CN115720413A - Method for processing circuit board by alkaline etching machine - Google Patents
Method for processing circuit board by alkaline etching machine Download PDFInfo
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- CN115720413A CN115720413A CN202211497627.3A CN202211497627A CN115720413A CN 115720413 A CN115720413 A CN 115720413A CN 202211497627 A CN202211497627 A CN 202211497627A CN 115720413 A CN115720413 A CN 115720413A
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Abstract
The invention relates to the technical field of circuit board processing, and provides a method for processing a circuit board by an alkaline etching machine, which comprises the following steps: s1, removing a film, namely removing the film of the substrate after nickel and gold electroplating, wherein a nickel layer of the substrate is connected with a gold layer and a copper layer; s2, etching, namely moving the substrate to etch the substrate by spraying etching liquid through an alkaline etching machine; s3, complexing and cleaning, namely removing monovalent copper ions on the substrate by using ammonia water to generate a soluble substance; s5, acid washing, namely washing alkaline ions in the etching waste liquid on the substrate by using an acid solution; s6, washing, namely further washing the substrate by using clean water; s7, drying, taking out the substrate and drying residual water stains on the surface of the substrate. The invention cleans and dries the plate surface through acid washing and water washing, removes the primary battery effect and effectively prevents the plating layer from being damaged.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a method for processing a circuit board by an alkaline etching machine.
Background
PCB (Pr interleaved Ci circuit Board), which is called Printed Circuit Board (PCB) and is also called PCB, is an important electronic component, which is a support for electronic components, and is a carrier alkaline etching machine for processing circuit boards, which is used for electrical interconnection of electronic components. With the development of the times, when a Cu-Ni-Au circuit board is manufactured, because etching waste liquid contains NH4+, cu2+ (electrolyte) and the like, a Ni-Au layer can form a galvanic cell effect in the presence of the electrolyte, a gold layer is very thin and has pores, and nickel loses electrons to form nickel ions, so that a nickel layer and a copper layer can be gradually corroded and dissolved, the gold layer is stripped and dropped, the phenomenon that the surface of a plating layer of the circuit board is damaged after etching can occur, and the performance of the substrate is influenced or functional defects can occur.
Disclosure of Invention
The invention aims to provide a method for processing a circuit board by an alkaline etching machine, which can effectively avoid the damage of a plating layer on the board surface caused by the primary battery effect on the board surface.
The embodiment of the invention is realized by the following technical scheme: a method of alkaline etching a circuit board, comprising the steps of:
s1, removing a film, namely removing the film of the substrate after nickel and gold electroplating, wherein a nickel layer of the substrate is connected with a gold layer and a copper layer;
s2, etching, namely moving the substrate to pass through an alkaline etching machine to etch the substrate by spraying etching liquid;
s3, complexing and cleaning, namely removing monovalent copper ions on the substrate by using ammonia water to generate a soluble substance;
s5, acid washing, namely washing alkaline ions in the etching waste liquid on the substrate by using an acid solution;
s6, washing, namely further washing the substrate by using clean water;
s7, drying, taking out the substrate and drying residual water stains on the surface of the substrate.
Further, in the step S5, the substrate is sprayed with sulfuric acid, the pH of the pickling solution is 1-3, and the pickling time is 30-60S.
Further, the time taken for the cleaning of the steps S2 to S5 is 2min to 3min.
Further, the spraying pressure of the water washing in the step S6 is 0.5-3.5MPa.
Further, in the step S7, hot air is used for drying, and the drying temperature is 70-100 ℃.
Further, ammonia water is used as the etching solution in the step S2, and the spraying pressure is 0.5-1Mpa.
Further, during the etching in the step S2, the internal temperature of the alkaline etching machine is 40 ℃ to 55 ℃.
The technical scheme of the embodiment of the invention at least has the following advantages and beneficial effects: compared with the prior art, the invention uses acid washing and water washing processes after etching, the acid solution can remove alkaline ions on the circuit board, the circuit board is dried after further cleaning after water washing, and no electrolyte solution exists on the board surface, thereby avoiding the galvanic cell effect on the substrate and preventing the plating layer on the board surface from being damaged to influence the performance of the circuit board.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a process flow diagram of circuit board processing according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
Examples
Referring to fig. 1, this embodiment is a method for processing a circuit board by an alkaline etching machine, and aims to solve the problem that an electrolyte solution is formed by etching waste solution (i.e. NH4+ and Cu2 +) after etching, so that a galvanic nickel layer is corroded, a gold layer is very thin and only 0.03 μm, and the processing method includes the following steps:
s1, removing a film, namely removing the film of the substrate after nickel and gold electroplating, wherein a nickel layer of the substrate is connected with a gold layer and a copper layer;
s2, etching, namely moving the substrate to pass through an alkaline etching machine to etch the substrate by spraying etching liquid; the substrate is driven by a conveying roller to enter an alkaline etching machine, and the specific gravity of the etching solution is 20-35kg/cm.
S3, complexing and cleaning, namely removing monovalent copper ions on the substrate by using ammonia water to generate a soluble substance; the etched circuit board is not easy to clean and easy to cause short circuit of the printed circuit board due to the attachment of precipitates containing part of monovalent copper ions.
S5, acid washing, namely washing alkaline ions in the etching waste liquid on the substrate by using an acid solution; dilute sulfuric acid is sprayed on the surface of the substrate to remove alkaline ions such as ammonium ions in the residual waste liquid, the amount of dilute sulfuric acid solution is far larger than that of alkaline etching waste liquid, and dilute sulfuric acid cannot be used as electrolyte, so that the galvanic cell effect on the substrate is eliminated, and the phenomenon that a plating layer is corroded and damaged is prevented.
S6, washing, namely further washing the substrate by using clean water; and (3) removing the residual acid solution on the board surface by using clean water, wherein the water washing can be normal-temperature water washing or hot-water washing.
S7, drying, namely taking out the substrate, drying residual water stains on the surface of the substrate, drying the water of the substrate, taking out the substrate, and standing.
On the basis, the step S6 of pickling adopts sulfuric acid to spray the substrate, the pH of the pickling solution is 1-3, the pickling time is 30-60S, and the sulfuric acid at the time and concentration can fully absorb and take out alkaline ions.
In addition, the cleaning of the steps S2-S5 takes 2min-3min, and after the board is etched, the cleaning is carried out as early as possible on the premise of ensuring sufficient etching and sufficient complexing cleaning, so that the damage of corrosion of the plating layer is further reduced to the minimum.
The effect is better that the spraying pressure of the water washing in the step S6 is 0.5-3.5MPa, normal-temperature water is firstly used for washing in the water washing process, then water with the temperature of 60 ℃ is used for washing, and the water pressure with certain spraying pressure is matched to ensure that almost no residue is left on the board surface.
S7, drying by using hot air at the drying temperature of 70-100 ℃; the substrate is prevented from being thermally damaged due to overhigh temperature, the evaporation of water on the surface of the substrate can be accelerated, the flowing direction of hot air is almost parallel to the surface of the substrate, and the two side surfaces of the substrate can be simultaneously dried by the hot air.
It is worth to say that ammonia is used as the etching solution in step S2, and the spraying pressure is 0.5 to 1Mpa.
During the etching in the step S2, the internal temperature of the alkaline etching machine is 40-55 ℃, and the etching temperature is higher than the normal temperature, which is beneficial to promoting the speed of etching away the copper layer.
The present invention has been described in terms of the preferred embodiment, and it is not intended to be limited to the embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A method of alkaline etching a circuit board, comprising the steps of:
s1, removing a film, namely removing the film of the substrate after nickel and gold electroplating, wherein a nickel layer of the substrate is connected with a gold layer and a copper layer;
s2, etching, namely moving the substrate to etch the substrate by spraying etching liquid through an alkaline etching machine;
s3, complexing and cleaning, namely removing monovalent copper ions on the substrate by using ammonia water to generate a soluble substance;
s5, acid washing, namely washing alkaline ions in the etching waste liquid on the substrate by using an acid solution;
s6, washing, namely further washing the substrate by using clean water;
s7, drying, taking out the substrate and drying residual water stains on the surface of the substrate.
2. The method for processing the circuit board by the alkaline etching machine according to claim 1, wherein the step S5 of pickling is to spray the substrate by using sulfuric acid, wherein the PH of the pickling solution is 1-3, and the pickling time is 30-60S.
3. The method of claim 2, wherein the process between steps S2-S5 takes 2-3 min.
4. The method of alkaline etching a circuit board according to claim 1, wherein the spraying pressure of the water washing of step S6 is 0.5 to 3.5MPa.
5. The method of alkaline etching a circuit board according to claim 1, wherein the step S7 is drying with hot air at a temperature of 70-100 ℃.
6. The method of claim 1, wherein the etching solution in step S2 is ammonia water, and the spraying pressure is 0.5 to 1Mpa.
7. The method of claim 6, wherein the inside temperature of the alkaline etching machine is 40-55 ℃ during the etching of the step S2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211497627.3A CN115720413A (en) | 2022-11-25 | 2022-11-25 | Method for processing circuit board by alkaline etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211497627.3A CN115720413A (en) | 2022-11-25 | 2022-11-25 | Method for processing circuit board by alkaline etching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115720413A true CN115720413A (en) | 2023-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211497627.3A Pending CN115720413A (en) | 2022-11-25 | 2022-11-25 | Method for processing circuit board by alkaline etching machine |
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| CN (1) | CN115720413A (en) |
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- 2022-11-25 CN CN202211497627.3A patent/CN115720413A/en active Pending
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