CN114007338A - Cleaning method and cleaning device for printed circuit board - Google Patents
Cleaning method and cleaning device for printed circuit board Download PDFInfo
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- CN114007338A CN114007338A CN202010738973.0A CN202010738973A CN114007338A CN 114007338 A CN114007338 A CN 114007338A CN 202010738973 A CN202010738973 A CN 202010738973A CN 114007338 A CN114007338 A CN 114007338A
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- circuit board
- printed circuit
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- cleaning
- stripping agent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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Abstract
The invention provides a cleaning method and a cleaning device for a printed circuit board. The cleaning method of the printed circuit board comprises the following steps: heating the ink stripping agent to a preset temperature; placing the printed circuit board in an ink stripping agent, and soaking for a preset time; and taking out and drying the printed circuit board. Compared with the prior art, the cleaning method of the printed circuit board provided by the invention has the advantages that the ink stripping agent is heated, the soaking time of the printed circuit board can be shortened, the treatment process is shortened, the printed circuit board is taken out and dried after being soaked, the production cost can be reduced, and the production benefit is improved. Meanwhile, the cleaning method of the printed circuit board provided by the embodiment of the invention can be used for backwashing processing of non-plugged plates and other scenes needing to backwash solder resist ink in processing of circuit boards.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a cleaning method and a cleaning device for a printed circuit board.
Background
With the technological innovation of electronic products, high-end technical products are continuously emerging, the requirements of customers are more and more strict, and defective products generated by a solder mask process need to be reworked and washed to remove solder mask ink in the production process of printed circuit boards. When the printed circuit board is cleaned, the printed circuit board is usually soaked in an alkaline solution in the related art, and the solder resist ink is peeled off after being expanded, so that the method has long operation time and low efficiency.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, a first aspect of the invention provides a method of cleaning a printed circuit board.
A second aspect of the present invention provides a cleaning apparatus for a printed circuit board.
In view of the above, according to a first aspect of the present invention, there is provided a cleaning method of a printed circuit board, comprising: heating the ink stripping agent to a preset temperature; placing the printed circuit board in an ink stripping agent, and soaking for a preset time; and taking out and drying the printed circuit board.
The cleaning method of the printed circuit board provided by the invention comprises the steps of heating the ink stripping agent to a preset temperature, placing the printed circuit board in the ink stripping agent, soaking for a preset time, taking out and drying the printed circuit board, and cleaning the printed circuit board. Compared with the prior art, the cleaning method of the printed circuit board provided by the invention has the advantages that the ink stripping agent is heated, the soaking time of the printed circuit board can be shortened, the treatment process is shortened, the printed circuit board is taken out and dried after being soaked, the production cost can be reduced, and the production benefit is improved. Meanwhile, the cleaning method of the printed circuit board provided by the embodiment of the invention can be used for backwashing processing of non-plugged plates and other scenes needing to backwash solder resist ink in processing of circuit boards.
In addition, the method for cleaning the printed circuit board provided by the technical scheme of the invention also has the following additional technical characteristics:
in one possible design, the ink stripper includes: the sodium hydroxide solution, the mass percent concentration of the sodium hydroxide solution is 30% -60%; surfactant, wherein the volume ratio of the surfactant to the sodium hydroxide solution is 4-10%; the volume ratio of the ink dissolving agent to the sodium hydroxide solution is 20-40%.
In the design, the sodium hydroxide solution has the mass percentage concentration of 30-60%, the surfactant with the volume ratio of 4-10% to the sodium hydroxide solution and the ink dissolving agent with the volume ratio of 20-40% to the sodium hydroxide solution are added into the sodium hydroxide solution, so that the ink stripping agent capable of expanding and dissolving the solder-resisting ink is formed, the effect of dissolving the solder-resisting ink after expansion is achieved, the solder-resisting ink is cleaned more quickly and thoroughly, and particularly the cleaning effect on the solder-resisting ink in the holes of the printed circuit board is remarkable. In the related technology, because of the solder mask hole plugging process, solder mask ink in the printed circuit board hole plugging is difficult to clean, the printed circuit board needs to be soaked in a sodium hydroxide solution for 60 to 90 minutes, then is taken out and cleaned by a high-pressure water gun, and then passes through a developing machine, the developing speed is usually 0.5 m/min, time is wasted, and in the cleaning process, the solder mask ink on the printed circuit board is flaky and drops off, and the printed circuit board easily enters the hole to cause hole plugging. Meanwhile, the soaking time in the sodium hydroxide solution is too long, so that the attack on the board is great, and the printed circuit board is easily scrapped due to whitening, circuit peeling and the like. Compared with the prior art, the ink stripping agent provided by the embodiment can effectively remove solder-resisting ink on the surface and in the hole of the printed circuit board, avoids the quality problems of hole blockage and the like of the solder-resisting ink, can reduce soaking time by heating the ink stripping agent, reduces production cost, improves production efficiency, and avoids causing the printed circuit board to be scrapped.
In one possible design, the ink dissolving agent includes: potassium hydroxide, the mass percent of potassium hydroxide is 10% -30%; the ethylene glycol ethyl ether accounts for 5 to 20 percent of the mass percent of the total mass of the ethylene glycol ethyl ether.
In the design, the ink dissolving agent comprises 10-30% by mass of potassium hydroxide and 5-20% by mass of ethylene glycol ethyl ether. By adding the printing ink dissolving agent into the sodium hydroxide solution, the solder-resisting printing ink on the surface and in the hole of the printed circuit board can be dissolved, and the quality problems of hole plugging of the solder-resisting printing ink and the like are avoided.
In one possible design, the preset temperature is 60 ℃ to 80 ℃.
In the design, the preset temperature is set to be 60-80 ℃, and compared with the ink stripping agent at normal temperature, the heated ink stripping agent can effectively reduce the soaking time of the printed circuit board. In addition, the preset temperature is set to be 60-80 ℃, and the surface layer of the printed circuit board can be prevented from being damaged due to the fact that the temperature of the ink stripping agent is too high.
In one possible embodiment, when the printed circuit board is a dielectric circuit board, the predetermined time period is a first predetermined time period, and the first predetermined time period is 10 minutes to 15 minutes.
In the design, when the printed circuit board is a dielectric circuit board, the dielectric circuit board is placed in the ink stripping agent and soaked for 10 to 15 minutes, and the effect that the solder resist ink on the surface and in the hole of the dielectric circuit board is dissolved after expansion can be achieved. Compared with the printed circuit board needing to be soaked for 60 to 90 minutes in the related technology, the method for cleaning the printed circuit board shortens the soaking time to 10 to 15 minutes, reduces the production cost, improves the production efficiency, and avoids the printed circuit board being scrapped.
In one possible design, when the printed circuit board is a copper circuit board, the preset time period is a second preset time period, and the second preset time period is 3 minutes to 5 minutes.
In the design, when the printed circuit board is a copper circuit board, the copper circuit board is placed in the ink stripping agent and soaked for 3 to 5 minutes, and the effect of preventing the solder ink on the surface and in the hole of the copper circuit board from being dissolved after being expanded can be achieved. Compared with the printed circuit board needing to be soaked for 60 to 90 minutes in the related technology, the method for cleaning the printed circuit board shortens the soaking time to 3 to 5 minutes, reduces the production cost, improves the production efficiency, and avoids the printed circuit board being scrapped.
In one possible design, the method includes the steps of placing the printed circuit board in an ink remover, and after soaking for a preset time, further including: the ink stripper is stirred for a third predetermined period of time.
In the design, the step of stirring the ink stripping agent for the third preset time is added, so that the printed circuit board is ensured to be fully contacted with the ink stripping agent, the dissolution of the solder resist ink on the surface and in the hole of the printed circuit board is accelerated, the production efficiency is improved, and the production cost is reduced.
In one possible design, the third predetermined period of time is 1 minute to 2 minutes.
In the design, the ink stripping agent is stirred for 1 to 2 minutes, so that the printed circuit board is ensured to be fully contacted with the ink stripping agent, the dissolution of solder resist ink on the surface and in holes of the printed circuit board is accelerated, the production efficiency is improved, and the production cost is reduced.
According to a second aspect of the present invention, there is provided a cleaning apparatus for a printed circuit board, comprising: the cleaning tank is used for containing the ink stripping agent; a heating member for heating the ink remover; the clamping piece is used for taking and placing the printed circuit board; and the drying piece is used for drying the printed circuit board.
According to the cleaning device for the printed circuit board, the ink stripping agent is added into the cleaning tank, the ink stripping agent is heated to the preset temperature by the aid of the heating element, the printed circuit board is placed into the ink stripping agent of the cleaning tank through the clamping element, and is taken out through the clamping element after being soaked for the preset time, and the printed circuit board is dried by the aid of the drying element, so that the printed circuit board is cleaned. According to the cleaning device for the printed circuit board, provided by the embodiment of the invention, the ink stripping agent is heated, so that the soaking time of the printed circuit board can be reduced, the treatment process is shortened, the printed circuit board can be taken out and dried after being soaked, the production cost can be reduced, and the production benefit can be improved. Meanwhile, the cleaning device for the printed circuit board provided by the embodiment of the invention can be used for backwashing processing of non-plugged plates and other scenes needing to backwash solder resist ink in processing of circuit boards.
In addition, the cleaning device for the printed circuit board provided by the technical scheme of the invention also has the following additional technical characteristics:
in one possible design, the cleaning device for the printed circuit board further includes: and the stirring piece is used for stirring the ink stripping agent.
In the design, the ink stripping agent is stirred by the stirring piece, so that the printed circuit board is ensured to be fully contacted with the ink stripping agent, the removal of solder mask ink on the surface and in the hole of the printed circuit board is accelerated, the production efficiency is improved, and the production cost is reduced.
Additional aspects and advantages in accordance with the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic flow diagram illustrating a method for cleaning a printed circuit board according to one embodiment of the present invention;
fig. 2 is a schematic flow chart showing a method for cleaning a printed circuit board according to another embodiment of the present invention.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described herein, and thus the scope of the present invention is not limited by the specific embodiments disclosed below.
A method and an apparatus for cleaning a printed circuit board according to some embodiments of the present invention will be described with reference to fig. 1 to 2.
The first embodiment is as follows:
as shown in fig. 1, a method for cleaning a printed circuit board includes:
step 102: heating the ink stripping agent to a preset temperature;
step 104: placing the printed circuit board in an ink stripping agent, and soaking for a preset time;
step 106: and taking out and drying the printed circuit board.
The cleaning method of the printed circuit board provided by the embodiment of the invention comprises the steps of heating the ink stripping agent to a preset temperature, placing the printed circuit board in the ink stripping agent, soaking for a preset time, taking out and drying the printed circuit board, and cleaning the printed circuit board. Compared with the prior art, the cleaning method of the printed circuit board provided by the embodiment of the invention can reduce the soaking time of the printed circuit board and shorten the treatment process by heating the ink stripping agent, and the printed circuit board can be taken out and dried after being soaked, so that the production cost can be reduced and the production benefit can be improved. Meanwhile, the cleaning method of the printed circuit board provided by the embodiment of the invention can be used for backwashing processing of non-plugged plates and other scenes needing to backwash solder resist ink in processing of circuit boards.
Further, the preset temperature is 60-80 ℃.
In this embodiment, the preset temperature is set to 60 ℃ to 80 ℃, and compared with the ink stripper at normal temperature, the heated ink stripper can effectively reduce the soaking time of the printed circuit board. In addition, the preset temperature is set to be 60-80 ℃, and the surface layer of the printed circuit board can be prevented from being damaged due to the fact that the temperature of the ink stripping agent is too high.
Example two:
on the basis of the first embodiment, the ink remover further comprises: the sodium hydroxide solution, the mass percent concentration of the sodium hydroxide solution is 30% -60%; surfactant, wherein the volume ratio of the surfactant to the sodium hydroxide solution is 4-10%; the volume ratio of the ink dissolving agent to the sodium hydroxide solution is 20-40%.
In the embodiment, the mass percent concentration of the sodium hydroxide solution is 30-60%, the surfactant with the volume ratio of 4-10% to the sodium hydroxide solution and the ink dissolving agent with the volume ratio of 20-40% to the sodium hydroxide solution are added into the sodium hydroxide solution, so that the ink stripping agent capable of expanding and dissolving ink is formed, the effect of dissolving the expanded solder resist ink is achieved, the speed of cleaning the solder resist ink is higher, the ink is more thorough, and the cleaning effect of the solder resist ink in holes of a printed circuit board is particularly remarkable.
In the related technology, because of the solder mask hole plugging process, solder mask ink in the printed circuit board hole plugging is difficult to clean, the printed circuit board needs to be soaked in a sodium hydroxide solution for 60 to 90 minutes, then is taken out and cleaned by a high-pressure water gun, and then passes through a developing machine, the developing speed is usually 0.5 m/min, time is wasted, and in the cleaning process, the solder mask ink on the printed circuit board is flaky and drops off, and the printed circuit board easily enters the hole to cause hole plugging. Meanwhile, the soaking time in the sodium hydroxide solution is too long, so that the attack on the board is great, and the printed circuit board is easily scrapped due to whitening, circuit peeling and the like. Compared with the prior art, the ink stripping agent provided by the embodiment can effectively remove solder-resisting ink on the surface and in the hole of the printed circuit board, avoids the quality problems of hole blockage and the like of the solder-resisting ink, can reduce soaking time by heating the ink stripping agent, reduces production cost, improves production efficiency, and avoids causing the printed circuit board to be scrapped.
Further, the ink dissolving agent includes: 10-30% by mass of potassium hydroxide; 5 to 20 percent of glycol ethyl ether.
In this embodiment, the ink dissolving agent includes 10 to 30 mass% of potassium hydroxide and 5 to 20 mass% of ethylene glycol ethyl ether. By adding the printing ink dissolving agent into the sodium hydroxide solution, the solder-resisting printing ink on the surface and in the hole of the printed circuit board can be dissolved, and the quality problems of hole plugging of the solder-resisting printing ink and the like are avoided.
In addition, the surface active agent is used for changing the surface activity of the solder mask ink on the surface of the printed circuit board and improving the dissolving efficiency of the solder mask ink on the surface of the printed circuit board, thereby improving the cleaning efficiency of the printed circuit board.
Example three:
on the basis of the first embodiment, it is further defined that when the printed circuit board is a dielectric circuit board, the preset time period is a first preset time period, and the first preset time period is 10 minutes to 15 minutes.
In the embodiment, when the printed circuit board is a dielectric circuit board, the dielectric circuit board is placed in the ink stripping agent and soaked for 10 to 15 minutes, so that the effect of dissolving the solder resist ink on the surface and in the hole of the dielectric circuit board after expansion can be realized. Compared with the printed circuit board needing to be soaked for 60 to 90 minutes in the related technology, the method for cleaning the printed circuit board shortens the soaking time to 10 to 15 minutes, reduces the production cost, improves the production efficiency, and avoids the printed circuit board being scrapped.
Example four:
on the basis of the first embodiment, it is further defined that when the printed circuit board is a copper circuit board, the preset time period is a second preset time period, and the second preset time period is 3 minutes to 5 minutes.
In the embodiment, when the printed circuit board is a copper circuit board, the copper circuit board is placed in the ink stripping agent and soaked for 3 to 5 minutes, so that the effect of preventing the solder ink on the surface and in the hole of the copper circuit board from being dissolved after being expanded can be achieved. Compared with the printed circuit board needing to be soaked for 60 to 90 minutes in the related technology, the method for cleaning the printed circuit board shortens the soaking time to 3 to 5 minutes, reduces the production cost, improves the production efficiency, and avoids the printed circuit board being scrapped.
Example five:
as shown in fig. 2, on the basis of the first embodiment, the method for cleaning a printed circuit board includes:
step 202: heating the ink stripping agent to a preset temperature;
step 204: placing the printed circuit board in an ink stripping agent, and soaking for a preset time;
step 206: stirring the ink stripping agent for a third preset time;
step 208: and taking out and drying the printed circuit board.
In the embodiment, the step of stirring the ink stripping agent for the third preset time is added, so that the printed circuit board is ensured to be fully contacted with the ink stripping agent, the dissolution of the solder resist ink on the surface and in the hole of the printed circuit board is accelerated, the production efficiency is improved, and the production cost is reduced.
Further, the third preset time period is 1 to 2 minutes.
In the embodiment, the ink stripping agent is stirred for 1 to 2 minutes, so that the printed circuit board is ensured to be fully contacted with the ink stripping agent, the dissolution of solder resist ink on the surface and in the hole of the printed circuit board is accelerated, the production efficiency is improved, and the production cost is reduced.
Example six:
a cleaning device for a printed circuit board, comprising: the cleaning tank is used for containing the ink stripping agent; a heating member for heating the ink remover; the clamping piece is used for taking and placing the printed circuit board; and the drying piece is used for drying the printed circuit board.
According to the cleaning device for the printed circuit board, provided by the embodiment of the invention, the ink stripping agent is added into the cleaning tank, the ink stripping agent is heated to the preset temperature by using the heating element, the printed circuit board is placed into the ink stripping agent of the cleaning tank through the clamping element, after the printed circuit board is soaked for the preset time, the printed circuit board is taken out through the clamping element, and the printed circuit board is dried by using the drying element, so that the cleaning of the printed circuit board is completed. According to the cleaning device for the printed circuit board, provided by the embodiment of the invention, the ink stripping agent is heated, so that the soaking time of the printed circuit board can be reduced, the treatment process is shortened, the printed circuit board can be taken out and dried after being soaked, the production cost can be reduced, and the production benefit can be improved. Meanwhile, the cleaning device for the printed circuit board provided by the embodiment of the invention can be used for backwashing processing of non-plugged plates and other scenes needing to backwash solder resist ink in processing of circuit boards.
Example seven:
on the basis of the sixth embodiment, the cleaning device for the printed circuit board further comprises: and the stirring piece is used for stirring the ink stripping agent.
In the embodiment, the ink stripping agent is stirred by the stirring piece, so that the printed circuit board is ensured to be fully contacted with the ink stripping agent, the removal of solder mask ink on the surface and in the hole of the printed circuit board is accelerated, the production efficiency is improved, and the production cost is reduced.
Aiming at the cleaning method of the printed circuit board provided by the embodiment of the invention, the following application scenes are listed:
firstly, cleaning the medium surface with solder mask ink comprises the following steps:
(1) adding an ink stripping agent: adding an ink stripping agent into the cleaning tank to ensure that the ink stripping agent is over the medium circuit board to be cleaned;
(2) heating the ink stripping agent: after adding the ink stripping agent, heating the ink stripping agent to 60-80 ℃ by a heating element;
(3) standing the medium circuit board to be cleaned: after the temperature of the ink stripping agent reaches the requirement, placing the medium circuit board to be cleaned into a cleaning tank through a clamping piece, standing for 10 to 15 minutes until the solder-resisting ink is fully expanded and dissolved;
(4) opening stirring: after the cleaning medium circuit board is placed still, the stirring piece is opened, the ink stripping agent in the cleaning tank is carefully stirred, the dissolution and the peeling of the solder mask ink are accelerated, and simultaneously, ink particles possibly remaining in the through holes are removed, and the stirring time is 1-2 minutes;
(5) taking out and drying: and taking out the cleaned medium circuit board through the clamping piece, and drying the medium circuit board by using the drying piece.
Secondly, the cleaning of the solder mask ink on the copper surface comprises the following steps:
(1) adding an ink stripping agent: adding an ink stripping agent into the cleaning tank to ensure that the ink stripping agent is over the copper circuit board to be cleaned;
(2) heating the ink stripping agent: after adding the ink stripping agent, heating the ink stripping agent to 60-80 ℃ by a heating element;
(3) standing the medium circuit board to be cleaned: after the temperature of the ink stripping agent reaches the requirement, putting the copper circuit board to be cleaned into a cleaning tank through a clamping piece, standing for 3 to 5 minutes until the solder-resisting ink is fully expanded and dissolved;
(4) opening stirring: after the cleaned copper circuit board is placed still, the stirring piece is opened, the ink stripping agent in the cleaning tank is carefully stirred, so that the dissolution and the stripping of the solder mask ink are accelerated, and simultaneously, ink particles possibly remaining in the through holes are removed, wherein the stirring time is 1-2 minutes;
(5) taking out and drying: and taking out the cleaned copper circuit board through the clamping piece, and drying the copper circuit board by using the drying piece.
In the description of the present specification, the terms "connect", "mount", "fix", and the like are to be understood in a broad sense, for example, "connect" may be a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method for cleaning a printed circuit board, the method comprising:
heating the ink stripping agent to a preset temperature;
placing the printed circuit board in the ink stripping agent, and soaking for a preset time;
and taking out and drying the printed circuit board.
2. The method of cleaning a printed circuit board according to claim 1, wherein the ink remover comprises:
the sodium hydroxide solution is 30-60% in mass percentage concentration;
the volume ratio of the surfactant to the sodium hydroxide solution is 4-10%;
and the volume ratio of the ink dissolving agent to the sodium hydroxide solution is 20-40%.
3. The method for cleaning a printed circuit board according to claim 2, wherein the ink dissolving agent comprises:
10-30% of potassium hydroxide by mass;
the ethylene glycol monoethyl ether is 5-20% by mass.
4. The method for cleaning a printed circuit board according to claim 1, wherein the preset temperature is 60 ℃ to 80 ℃.
5. The method for cleaning a printed circuit board according to claim 1,
when the printed circuit board is a dielectric circuit board, the preset time is a first preset time, and the first preset time is 10 minutes to 15 minutes.
6. The method for cleaning a printed circuit board according to claim 1,
when the printed circuit board is a copper circuit board, the preset time is a second preset time, and the second preset time is 3-5 minutes.
7. The method for cleaning a printed circuit board according to any one of claims 1 to 6, wherein the step of immersing the printed circuit board in the ink remover for a predetermined period of time further comprises:
and stirring the ink stripping agent for a third preset time.
8. The method for cleaning a printed circuit board according to claim 7, wherein the third predetermined time period is 1 minute to 2 minutes.
9. A cleaning apparatus for a printed circuit board, comprising:
the cleaning tank is used for containing an ink stripping agent;
a heating member for heating the ink remover;
the clamping piece is used for taking and placing the printed circuit board;
and the drying piece is used for drying the printed circuit board.
10. The printed circuit board cleaning apparatus according to claim 9, further comprising:
and the stirring piece is used for stirring the ink stripping agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010738973.0A CN114007338A (en) | 2020-07-28 | 2020-07-28 | Cleaning method and cleaning device for printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010738973.0A CN114007338A (en) | 2020-07-28 | 2020-07-28 | Cleaning method and cleaning device for printed circuit board |
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Cited By (1)
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| CN115156171A (en) * | 2022-09-06 | 2022-10-11 | 天津市海承科技发展有限公司 | Method for cleaning printed circuit board |
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