CN112867276A - Horizontal glue removing process for printed circuit board - Google Patents
Horizontal glue removing process for printed circuit board Download PDFInfo
- Publication number
- CN112867276A CN112867276A CN202011624819.7A CN202011624819A CN112867276A CN 112867276 A CN112867276 A CN 112867276A CN 202011624819 A CN202011624819 A CN 202011624819A CN 112867276 A CN112867276 A CN 112867276A
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- Prior art keywords
- tank
- circuit board
- cleaning
- printed circuit
- removing process
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a horizontal glue removing process for a printed circuit board, which comprises the following steps: the first step is as follows: putting the printed circuit board into a bulking tank, and continuously filtering and circularly cleaning for 90-120 s; the second step is that: cleaning with clear water for 1-2 minutes; the third step: putting the mixture into an oxidation tank for continuous filtration and cyclic cleaning for 2-4 minutes; the fourth step: cleaning with clear water for 1-2 minutes; the fifth step: putting the mixture into a neutralization tank, and filtering and circularly cleaning for 40-50 s; and a sixth step: and cleaning with clear water for 1-2 minutes, wherein a swelling agent is arranged in the swelling tank, and the temperature of the swelling tank is 70-80 ℃. In the invention, the strong oxidizing property of the alkaline sodium permanganate solution is utilized to bite and erode the bulked hole wall so as to remove the drilling dirt generated by drilling, simultaneously, the substrate is moderately bitten and eroded, so that the inner layer copper is exposed, and the epoxy resin on the hole wall forms a honeycomb-shaped micro-rough surface, thus being beneficial to the adsorption of palladium, enhancing the binding force of a chemical copper layer and preventing the separation of the hole wall and the occurrence of hole blowing.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a horizontal glue removing process for a printed circuit board.
Background
Printed Circuit Boards (PCBs) are the basis of almost any electronic product, and are found in almost every electronic device, and generally, if electronic components are present in a certain device, they are also integrated on PCBs of various sizes. The main material of the PCB is a substrate material which plays three functions of conduction, insulation and support for the overall characteristics of the PCB. The performance, quality, processability during manufacture, manufacturing level, manufacturing cost, long-term reliability, etc. of a PCB depend to a large extent on the substrate material used for it. The substrate material is a plate-shaped material which is formed by soaking a reinforcing material (glass fiber cloth and paper) with resin and covering one or two surfaces with copper foil through hot pressing, and is also called a copper-clad plate for short. Along with electronic equipment is more and more complicated, the components and parts that need are more and more, and high temperature resistant, high pressure, high fire resistance are more and more strict, and among the prior art, the surface and the back of circuit board all are provided with the copper foil, set up glass fiber cloth between the copper foil from top to bottom and support and keep apart, in order to improve the structural strength of glass fiber cloth and copper foil, set up glue respectively and connect fixedly. In the prior art, when the circuit board is drilled with holes and plated with copper, residual glue is generated in the drilled holes, and if the residual glue is not completely treated, a large amount of circuit board products are scrapped. For example, chinese patent CN201610638229.7 discloses a horizontal glue removing process for producing PCB board, which is characterized by comprising the following steps: (1) placing a plate: placing the PCB needing browning and horizontal degumming treatment in a production line; (2) micro-etching: placing the PCB board obtained in the step (1) in a microetching cylinder for microetching treatment; (3) washing with water: placing the PCB processed in the step (2) into a washing tank for overflow washing; (4) expansion: placing the PCB processed in the step (3) in an expansion cylinder for expansion treatment; (5) washing with water: placing the PCB processed in the step (4) into a washing tank for washing; (6) removing glue: placing the PCB processed in the step (5) in a glue removing cylinder for glue removing treatment; (7) washing with water: placing the PCB processed in the step (6) into a washing tank for washing; (8) neutralizing: placing the PCB processed in the step (7) in a neutralization cylinder for neutralization treatment; (9) washing with water: placing the PCB processed in the step (8) into a washing tank for washing; (10) drying: placing the PCB processed in the step (9) in a dryer for drying treatment; (11) and (6) collecting the plate. According to the technical scheme, in order to remove the residual glue, a secondary glue removing process is adopted in the existing production process, and the process has the following main defects: the repeated process wastes water and electricity resources, increases the production of industrial wastewater, is not very environment-friendly, and has an unsatisfactory degumming effect.
Disclosure of Invention
In order to solve the problems that the prior art has more repeated processes, each process consumes longer time, the overall process duration is increased, and the process is not environment-friendly, the invention provides a horizontal glue removing process for a printed circuit board.
The technical scheme disclosed by the invention is as follows: a horizontal glue removing process for a printed circuit board is characterized by comprising the following steps: the method comprises the following steps:
the first step is as follows: putting the printed circuit board into a bulking tank, and continuously filtering and circularly cleaning for 90-120 s;
the second step is that: cleaning with clear water for 1-2 minutes;
the third step: putting the mixture into an oxidation tank for continuous filtration and cyclic cleaning for 2-4 minutes;
the fourth step: cleaning with clear water for 1-2 minutes;
the fifth step: putting the mixture into a neutralization tank, and filtering and circularly cleaning for 40-50 s;
and a sixth step: cleaning for 1-2 minutes by adopting clean water
The swelling agent is arranged in the swelling tank, and the temperature of the swelling tank is 70-80 ℃.
On the basis, a neutralizing agent is arranged in the neutralizing tank, and the temperature of the neutralizing tank is 35-45 ℃.
On the basis, the mass fraction of the leavening agent added into the puffing groove is 35-45%; the mass fraction of the neutralizing agent added into the neutralizing tank is 18-25%.
On the basis of this, the treatment time in the leavening tank in the first step was 100 seconds, and the treatment temperature was 75 ℃.
On the basis, the treatment time in the neutralization tank in the fifth step is 45s, and the treatment temperature is 40 ℃.
On the basis, a quartz or titanium heater is arranged in the bulking groove.
On the basis, a quartz or teflon heater is arranged in the neutralization groove.
On the basis, the mass fraction of 98% sulfuric acid in the neutralization tank is 4-6%.
On the basis, an alkaline sodium permanganate solution and a sodium hydroxide solution are arranged in the oxidation pond in the third step, wherein the concentration of sodium permanganate in the sodium permanganate solution is 70-80g/L, and the concentration of sodium hydroxide is 35-45 g/L.
On the basis, the temperature of the oxidation tank is controlled to be 70-85 ℃, and the degumming amount is 0.1-0.4mg/cm 2; and a heater is arranged in the oxidation tank, and the heater is titanium or quartz.
Compared with the prior art, the invention has the beneficial effects that:
(1) the swelling agent is used in the pretreatment of the degumming residue, can effectively remove the degumming residue and dirt generated by the high temperature of drilling, and can swell and soften the base material so as to improve the biting action of the degumming agent.
(2) The neutralizing agent of the present invention is strong acid reducing agent capable of neutralizing residual alkali liquid and reducing bivalent Mn ion to eliminate oxidant.
(3) In the invention, the strong oxidizing property of the alkaline sodium permanganate solution is utilized to bite and erode the bulked hole wall so as to remove the drilling dirt generated by drilling, simultaneously, the substrate is moderately bitten and eroded, so that the inner layer copper is exposed, and the epoxy resin on the hole wall forms a honeycomb-shaped micro-rough surface, thus being beneficial to the adsorption of palladium, enhancing the binding force of a chemical copper layer and preventing the separation of the hole wall and the occurrence of hole blowing.
(4) In the invention, a pre-neutralization tank can be added in front of the neutralization tank, and sulfuric acid and hydrogen peroxide are added into the pre-neutralization tank, wherein the sulfuric acid and the hydrogen peroxide are respectively added by 2-3%, so that the load of the neutralization tank can be effectively reduced.
Detailed Description
The present invention will be described in further detail with reference to examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention discloses a horizontal glue removing process for a printed circuit board, which has the innovation points that: the method comprises the following steps:
the first step is as follows: putting the printed circuit board into a bulking tank, and continuously filtering and circularly cleaning for 90-120 s;
the second step is that: cleaning with clear water for 1-2 minutes;
the third step: putting the mixture into an oxidation tank for continuous filtration and cyclic cleaning for 2-4 minutes;
the fourth step: cleaning with clear water for 1-2 minutes;
the fifth step: putting the mixture into a neutralization tank, and filtering and circularly cleaning for 40-50 s;
and a sixth step: cleaning for 1-2 minutes by adopting clean water
The swelling agent is arranged in the swelling tank, and the temperature of the swelling tank is 70-80 ℃. The swelling agent is used in the pretreatment of the degumming residue, can effectively remove the degumming residue and dirt generated by the high temperature of drilling, and can swell and soften the base material so as to improve the biting action of the degumming agent.
Specifically, a neutralizing agent is arranged in the neutralizing tank, and the temperature of the neutralizing tank is 35-45 ℃.
The neutralizing agent of the present invention is strong acid reducing agent capable of neutralizing residual alkali liquid and reducing bivalent Mn ion to eliminate oxidant.
As a further preference, in this embodiment of the invention, the mass fraction of the leavening agent added in the puffing groove is 35% -45%; the mass fraction of the neutralizing agent added into the neutralizing tank is 18-25%.
Further preferably, in this embodiment of the present invention, the treatment time in the first step in the puffing tank is 100s, and the treatment temperature is 75 ℃.
Further preferably, in this embodiment of the present invention, the treatment time in the neutralization tank in the fifth step is 45s, and the treatment temperature is 40 ℃.
Further preferably, in this embodiment of the present invention, a quartz or titanium heater is provided in the puffing tank.
Further preferably, in this embodiment of the present invention, a quartz or teflon heater is provided in the neutralization tank.
As a further preference, in this embodiment of the invention, the mass fraction of 98% sulfuric acid in the neutralization tank is 4-6%. Further preferably, the mass fraction of the sulfuric acid having 98% in the neutralization tank is 5%.
Preferably, a pre-neutralization tank is added in front of the neutralization tank, sulfuric acid and hydrogen peroxide are added into the pre-neutralization tank, wherein the sulfuric acid and the hydrogen peroxide are respectively added by 2-3%, and the load of the neutralization tank can be effectively reduced.
Further preferably, in this embodiment of the present invention, the oxidation tank in the third step contains an alkaline sodium permanganate solution and a sodium hydroxide solution, wherein the sodium permanganate solution has a sodium permanganate concentration of 70-80g/L and a sodium hydroxide concentration of 35-45 g/L. More preferably, the concentration of sodium permanganate in the sodium permanganate solution is 75g/L, and the concentration of sodium hydroxide is 40 g/L. In the invention, the strong oxidizing property of the alkaline sodium permanganate solution is utilized to bite and erode the bulked hole wall so as to remove the drilling dirt generated by drilling, simultaneously, the substrate is moderately bitten and eroded, so that the inner layer copper is exposed, and the epoxy resin on the hole wall forms a honeycomb-shaped micro-rough surface, thus being beneficial to the adsorption of palladium, enhancing the binding force of a chemical copper layer and preventing the separation of the hole wall and the occurrence of hole blowing.
Further preferably, in this embodiment of the present invention, the temperature of the oxidation tank is controlled to 70 to 85 ℃ and the amount of the binder removed is 0.1 to 0.4mg/cm2(ii) a And a heater is arranged in the oxidation tank, and the heater is titanium or quartz. Further preferably, in this embodiment of the present invention, the temperature of the oxidation tank is controlled to 75 ℃ and the amount of the degummed product is 0.3mg/cm2。
Example 1
A horizontal glue removing process for a printed circuit board comprises the following steps:
the first step is as follows: a quartz or titanium heater is arranged in the bulking tank, and the printed circuit board is placed in the bulking tank for continuous filtration and cyclic cleaning for 90 s;
the second step is that: cleaning with clear water for 1 minute;
the third step: putting the mixture into an oxidation tank for continuous filtration and cyclic cleaning for 2 minutes;
the fourth step: cleaning with clear water for 1 minute;
the fifth step: putting the mixture into a neutralization tank, and filtering and circularly cleaning for 40 s; a quartz or teflon heater is arranged in the neutralization groove;
and a sixth step: cleaning with clear water for 1 minute;
the swelling agent is filled in the swelling tank, and the temperature of the swelling tank is 70 ℃.
The neutralizing agent is arranged in the neutralizing tank, and the temperature of the neutralizing tank is 35 ℃.
The mass fraction of the leavening agent added into the swelling groove is 35 percent;
the mass fraction of the neutralizing agent added into the neutralizing tank is 18 percent. The mass fraction of the 98% sulfuric acid in the neutralization tank was 4%.
And in the third step, an alkaline sodium permanganate solution and a sodium hydroxide solution are filled in the oxidation tank, wherein the concentration of sodium permanganate in the sodium permanganate solution is 70g/L, and the concentration of sodium hydroxide is 35 g/L.
The temperature of the oxidation tank is controlled to be 70 ℃, and the degumming amount is 0.1mg/cm2；
A heater is arranged in the oxidation tank, and the heater is made of titanium or quartz.
Example 2
A horizontal glue removing process for a printed circuit board has the innovation points that: the method comprises the following steps:
the first step is as follows: putting the printed circuit board into a bulking tank, and continuously filtering and circularly cleaning for 120 s;
the second step is that: cleaning with clear water for 2 minutes;
the third step: putting the mixture into an oxidation tank for continuous filtration and circular cleaning for 4 minutes;
the fourth step: cleaning with clear water for 2 minutes;
the fifth step: putting the mixture into a neutralization tank, and filtering and circularly cleaning for 50 s;
and a sixth step: cleaning with clear water for 2 minutes
The swelling agent is filled in the swelling tank, and the temperature of the swelling tank is 80 ℃.
The neutralizing agent is arranged in the neutralizing tank, and the temperature of the neutralizing tank is 45 ℃.
The neutralizing agent of the present invention is strong acid reducing agent capable of neutralizing residual alkali liquid and reducing bivalent Mn ion to eliminate oxidant.
The mass fraction of the leavening agent added into the swelling groove is 45 percent; the mass fraction of the neutralizing agent added into the neutralizing tank is 25%.
A quartz or titanium heater is arranged in the expansion tank.
A quartz or teflon heater is arranged in the neutralization groove.
The mass fraction of the 98% sulfuric acid in the neutralization tank was 6%.
And in the third step, an alkaline sodium permanganate solution and a sodium hydroxide solution are arranged in the oxidation pond, wherein the concentration of sodium permanganate in the sodium permanganate solution is 80g/L, and the concentration of sodium hydroxide is 45 g/L.
The temperature of the oxidation tank is controlled to be 85 ℃, and the degumming amount is 0.4mg/cm2(ii) a A heater is arranged in the oxidation tank, and the heater is made of titanium or quartz.
Example 3
A horizontal glue removing process for a printed circuit board has the innovation points that: the method comprises the following steps:
the first step is as follows: putting the printed circuit board into a bulking tank, and continuously filtering and circularly cleaning for 100 s;
the second step is that: cleaning with clear water for 1.5 minutes;
the third step: putting the mixture into an oxidation tank for continuous filtration and cyclic cleaning for 3 minutes;
the fourth step: cleaning with clear water for 1.5 minutes;
the fifth step: putting the mixture into a neutralization tank, and filtering and circularly cleaning for 45 s;
and a sixth step: cleaning with clear water for 1.5 minutes
The swelling tank is filled with a swelling agent, and the temperature of the swelling tank is 75 ℃.
The neutralizing agent is arranged in the neutralizing tank, and the temperature of the neutralizing tank is 40 ℃.
The neutralizing agent of the present invention is strong acid reducing agent capable of neutralizing residual alkali liquid and reducing bivalent Mn ion to eliminate oxidant.
The mass fraction of the leavening agent added into the swelling groove is 40 percent; the mass fraction of the neutralizing agent added into the neutralizing tank is 21%.
A quartz or titanium heater is arranged in the expansion tank.
A quartz or teflon heater is arranged in the neutralization groove.
The mass fraction of the 98% sulfuric acid in the neutralization tank was 5%.
And in the third step, an alkaline sodium permanganate solution and a sodium hydroxide solution are arranged in the oxidation pond, wherein the concentration of sodium permanganate in the sodium permanganate solution is 75g/L, and the concentration of sodium hydroxide is 40 g/L.
The temperature of the oxidation tank is controlled to be 75 ℃, and the degumming amount is 0.3mg/cm2. And a heater is arranged in the oxidation tank, and the heater is titanium or quartz.
Example 4
A horizontal glue removing process for a printed circuit board has the innovation points that: the method comprises the following steps:
the first step is as follows: putting the printed circuit board into a bulking tank, and continuously filtering and circularly cleaning for 100 s;
the second step is that: cleaning with clear water for 1.5 minutes;
the third step: putting the mixture into an oxidation tank for continuous filtration and cyclic cleaning for 3 minutes;
the fourth step: cleaning with clear water for 1.5 minutes;
the fifth step: putting the mixture into a neutralization tank, and filtering and circularly cleaning for 45 s;
and a sixth step: cleaning with clear water for 1.5 minutes
The swelling tank is filled with a swelling agent, and the temperature of the swelling tank is 75 ℃.
The neutralizing agent is arranged in the neutralizing tank, and the temperature of the neutralizing tank is 40 ℃.
The neutralizing agent of the present invention is strong acid reducing agent capable of neutralizing residual alkali liquid and reducing bivalent Mn ion to eliminate oxidant.
The mass fraction of the leavening agent added into the swelling groove is 40 percent; the mass fraction of the neutralizing agent added into the neutralizing tank is 21%.
A quartz or titanium heater is arranged in the expansion tank.
A quartz or teflon heater is arranged in the neutralization groove.
The mass fraction of the 98% sulfuric acid in the neutralization tank was 5%.
On the basis of the steps, a pre-neutralization tank is added in front of the neutralization tank, sulfuric acid and hydrogen peroxide are added into the pre-neutralization tank, wherein the sulfuric acid and the hydrogen peroxide are respectively added by 2-3 wt%, and the load of the neutralization tank can be effectively reduced.
And in the third step, an alkaline sodium permanganate solution and a sodium hydroxide solution are arranged in the oxidation pond, wherein the concentration of sodium permanganate in the sodium permanganate solution is 75g/L, and the concentration of sodium hydroxide is 40 g/L.
The temperature of the oxidation tank is controlled to be 75 ℃, and the degumming amount is 0.3mg/cm2. And a heater is arranged in the oxidation tank, and the heater is titanium or quartz.
In examples 1 to 3: the swelling agent is used in the pretreatment of the degumming residue, can effectively remove the degumming residue and dirt generated by the high temperature of drilling, and can swell and soften the base material so as to improve the biting action of the degumming agent.
The neutralizer is an acidic strong reducing agent, can neutralize alkaline residual liquid, and can reduce and participate in heptavalent manganese, hexavalent manganese, manganese dioxide and the like to be soluble divalent manganese ions, so that an oxidant is prevented from being brought into the subsequent flow.
The oxidant utilizes the strong oxidizing property of the alkaline sodium permanganate solution to bite and corrode the bulked hole wall so as to remove the drilling dirt generated by drilling, simultaneously moderately bite and corrode the substrate, so that the inner layer copper is exposed, and the epoxy resin on the hole wall forms a honeycomb-shaped micro-rough surface, thereby being beneficial to the adsorption of palladium, enhancing the binding force of a chemical copper layer and preventing the separation of the hole wall and the occurrence of hole blowing.
In example 4, on the basis of the above examples 1 to 3, a pre-neutralization tank is added before the neutralization tank, and sulfuric acid and hydrogen peroxide are added into the pre-neutralization tank, wherein the sulfuric acid and the hydrogen peroxide are added by 2 to 3 percent respectively, so that the load of the neutralization tank can be effectively reduced.
While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as described herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A horizontal glue removing process for a printed circuit board is characterized by comprising the following steps: the method comprises the following steps:
the first step is as follows: putting the printed circuit board into a bulking tank, and continuously filtering and circularly cleaning for 90-120 s;
the second step is that: cleaning with clear water for 1-2 minutes;
the third step: putting the mixture into an oxidation tank for continuous filtration and cyclic cleaning for 2-4 minutes;
the fourth step: cleaning with clear water for 1-2 minutes;
the fifth step: putting the mixture into a neutralization tank, and filtering and circularly cleaning for 40-50 s;
and a sixth step: cleaning with clear water for 1-2 minutes;
the swelling agent is arranged in the swelling tank, and the temperature of the swelling tank is 70-80 ℃.
2. The horizontal glue removing process of the printed circuit board as claimed in claim 1, wherein: the neutralizing agent is arranged in the neutralizing tank, and the temperature of the neutralizing tank is 35-45 ℃.
3. The horizontal glue removing process of the printed circuit board as claimed in claim 2, wherein: the mass fraction of the leavening agent added into the expansion tank is 35-45%; the mass fraction of the neutralizing agent added into the neutralizing tank is 18-25%.
4. The horizontal glue removing process of the printed circuit board as claimed in claim 3, wherein: the treatment time in the leavening tank in the first step is 100s, and the treatment temperature is 75 ℃.
5. The horizontal glue removing process of the printed circuit board as claimed in claim 3, wherein: in the fifth step, the treatment time in the neutralization tank is 45s, and the treatment temperature is 40 ℃.
6. The horizontal glue removing process of the printed circuit board as claimed in claim 1, wherein: and a quartz or titanium heater is arranged in the expansion tank.
7. The horizontal glue removing process of the printed circuit board as claimed in claim 1, wherein: and a quartz or teflon heater is arranged in the neutralization groove.
8. The horizontal glue removing process for the printed circuit board according to claim 7, wherein: the mass fraction of 98% sulfuric acid in the neutralization tank is 4-6%.
9. The horizontal glue removing process of the printed circuit board as claimed in claim 1, wherein: and in the third step, an alkaline sodium permanganate solution and a sodium hydroxide solution are arranged in the oxidation pond, wherein the concentration of sodium permanganate in the sodium permanganate solution is 70-80g/L, and the concentration of sodium hydroxide is 35-45 g/L.
10. The horizontal glue removing process for printed circuit board according to claim 9, characterized in that: the temperature of the oxidation tank is controlled to be 70-85 ℃, and the degumming amount is 0.1-0.4mg/cm2(ii) a And a heater is arranged in the oxidation tank, and the heater is titanium or quartz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011624819.7A CN112867276A (en) | 2020-12-31 | 2020-12-31 | Horizontal glue removing process for printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011624819.7A CN112867276A (en) | 2020-12-31 | 2020-12-31 | Horizontal glue removing process for printed circuit board |
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| Publication Number | Publication Date |
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| CN112867276A true CN112867276A (en) | 2021-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011624819.7A Pending CN112867276A (en) | 2020-12-31 | 2020-12-31 | Horizontal glue removing process for printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156171A (en) * | 2022-09-06 | 2022-10-11 | 天津市海承科技发展有限公司 | Method for cleaning printed circuit board |
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| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
| CN106572602A (en) * | 2016-10-27 | 2017-04-19 | 江门崇达电路技术有限公司 | Method of removing solder resist layer of PCB (printed circuit board) |
| CN107734870A (en) * | 2017-09-26 | 2018-02-23 | 深圳明阳电路科技股份有限公司 | A kind of rigid-flex combined board is except the method for boring dirt |
| CN108289384A (en) * | 2018-01-22 | 2018-07-17 | 奥士康精密电路（惠州）有限公司 | High TG plates remove gluing method |
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2020
- 2020-12-31 CN CN202011624819.7A patent/CN112867276A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
| CN106572602A (en) * | 2016-10-27 | 2017-04-19 | 江门崇达电路技术有限公司 | Method of removing solder resist layer of PCB (printed circuit board) |
| CN107734870A (en) * | 2017-09-26 | 2018-02-23 | 深圳明阳电路科技股份有限公司 | A kind of rigid-flex combined board is except the method for boring dirt |
| CN108289384A (en) * | 2018-01-22 | 2018-07-17 | 奥士康精密电路（惠州）有限公司 | High TG plates remove gluing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156171A (en) * | 2022-09-06 | 2022-10-11 | 天津市海承科技发展有限公司 | Method for cleaning printed circuit board |
| CN115156171B (en) * | 2022-09-06 | 2023-01-03 | 天津市海承科技发展有限公司 | Method for cleaning printed circuit board |
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Application publication date: 20210528 |