CN115156171B - Method for cleaning printed circuit board - Google Patents
Method for cleaning printed circuit board Download PDFInfo
- Publication number
- CN115156171B CN115156171B CN202211081445.8A CN202211081445A CN115156171B CN 115156171 B CN115156171 B CN 115156171B CN 202211081445 A CN202211081445 A CN 202211081445A CN 115156171 B CN115156171 B CN 115156171B
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- CN
- China
- Prior art keywords
- cleaning
- circuit board
- printed circuit
- parts
- deionized water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a cleaning method of a printed circuit board, which comprises the following steps: after the printed circuit board is cleaned by a cleaning solvent, secondarily cleaning the printed circuit board by a pre-configured neutralization liquid medicine; after the secondary cleaning, the cleaned printed circuit board is washed by deionized water and dried after washing so as to complete the cleaning of the printed circuit board; wherein the components of the neutralization liquid medicine comprise: potassium tripolyphosphate, coconut monoethanol amine, glycerol polyoxyethylene propylene ether, polyethylene glycol 200, monolauryl monoacid and deionized water. The invention adopts two solvents to clean the printed circuit board assembly, thereby not only cleaning the residual substance of the active resin on the surface of the printed circuit board, but also cleaning the chemical residue including the marked mark on the surface of the printed circuit board assembly, thereby achieving the purpose of completely cleaning organic impurities and inorganic substances, and the printed circuit board can be completely cleaned by two steps of cleaning.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a cleaning method of a printed circuit board.
Background
Generally, after electronic products are welded, a printed circuit board needs to be cleaned, pollutants can be effectively removed after cleaning, and the appearance of a component is clear, so that the cleaning plays an important role in ensuring the reliability, the electrical index and the service life of the electronic products. For this reason, post-assembly cleaning of the circuit is necessary. At present, the existing circuit board is cleaned by a solvent, residues are not thoroughly cleaned, the residues play a role in chemical erosion or mechanical damage, equipment failure is caused, and meanwhile, the cleaning cost is high.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
Aiming at the problems in the related art, the invention provides a cleaning method of a printed circuit board, which can solve the problems of poor cleaning effect and high cleaning cost in the prior art.
The technical scheme of the invention is realized as follows:
a cleaning method of a printed circuit board comprises the following steps:
after the printed circuit board is cleaned by a cleaning solvent, secondarily cleaning the printed circuit board by a pre-configured neutralization liquid medicine;
after the secondary cleaning, the cleaned printed circuit board is washed by deionized water and dried after washing so as to complete the cleaning of the printed circuit board;
wherein the components of the neutralization liquid medicine comprise: potassium tripolyphosphate, coconut monoethanol amine, glycerol polyoxyethylene propylene ether, polyethylene glycol 200, monolauryl monoacid and deionized water.
Optionally, in the method for cleaning a printed circuit board, the cleaning the printed circuit board with a cleaning solvent includes: completely soaking the printed circuit board by using a cleaning solvent; heating the cleaning solvent to clean the printed circuit board; after the cleaning is completed, the printed circuit board is subjected to a drying process.
Optionally, the drying treatment mode is natural drying.
Optionally, the cleaning solvent is an absolute ethanol solvent.
Optionally, the soaking time is less than or equal to 4 minutes, and the heating temperature is 30 to 40 ℃.
Optionally, the neutralization liquid medicine comprises the following components in parts by weight:
3 parts of potassium tripolyphosphate, 5 parts of coconut monoethanol amine, 2 parts of glycerol polyoxyethylene propylene ether, 8 parts of a mixture of polyethylene glycol 200 and monolaurate and 82 parts of deionized water.
Optionally, 8 parts of the mixture of polyethylene glycol 200 and monolaurate comprises: comprises 4 parts by weight of polyethylene glycol 200 and 4 parts by weight of monolaurate.
Optionally, the conductivity of the deionized water is less than 0.05 us/cm.
Optionally, the cleaning mode of the secondary cleaning is rinsing.
Optionally, the drying temperature is 60 to 80 ℃.
Has the advantages that: the invention adopts two solvents to clean the printed circuit board assembly, thereby not only cleaning the active resin residual substance on the surface of the printed circuit board, but also removing the chemical residue including the marked mark on the surface of the printed circuit board assembly. Wherein, the potassium tripolyphosphate is used as a penetrating agent, so that the grease can be better stripped; the cocoyl monoethanolamine is used for emulsification and saponification, and reacts to strip resin grease; the glycerol polyoxypropylene ether is used for dissolving, permeating and stripping; the polyethylene glycol 200 and the monolaurate are used for dissolving and stripping; deionized water is used for diluting; therefore, the purpose of completely removing organic impurities and inorganic substances is achieved, and the printed circuit board can be completely cleaned by the two-step cleaning.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for cleaning a printed circuit board according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
According to an embodiment of the present invention, there is provided a cleaning method of a printed circuit board.
As shown in fig. 1, a method for cleaning a printed circuit board according to an embodiment of the present invention includes the following steps:
step S101, after the printed circuit board is cleaned by the cleaning solvent, the printed circuit board is cleaned for the second time by the pre-configured neutralization liquid medicine;
step S103, after secondary cleaning, washing the cleaned printed circuit board by using deionized water, and drying the washed printed circuit board after washing to finish cleaning the printed circuit board;
wherein, the components of the neutralization liquid medicine comprise: potassium tripolyphosphate, coconut monoethanol amine, glycerol polyoxyethylene propylene ether, polyethylene glycol 200, monolauryl monoacid and deionized water.
In one embodiment, in the above method for cleaning a printed circuit board, the cleaning the printed circuit board with a cleaning solvent includes: completely soaking the printed circuit board by using an absolute ethyl alcohol solvent, wherein the soaking time is less than or equal to 4 minutes; then heating the cleaning solvent at the temperature of 30-40 ℃, and cleaning the printed circuit board; and after the cleaning is finished, drying the printed circuit board in a natural drying mode.
In one embodiment, in the method for cleaning a printed circuit board, the neutralization solution comprises the following components in parts by weight: 3 parts of potassium tripolyphosphate, 5 parts of coconut monoethanol amine, 2 parts of glycerol polyoxyethylene propylene ether, 8 parts of a mixture of polyethylene glycol 200 and monolaurate and 82 parts of deionized water; wherein, 8 parts of the mixture of the polyethylene glycol 200 and the monolaurate comprises: comprises 4 parts by weight of polyethylene glycol 200 and 4 parts by weight of monolaurate.
Of course, in practical application, according to actual requirements and the degree of the residual solvent, 8 parts of the mixture of the polyethylene glycol 200 and the monolaurate can also adopt other proportioning modes of the polyethylene glycol 200 and the monolaurate.
In one embodiment, in the above method for cleaning a printed circuit board, the conductivity of the deionized water is less than 0.05 us/cm. The cleaning mode of the secondary cleaning can adopt rinsing, and the drying temperature is 60-80 ℃.
In order to facilitate understanding of the above-mentioned technical solutions of the present invention, the following further describes the above-mentioned technical solutions of the present invention by specific examples.
In practical application, before cleaning the printed circuit board, firstly, a static-free dust blowing gun is adopted to blow off dust adhered to the surface of the printed circuit board, then, an absolute ethyl alcohol solvent is added into a stainless steel container, the printed circuit board is completely soaked into the absolute ethyl alcohol solvent, the temperature is heated to 30-40 ℃, and the soaking time is controlled within 4 minutes, so that the cleaning of the active resin residual substances on the surface of the printed circuit board is completed.
And after the cleaning is finished, naturally drying the printed circuit board assembly until the solvent is completely volatilized. After the printed circuit board is completely volatilized, a mixed solution formed by mixing 3 parts of potassium tripolyphosphate, 5 parts of coconut monoethanol amine, 2 parts of glycerol polyoxyethylene propylene ether, 8 parts of a mixture of polyethylene glycol 200 and monolauryl monoacid and 82 parts of deionized water is used for rinsing the printed circuit board, and after rinsing is finished, the printed circuit board is rinsed by using the deionized water. And after the flushing is finished, drying the printed circuit board at the temperature of 60 to 80 ℃.
In summary, according to the above technical solution of the present invention, two solvents are used to clean the printed circuit board assembly, so that not only the residual active resin on the surface of the printed circuit board can be cleaned, but also the chemical residue including the mark trace on the surface of the printed circuit board assembly can be removed. Wherein, the potassium tripolyphosphate is used as a penetrating agent, so that the grease can be better stripped; the cocoyl monoethanolamine is used for emulsification and saponification, reaction is carried out, and resin grease is stripped; the glycerol polyoxypropylene ether is used for dissolving, permeating and stripping; the polyethylene glycol 200 and the monolaurate are used for dissolving and stripping; deionized water is used for diluting; therefore, the purpose of completely removing organic impurities and inorganic substances is achieved, and the printed circuit board can be completely cleaned by the two-step cleaning.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, which is intended to cover any modifications, equivalents, improvements, etc. within the spirit and scope of the present invention.
Claims (8)
1. A method for cleaning a printed circuit board is characterized by comprising the following steps:
after the printed circuit board is cleaned by a cleaning solvent for cleaning residual substances of active resin, carrying out secondary cleaning on the printed circuit board by a pre-prepared neutralization liquid medicine for cleaning chemical residues;
after the secondary cleaning, the cleaned printed circuit board is washed by deionized water and dried after washing so as to complete the cleaning of the printed circuit board;
wherein the components of the neutralization liquid medicine comprise: potassium tripolyphosphate, cocoyl monoethanolamine, glycerol polyoxyethylene propylene ether, polyethylene glycol 200, monolauryl monoacid and deionized water; the neutralizing liquid medicine comprises the following components in parts by weight: 3 parts of potassium tripolyphosphate, 5 parts of coconut monoethanol amine, 2 parts of glycerol polyoxyethylene propylene ether, 8 parts of a mixture of polyethylene glycol 200 and monolaurate and 82 parts of deionized water; 8 parts of a mixture of polyethylene glycol 200 and monolaurate comprises: comprises 4 parts by weight of polyethylene glycol 200 and 4 parts by weight of monolaurate.
2. The method of claim 1, wherein the cleaning of the printed circuit board with the cleaning solvent comprises:
completely soaking the printed circuit board by using a cleaning solvent;
heating the cleaning solvent to clean the printed circuit board;
after the cleaning is completed, the printed circuit board is subjected to a drying process.
3. The method for cleaning the printed circuit board according to claim 2, wherein the drying process is a natural drying process.
4. The method for cleaning a printed circuit board according to claim 3, wherein the cleaning solvent is an absolute ethanol solvent.
5. The method for cleaning the printed circuit board according to claim 4, wherein the soaking time is less than or equal to 4 minutes, and the heating temperature is 30 to 40 ℃.
6. The method of claim 1, wherein the conductivity of the deionized water is less than 0.05 us/cm.
7. The method for cleaning the printed circuit board as claimed in claim 1, wherein the cleaning manner of the secondary cleaning is rinsing.
8. The method for cleaning the printed circuit board as claimed in claim 1, wherein the drying temperature is 60 to 80 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211081445.8A CN115156171B (en) | 2022-09-06 | 2022-09-06 | Method for cleaning printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211081445.8A CN115156171B (en) | 2022-09-06 | 2022-09-06 | Method for cleaning printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115156171A CN115156171A (en) | 2022-10-11 |
| CN115156171B true CN115156171B (en) | 2023-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211081445.8A Active CN115156171B (en) | 2022-09-06 | 2022-09-06 | Method for cleaning printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115156171B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104519664A (en) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | Printed circuit board cleaning method and printed circuit board |
| CN108990304A (en) * | 2018-09-03 | 2018-12-11 | 嘉善中佳电路板有限公司 | A kind of cleaning process of printed circuit board |
| CN110730571A (en) * | 2019-10-25 | 2020-01-24 | 四川普瑞森电子有限公司 | Cleaning method of printed circuit board, printed circuit board and circuit board clamp |
| CN112867276A (en) * | 2020-12-31 | 2021-05-28 | 南通赛可特电子有限公司 | Horizontal glue removing process for printed circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202206661U (en) * | 2011-09-22 | 2012-04-25 | 常州紫寅电子电路有限公司 | Cleaning device for printed circuit board |
| CN114007338A (en) * | 2020-07-28 | 2022-02-01 | 珠海方正印刷电路板发展有限公司 | Cleaning method and cleaning device for printed circuit board |
-
2022
- 2022-09-06 CN CN202211081445.8A patent/CN115156171B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104519664A (en) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | Printed circuit board cleaning method and printed circuit board |
| CN108990304A (en) * | 2018-09-03 | 2018-12-11 | 嘉善中佳电路板有限公司 | A kind of cleaning process of printed circuit board |
| CN110730571A (en) * | 2019-10-25 | 2020-01-24 | 四川普瑞森电子有限公司 | Cleaning method of printed circuit board, printed circuit board and circuit board clamp |
| CN112867276A (en) * | 2020-12-31 | 2021-05-28 | 南通赛可特电子有限公司 | Horizontal glue removing process for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115156171A (en) | 2022-10-11 |
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