CN111935915A - Production process for gold-selective plating of PCB (printed circuit board) - Google Patents
Production process for gold-selective plating of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN111935915A CN111935915A CN202010488362.5A CN202010488362A CN111935915A CN 111935915 A CN111935915 A CN 111935915A CN 202010488362 A CN202010488362 A CN 202010488362A CN 111935915 A CN111935915 A CN 111935915A
- Authority
- CN
- China
- Prior art keywords
- pcb
- gold
- film
- cleaning
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 30
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 239000010931 gold Substances 0.000 title claims abstract description 29
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000004140 cleaning Methods 0.000 claims abstract description 24
- 238000005530 etching Methods 0.000 claims abstract description 22
- 230000001681 protective effect Effects 0.000 claims abstract description 19
- 239000002253 acid Substances 0.000 claims abstract description 18
- 239000007888 film coating Substances 0.000 claims abstract description 16
- 238000009501 film coating Methods 0.000 claims abstract description 16
- 239000002904 solvent Substances 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000002791 soaking Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 11
- 239000012670 alkaline solution Substances 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 239000002699 waste material Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000010306 acid treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Abstract
The invention provides a PCB gold-plating production process, which comprises the following steps of S1: performing film coating treatment on the PCB, forming a layer of protective film on the surface of the PCB, and performing hollow-out treatment at a gold-plated position; s2: soaking the PCB into an acid solvent for cleaning, and putting the PCB into clear water for cleaning after acid cleaning; s3: plating gold at the hollow part of the PCB; s4: removing the film, namely removing the protective film in the step one; s5: coating a film again, forming a layer of protective film on the surface of the PCB, and hollowing out the part of the PCB needing to be etched; s6: etching, namely etching away the copper at the hollow part in the step five; s7: removing the film again; s8: soaking the PCB obtained in the step seven into an acid solvent for cleaning, and putting the PCB into clear water for cleaning after acid cleaning; s9: and after the step eight is finished, printing ink on the PCB. The invention provides a production process for selectively plating gold on a PCB, which can effectively solve the problem that the gold-plated layer is damaged by over-etching, thereby reducing the gold waste and achieving the purpose of reducing the production cost.
Description
Technical Field
The invention relates to a PCB production process, in particular to a PCB gold-plating production process.
Background
Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components. It is referred to as a "printed" circuit board because it is made using electronic printing.
As is well known, gold is a precious metal and a non-renewable resource, and the price of gold is expected to increase with the increase of market demand, which brings great cost pressure to printed board manufacturing enterprises. In the manufacturing process of a PCB (printed circuit board), a layer of gold plating layer needs to be deposited on a certain area of the PCB, but when etching is carried out, the gold plating layer is damaged due to over etching caused by various reasons, the product quality is influenced, gold waste is caused, and the production cost is improved.
Disclosure of Invention
In view of this, the invention provides a production process for gold-plating of a PCB, which can effectively solve the problem that the gold-plating layer is damaged by over-etching, thereby reducing gold waste and achieving the purpose of reducing production cost.
Therefore, the invention provides a PCB gold-plating production process, which comprises the following steps:
s1: performing film coating treatment on the PCB, forming a layer of protective film on the surface of the PCB, and performing hollow-out treatment at a gold-plated position;
s2: soaking the PCB in an acid solvent for cleaning, removing an oxide film at the hollow part, and putting the PCB in clean water for cleaning after acid cleaning;
s3: plating gold at the hollow part of the PCB;
s4: removing the film, namely removing the protective film in the first step after gold plating;
s5: performing secondary film coating treatment, namely performing secondary film coating treatment on the PCB subjected to film stripping in the fourth step, forming a layer of protective film on the surface of the PCB, and hollowing out the part of the PCB to be etched;
s6: etching, namely etching the copper at the hollow part in the step five by using an etching solution to expose the base material;
s7: removing the film again, and removing the protective film in the fifth step after etching;
s8: soaking the PCB obtained in the seventh step into an acid solvent for cleaning, removing impurities and oil stains on the surface of the PCB, and putting the PCB into clean water for cleaning after the PCB is subjected to acid cleaning;
s9: and after the step eight is finished, printing ink on the PCB.
Further, the protective film in step 1 is a photoresist dry film.
Further, the solution used for film removal in the step 4 is an alkaline solution.
Further, the alkaline solution is a sodium hydroxide solution.
The invention provides a PCB gold-selective plating production process, which can reduce the use of gold by performing film-coating treatment twice on a PCB, wherein the first film-coating treatment can prevent gold from being wasted by plating the gold on a required place, and the second film-coating treatment can protect the gold-plated layer from being damaged by etching, thereby improving the production quality.
Therefore, the invention provides a production process for gold-plating of a PCB (printed circuit board), which can effectively solve the problem that the gold-plating layer is damaged by over-etching, thereby reducing the gold waste and achieving the aim of reducing the production cost.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below. It should be understood, however, that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The first embodiment is as follows:
the PCB gold-plating production process provided by the embodiment of the invention mainly comprises the following steps:
s1: performing film coating treatment on the PCB, forming a layer of protective film on the surface of the PCB, and performing hollow-out treatment at a gold-plated position;
s2: soaking the PCB in an acid solvent for cleaning, removing an oxide film at the hollow part, and putting the PCB in clean water for cleaning after acid cleaning;
s3: plating gold at the hollow part of the PCB;
s4: removing the film, namely removing the protective film in the first step after gold plating;
s5: performing secondary film coating treatment, namely performing secondary film coating treatment on the PCB subjected to film stripping in the fourth step, forming a layer of protective film on the surface of the PCB, and hollowing out the part needing to be etched on the PCB;
s6: etching, namely etching the copper at the hollow part in the step five by using an etching solution to expose the base material;
s7: removing the film again, and removing the protective film in the fifth step after etching;
s8: soaking the PCB obtained in the seventh step into an acid solvent for cleaning, removing impurities and oil stains on the surface of the PCB, and putting the PCB into clean water for cleaning after the PCB is subjected to acid cleaning;
s9: and after the step eight is finished, printing ink on the PCB.
The embodiment provides a PCB gold-selective plating production process, which comprises the steps of performing two times of film coating treatment on a PCB, specifically, performing the first film coating treatment, wherein a protective film is a photoresist dry film and can cover the position, which does not need to be plated with gold, on the PCB, performing hollowing treatment at the position where the gold is plated, simultaneously using an acid solvent to clean the oxide film at the hollowed-out position, putting the PCB into clear water to clean after the acid treatment, improving the efficiency of the gold plating, avoiding the waste of gold liquid, performing film stripping by using a sodium hydroxide solution, performing film coating treatment again on the PCB, hollowing the position, which needs to be etched, on the PCB, etching copper at the hollowed-out position in the fifth step, exposing a base material, performing film stripping treatment again, immersing the PCB into the acid solvent to clean, removing impurities and oil stains on the surface of the PCB, putting the PCB into clear water to clean after the acid treatment, the quality of the ink printing can be improved.
Therefore, the invention provides a production process for gold-plating of a PCB (printed circuit board), which can effectively solve the problem that the gold-plating layer is damaged by over-etching, thereby reducing the gold waste and achieving the aim of reducing the production cost.
Example two:
in the second embodiment of the present invention, based on the second embodiment, the following improved technical solutions are further made: the solution used for removing the film is alkaline solution, and the alkaline solution is sodium hydroxide solution, so that the protective film can be completely removed, and meanwhile, impurities on the plate are removed, and the purpose of improving the production quality is achieved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (4)
1. A production process for selectively plating gold on a PCB is characterized by comprising the following specific steps:
s1: performing film coating treatment on the PCB, forming a layer of protective film on the surface of the PCB, and performing hollow-out treatment at a gold-plated position;
s2: soaking the PCB in an acid solvent for cleaning, removing an oxide film at the hollow part, and putting the PCB in clean water for cleaning after acid cleaning;
s3: plating gold at the hollow part of the PCB;
s4: removing the film, namely removing the protective film in the first step after gold plating;
s5: performing secondary film coating treatment, namely performing secondary film coating treatment on the PCB subjected to film stripping in the fourth step, forming a layer of protective film on the surface of the PCB, and hollowing out the part of the PCB to be etched;
s6: etching, namely etching the copper at the hollow part in the step five by using an etching solution to expose the base material;
s7: removing the film again, and removing the protective film in the fifth step after etching;
s8: soaking the PCB obtained in the seventh step into an acid solvent for cleaning, removing impurities and oil stains on the surface of the PCB, and putting the PCB into clean water for cleaning after the PCB is subjected to acid cleaning;
s9: and after the step eight is finished, printing ink on the PCB.
2. The PCB gold-plating production process of claim 1, which is characterized in that: the protective film in the step 1 is a photoresist dry film.
3. The PCB gold-plating production process of claim 1, which is characterized in that: and the solution used for stripping the film in the step 4 is an alkaline solution.
4. The PCB gold-plating production process of claim 3, which is characterized in that: the alkaline solution is a sodium hydroxide solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010488362.5A CN111935915A (en) | 2020-06-02 | 2020-06-02 | Production process for gold-selective plating of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010488362.5A CN111935915A (en) | 2020-06-02 | 2020-06-02 | Production process for gold-selective plating of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111935915A true CN111935915A (en) | 2020-11-13 |
Family
ID=73316413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010488362.5A Pending CN111935915A (en) | 2020-06-02 | 2020-06-02 | Production process for gold-selective plating of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111935915A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960113A (en) * | 2016-05-27 | 2016-09-21 | 东莞联桥电子有限公司 | Golden finger plate processing technology |
| CN109121313A (en) * | 2018-10-16 | 2019-01-01 | 江苏迪飞达电子有限公司 | A kind of secondary dry film production technology of selectivity coated plate |
-
2020
- 2020-06-02 CN CN202010488362.5A patent/CN111935915A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960113A (en) * | 2016-05-27 | 2016-09-21 | 东莞联桥电子有限公司 | Golden finger plate processing technology |
| CN109121313A (en) * | 2018-10-16 | 2019-01-01 | 江苏迪飞达电子有限公司 | A kind of secondary dry film production technology of selectivity coated plate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |