate 22 two sides are equipped with described vertical clamp shallow slot 6.
Plating as above ceramic circuit board clamp, it is characterized in that: described clamping plate 2 comprise the stationary jaw 21 being fixed on described base plate 1 and the removable clamping plate 22 that are located at stationary jaw 21 both sides, and described stationary jaw 21 and removable clamping plate 22 two sides are equipped with described vertical clamp shallow slot 6.
Plating as above ceramic circuit board clamp, it is characterized in that: described base plate 1 both sides are provided with rail groove 11, described removable clamping plate 22 bottoms are provided with the chute 8 that passes and communicate with described vertical clamp shallow slot 6 for base plate 1, in described chute 8, are provided with and can insert the slide block 81 that in rail groove 11, removable clamping plate 22 is moved along described base plate 1.
Plating as above ceramic circuit board clamp, is characterized in that: described base plate 1 and clamping plate 2 all adopt Teflon material.
Compared with prior art, the present invention has the following advantages:
1, fixture of the present invention is by pressing conduction edge strip with adjustable screw top, with two conduction edge strips, clamp ceramic circuit board again, increase the area clamping, in the time of can avoiding ceramic circuit board to electroplate, be plated that clip is caught broken or fall in electroplate liquid because the vibrations fragmentation of production line machinery equipment comes off.
2, fixture of the present invention is provided with the removable clamping plate that can move along described base plate on base plate, can clamp the ceramic circuit board of different sizes, and can make various ways, and simple in structure, easy to operate, practicality is very strong.
[accompanying drawing explanation]
Fig. 1 is the stereographic map 1 of the embodiment of the present invention one;
Fig. 2 is the stereographic map 2 of the embodiment of the present invention one;
Fig. 3 is the use state decomposition figure of the embodiment of the present invention one;
Fig. 4 is the stereographic map of the embodiment of the present invention two;
Fig. 5 is the stereographic map of the embodiment of the present invention three;
In figure; 1 is base plate; 2 is clamping plate; 21 is stationary jaw; 22 is removable clamping plate; 3 is edge strip draw-in groove; 4 is threaded hole; 5 is adjustable screw; 6 is vertical clamp shallow slot; 7 is horizontal clamp shallow slot; 8 is chute; 81 is slide block; 9 is conduction edge strip; 10 is ceramic circuit board; 11 is rail groove.
[embodiment]
Below in conjunction with accompanying drawing, the invention will be further described:
A kind of plating used ceramic circuit board clamp, include base plate 1, on described base plate 1, be vertically provided with polylith clamping plate 2, described clamping plate 2 upper ends are provided with the edge strip draw-in groove 3 for placing conduction edge strip 9, described clamping plate 1 side is provided with the vertical clamp shallow slot 6 that communicates with edge strip draw-in groove 3 and insert for ceramic circuit board 10 sidepieces, the clamping plate 2 of described edge strip draw-in groove 3 both sides are provided with threaded hole 4, be provided with top and press conduction edge strip 9 sides to clamp the adjustable screw 5 of ceramic circuit board 10 in described threaded hole 4.
In use procedure, first clean ceramic circuit board 10 surface cleaning, then ceramic circuit board 10 is put in the vertical clamp shallow slot 6 of fixture, with two conduction edge strips 9 put in edge strip draw-in groove 3, again adjustable screw 5 is put in threaded hole 4, screw adjustable screw 5, top is pressed conduction edge strip 9 outer sides to clamp ceramic circuit board 10 with regard to available two conduction edge strips 9 and is placed on plating line and has thickeied copper.
Rock when preventing that ceramic circuit board 10 from electroplating, further clamp ceramic circuit board 10, at base plate 1 upper surface, be provided with the horizontal clamp shallow slot 7 that communicates with described vertical clamp shallow slot 6 and insert for ceramic circuit board 10 bottoms.
The clamping plate 2 that are located on base plate 1 can have various ways, can comprise the stationary jaw 21 being fixed on described base plate 1 and be located at the removable clamping plate 22 that stationary jaw 21 1 sides can move horizontally along base plate 1, described stationary jaw 21 is provided with described vertical clamp shallow slot 6 towards the side of removable clamping plate 22, described removable clamping plate 22 two sides are equipped with described vertical clamp shallow slot 6, as shown in Figure 1.
Described clamping plate 2 also can be the removable clamping plate 22 that can move horizontally along described base plate 1, and described removable clamping plate 22 two sides are equipped with described vertical clamp shallow slot 6, as shown in Figure 4.
The third form of clamping plate 2 is: described clamping plate 2 comprise the stationary jaw 21 being fixed on described base plate 1 and the removable clamping plate 22 that are located at stationary jaw 21 both sides, described stationary jaw 21 and removable clamping plate 22 two sides are equipped with described vertical clamp shallow slot 6, as shown in Figure 5.
The present invention, by removable clamping plate 22 are set, can regulate the position of removable clamping plate 22 to clamp ceramic circuit board 10 according to the different size of ceramic circuit board 10.The length of base plate 1, the quantity of removable clamping plate 22 are depending on factory's plating line practical situation.
The implementation structure that removable clamping plate 22 can move horizontally along stationary jaw 21 is as follows: described stationary jaw 21 both sides are provided with rail groove 11, described removable clamping plate 22 bottoms are provided with the chute 8 that passes and communicate with described vertical clamp shallow slot 6 for base plate 1, thereby be provided with in described chute 8, can insert the slide block 81 that in rail groove 11, removable clamping plate 22 is moved along described base plate 1.
Described base plate 1 and the preferred Teflon material of clamping plate 2.Teflon material material neither with electroplating liquid medicine generation chemical reaction, quality is very light again.
Claims (7)
1. a plating ceramic circuit board clamp, it is characterized in that: include base plate (1), on described base plate (1), be vertically provided with polylith clamping plate (2), described clamping plate (2) upper end is provided with the edge strip draw-in groove (3) for placing conduction edge strip (9), described clamping plate (1) side is provided with the vertical clamp shallow slot (6) that communicates with edge strip draw-in groove (3) and insert for ceramic circuit board (10) sidepiece, on the clamping plate (2) of described edge strip draw-in groove (3) both sides, be respectively equipped with threaded hole (4), in described threaded hole (4), being provided with top presses conduction edge strip (9) side to clamp the adjustable screw (5) of ceramic circuit board (10).
2. plating according to claim 1 ceramic circuit board clamp, is characterized in that: described base plate (1) upper surface is provided with the horizontal clamp shallow slot (7) that communicates with described vertical clamp shallow slot (6) and insert for ceramic circuit board (10) bottom.
3. plating according to claim 2 ceramic circuit board clamp, it is characterized in that: described clamping plate (2) comprise the stationary jaw (21) being fixed on described base plate (1) and are located at the removable clamping plate (22) that stationary jaw (21) one sides can move horizontally along base plate (1), described stationary jaw (21) is provided with described vertical clamp shallow slot (6) towards the side of removable clamping plate (22), described removable clamping plate (22) two sides are equipped with described vertical clamp shallow slot (6).
4. plating according to claim 2 ceramic circuit board clamp, it is characterized in that: described clamping plate (2) are the removable clamping plate (22) that can move horizontally along described base plate (1), described removable clamping plate (22) two sides are equipped with described vertical clamp shallow slot (6).
5. plating according to claim 2 ceramic circuit board clamp, it is characterized in that: described clamping plate (2) comprise the stationary jaw (21) being fixed on described base plate (1) and are located at the removable clamping plate (22) of stationary jaw (21) both sides, the vertical clamp shallow slot (6) described in described stationary jaw (21) and removable clamping plate (22) two sides are equipped with.
6. according to the plating ceramic circuit board clamp described in any one of claim 3 to 5, it is characterized in that: described base plate (1) both sides are provided with rail groove (11), described removable clamping plate (22) bottom is provided with the chute (8) that passes and communicate with described vertical clamp shallow slot (6) for base plate (1), is provided with can insert in rail groove (11) to make removable clamping plate (22) along the mobile slide block (81) of described base plate (1) in described chute (8).
7. plating according to claim 6 ceramic circuit board clamp, is characterized in that: described base plate (1) and clamping plate (2) all adopt Teflon material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410037041.8A CN103757685B (en) | 2014-01-24 | 2014-01-24 | Ceramic circuit board clamp is used in a kind of plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410037041.8A CN103757685B (en) | 2014-01-24 | 2014-01-24 | Ceramic circuit board clamp is used in a kind of plating |
Publications (2)
Publication Number | Publication Date |
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CN103757685A true CN103757685A (en) | 2014-04-30 |
CN103757685B CN103757685B (en) | 2016-09-21 |
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CN201410037041.8A Expired - Fee Related CN103757685B (en) | 2014-01-24 | 2014-01-24 | Ceramic circuit board clamp is used in a kind of plating |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105420797A (en) * | 2015-11-26 | 2016-03-23 | 扬中市宏飞镀业有限公司 | Novel electroplating bath |
CN106149019A (en) * | 2016-08-24 | 2016-11-23 | 奥士康精密电路(惠州)有限公司 | A kind of mixing electro-plating method |
CN112276606A (en) * | 2019-07-22 | 2021-01-29 | 艾里亚设计股分有限公司 | Clamping device |
CN112323125A (en) * | 2020-11-03 | 2021-02-05 | 天长市京发铝业有限公司 | Production line for electroplated aluminum plate |
CN112512225A (en) * | 2021-02-07 | 2021-03-16 | 四川英创力电子科技股份有限公司 | Universal adjustable PCB electroplating uniformity improvement edge strip assembly |
Citations (8)
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JPH04173994A (en) * | 1990-11-02 | 1992-06-22 | Sakae Denshi Kogyo Kk | Jig for electroplating of printed circuit board and electroplating method using this jig |
JPH05148693A (en) * | 1992-01-14 | 1993-06-15 | Toshiba Corp | Copper electroplating jig |
JPH10150257A (en) * | 1996-11-20 | 1998-06-02 | Ono Seisakusho:Kk | Plating jig for printed board |
CN2536602Y (en) * | 2002-03-26 | 2003-02-19 | 竞铭机械股份有限公司 | Replaceable conductive holder |
CN102584846A (en) * | 2012-03-09 | 2012-07-18 | 沈阳药科大学 | Curcumenol derivatives resisting influenza A(H1N1) virus |
CN102080253B (en) * | 2010-12-23 | 2012-07-25 | 北大方正集团有限公司 | Electroplating fixture and printed wiring board electroplating system |
CN203256356U (en) * | 2013-04-19 | 2013-10-30 | 深圳市强达电路有限公司 | Fixture used for electroplating ceramic printed circuit board |
CN203715772U (en) * | 2014-01-24 | 2014-07-16 | 广东达进电子科技有限公司 | Electroplating ceramic circuit board clamp |
-
2014
- 2014-01-24 CN CN201410037041.8A patent/CN103757685B/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04173994A (en) * | 1990-11-02 | 1992-06-22 | Sakae Denshi Kogyo Kk | Jig for electroplating of printed circuit board and electroplating method using this jig |
JPH05148693A (en) * | 1992-01-14 | 1993-06-15 | Toshiba Corp | Copper electroplating jig |
JPH10150257A (en) * | 1996-11-20 | 1998-06-02 | Ono Seisakusho:Kk | Plating jig for printed board |
CN2536602Y (en) * | 2002-03-26 | 2003-02-19 | 竞铭机械股份有限公司 | Replaceable conductive holder |
CN102080253B (en) * | 2010-12-23 | 2012-07-25 | 北大方正集团有限公司 | Electroplating fixture and printed wiring board electroplating system |
CN102584846A (en) * | 2012-03-09 | 2012-07-18 | 沈阳药科大学 | Curcumenol derivatives resisting influenza A(H1N1) virus |
CN203256356U (en) * | 2013-04-19 | 2013-10-30 | 深圳市强达电路有限公司 | Fixture used for electroplating ceramic printed circuit board |
CN203715772U (en) * | 2014-01-24 | 2014-07-16 | 广东达进电子科技有限公司 | Electroplating ceramic circuit board clamp |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105420797A (en) * | 2015-11-26 | 2016-03-23 | 扬中市宏飞镀业有限公司 | Novel electroplating bath |
CN106149019A (en) * | 2016-08-24 | 2016-11-23 | 奥士康精密电路(惠州)有限公司 | A kind of mixing electro-plating method |
CN112276606A (en) * | 2019-07-22 | 2021-01-29 | 艾里亚设计股分有限公司 | Clamping device |
CN112323125A (en) * | 2020-11-03 | 2021-02-05 | 天长市京发铝业有限公司 | Production line for electroplated aluminum plate |
CN112512225A (en) * | 2021-02-07 | 2021-03-16 | 四川英创力电子科技股份有限公司 | Universal adjustable PCB electroplating uniformity improvement edge strip assembly |
CN112512225B (en) * | 2021-02-07 | 2021-05-14 | 四川英创力电子科技股份有限公司 | Universal adjustable PCB electroplating uniformity improvement edge strip assembly |
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Publication number | Publication date |
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CN103757685B (en) | 2016-09-21 |
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Granted publication date: 20160921 Termination date: 20220124 |