CN106198142A - Welding resistance obstacles in quit - Google Patents
Welding resistance obstacles in quit Download PDFInfo
- Publication number
- CN106198142A CN106198142A CN201610519223.8A CN201610519223A CN106198142A CN 106198142 A CN106198142 A CN 106198142A CN 201610519223 A CN201610519223 A CN 201610519223A CN 106198142 A CN106198142 A CN 106198142A
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- welding resistance
- pcb sample
- sample
- pcb
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/34—Purifying; Cleaning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
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- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Molecular Biology (AREA)
- Biomedical Technology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention discloses a kind of welding resistance obstacles in quit, comprise the following steps: S1: the container being loaded with concentrated sulphuric acid is put into constant temperature in thermostat and stands；S2: pending PCB sample is put in concentrated sulphuric acid；S3: observe PCB sample, when the welding resistance on PCB sample is swelling completely fall off after, take out welding resistance stripping after PCB sample；S4: post processing, obtains the PCB sample after having processed.Described welding resistance obstacles in quit, concentrated sulphuric acid is placed in thermostat constant temperature in certain temperature, welding resistance stripping is carried out by putting into have in the concentrated sulphuric acid of uniform temperature by pending PCB sample, the solute effect of concentrated sulphuric acid is better than traditional NaOH solution, the soldermask coatings on PCB sample can be dissolved faster, and welding resistance stripping is more thorough, the PCB sample after welding resistance stripping is without clearing up with hairbrush, and the microscopic appearance on its surface and the foreign body of conductors are difficult to impaired.
Description
Technical field
The present invention relates to welding resistance stripping field, particularly relate to a kind of welding resistance obstacles in quit.
Background technology
Detect and failure analysis field in some occasions, such as PCB (Printed Circuit Board, printed circuit board),
The when of relating to conductor microscopic appearance and open foreign body Components identification between short-circuit analysis or conductor, it usually needs by pcb board surface
Soldermask coatings return.Traditional, using concentrated NaOH solution infusion method to strip welding resistance, but use said method, welding resistance is moved back
Except the time is long, typically more than 30 minutes；Welding resistance stripping is not thorough, particularly with regard to the occasion of fine dense conductor；Further,
Still need to after welding resistance stripping by hairbrush cleaning welding resistance residual.Using the sample that said method obtains, conductive surface microscopic appearance is usual
Can be by destruction in various degree, between conductor, foreign body is also very easy to impaired in hairbrush scale removal process, usually affects follow-up
Detection and failure analysis, easily cause the analysis conclusion of mistake.
Summary of the invention
Based on this, the invention reside in the defect overcoming prior art, it is provided that a kind of welding resistance stripping time is short, stripping is thorough,
It is hardly damaged the welding resistance obstacles in quit of PCB sample.
Its technical scheme is as follows:
A kind of welding resistance obstacles in quit, comprises the following steps:
S1: the container being loaded with concentrated sulphuric acid is put into constant temperature in thermostat and stands；
S2: pending PCB sample is put in concentrated sulphuric acid；
S3: observe PCB sample, when the welding resistance on PCB sample is swelling completely fall off after, take out welding resistance stripping after PCB sample
Product；
S4: post processing, obtains the PCB sample after having processed.
Wherein in an embodiment, described step S4 specifically includes following steps:
S41: the PCB sample after stripping welding resistance is lowered the temperature；
S42: the PCB sample after cooling is carried out；
S43: the PCB sample after cleaning is dried, obtains the PCB sample after having processed.
Wherein in an embodiment, concretely comprising the following steps of described step S41: the PCB sample after welding resistance being stripped is put into
Stirring in acetone soln, the PCB sample after welding resistance is stripped by acetone soln is lowered the temperature, and to the PCB sample after welding resistance stripping
On welding resistance residual and concentrated sulphuric acid be carried out.
Wherein in an embodiment, concretely comprising the following steps of described step S42: by molten from acetone for the PCB sample after cooling
Liquid takes out, in the tap water of flowing, the welding resistance residual on the PCB sample after cooling and acetone soln is rinsed；
Concretely comprising the following steps of described step S43: the PCB sample after cleaning is put in baking oven and dried, and is processed
PCB sample after completing.
Wherein in an embodiment, described step S3 specifically includes following steps:
S31: slowly stir PCB sample and observe, in 1 to 3 minute, the welding resistance blackout on PCB sample is swelling, and starts big
Block comes off, and concentrated sulphuric acid is become black from colourless；
S32: continue agitation 4 to 10 minutes, takes out PCB sample at any time and observes, when the welding resistance on PCB sample is the most de-
When falling, take out the PCB sample after welding resistance stripping.
Wherein in an embodiment, the thermostat temperature span of control of described thermostat is 75 DEG C 95 DEG C.
Wherein in an embodiment, when the conductor on pending PCB sample is smaller than 45 μm, described constant temperature fills
The thermostat temperature span of control put is 90 DEG C 95 DEG C；When the conductor spacing on pending PCB sample is more than 70 μm, described
The thermostat temperature span of control of thermostat is 75 DEG C 80 DEG C.
Wherein in an embodiment, described thermostat is thermostat water bath, before described step S1, also includes step
Rapid: thermostat water bath water level spot check, to start shooting and heat up.
Wherein in an embodiment, the edge of described pending PCB sample has connection through hole, and described connection is led to
Stirring parts it is provided with at hole.
Wherein in an embodiment, described stirring parts is stainless steel silk, and described stirring parts is away from described connection through hole
One end is provided with handle.
The beneficial effects of the present invention is:
Described welding resistance obstacles in quit, concentrated sulphuric acid is placed in thermostat that constant temperature is in certain temperature, by by pending
PCB sample put into have in the concentrated sulphuric acid of uniform temperature and carry out welding resistance stripping, the solute effect of concentrated sulphuric acid is than traditional NaOH
Solution is good, it is possible to dissolve the soldermask coatings on PCB sample faster, and welding resistance stripping is more thorough, the PCB sample after welding resistance stripping
Product are without clearing up with hairbrush, and the microscopic appearance on its surface and the foreign body of conductors are difficult to impaired.Described welding resistance obstacles in quit, resistance
The weldering stripping time is short, stripping is thorough, and is hardly damaged PCB sample.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the welding resistance obstacles in quit described in the embodiment of the present invention；
Fig. 2 is the structural representation one of the welding resistance obstacles in quit described in the embodiment of the present invention；
Fig. 3 is the structural representation two of the welding resistance obstacles in quit described in the embodiment of the present invention.
Description of reference numerals:
10, pending PCB sample, 20, concentrated sulphuric acid, 30, stirring parts, 310, handle, 40, PCB sample after welding resistance stripping
Product, 50, acetone soln.
Detailed description of the invention
Below embodiments of the invention are described in detail:
As shown in Figure 1, Figure 2, Figure 3 shows, a kind of welding resistance obstacles in quit, comprise the following steps:
S1: the container being loaded with concentrated sulphuric acid 20 is put into constant temperature in thermostat and stands.In the present embodiment, described constant temperature fills
It is set to thermostat water bath, before described step S1, further comprises the steps of: thermostat water bath water level spot check, start shooting and heat up.This reality
The welding resistance obstacles in quit executing example uses thermostat water bath as thermostat, and heating is convenient, simple operation, it is not necessary to use other attached
The equipment added.Before the container containing concentrated sulphuric acid 20 is put into thermostat water bath, first thermostat water bath is carried out water level spot check, start
And intensification, operate safety.For ensureing that the temperature of concentrated sulphuric acid 20 reaches requirement, after thermostat water bath temperature stabilization, make to be loaded with
After the container of concentrated sulphuric acid 20 stands about 10 minutes in thermostat water bath, then carry out next step operation.
In the present embodiment, the thermostat temperature span of control of described thermostat is 75 DEG C 95 DEG C.Within the range, dense sulfur
Acid 20 is optimal to the solute effect of welding resistance, it is possible to effectively dissolve the soldermask coatings on pending PCB sample 10, and don't can be right
Other structures on pending PCB sample 10 produce to be destroyed.Further, when between the conductor on pending PCB sample 10
Away from during less than 45 μm, this sample is fine dense conductor sample, and the thermostat temperature span of control of described thermostat is 90 DEG C
95 DEG C, it is ensured that the pending welding resistance on PCB sample 10 is effectively dissolved, dissolve thoroughly, and again will not be to PCB sample
On other structures produce destroy.When the conductor spacing on pending PCB sample 10 is more than 70 μm, this sample is sparse leading
Body sample, the thermostat temperature span of control of described thermostat is 75 DEG C 80 DEG C, can preferably dissolve pending PCB sample
Welding resistance on product 10, strips effective, and can reduce energy loss, cost-effective.Welding resistance stripping side described in the present embodiment
The base plate for packaging that method is particularly suited for covering fine dense conductor carries out soldermask coatings stripping, the shortest, stripping thoroughly, and not
PCB sample can be caused damage.
S2: pending PCB sample 10 is put in concentrated sulphuric acid 20.Concentrated sulphuric acid put into by the PCB sample 10 that Fig. 2 is pending
Structural representation in 20.Concrete, the edge of described pending PCB sample 10 has connection through hole, and described connection is led to
Stirring parts 30 it is provided with at hole.By arranging stirring parts 30 at pending PCB sample 10 edge, can during operator's practical operation
This stirring parts 30 hand-held moves described pending PCB sample 10, puts it in concentrated sulphuric acid 20, stirs or take out observation etc.,
Easy to operate.In the present embodiment, described stirring parts 30 is stainless steel silk, can prevent the corrosion of concentrated sulphuric acid 20, described stirring parts 30
One end away from described connection through hole is provided with handle 310, it is simple to grip.
S3: observe PCB sample, when the welding resistance on PCB sample is swelling completely fall off after, take out welding resistance stripping after PCB sample
Product 40.Described step S3 specifically includes following steps:
S31: slowly stir PCB sample and observe, in 1 to 3 minute, the welding resistance blackout on PCB sample is swelling, and starts big
Block comes off, and concentrated sulphuric acid 20 is become black from colourless.By stirring described PCB sample, it is simple to the welding resistance on PCB sample is quick, thorough
The stripping at the end, and agitation is slowly, can prevent concentrated sulphuric acid 20 from spilling.By observing PCB sample and the change of concentrated sulphuric acid 20, can
Solve the stripping situation on PCB sample.
S32: continue agitation 4 to 10 minutes, takes out PCB sample at any time and observes, when the welding resistance on PCB sample is the most de-
When falling, take out the PCB sample 40 after welding resistance stripping.Generally, pending PCB sample 10 dissolves 4-in concentrated sulphuric acid 20
10 minutes, the soldermask coatings on PCB sample can strip completely, by observing while stirring, and coordinates timing control, it is ensured that
When welding resistance on PCB sample strips completely, just can take out the PCB sample 40 after welding resistance stripping, save the operating time.
S4: post processing, obtains the PCB sample after having processed.Described step S4 specifically includes following steps:
S41: the PCB sample 40 after stripping welding resistance is lowered the temperature.Concrete, the PCB sample 40 after welding resistance being stripped is put
Enter in acetone soln 50 stir, acetone soln 50 to welding resistance strip after PCB sample 40 lower the temperature, and to welding resistance strip after
Welding resistance residual and concentrated sulphuric acid 20 on PCB sample 40 are carried out.PCB sample 40 after welding resistance stripping enters in acetone soln 50
Row cooling, good cooling results, and, acetone soln 50 can wash the welding resistance residual on the PCB sample 40 after welding resistance stripping
And the concentrated sulphuric acid 20 of residual, cleaning performance is good.Fig. 3 is that the structure in acetone soln 50 put into by the PCB sample 40 after welding resistance stripping
Schematic diagram.
S42: the PCB sample after cooling is carried out.Concrete, the PCB sample after cooling can be loaded with from the beginning
The container of water is carried out, it is also possible to be carried out by the tap water of flowing.In the present embodiment, by the PCB sample after cooling
After product take out from acetone soln 50, molten to the welding resistance residual on the PCB sample after cooling and acetone in the tap water of flowing
Liquid 50 is rinsed.Using backwashing manner, cleaning performance is more preferable.When being rinsed, hydraulic pressure should not be too big, in order to avoid after to cooling
PCB sample causes damage.
S43: the PCB sample after cleaning is dried, obtains the PCB sample after having processed.Concrete, after cleaning
PCB sample put in baking oven and dry, obtain the PCB sample after having processed.In the present embodiment, oven temperature is set to
80 DEG C, it is possible to dry the PCB sample after cleaning effectively and rapidly.
The post processing flow process lowered the temperature by the PCB sample 40 after welding resistance is stripped, clean and dry, it is possible to effectively
Wash the welding resistance residual on the PCB sample 40 after welding resistance stripping and the solution of residual, without using hair in last handling process
Brush cleaning, between the conductive surface microscopic appearance of the PCB sample 40 after welding resistance stripping and conductor, foreign body is not damaged, finally
The process obtained complete after PCB sample as test specimen time, do not interfere with follow-up detection and failure analysis.
Welding resistance obstacles in quit described in the present embodiment, uses concentrated sulphuric acid 20, and by concentrated sulphuric acid 20 constant temperature at 75 DEG C 95 DEG C
Between, pending PCB sample 10 is immersed in concentrated sulphuric acid 20 and gentle agitation, PCB sample pending in 4-10 minute
Whole soldermask coatings on 10 can be the most fluffy and come off, and is first down to room temperature with acetone soln 50, then uses tap water after taking-up
Rinsing, and dry, the PCB sample after the process obtained completes can be used as test specimen.Described welding resistance obstacles in quit, welding resistance is moved back
Except the time is short, stripping thorough, in general 5 minutes, welding resistance can strip thoroughly, and without by hairbrush cleaning residual welding resistance, breaking
Conductor microscopic appearance on bad PCB sample and conductors foreign body, be particularly suited for the fine dense conductor of base plate for packaging and move back welding resistance painting
The occasion of layer, can high-volume carry out pending PCB sample stripping welding resistance process simultaneously.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but also
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that, come for those of ordinary skill in the art
Saying, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a welding resistance obstacles in quit, it is characterised in that comprise the following steps:
S1: the container being loaded with concentrated sulphuric acid is put into constant temperature in thermostat and stands；
S2: pending PCB sample is put in concentrated sulphuric acid；
S3: observe PCB sample, when the welding resistance on PCB sample is swelling completely fall off after, take out welding resistance stripping after PCB sample；
S4: post processing, obtains the PCB sample after having processed.
Welding resistance obstacles in quit the most according to claim 1, it is characterised in that described step S4 specifically includes following steps:
S41: the PCB sample after stripping welding resistance is lowered the temperature；
S42: the PCB sample after cooling is carried out；
S43: the PCB sample after cleaning is dried, obtains the PCB sample after having processed.
Welding resistance obstacles in quit the most according to claim 2, it is characterised in that concretely comprising the following steps of described step S41: will resistance
PCB sample after weldering stripping is put in acetone soln and is stirred, and the PCB sample after welding resistance is stripped by acetone soln is lowered the temperature, and
Welding resistance residual and concentrated sulphuric acid on PCB sample after stripping welding resistance are carried out.
Welding resistance obstacles in quit the most according to claim 3, it is characterised in that concretely comprising the following steps of described step S42: will fall
PCB sample after temperature takes out from acetone soln, flowing tap water in cooling after PCB sample on welding resistance residual and
Acetone soln is rinsed；
Concretely comprising the following steps of described step S43: the PCB sample after cleaning is put in baking oven and dried, and obtains process and completes
After PCB sample.
Welding resistance obstacles in quit the most according to claim 1, it is characterised in that described step S3 specifically includes following steps:
S31: slowly stir PCB sample and observe, in 1 to 3 minute, the welding resistance blackout on PCB sample is swelling, and it is de-to start bulk
Falling, concentrated sulphuric acid is become black from colourless；
S32: continue agitation 4 to 10 minutes, takes out PCB sample at any time and observes, when the welding resistance on PCB sample completely falls off
Time, take out the PCB sample after welding resistance stripping.
6. according to the welding resistance obstacles in quit described in any one of claim 1-5, it is characterised in that the constant temperature temperature of described thermostat
Degree span of control is 75 DEG C 95 DEG C.
Welding resistance obstacles in quit the most according to claim 6, it is characterised in that when between the conductor on pending PCB sample
Away from during less than 45 μm, the thermostat temperature span of control of described thermostat is 90 DEG C 95 DEG C；When on pending PCB sample
When conductor spacing is more than 70 μm, the thermostat temperature span of control of described thermostat is 75 DEG C 80 DEG C.
8. according to the welding resistance obstacles in quit described in any one of claim 1-5, it is characterised in that described thermostat is thermostatted water
Bath, before described step S1, further comprises the steps of: thermostat water bath water level spot check, starts shooting and heat up.
9. according to the welding resistance obstacles in quit described in any one of claim 1-5, it is characterised in that described pending PCB sample
Edge have connection through hole, described connection through hole to be provided with stirring parts.
Welding resistance obstacles in quit the most according to claim 9, it is characterised in that described stirring parts is stainless steel silk, described in stir
Mix part and be provided with handle away from one end of described connection through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610519223.8A CN106198142A (en) | 2016-07-01 | 2016-07-01 | Welding resistance obstacles in quit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610519223.8A CN106198142A (en) | 2016-07-01 | 2016-07-01 | Welding resistance obstacles in quit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106198142A true CN106198142A (en) | 2016-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610519223.8A Pending CN106198142A (en) | 2016-07-01 | 2016-07-01 | Welding resistance obstacles in quit |
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Citations (6)
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| CN101547568A (en) * | 2009-04-24 | 2009-09-30 | 深圳市博敏电子有限公司 | Method for printing black soldermask on PCB board |
| CN103763865A (en) * | 2014-02-13 | 2014-04-30 | 遂宁市广天电子有限公司 | Solder resist ink entry hole processing method |
| CN103882458A (en) * | 2014-03-31 | 2014-06-25 | 沈阳大学 | Method for stripping titanium-aluminium-zirconium-chromium nitride hard reaction films |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN104610804A (en) * | 2015-01-30 | 2015-05-13 | 惠州市容大油墨有限公司 | Photoreception solder resistance compound, application thereof and PCB (Printed Circuit Board) comprising compound |
-
2016
- 2016-07-01 CN CN201610519223.8A patent/CN106198142A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1910519A (en) * | 2004-01-26 | 2007-02-07 | 日本化药株式会社 | Photosensitive resin composition and cured product thereof |
| CN101547568A (en) * | 2009-04-24 | 2009-09-30 | 深圳市博敏电子有限公司 | Method for printing black soldermask on PCB board |
| CN103763865A (en) * | 2014-02-13 | 2014-04-30 | 遂宁市广天电子有限公司 | Solder resist ink entry hole processing method |
| CN103882458A (en) * | 2014-03-31 | 2014-06-25 | 沈阳大学 | Method for stripping titanium-aluminium-zirconium-chromium nitride hard reaction films |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN104610804A (en) * | 2015-01-30 | 2015-05-13 | 惠州市容大油墨有限公司 | Photoreception solder resistance compound, application thereof and PCB (Printed Circuit Board) comprising compound |
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| Title |
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| 朱军: "阳图PS版无损伤快速再生法", 《大连大学学报》 * |
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Application publication date: 20161207 |