CN214481497U

CN214481497U - PCB button position structure

Info

Publication number: CN214481497U
Application number: CN202022743910.2U
Authority: CN
Inventors: 柯木真; 徐巧丹; 刘涛; 卢海航; 陈文德
Original assignee: Baiqiang Electronics Shenzhen Co ltd
Current assignee: Baiqiang Electronics Shenzhen Co ltd
Priority date: 2020-11-24
Filing date: 2020-11-24
Publication date: 2021-10-22
Anticipated expiration: 2030-11-24

Abstract

The utility model provides a PCB board button position structure, PCB board button position structure includes PCB base plate, button position and shell fragment, the button position is on PCB base plate, the shell fragment covers on the button position, and the peripheral sealed cover of shell fragment the button position, the button position is concentric PAD and ring, there is annular median between concentric PAD and the ring, on concentric PAD or on the ring, be equipped with electrically conductive hole; an anti-oxidation film is coated on the key position, and the anti-oxidation film is an organic welding film OSP; the utility model discloses under the prerequisite of guaranteeing the quality, reduction cost by a wide margin, production efficiency promotes by a wide margin simultaneously, has promoted market competition, has satisfied the cost demand that consumer electronics updated fast.

Description

PCB button position structure

Technical Field

The utility model relates to a PCB presses the manufacturing of key position, more specifically says, relates to a PCB button position structure.

Background

A PCB, i.e., a printed circuit board, also called a PCB, is a provider of electrical connection of electronic components. The circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The key position can not be separated from the control of the circuit, in the existing key position control, the surface gold-deposition key position and the carbon film PCB key position are mainstream products, wherein, the key position structure with gold-deposition surface realizes the service life of the key position function by the characteristics of difficult oxidation of the gold surface and good conductivity, but has high cost and complex process. In the carbon film PCB key position, the carbon film adopts concentric inner circle and closed outer ring, and the pad sets up in the below of inner circle, then main shortcoming has: the carbon film is easy to scratch after long use, so that the routing below the carbon film is exposed, and the key position is short-circuited; due to the limitation of the single-sided carbon film process, the concave-convex shape of the middle contact (i.e. the inner circle) causes that the key position is pressed lightly, the function cannot be realized, and the user experience effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a new button position structure when having realized button position function, practices thrift the cost by a wide margin, has strengthened the competitiveness, solves above-mentioned problem.

In order to solve the above problem, the utility model provides a technical scheme as follows: a PCB key position structure comprises a PCB substrate, a key position and a spring plate, wherein the key position is arranged on the PCB substrate, the spring plate covers the key position, the periphery of the spring plate hermetically covers the key position, the key position comprises a concentric PAD and a circular ring, an annular isolation belt is arranged between the concentric PAD and the circular ring, and a conductive hole is arranged on the concentric PAD or the circular ring; and an anti-oxidation film is coated on the key position, and the anti-oxidation film is an organic welding film OSP.

In the preferable technical scheme, the distance of the annular isolation belt in the key position is 0.1-0.3 mm.

In a preferable technical scheme, the antioxidant film is purrocoline and the thickness is 0.1-0.4 UM.

According to the preferable technical scheme, the elastic sheet is in a pot cover shape with a convex middle part and a sealed periphery.

According to the preferred technical scheme, a sealing film is arranged on the periphery of the elastic piece, the sealing film and the key position are concentric and cover the elastic piece, and the diameter of the sealing film is at least 1mm larger than that of the elastic piece.

According to the preferable technical scheme, the concentric PAD is provided with an aligning body which is a base material position of a cross structure.

The preferable technical scheme is that the method comprises the steps of sequentially operating, key structure design, circuit etching, plate grinding, solder resisting, antioxidant film processing, spring plate mounting and sealing, wherein the antioxidant film processing further comprises → water washing → micro etching → water washing → acid washing → pure water washing → antioxidant film processing → pure water washing → drying.

According to the preferable technical scheme, the key structure design comprises the width and the distance arrangement of a concentric PAD, a circular ring and an annular isolation belt, the concentric PAD and the circular ring are compensated according to an etching factor, and the minimum distance of the annular isolation belt is the minimum distance of equipment etching.

According to the preferable technical scheme, the line is etched with concentric PAD and a circular ring, and the grinding plate is arranged before the anti-oxidation film is processed.

According to the preferable technical scheme, the middle part of the elastic piece is provided with a sunken or raised central datum point, the datum point of the elastic piece corresponds to the alignment body of the concentric PAD, the sealing membrane is in a ring structure or a circle, the contact part of the ring or the circle on the periphery of the elastic piece is elastic colloid, and the elastic colloid is annularly surrounded at the joint of the elastic piece and the PCB substrate.

The beneficial effects for prior art are that, adopt above-mentioned scheme, the utility model discloses under the prerequisite of assurance quality, reduction cost by a wide margin, production efficiency promotes by a wide margin simultaneously, has promoted market competition, has satisfied the cost demand that consumer electronics updated fast.

Drawings

For a clearer explanation of the embodiments or technical solutions in the prior art, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of the key position of the present invention;

fig. 2 is a schematic diagram of the layered structure of the present invention.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1 and 2, an embodiment of the present invention is: in order to solve the above problem, the utility model provides a technical scheme as follows: the utility model provides a PCB button position structure, PCB button position structure includes PCB base plate 1, button position 2 and shell fragment 3, button position 2 is on PCB base plate 1, shell fragment 3 covers on button position 2, just the peripheral sealed cover of shell fragment 3 button position 2, button position 2 is concentric PAD4 and ring 5, there is annular median 6 between concentric PAD4 and the ring 5, according to the design, verify the structural design that the button is in production, ensure the rationality of design between concentric PAD4 and the ring 5 on concentric PAD4 or ring 5, be equipped with the electrically conductive hole, the electrically conductive hole aperture is less, the consent is handled in the production process; the key position 2 is coated with an oxidation resistant film 7, the oxidation resistant film 7 is an organic welding film OSP, the oxidation resistant film 7 is purrocoline, the electrical performance of the oxidation resistant film 7 printed by the purrocoline is not influenced under the condition of controlling the thickness, the oxidation resistant film has a protective and oxidation resistant effect on the key position 2, and the thickness is 0.1-0.3 UM.

The elastic sheet 3 is made of stainless steel and is an important component of the switch, and the function of a high-quality switch is achieved between an operator and a product by means of the conductivity of the elastic sheet 3. Meanwhile, the stable resilience force (automatic return after being pressed) and the overlong service life of the elastic sheet 3 enable the elastic sheet 3 to become an important part in products such as a membrane switch, a micro switch, a PCB and the like, play an important role in conducting a circuit, when being pressed, a circuit can be conducted, and when being loosened, the circuit can be automatically disconnected.

The elastic sheet 3 is in a pot cover shape with a convex middle part and a sealed periphery, a sealing film 8 is arranged on the periphery of the elastic sheet 3, the sealing film 8 and the key position 2 are concentric and cover the elastic sheet 3, and the diameter of the sealing film 8 is at least 1mm larger than that of the elastic sheet 3. The sealing film 8 isolates the key position 2 from air, so that the environment of the key position 2 is ensured to be dry, the oxidation of a copper surface in an OSP film damage environment is avoided, and the stability of the electrical performance is further determined. Elastic colloid has realized gaseous space transfer when shell fragment pressurized and release, and the gaseous entering or revealing in the sealing film of limited avoidance has realized the protection of antagonism oxide film, and simultaneously in practical process, perhaps the shell fragment practical process of long-time high frequency, the anti-oxidant film is damaged, and under the damaged condition of anti-oxidant film, the gas in the sealing film is not oxidizing the copper face, realizes the extension by a wide margin of button life-span.

The distance between the annular isolation belts 6 in the key position 2 is 0.05-0.3mm, the distance between the concentric PAD4 and the circular ring 5 is ensured, and the problem of electrical short circuit caused by the distance problem is avoided.

The concentric PAD4 is provided with an aligning body which is a base material position of a cross structure. The aligning body can also be of other structures, so that the elastic sheet 3 and the key position 2 can be conveniently aligned and installed.

The oxidation resistant film 7 only floats on the clean bare copper surface, a layer of organic film is chemically grown, the oxidation resistant film 7 has oxidation resistance, thermal shock resistance and moisture resistance, is used for protecting the copper surface of the circuit board from being oxidized or vulcanized in a normal environment and the like so as to ensure the stable performance of the oxidation resistant film 7, in order to ensure the cleanness of the copper surface, firstly, oil removal is needed in the process of oxidation resistant treatment, the oil removal comprises acid washing or alkali washing in the process of plate grinding, water washing is carried out after each acid washing or alkali washing in order to clean acid or alkali of a key position, in order to increase the roughness of the copper surface, micro etching is carried out after the water washing, the micro etching increases the roughness of the copper surface, so that the oxidation resistant film 7 is firmly combined on the copper surface, in the micro etching process, an etching solution is acidic or alkaline, and is also subjected to water washing after the micro etching, meanwhile, the cleaning of the copper surface is ensured by pure water washing, so the conventional OSP process also comprises the following procedures of degreasing → water washing → micro etching → water washing → acid washing → pure water washing → OSP → pure water washing → drying.

It should be noted that the above technical features are continuously combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; moreover, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

Claims

1. A PCB key position structure is characterized by comprising a PCB substrate, a key position and a spring plate, wherein the key position is arranged on the PCB substrate, the spring plate covers the key position, the periphery of the spring plate hermetically covers the key position, the key position is concentric PAD and a ring, an annular isolation belt is arranged between the concentric PAD and the ring, and a conductive hole is arranged on the concentric PAD or the ring; and an anti-oxidation film is coated on the key position, and the anti-oxidation film is an organic welding film OSP.

2. The PCB key site structure of claim 1, wherein the distance of the annular isolation strip in the key site is 0.1-0.3 mm.

3. The PCB key position structure of claim 2, wherein the anti-oxidation film is purrocoline and has a thickness of 0.1-0.4 UM.

4. The PCB key position structure of claim 1, wherein the spring plate is in a shape of a pot cover with a convex middle part and a sealed periphery.

5. The PCB key position structure of claim 4, wherein a sealing film is arranged on the periphery of the spring plate, the sealing film and the key position are concentric and cover the spring plate, and the diameter of the sealing film is at least 1mm larger than that of the spring plate.

6. The PCB key position structure of any one of claims 1-4, wherein the concentric PAD is provided with a counter, and the counter is a base position of a cross structure.