CN201717150U - Solder pad structure of key element - Google Patents
Solder pad structure of key element Download PDFInfo
- Publication number
- CN201717150U CN201717150U CN2010203027770U CN201020302777U CN201717150U CN 201717150 U CN201717150 U CN 201717150U CN 2010203027770 U CN2010203027770 U CN 2010203027770U CN 201020302777 U CN201020302777 U CN 201020302777U CN 201717150 U CN201717150 U CN 201717150U
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- CN
- China
- Prior art keywords
- solder pad
- pad
- key element
- welding
- pad structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a solder pad structure of a key element, wherein for the solder pad structure, a printed circuit board is provided with a soldmask layer which is provided with a solder pad; the diameter of the soldmask layer is 0.1524mm larger than that of the solder pad; the solder pad is plated with gold; and base material is exposed between the soldmask layer and the solder pad. For the solder pad structure of the key element, since the base material is exposed between the soldmask layer and the solder pad and in the range 0.1524mm far away from the solder pad, the printing ink is easy to control and the residual printing ink or impurities on the solder pad can be effectively avoided, thus effectively avoiding key failure and improving key quality.
Description
Technical field
The utility model relates to a kind of welding pad structure, relates in particular to a kind of welding pad structure that is applicable to Key element.
Background technology
In the design welding pad structure 10 as shown in Figure 1 of existing Key element pad, welding resisting layer 102 is identical with pad 101 diameters, so, place outside the pad 101 is all covered by printing ink, because of pad 101 is irregularly shaped, spacing between pad 101 bodies is less, the printed circuit board (PCB) supplier influences because of being subjected to ink characteristics and processing procedure, cause pad on the printing ink easily, thereby make easy residual impurity between printing ink and pad, therefore there is following risk: have foreign matter to be present in the weldering dike (solder dam), such as diamond dust is gone to the pad face, causes the Key element loose contact, or may make printing ink be higher than pad, when button, cause the printing ink powder to go to pad, cause keys deactivation.
Summary of the invention
In view of the above problems, the utility model provides a kind of welding pad structure of Key element.
In order to achieve the above object, the utility model has adopted following technical scheme: a kind of welding pad structure of Key element, wherein, this welding pad structure is provided with welding resisting layer on printed circuit board (PCB), on this welding resisting layer weld pad is set, and the welding resisting layer diameter is greater than the weld pad diameter, and described welding resisting layer diameter is bigger 0.1524 millimeter than weld pad diameter.
Preferable, the utility model provides a kind of welding pad structure of Key element, and described weld pad is gold-plated, between this welding resisting layer and the weld pad, apart from bare substrate in the scope of 0.1524 millimeter of weld pad.
Compared to prior art, the utility model provides a kind of welding pad structure of Key element, is base material owing to what expose between welding resisting layer and the weld pad, be easy to control printing ink, effectively avoid residual ink or impurity on weld pad, thereby avoided keys deactivation effectively, improved the button quality.
Description of drawings
Fig. 1 is existing Key element pad configuration
Fig. 2 is a schematic diagram of the present utility model
Embodiment
Please refer to shown in Figure 2ly, be schematic diagram of the present utility model.The utility model provides a kind of welding pad structure 20 of Key element.
Wherein, the welding pad structure 20 of described Key element is arranged on the printed circuit board (PCB), opening full window on this printed circuit board (PCB) handles to make circular welding resisting layer 204, at the center of this rounded welding resisting layer 204 weld pad 201 is set, and the welding resisting layer diameter is greater than the weld pad diameter, the diameter of this welding resisting layer 204 is bigger 0.1524 millimeter than the diameter of weld pad 201, because weld pad 201 inside are irregularly shaped, between welding resisting layer 204 and the weld pad 201, apart from bare substrate 202 in the scope of 0.1524 millimeter of weld pad 201 periphery.
Compared to prior art, the utility model provides a kind of welding pad structure of Key element, because between welding resisting layer 204 and the weld pad 201, apart from what expose in the scope of 0.1524 millimeter of weld pad 201 periphery is base material 202, be easy to control printing ink, residual ink or impurity on weld pad have effectively been avoided, thereby avoided keys deactivation effectively, improved the button quality.
Claims (4)
1. the welding pad structure of a Key element is characterized in that, this welding pad structure is provided with welding resisting layer on printed circuit board (PCB), on this welding resisting layer weld pad is set, and this welding resisting layer diameter is greater than the weld pad diameter.
2. the welding pad structure of Key element according to claim 1 is characterized in that, described weld pad is gold-plated.
3. the welding pad structure of Key element according to claim 1 is characterized in that, described welding resisting layer diameter is bigger 0.1524 millimeter than weld pad diameter.
4. the welding pad structure of Key element according to claim 1 is characterized in that, between described welding resisting layer and the weld pad, apart from bare substrate in the scope of 0.1524 millimeter of weld pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010203027770U CN201717150U (en) | 2010-02-09 | 2010-02-09 | Solder pad structure of key element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010203027770U CN201717150U (en) | 2010-02-09 | 2010-02-09 | Solder pad structure of key element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201717150U true CN201717150U (en) | 2011-01-19 |
Family
ID=43463157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010203027770U Expired - Fee Related CN201717150U (en) | 2010-02-09 | 2010-02-09 | Solder pad structure of key element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201717150U (en) |
-
2010
- 2010-02-09 CN CN2010203027770U patent/CN201717150U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110119 Termination date: 20130209 |