KR100857615B1 - Manufacturing method of rfid antenna - Google Patents

Abstract

A method for manufacturing an RFID(Radio Frequency IDentification) antenna is provided to implement an exact pattern line by performing plating only on a print layer when implementing a desired pattern through the print layer, thereby reducing an error rate. A method for manufacturing an RFID antenna includes the steps of: forming a print layer with a predetermined pattern on the surface of a film type plated material made of insulating material by using a print unit(S10); removing oil included on the surface of the plated material including the print layer(S20); absorbing a first catalyst with a metallic catalyst and a reducing catalyst on the print layer of the plated material(S30); removing the reducing catalyst with a second catalyst to receive only the metallic catalyst on the surface of the plated material(S40); coating the metallic catalyst formed on the print layer of the plated material with a conductive metal ion(S50); performing partial plating by using a electroplating type plating unit to plate metal with high conductivity on an upper part of the conductive metal ion(S60); washing the surface of the plated material by using ultrasonic waves(S70); washing the surface of the plated material by using ions(S80); and dehydrating and drying the plated material(S90).

Description

MANUFACTURING METHOD OF RFID ANTENNA

The present invention relates to a radio frequency identification (RFID) antenna manufacturing method for manufacturing an antenna, and more particularly, in a state in which a pattern of a shape desired by a user is implemented on a plated material through a printing layer. Since the plating is performed only in this way, it is possible to improve the safety of the manufacturer due to the lead component generated during the etching process, and unlike the conventional etching method, partial plating is possible only on the portion desired by the user, thereby reducing the material cost. In particular, since plating is performed only on the printed layer in a state in which a desired pattern is implemented through the printed layer, the defect rate can be lowered by realizing accurate pattern lines designed by the original designer at the time of antenna manufacturing. During the plating process, do not print each pattern line formed on the plated material without connecting each other. Even if the structure of the plating part is electricity is supplied only in the printing layer passing through the electrode roller, precise partial plating is possible, and also the whole process is a roll-to-roll process relates to an RFID antenna manufacturing method capable of mass production.

Due to the rapid industrial growth and technology expansion, the amazing development of semiconductor integrated circuits and the small chip components directly mounted in the entire industry such as mobile phones, MP3, and displays, the development of surface-mount technology and the short and light reduction of electronic products As a result, the use of flexible circuit boards for miniaturization and flexibility of products is increasing rather than conventional rigid circuit boards.

Meanwhile, the conventional method of manufacturing an antenna, particularly an RFID antenna, used in a mobile phone among the above components is coated with copper foil on the surface of the plated material and then etched in a state in which only a pattern portion having a desired shape is separately processed by a user. It was possible by removing copper foil of parts except a pattern part through work.

However, in the conventional antenna manufacturing method as described above, since the antenna is manufactured through etching, waste of unnecessary materials may be caused, and in particular, the lead component generated during the etching operation may impair the safety of the processor.

In addition, in manufacturing an antenna, in order to accurately receive the frequency of the band band of the desired shape only by implementing the exact pattern line intended by the first designer, when manufacturing the antenna by the etching method, Since the implementation is difficult, there was a problem that the defect rate is significantly higher.

RFID antenna manufacturing method of the present invention for solving the above problems is a printing layer forming step of forming a printed layer of a predetermined pattern by using a printing portion on the surface of the film-like plated material made of an insulating material; A degreasing step of degreasing the oil component contained on the surface of the plated material including the print layer by using a degreasing solution; A first activation step of adsorbing a first catalyst comprising a metallic catalyst and a reducing catalyst to a printing layer of the plated material from which an oil component is removed by the degreasing step; A second activation step of removing the reducing catalyst with a second catalyst capable of removing the reducing catalyst in order to deposit only the metallic catalyst of the first catalyst on the surface of the plated material in the first activation step; A conductive metal ion forming step of applying conductive nickel ions to the metallic catalyst of the first catalyst formed on the printed layer of the plated material; A partial plating step of partially plating using an electroplating type plating part to plate a conductive metal on the upper side of the nickel formed in the conductive metal ion forming step; An ultrasonic washing step of washing with ultrasonic waves to clean the surface of the plated material after the partial plating step; and an ion washing step of washing the surface of the plated material with ions after the ultrasonic washing step; It consists of a product completion step of producing a product by dehydrating and drying the plated material undergoing the water washing step.

In the RFID antenna manufacturing method according to the present invention, since the plating is performed only on the printed layer in a state in which a pattern of a shape desired by a user on the plated material is realized through the printed layer, the manufacturer of the RFID antenna by the lead component generated during the etching operation I can aim for safety.

In addition, unlike the conventional etching method, the partial plating is possible only on the portion desired by the user, thereby reducing the material cost. In particular, the plating is performed only on the printed layer in a state in which the desired pattern is realized through the printed layer. Therefore, since the accurate pattern line designed by the original designer at the time of antenna manufacture can be implemented, the failure rate can be lowered.

In addition, even when each pattern line formed on the plated material is printed without being connected to each other during the plating operation, accurate partial plating is possible because electricity is energized only in the print layer passing through the electrode roller. In addition, the whole process consists of a roll-to-roll process is a useful invention capable of mass production.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

First, as illustrated in FIG. 1, the printing layer P is formed on the surface of the film-like plated material M formed of an insulating material using the printing unit 10 in a pattern desired by the user. Forming step S10)

Here, the printing unit 10 may be printed on the surface of the plated material by various printing techniques, but is printed on the surface of the plated material (M) through inkjet printing, rotary printing, gravure printing, flexographic printing, and the like. It is more preferable to form the layer P, and in this case, the printing layer P having a pattern shape formed on the surface of the plated material M is printed layer P as shown in FIG. In this non-connected form, the ink used in the printing unit 10 may be a conventional ink capable of reacting with the first catalyst in the first activation step S30 to be described later. .

Thereafter, the plated material M on which the printing layer P is formed is washed with an oil component contained on the surface of the plated material M by using a normal degreasing portion B. Degreasing step S20)

On the other hand, in the degreasing step (S30) to adsorb the first catalyst consisting of a metallic catalyst and a reducing catalyst to the printing layer (P) formed on the surface of the plated material (M) degreased oil component. 1 activation step S30)

Here, the first catalyst is a catalyst commonly used, and since the metallic catalyst cannot be directly formed on the printing layer P formed on the surface of the plated material M, which is an insulating material, the metallic catalyst is formed using a reducing catalyst. It is configured to facilitate the adsorption on the surface of the plated material (M), wherein the first catalyst is a printing layer (P) formed on the surface of the plated material (M) by the printing unit 10 Only adsorption will be done.

In addition, the plated material (M) to remove the unnecessary reducing catalyst during plating by using a second catalyst in the printing layer (P) formed on the surface of the plated material (M) through the first activation step (S30). Activate the printed layer P formed in the second process (second activation step S40).

Then, conductive metal ions are applied to the printing layer P formed on the surface of the plated material M in which only the metallic catalyst is formed so that electricity can be supplied during electroplating. Forming step S50)

Here, the conductive metal ion may be any conductive metal ion, but it is more preferable to use a metal ion having excellent conductivity such as nickel or copper.

Meanwhile, plating is performed using the plating parts 20a and 20b so that partial plating may be performed on the surface of the printing layer P of the plated material M passing through the conductive metal ion forming step S50. (Partial plating step S60)

Here, the plating part 20a forms an accommodating part 21a for accommodating a solvent inward as shown in FIG. 3, and an electrolytic cell 22a configured to receive a positive electrode outward. ) And a plurality of feed rollers 23a capable of moving the plated material M to an upper side of the accommodating portion 21a of the electrolytic cell 22a, and the lower side of the feed roller 23a is staggered. It is formed in the electrode roller (24a) is applied to the (-) electrode by the electrode (25a).

In addition, in the case of the plating part 20a, the plated material M may be transferred in the horizontal direction. However, as shown in FIGS. 4 to 5, the solvent may be stored inwardly as shown in FIGS. First storage holes h1 are formed at both sides of the accommodating part 21b and the accommodating part 21b, and the accommodating part 22b and the accommodating part 22b of the cell 21b) a plurality of electrode rollers 24b formed on the inner side and receiving (-) electrodes by the electrode rod 25b and both sides of the electrolytic cell 22b, but having a lower end than the electrolytic cell 22b. The plated material M is formed by forming a chamber 27a having a second transfer hole h2 formed at the same position as the first transfer hole h1 of the electrolytic cell. When the solvent contained in the housing 21b of the electrolytic cell 22b flows out due to the first transfer hole h1, Is configured to be stored, and, it may be so over, it can be plated using the plating section (20b) upright in a direction normal to be plated material (M).

In this case, the plating part 20b may further include a conveying pipe line 26b so as to transfer the solvent contained in the chamber 27b back to the electrolytic cell 22b, and at this time, a motor may be provided in the conveying pipe line 26b. The solvent may be transported to the electrolytic cell 22b by (not shown in the figure).

In addition, the plating parts 20a and 20b are fitted with the electrode rollers 24a and 24b in a state in which the plating parts 20a and 20b are immersed in a solvent by using the printing layer P formed on the plated material M. Electricity is energized only in the print layer P of the plated material M to be touched, so that partial plating is possible.

In addition, the electrode rods 25a and 25b for applying the (-) electrode to the electrode rollers 24a and 24b in the plating parts 20a and 20b are contacted with the electrode rollers 24a and 24b through a point contact (-). In this case, the electrode rods 25a and 25b may be coated (not shown) on the entire surface except for the contact surfaces in contact with the electrode rollers 24a and 24b. Springs (not shown) may be further formed on the electrodes 25a and 25b to smoothly apply and protect the electrodes 24a and 24b and the electrodes 25a and 25b.

On the other hand, after washing the surface of the plated material (M) through the partial plating step (S60) again by using ultrasonic waves (S70) and ions (S80), and manufacturing the product through dehydration and drying (S90) Will be able to complete.

Here, each step of manufacturing the RFID antenna is to be able to continuously work the plated material (M) by a roll-to-roll (Roll to Roll) method, between each step further includes a washing step (S0) In addition, the washing unit (O) used in the washing step acts to wash the plated material (M) in the form of a spray or shower, it is natural that the efficiency can be further increased during washing.

Hereinafter, a method of manufacturing an RFID antenna according to another embodiment of the present invention will be described.

Hereinafter, detailed descriptions of the matters described in the first embodiment may be omitted.

In the second embodiment, almost all the steps are similar to those in the first embodiment.

That is, the print layer forming step (S110), degreasing step (S120), conductive metal ion forming step (S140), partial plating step (S150), ultrasonic washing step (S160), ion washing step (S170), product completion step ( S180) is similar.

However, in the printing layer forming step (S110), the ink used in the printing unit 10 uses conductive ink, so that the metallic catalyst is adsorbed onto the plated material M formed of a film of insulating material in the first embodiment. Since it is not necessary to mix the reducing catalyst in the first catalyst mixed with the reducing catalyst, it is possible to obtain a shortening effect of the work process without having to go through the second activation step (S40) performed to remove the reducing catalyst.

Here, the reason for not having to use a reducing catalyst as described above is that when the conductive ink is used when the printing layer P is formed in the printing unit 10, the conductive material having a release property on the surface of the plated material M is formed. This is because, while the material is adsorbed, the metallic catalyst can be smoothly formed by the ink when the metallic catalyst is adsorbed onto the plated material M, which is an insulating material, so that it is not necessary to use a reducing catalyst.

Although the above-described embodiments have been described with respect to the most preferred embodiments of the present invention, it is not limited to the above embodiments, and various modifications are possible within the scope without departing from the technical spirit of the present invention. It is evident to those who have knowledge of.

1 is a flowchart illustrating a method for manufacturing an RFID antenna according to the present invention.

Figure 2 is a state diagram showing a state in which a printing layer is formed on the plated material according to the present invention.

3 is an exemplary view showing a first embodiment of a plating part according to the present invention.

Figure 4 (a) is a perspective view showing a second embodiment of the plating portion according to the present invention, (b) is a perspective view shown from another angle.

5 is a plan view according to a second embodiment of a plating part according to the present invention.

6 is a flowchart illustrating a method of manufacturing an RFID antenna according to a second embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

B: degreasing part C: first active part

D: 2nd active part E: Chemical plating part

G: Ultrasonic Cleaner H: Ion Cleaner

I: Dehydration drying part M: Plated material

O: Water washing part P: Printed layer

h1: first transfer hole h2: second transfer hole

10: printing part 20a, 20b: plating part

21a, 21b: Storage part 22a, 22b: Electrolyzer

23a, 23b: feed roller 24a, 24b: electrode roller

25a, 25b: electrode 26b: transfer pipe

27b: chamber

Claims (19)

In the RFID antenna manufacturing method for manufacturing an RFID antenna, A printing layer forming step (S10) of forming a printing layer having a predetermined pattern by using a printing unit on the surface of the film-form plated material formed of an insulating material; A degreasing step (S20) of degreasing the oil component contained on the surface of the plated material including the print layer using a degreasing solution; A first activation step (S30) of adsorbing a first catalyst comprising a metallic catalyst and a reducing catalyst to a printing layer of the plated material from which an oil component is removed by the degreasing step; A second activation step (S40) of removing the reductive catalyst with a second catalyst capable of removing the reductive catalyst to deposit only the metallic catalyst of the first catalyst on the surface of the plated material in the first activation step; A conductive metal ion forming step of applying conductive metal ions to the metallic catalyst of the first catalyst formed on the printed layer of the plated material (S50); A partial plating step (S60) of partially plating by using a plating part having an electroplating form so as to plate a strong conductive metal on the conductive metal ion formed in the conductive metal ion forming step; An ultrasonic washing step (S70) of washing with ultrasonic waves to wash the surface of the plated material after the partial plating step; An ion washing step (S80) of washing the surface of the plated material using ions after the ultrasonic washing step (S80); RF antenna manufacturing method characterized in that the product consisting of the finished product (S90) to produce a product by dewatering and drying the plated material undergoing the ultrasonic washing step and the ion washing step. The method of claim 1, wherein each step is a RF antenna manufacturing method characterized in that the roll to roll method that can be a continuous operation. According to claim 1, RF antenna manufacturing method characterized in that it further comprises a washing step of spraying the washing liquid in the form of a spray spray between each step. The RF antenna according to claim 1, wherein the printing unit forming the printing layer on the plated material in the printing layer forming step is performed by printing by any one of inkjet printing, rotary printing, gravure printing, and flexo printing. Manufacturing method. The RF antenna according to claim 1 or 4, wherein the printing layer formed on the surface of the plated material by using the printing unit in the printing layer forming step is formed in a predetermined pattern, and the patterns are not connected to each other. Manufacturing method. The electrolytic cell according to claim 1, wherein in the partial plating step, the plating part forms an accommodating part for accommodating the solvent inward and an external positive electrode is applied to the outside; RDF antenna manufacturing method characterized in that a plurality of feed rollers are formed on the upper side of the receiving portion of the electrolytic cell, and the lower side is composed of a plurality of electrode rollers to which the negative electrode is applied. The electrolytic cell of claim 1, wherein in the partial plating step, the plating part comprises an accommodating part accommodating a solvent inwardly and an electrolytic cell configured to form first conveying holes on both sides of the accommodating part and to receive a positive electrode outward; A plurality of feed rollers formed inside the receiving part of the electrolytic cell and vertically formed; A plurality of electrode rollers formed between the transfer rollers and receiving a negative electrode by an electrode rod; It is formed on both sides of the electrolytic cell, the lower end is formed more protruding than the electrolytic cell, the outer side is characterized by consisting of a chamber formed with a second transfer hole formed at the same position as the first transfer hole of the electrolytic cell RF antenna production method. 8. The RF antenna manufacturing method according to claim 7, wherein a lower end of the chamber further includes a transfer pipe for transferring a solvent to an electrolytic cell. 8. The method of claim 6 or 7, wherein the plated portion is partially plated with a conductive metal ion formed in the printed layer of the plated material that abuts the electrode roller when the plated material passes through the electrode roller. RF antenna manufacturing method characterized in that the partial plating by the electricity is supplied only in. In the RFID antenna manufacturing method for manufacturing an RFID antenna, A printing layer forming step (S110) of forming a printing layer having a predetermined pattern on the surface of the film-form plated material made of an insulating material by using a printing unit; A degreasing step of degreasing the oil component included in the surface of the plated material including the print layer using a degreasing solution (S120); An activation step of adsorbing a first catalyst made of a metallic catalyst to the printing layer of the plated material from which the oil component is removed by the degreasing step (S130); A conductive metal ion forming step of applying conductive metal ions to the metallic catalyst of the first catalyst formed on the printed layer of the plated material (S140); A partial plating step (S150) of partially plating by using a plating part having an electroplating form so as to plate a conductive metal on the upper side of the nickel formed in the conductive metal ion forming step; An ultrasonic washing step (S160) of washing with ultrasonic waves to wash the surface of the plated material after the partial plating step; An ion washing step (S170) of washing the surface of the plated material using ions after the ultrasonic washing step (S170); RF antenna manufacturing method characterized in that the product consisting of a product completion step (S180) to produce a product by dewatering and drying the plated material undergoing the ultrasonic washing step and the ion washing step. The method of claim 10, wherein after each step, the RF antenna manufacturing method characterized in that it further comprises a washing step of spraying the washing liquid in the form of a spray spray. The method of claim 10, wherein each step is a RF antenna manufacturing method characterized in that the roll to roll method capable of performing a continuous operation. The method of claim 10, wherein the printing unit for forming a printing layer on the plated material in the printing layer forming step is characterized in that the printing layer is formed by any one of inkjet printing, rotary printing, gravure printing, printing method of flexographic printing. RF antenna manufacturing method. The RF antenna manufacturing method according to claim 10 or 13, wherein the printing part uses a conductive ink in the printing layer forming step. The RDF antenna according to claim 10 or 13, wherein the printing layer formed on the surface of the plated material by using the printing unit in the printing layer forming step is formed in a predetermined pattern, and each pattern is not connected. Manufacturing method. 12. The method of claim 10, wherein in the partial plating step, the plating unit forms an accommodating part for accommodating the solvent to the inside, and an electrolytic cell receiving a (+) electrode to the outside; RDF antenna manufacturing method characterized in that the formation of a plurality of feed rollers on the upper side of the receiving portion of the electrolytic cell, the lower side is composed of a plurality of electrode rollers receiving the (-) electrode by the electrode. 12. The method of claim 10, wherein in the partial plating step, the plating unit comprises an accommodating part for accommodating the solvent inwardly and an electrolytic cell for forming a first transfer hole on both sides of the accommodating part and receiving a positive electrode outward; A plurality of feed rollers formed inside the receiving part of the electrolytic cell and vertically formed; A plurality of electrode rollers formed between the transfer rollers and receiving a negative electrode by an electrode rod; It is formed on both sides of the electrolytic cell, the lower end is formed more protruding than the electrolytic cell, the outer side is characterized by consisting of a chamber formed with a second transfer hole formed at the same position as the transfer material to be plated material of the electrolytic cell RF antenna manufacturing method. 18. The RF antenna manufacturing method according to claim 17, wherein the chamber further includes a transfer pipe for transferring the solvent to the electrolytic cell. 18. The method of claim 16 or 17, wherein the partial plating of the plated material using the plating portion in the partial plating step comprises: printing the plated material on the printed layer which is in contact with the electrode roller when the plated material passes through the electrode roller. RF antenna manufacturing method characterized in that the partial plating by the electricity is supplied only to the formed nickel.

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