CN112750683A - Cleaning method of integrated circuit board - Google Patents
Cleaning method of integrated circuit board Download PDFInfo
- Publication number
- CN112750683A CN112750683A CN201911043484.7A CN201911043484A CN112750683A CN 112750683 A CN112750683 A CN 112750683A CN 201911043484 A CN201911043484 A CN 201911043484A CN 112750683 A CN112750683 A CN 112750683A
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- Prior art keywords
- circuit board
- integrated circuit
- cleaning
- water
- cleaning solution
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
- C11D7/30—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5018—Halogenated solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Emergency Medicine (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a cleaning method of an integrated circuit board, which comprises the following steps: (1) blowing off dust adhered to the surface of the integrated circuit board by using compressed air; (2) soaking the integrated circuit board in a first cleaning solution, and ultrasonically cleaning for 8-10 min, wherein the first cleaning solution is a mixed solution of chloroform and alcohol; (3) washing the integrated circuit board with water; (4) blowing off water drops on the surface of the integrated circuit board by using compressed air; (5) spraying and cleaning the integrated circuit board by using a second cleaning solution, wherein the second cleaning solution is a mixed solution of sulfuric acid, hydrogen peroxide and water; (6) and washing the integrated circuit board with water, and drying to obtain the cleaned integrated circuit board. The method of the invention adopts the first cleaning solution to clean the organic residual substances on the surface, and then uses the strong oxidant and the dehydration property of the second cleaning solution to thoroughly destroy the hydrocarbon bonding of the organic matters so as to achieve the purpose of completely removing the organic impurities, and the integrated circuit board can be completely cleaned by two-step cleaning.
Description
Technical Field
The invention relates to a device cleaning method, in particular to an integrated circuit board cleaning method.
Background
The quality of the integrated circuit, which is used as a core component in an electronic product, directly determines the performance and reliability of the electronic product. In the process of manufacturing integrated circuits, the performance of the devices is seriously affected by pollutants such as particles, organic matters, metals and the like adhered to the surfaces of the integrated circuits. The existing integrated circuit board cleaning method adopts solvent cleaning, but cannot clean; if clean cleaning is desired, the solution formulation needs to be adjusted, and typical formulations are detrimental to the board itself.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a method for cleaning an integrated circuit board.
In order to achieve the purpose, the invention adopts the technical scheme that: a cleaning method of an integrated circuit board comprises the following steps:
(1) blowing off dust adhered to the surface of the integrated circuit board by using compressed air;
(2) soaking the integrated circuit board in a first cleaning solution, and ultrasonically cleaning for 8-10 min, wherein the first cleaning solution is a mixed solution of chloroform and alcohol;
(3) washing the integrated circuit board with water;
(4) blowing off water drops on the surface of the integrated circuit board by using compressed air;
(5) spraying and cleaning the integrated circuit board by using a second cleaning solution, wherein the second cleaning solution is a mixed solution of sulfuric acid, hydrogen peroxide and water;
(6) and washing the integrated circuit board with water, and drying to obtain the cleaned integrated circuit board.
The cleaning method of the integrated circuit board firstly adopts the first cleaning solution to clean the organic residual substances on the surface, then utilizes the second cleaning solution to clean the metal substances on the surface, and utilizes the strong oxidizer and the dehydration property of the second cleaning solution to thoroughly destroy the hydrocarbon bonding of the organic matters so as to achieve the purpose of completely removing the organic impurities.
Preferably, in the first cleaning solution, the weight ratio of chloroform to alcohol is: chloroform: the alcohol is 1: 90-110. More preferably, the weight ratio of chloroform to alcohol is: chloroform: alcohol 1: 100. The first cleaning solution with the components can effectively remove organic residual impurities on the surface of the integrated circuit board.
Preferably, the second cleaning solution comprises the following components in percentage by weight: 8-12% of sulfuric acid, 25-35% of hydrogen peroxide and the balance of water. More preferably, the second cleaning solution comprises the following components in percentage by weight: 10% of sulfuric acid, 30% of hydrogen peroxide and 60% of water. The second cleaning solution prepared according to the proportion can obviously clean metal and organic matters in a short time.
Preferably, in the step (2), the ultrasonic power is 100-150 kHZ, the time is 8-10 min, and the temperature is 35-40 ℃.
Preferably, in the step (5), the spraying pressure is 15-25 MPa, the time is 60-100 seconds, and the temperature of the second cleaning solution is 20-40 ℃.
Preferably, in step (3), the conductivity of the water is less than 0.05 us/cm.
Preferably, in step (6), the conductivity of the water is less than 0.01 us/cm.
Preferably, in the step (6), the drying temperature is 65-80 ℃.
The invention has the beneficial effects that: the invention provides a cleaning method of an integrated circuit board. The method adopts two solvents for cleaning, the first cleaning solution cleans organic residual substances on the surface, and then the strong oxidizer and the dehydration property of the second cleaning solution are utilized to thoroughly destroy the hydrocarbon bonding of the organic matters so as to achieve the purpose of completely removing organic impurities, and the integrated circuit board can be completely cleaned by two-step cleaning.
Detailed Description
To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to specific examples.
Example 1
In an embodiment of the method for cleaning an integrated circuit board according to the present invention, the method for cleaning an integrated circuit board includes the following steps:
(1) blowing off dust adhered to the surface of the integrated circuit board by using compressed air;
(2) soaking the integrated circuit board in a first cleaning solution, wherein the first cleaning solution is a mixed solution of chloroform and alcohol, and the weight ratio of the chloroform to the alcohol is as follows: chloroform: ultrasonic cleaning with alcohol at 36 deg.C for 10min at 100kHZ frequency at 1: 100;
(3) washing the integrated circuit board by water, wherein the conductivity of the water is less than 0.05 us/cm;
(4) blowing water drops on the surface of the integrated circuit board by using compressed air;
(5) spraying and cleaning the integrated circuit board by using a second cleaning solution, wherein the second cleaning solution is a mixed solution of sulfuric acid, hydrogen peroxide and water, and the second cleaning solution comprises the following components in percentage by weight: 10% of sulfuric acid, 30% of hydrogen peroxide and 60% of water; the spraying pressure is 20MPa, the time is 60 seconds, and the temperature of the second cleaning liquid is 30 ℃;
(6) washing the integrated circuit board with water, wherein the conductivity of the water is less than 0.1 us/cm;
(7) and drying at 70 ℃ to obtain the cleaned integrated circuit board.
Example 2
In an embodiment of the method for cleaning an integrated circuit board according to the present invention, the method for cleaning an integrated circuit board includes the following steps:
(1) blowing off dust adhered to the surface of the integrated circuit board by using compressed air;
(2) soaking the integrated circuit board in a first cleaning solution, wherein the first cleaning solution is a mixed solution of chloroform and alcohol, and the weight ratio of the chloroform to the alcohol is as follows: chloroform: ultrasonic cleaning with alcohol at 35 deg.C for 8min at 150kHZ frequency at 1:90 deg.C;
(3) washing the integrated circuit board by water, wherein the conductivity of the water is less than 0.05 us/cm;
(4) blowing water drops on the surface of the integrated circuit board by using compressed air;
(5) spraying and cleaning the integrated circuit board by using a second cleaning solution, wherein the second cleaning solution is a mixed solution of sulfuric acid, hydrogen peroxide and water, and the second cleaning solution comprises the following components in percentage by weight: 8% of sulfuric acid, 35% of hydrogen peroxide and 57% of water; the spraying pressure is 15MPa, the time is 100 seconds, and the temperature of the second cleaning liquid is 20 ℃;
(6) washing the integrated circuit board with water, wherein the conductivity of the water is less than 0.1 us/cm;
(7) and drying at 65 ℃ to obtain the cleaned integrated circuit board.
Example 3
In an embodiment of the method for cleaning an integrated circuit board according to the present invention, the method for cleaning an integrated circuit board includes the following steps:
(1) blowing off dust adhered to the surface of the integrated circuit board by using compressed air;
(2) soaking the integrated circuit board in a first cleaning solution, wherein the first cleaning solution is a mixed solution of chloroform and alcohol, and the weight ratio of the chloroform to the alcohol is as follows: chloroform: ultrasonic cleaning with alcohol at 40 deg.C for 10min at 100kHZ frequency at 1: 110;
(3) washing the integrated circuit board by water, wherein the conductivity of the water is less than 0.05 us/cm;
(4) blowing water drops on the surface of the integrated circuit board by using compressed air;
(5) spraying and cleaning the integrated circuit board by using a second cleaning solution, wherein the second cleaning solution is a mixed solution of sulfuric acid, hydrogen peroxide and water, and the second cleaning solution comprises the following components in percentage by weight: 12% of sulfuric acid, 25% of hydrogen peroxide and 63% of water; the spraying pressure is 25MPa, the time is 60 seconds, and the temperature of the second cleaning liquid is 40 ℃;
(6) washing the integrated circuit board with water, wherein the conductivity of the water is less than 0.1 us/cm;
(7) and drying at 80 ℃ to obtain the cleaned integrated circuit board.
By adopting the cleaning method in the embodiment 1-3, more than 99% of organic matters and metal impurities on the surface of the integrated circuit board can be cleaned.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (9)
1. A cleaning method of an integrated circuit board is characterized by comprising the following steps:
(1) blowing off dust adhered to the surface of the integrated circuit board by using compressed air;
(2) soaking the integrated circuit board in a first cleaning solution, and ultrasonically cleaning for 8-10 min, wherein the first cleaning solution is a mixed solution of chloroform and alcohol;
(3) washing the integrated circuit board with water;
(4) blowing off water drops on the surface of the integrated circuit board by using compressed air;
(5) spraying and cleaning the integrated circuit board by using a second cleaning solution, wherein the second cleaning solution is a mixed solution of sulfuric acid, hydrogen peroxide and water;
(6) and washing the integrated circuit board with water, and drying to obtain the cleaned integrated circuit board.
2. The method for cleaning an integrated circuit board according to claim 1, wherein the first cleaning solution contains chloroform and alcohol at a weight ratio of: chloroform: the alcohol is 1: 90-110.
3. The method for cleaning an integrated circuit board according to claim 1, wherein the second cleaning solution comprises the following components in percentage by weight: 8-12% of sulfuric acid, 25-35% of hydrogen peroxide and the balance of water.
4. The method for cleaning an integrated circuit board according to claim 1, wherein the second cleaning solution comprises the following components in percentage by weight: 10% of sulfuric acid, 30% of hydrogen peroxide and the balance of water.
5. The method for cleaning an integrated circuit board according to claim 1, wherein in the step (2), the ultrasonic power is 100 to 150kHZ, the time is 8 to 10min, and the temperature is 35 to 40 ℃.
6. The method for cleaning an integrated circuit board according to claim 1, wherein in the step (5), the spraying pressure is 15 to 25MPa, the time is 60 to 100 seconds, and the temperature of the second cleaning liquid is 20 to 40 ℃.
7. The method for cleaning an integrated circuit board according to claim 1, wherein in the step (3), the conductivity of the water is less than 0.05 us/cm.
8. The method for cleaning an integrated circuit board according to claim 1, wherein in the step (6), the conductivity of the water is less than 0.01 us/cm.
9. The method for cleaning an integrated circuit board according to claim 1, wherein in the step (6), the temperature for drying is 65-80 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911043484.7A CN112750683A (en) | 2019-10-30 | 2019-10-30 | Cleaning method of integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911043484.7A CN112750683A (en) | 2019-10-30 | 2019-10-30 | Cleaning method of integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112750683A true CN112750683A (en) | 2021-05-04 |
Family
ID=75640380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911043484.7A Pending CN112750683A (en) | 2019-10-30 | 2019-10-30 | Cleaning method of integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112750683A (en) |
-
2019
- 2019-10-30 CN CN201911043484.7A patent/CN112750683A/en active Pending
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