CN106572602A - Method of removing solder resist layer of PCB (printed circuit board) - Google Patents
Method of removing solder resist layer of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN106572602A CN106572602A CN201610953531.1A CN201610953531A CN106572602A CN 106572602 A CN106572602 A CN 106572602A CN 201610953531 A CN201610953531 A CN 201610953531A CN 106572602 A CN106572602 A CN 106572602A
- Authority
- CN
- China
- Prior art keywords
- washing
- solder masks
- pcb
- flow process
- pcb solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
Abstract
The invention provides a method for removing the solder resist layer of a PCB (printed circuit board). The method includes the following steps of: PCB feeding; swelling; washing; pre-neutralizing; washing; neutralizing; washing; and PCB discharging. According to the method for removing the solder resist layer of the PCB, the solder resist layer is swelled through using resin solder; and the solder resist layer is removed from the PCB through chemical action. Compared with an existing method using strong alkali solution soaking, the method is better in removal effect, and has more obvious advantages especially for boards with solder resist filled holes.
Description
Technical field
The present invention relates to a kind of PCB technology, refers in particular to a kind of method of removal PCB solder masks.
Background technology
In welding resistance production process, need to return to wash resistance of reforming because ink enters hole, the ill-exposed, quality problem such as unnet of developing
Layer.The method that PCB solder masks are removed in prior art be by using highly basic NaOH solution, i.e., in 80 DEG C of -90 DEG C of temperature and
Content is under conditions of 8%-12% (volume fraction), will to be immersed in 20- in the solution through the plank of photocuring and heat cure
25min, allows ink that chemical reaction occurs therewith, ink dissolving is departed from pcb board, so as to reach the mesh for removing PCB soldering-resistance layers
's.But, when there is ink to enter hole, ink is very difficult to except clean in hole, particularly has the plate of welding resistance consent, if height is in length and breadth
During the plate of ratio, the more difficult removal of ink in aperture is clean, and when ink cannot remove clean product rejection is easily caused.
The content of the invention
Clean in order to solder mask in pcb board face and hole is quickly removed, the technical problem not washed clean is returned in solution, the present invention
A kind of method of new removal PCB solder masks is employed, successively including below scheme：Pcb board feeding → bulk → wash → remove
Ink glue residue → washing → preneutralization → washing → neutralization → washing → lower plate.
Further, in the bulk flow process, containing bulking agent and NaOH in medicinal liquid cylinder, wherein, bulking agent volume fraction
For 20-30%, NaOH content is 20-48g/L.
Further, the bulk flow processing temperature is 70-80 DEG C, and process time is 6-8 minutes.
Further, in the glue residue flow process except ink, in medicinal liquid cylinder KMnO is contained4, NaOH and potassium manganate, wherein,
KMnO4Content be 50-60g/L, the content of NaOH is 40-50g/L, and the content of potassium manganate is less than 25g/L.
Further, described except ink glue residue flow processing temperature is 75-85 DEG C, process time is 14-16 minutes.
Further, in the preneutralization flow process, in medicinal liquid cylinder H is contained2SO4And H2O2, wherein H2SO4Volume fraction be
0.5-1.5%, H2O2Volume fraction be 0.5-1.5%.
Further, the preneutralization flow process is carried out at room temperature, and process time is 1-2 minutes.
Further, in the neutralization flow process, containing nertralizer and H in medicinal liquid cylinder2SO4, wherein, the volume integral of nertralizer
Number is 16-24%, H2SO4Volume fraction be 4-6%.
Further, the neutralization flow process is carried out at 35-45 DEG C, and process time is 4-6 minutes.
Further, the washing process is one-stage water wash or two grades of washings or high-order washing.
The method of this new removal PCB solder masks, mainly by first that resin solder mask is bulk, then passes through again
It is departed from removing by chemical action with pcb board.Compared with the method for existing direct employing strong base solution immersion, this programme goes
Except better, there is the plate of welding resistance consent especially for some, this programme removes the advantage of solder mask and becomes apparent from.
Specific embodiment
To describe technology contents of the invention, structural features in detail, purpose and effect being realized, below in conjunction with embodiment
It is explained in detail.
This programme discloses a kind of method of new removal PCB solder masks, successively including below scheme：Pcb board feeding →
Bulk → washing → remove ink glue residue → washing → preneutralization → washing → neutralization → washing → lower plate.
For bulk flow process, containing bulking agent and NaOH in medicinal liquid cylinder used, wherein, bulking agent volume fraction is
20-30%, NaOH content is 20-48g/L.In the flow process, the solvent molecule in medicinal liquid can be by diffusing into solder mask oil
Among black molecular resin, and then the bond length between solder mask ink resin molecular carbon carbon is expanded, effectively increased subsequently except ink
Glue residue flow process herb liquid composition attacks the speed on solder mask ink resin surface, enhances the easy degree of carbon-carbon bond fracture, enters
And it is more beneficial for the removing of solder mask ink resin.
Molecule and other particles typically have at high temperature higher activity, and its motion is also more enlivened.To a certain degree
On be proportionate with the temperature and time of bulk flow processing, i.e., the temperature of bulk process is higher, process time is longer, PCB tables
The solder mask ink resin in face is just more readily removable.But consider whole except the removing glue speed of adhesive process, it is impossible to will
Treatment temperature or process time are set to infinite height.By comprehensive correlation theory and substantial amounts of experiment with verify repeatedly, can will be swollen
Loose flow processing temperature is preferably 70-80 DEG C, and process time is preferably 6-8 minutes.Under this processing parameter, can reach optimal
Removing glue speed and removing glue effect.
Except ink glue residue flow process is one of critical workflow of this process, in this flow process, contain in medicinal liquid cylinder used
There is KMnO4, the composition such as NaOH and potassium manganate.Herein, potassium permanganate can allow the carbon carbon of solder mask ink resin as strong oxidizer
Alkali reaction in bond fission, and carbon and the medicinal liquid allowed after oxidation, generates carbon dioxide, so as to by solder mask ink resin point
Solution is removed.Wherein for each composition concrete content, KMnO4Content be preferably 50-60g/L, the content of NaOH is preferably 40-
50g/L, the content of potassium manganate is less than 25g/L.Additionally, it is described except ink glue residue flow processing temperature is preferably 75-85 DEG C, process
Time is preferably 14-16 minutes.
After except ink glue residue flow process, substantial amounts of high price manganese ion can be all remained in pcb board face or hole, if thinking straight
Connect cleaning to be removed, difficulty is larger.But can be by setting up neutralization technological process, i.e., in acid condition, in recycling
Mediating recipe just can be by value Mn ion reduction into divalent manganesetion, then again just can be by residual in PCB surface or hole by washing
Manganese ion is removed.But before neutralization flow process, pre-neutralization process is had additional, to obtain more preferably neutralization.It is described pre-
In neutralization flow process, in medicinal liquid cylinder H is contained2SO4And H2O2.H herein2O2With certain reproducibility, can with strong oxidizing property
High price manganese ion reacted, obtain the manganese ion of relatively low price.Wherein H2SO4Volume fraction be preferably 0.5-1.5%,
H2O2Volume fraction be preferably 0.5-1.5%.Meanwhile, the preneutralization flow process is carried out at room temperature, and process time is 1-2
Minute.
Specifically, in neutralization flow process, nertralizer and H are added with medicinal liquid cylinder2SO4, it is high that nertralizer is mainly used in neutralization
, there is redox reaction in valency manganese ion, and obtain divalent manganesetion in order to be cleaned removing.Meanwhile, sulphuric acid is used as auxiliary
Reagent is helped, the reaction for high price manganese ion provides a sour environment.Preferably, the volume fraction of nertralizer is 16-24%,
H2SO4Volume fraction be 4-6%, while neutralize flow process carry out at 35-45 DEG C, process time be 4-6 minutes.
Remove in pcb board surface and its hole in the technological process of solder mask ink resin in this programme, many places are directed to
Washing process flow process, almost there is a washing process between each two technological process.Mainly prevent the medicine of different kinds of process flow
Mutually pollute between fluid cylinder, the medicine liquid ingredient for preventing an operation takes the medicinal liquid cylinder of subsequent processing to by pcb board, and it is dirty
Dye.Meanwhile, according to the complexity and the required cleaning standard for reaching of cleaning, the washing process can be divided into for one-stage water wash or
Two grades of washings or high-order washing.Specifically, bulk flow process and the washing except ink glue residue technology room are two grades of washings, except ink
Washing between glue residue flow process and preneutralization flow process is washed to reclaim washing and a high position, the washing between preneutralization flow process and neutralization flow process
For high-order washing, it is two grades of washings to neutralize the washing after flow process.
The method of this new removal PCB solder masks of this programme, mainly by using bulking agent first by solder mask oil
Inkwood fat is bulk so that solder mask is easily removed, and then again departs from it with pcb board by chemical actions such as oxidoreductions and removes
Go.The program is compared with the method for existing direct employing strong base solution immersion, and this programme removes the better of solder mask, special
It is not the plate that there is welding resistance consent for some, this programme removes the advantage of solder mask and becomes apparent from.
Embodiments of the invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that bright description is made, or other related technical fields are directly or indirectly used in,
It is included within the scope of the present invention in the same manner.
Claims (10)
1. a kind of method of removal PCB solder masks, it is characterised in that：Include below scheme, pcb board feeding → bulk → water successively
Wash → remove ink glue residue → washing → preneutralization → washing → neutralization → washing → lower plate.
2. the method for removing PCB solder masks as claimed in claim 1, it is characterised in that：In the bulk flow process, contain in medicinal liquid cylinder
There are bulking agent and NaOH, wherein, bulking agent volume fraction is 20-30%, and NaOH content is 20-48g/L.
3. the method for removing PCB solder masks as claimed in claim 2, it is characterised in that：The bulk flow processing temperature is 70-
80 DEG C, process time is 6-8 minutes.
4. the method for removing PCB solder masks as claimed in claim 1, it is characterised in that：In the glue residue flow process except ink, medicinal liquid
Contain KMnO in cylinder4, NaOH and potassium manganate, wherein, KMnO4Content be 50-60g/L, the content of NaOH is 40-50g/L, manganese
The content of sour potassium is less than 25g/L.
5. the method for removing PCB solder masks as claimed in claim 4, it is characterised in that：It is described except ink glue residue flow processing temperature
Spend for 75-85 DEG C, process time is 14-16 minutes.
6. the method for removing PCB solder masks as claimed in claim 1, it is characterised in that：In the preneutralization flow process, in medicinal liquid cylinder
Containing H2SO4And H2O2, wherein H2SO4Volume fraction be 0.5-1.5%, H2O2Volume fraction be 0.5-1.5%.
7. the method for removing PCB solder masks as claimed in claim 6, it is characterised in that：The preneutralization flow process is entered at room temperature
OK, process time is 1-2 minutes.
8. the method for removing PCB solder masks as claimed in claim 1, it is characterised in that：In the neutralization flow process, contain in medicinal liquid cylinder
There are nertralizer and H2SO4, wherein, the volume fraction of nertralizer is 16-24%, H2SO4Volume fraction be 4-6%.
9. the method for removing PCB solder masks as claimed in claim 8, it is characterised in that：The neutralization flow process is entered at 35-45 DEG C
OK, process time is 4-6 minutes.
10. the method that PCB solder masks are removed as described in any one of claim 1-9, it is characterised in that：The washing process is one
Level washing or two grades of washings or high-order washing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610953531.1A CN106572602A (en) | 2016-10-27 | 2016-10-27 | Method of removing solder resist layer of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610953531.1A CN106572602A (en) | 2016-10-27 | 2016-10-27 | Method of removing solder resist layer of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106572602A true CN106572602A (en) | 2017-04-19 |
Family
ID=58535301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610953531.1A Pending CN106572602A (en) | 2016-10-27 | 2016-10-27 | Method of removing solder resist layer of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106572602A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348643A (en) * | 2018-12-06 | 2019-02-15 | 四川英创力电子科技股份有限公司 | A kind of wiring board moves back washing lotion and preparation method thereof |
| CN109462946A (en) * | 2018-12-14 | 2019-03-12 | 江门崇达电路技术有限公司 | A kind of PCB welding resistance returns washing method |
| CN110856348A (en) * | 2019-10-09 | 2020-02-28 | 广东利尔化学有限公司 | Neutralizing and reducing agent for PCB (printed circuit board) glue removal post-treatment |
| CN112867276A (en) * | 2020-12-31 | 2021-05-28 | 南通赛可特电子有限公司 | Horizontal glue removing process for printed circuit board |
| CN113194627A (en) * | 2021-06-30 | 2021-07-30 | 智恩电子(大亚湾)有限公司 | Solder resist stripping method and solder resist stripping liquid medicine |
| CN114364165A (en) * | 2021-12-17 | 2022-04-15 | 龙南骏亚精密电路有限公司 | Electroplating processing method for circuit board through hole with high thickness-diameter ratio |
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|---|---|---|---|---|
| CN201639860U (en) * | 2010-05-11 | 2010-11-17 | 惠州中京电子科技股份有限公司 | Fading and cleaning line of solder resisting layer of PCB |
| CN102548230A (en) * | 2012-02-10 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Device and method for ultrasonically rewashing printing ink of hole-plugging plate |
| CN104519664A (en) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | Printed circuit board cleaning method and printed circuit board |
| CN104703412A (en) * | 2015-04-07 | 2015-06-10 | 深圳市化讯应用材料有限公司 | Method for metallizing hole |
| CN104735927A (en) * | 2013-12-20 | 2015-06-24 | 深圳崇达多层线路板有限公司 | PCB glue removing method in mode of vertically depositing copper wires |
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
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2016
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Patent Citations (6)
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| CN201639860U (en) * | 2010-05-11 | 2010-11-17 | 惠州中京电子科技股份有限公司 | Fading and cleaning line of solder resisting layer of PCB |
| CN102548230A (en) * | 2012-02-10 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Device and method for ultrasonically rewashing printing ink of hole-plugging plate |
| CN104519664A (en) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | Printed circuit board cleaning method and printed circuit board |
| CN104735927A (en) * | 2013-12-20 | 2015-06-24 | 深圳崇达多层线路板有限公司 | PCB glue removing method in mode of vertically depositing copper wires |
| CN104703412A (en) * | 2015-04-07 | 2015-06-10 | 深圳市化讯应用材料有限公司 | Method for metallizing hole |
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348643A (en) * | 2018-12-06 | 2019-02-15 | 四川英创力电子科技股份有限公司 | A kind of wiring board moves back washing lotion and preparation method thereof |
| CN109462946A (en) * | 2018-12-14 | 2019-03-12 | 江门崇达电路技术有限公司 | A kind of PCB welding resistance returns washing method |
| CN110856348A (en) * | 2019-10-09 | 2020-02-28 | 广东利尔化学有限公司 | Neutralizing and reducing agent for PCB (printed circuit board) glue removal post-treatment |
| CN112867276A (en) * | 2020-12-31 | 2021-05-28 | 南通赛可特电子有限公司 | Horizontal glue removing process for printed circuit board |
| CN113194627A (en) * | 2021-06-30 | 2021-07-30 | 智恩电子(大亚湾)有限公司 | Solder resist stripping method and solder resist stripping liquid medicine |
| WO2023273087A1 (en) * | 2021-06-30 | 2023-01-05 | 智恩电子(大亚湾)有限公司 | Solder mask stripping method and solder mask stripping chemical solution |
| CN114364165A (en) * | 2021-12-17 | 2022-04-15 | 龙南骏亚精密电路有限公司 | Electroplating processing method for circuit board through hole with high thickness-diameter ratio |
| CN114364165B (en) * | 2021-12-17 | 2024-01-23 | 龙南骏亚精密电路有限公司 | Electroplating processing method for high-thickness-diameter ratio through hole of circuit board |
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Legal Events
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170419 |
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| RJ01 | Rejection of invention patent application after publication |