CN103555443A - Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent - Google Patents

Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent Download PDF

Info

Publication number
CN103555443A
CN103555443A CN201310523475.4A CN201310523475A CN103555443A CN 103555443 A CN103555443 A CN 103555443A CN 201310523475 A CN201310523475 A CN 201310523475A CN 103555443 A CN103555443 A CN 103555443A
Authority
CN
China
Prior art keywords
parts
ethanol
printed circuit
cleaning agent
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310523475.4A
Other languages
Chinese (zh)
Inventor
刘青
马楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEFEI CITY HUAMEI PHOTOELECTRIC TECHNOLOGY Co Ltd
Original Assignee
HEFEI CITY HUAMEI PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEFEI CITY HUAMEI PHOTOELECTRIC TECHNOLOGY Co Ltd filed Critical HEFEI CITY HUAMEI PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority to CN201310523475.4A priority Critical patent/CN103555443A/en
Publication of CN103555443A publication Critical patent/CN103555443A/en
Pending legal-status Critical Current

Links

Landscapes

  • Detergent Compositions (AREA)

Abstract

The invention discloses an aqueous solder paste cleaning agent for a printed circuit board. The cleaning agent is prepared from the following raw materials in parts by weight: 3 to 4 parts of fatty alcohol-polyoxyethylene ether, 3 to 4 parts of sodium isopropyl benzene sulfonate, 5 to 6 parts of coconut diethanolamide, 40 to 50 parts of ethanol, 3 to 5 parts of tween 80, 4 to 5 parts of lauryl alcohol, 2 to 3 parts of disodium malate, 2 to 3 parts of acetic acid, 4 to 5 parts of auxiliaries and 100 to 120 parts of de-ionized water. The cleaning agent is high in compatibilization performance, antistatic, anticorrosive, low in loss and high in printing quality, and has a good pH value buffer effect and a remarkable surfactant compounding effect, residual solder paste, a residual adhesive and a solvent can be quickly removed from the printed circuit board, the cost is lowered, time is saved, the reject ratio can be greatly decreased, and a plurality of printed circuit boards with high quality can be quickly manufactured; the auxiliaries can form a protective film on the surface of the printed circuit board to isolate air, prevent the printed circuit board from being corroded by water and other molecules in the atmosphere and prevent oxidation, so that convenience is brought to the next manufacturing process.

Description

A kind of water-based printing circuit card tin cream clean-out system and preparation method thereof
Technical field
The present invention relates to clean-out system field, relate in particular to a kind of water-based printing circuit card tin cream clean-out system and preparation method thereof.
Background technology
Along with the high speed development of unicircuit, the volume of circuit card is more and more less, and electronic component is more and more less, and density is increasing.If the dirt dust of the inside does not clean up in making processes, likely can cause the problems such as short circuit, corrosion, affect the normal operation of circuit card.At present majority circuit plate sanitising agent is all made with organism, and cleaning effect is good, is difficult for causing the problems such as short circuit, corrosion, and still, organic compound not only cost is high, and contaminate environment, damage the ozone layer, harmful to HUMAN HEALTH.Also have minority waterborne cleaning agent, but cleaning performance is limited, has security risk, require further improvement formula, technique, to reach clean thorough, pollution-free, the object of corroding little, healthy, circuit safety, reducing costs.
Summary of the invention
The object of the present invention is to provide a kind of water-based printing circuit card tin cream clean-out system and preparation method thereof, this clean-out system have clean thoroughly, fast, the protection against corrosion of cleaning speed, anlistatig advantage.
Technical scheme of the present invention is as follows:
A circuit card tin cream clean-out system, is characterized in that being made by the raw material of following weight part: fatty alcohol-polyoxyethylene ether 3-4, isopropyl benzene semi-annular jade pendant acid sodium 3-4, lauric acid amide of ethanol 5-6, ethanol 40-50, tween 80 3-5, lauryl alcohol 4-5, sodium malate 2-3, acetic acid 2-3, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, methyl methacrylate 3-4, oxidation inhibitor 1035 1-2,2-aminoethyl 17 alkenyl imidazoline 1-2, ethanol 15-18; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
The preparation method of described water-based printing circuit card tin cream clean-out system, it is characterized in that comprising the following steps: deionized water, fatty alcohol-polyoxyethylene ether, isopropyl benzene semi-annular jade pendant acid sodium, lauric acid amide of ethanol, ethanol, tween 80, lauryl alcohol, sodium malate, acetic acid are mixed, under 1000-1200 rev/min of stirring, speed with 6-8 ℃/minute is heated to 60-70 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
Beneficial effect of the present invention
Clean-out system compatibilization of the present invention is strong, antistatic, protection against corrosion, pH value good buffer effect, surfactant compound successful, can remove fast tin cream unnecessary on printed circuit board (PCB), tackiness agent and solvent, still less, printing quality is better, reduce costs in loss, thereby save time, reduces greatly scrap rate, and produce faster more, the printed circuit board (PCB) of better quality.Auxiliary agent of the present invention can form protective membrane at circuit board surface, and isolated air, prevents water and other molecule open circuit potential plates in atmosphere, anti-oxidant, facilitates next step manufacture craft to carry out.
Embodiment
A circuit card tin cream clean-out system, by following weight part (kilogram) raw material make: fatty alcohol-polyoxyethylene ether 4, isopropyl benzene semi-annular jade pendant acid sodium 3, lauric acid amide of ethanol 5.4, ethanol 44, tween 80 4, lauryl alcohol 4.6, sodium malate 2.5, acetic acid 2.5, auxiliary agent 4.5, deionized water 110;
Described auxiliary agent by following weight part (kilogram) raw material make: Silane coupling reagent KH-570 2.5, phytic acid 1.5, methyl methacrylate 3.5, oxidation inhibitor 1,035 1.5,2-aminoethyl 17 alkenyl imidazolines 1.5, ethanol 16; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 65 ℃, stirs after 25 minutes, then adds other remaining component, is warming up to 83 ℃, stirs 35 minutes, obtains.
The preparation method of described water-based printing circuit card tin cream clean-out system, comprise the following steps: deionized water, fatty alcohol-polyoxyethylene ether, isopropyl benzene semi-annular jade pendant acid sodium, lauric acid amide of ethanol, ethanol, tween 80, lauryl alcohol, sodium malate, acetic acid are mixed, under 1100 revs/min of stirrings, with the speed of 7 ℃/minute, be heated to 65 ℃, add other remaining components, continue to stir 19 minutes, obtain.
This water-based printing circuit card tin cream clean-out system is used for cleaning copper printed circuit board (PCB), through 10 times of amplification detection of Olympus microscope, surface is clean without pollutents such as obvious rosin, scolding tin, greasy dirt, fingerprints, cleaning solution resistivity is greater than 2*106 Ω .cm, First Pass Yield reaches 85%, is better than normal level.

Claims (2)

1. a water-based printing circuit card tin cream clean-out system, is characterized in that being made by the raw material of following weight part: fatty alcohol-polyoxyethylene ether 3-4, isopropyl benzene semi-annular jade pendant acid sodium 3-4, lauric acid amide of ethanol 5-6, ethanol 40-50, tween 80 3-5, lauryl alcohol 4-5, sodium malate 2-3, acetic acid 2-3, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, methyl methacrylate 3-4, oxidation inhibitor 1035 1-2,2-aminoethyl 17 alkenyl imidazoline 1-2, ethanol 15-18; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
2. the preparation method of water-based printing circuit card tin cream clean-out system according to claim 1, it is characterized in that comprising the following steps: deionized water, fatty alcohol-polyoxyethylene ether, isopropyl benzene semi-annular jade pendant acid sodium, lauric acid amide of ethanol, ethanol, tween 80, lauryl alcohol, sodium malate, acetic acid are mixed, under 1000-1200 rev/min of stirring, speed with 6-8 ℃/minute is heated to 60-70 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
CN201310523475.4A 2013-10-30 2013-10-30 Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent Pending CN103555443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310523475.4A CN103555443A (en) 2013-10-30 2013-10-30 Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310523475.4A CN103555443A (en) 2013-10-30 2013-10-30 Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent

Publications (1)

Publication Number Publication Date
CN103555443A true CN103555443A (en) 2014-02-05

Family

ID=50009811

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310523475.4A Pending CN103555443A (en) 2013-10-30 2013-10-30 Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent

Country Status (1)

Country Link
CN (1) CN103555443A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104279465A (en) * 2014-10-28 2015-01-14 合肥京东方光电科技有限公司 Backlight module and display device
CN105886154A (en) * 2016-04-08 2016-08-24 苏州龙腾万里化工科技有限公司 Environment-friendly efficient concentrated tin paste cleaning agent and preparation method thereof
CN106190649A (en) * 2016-07-11 2016-12-07 广州安达净水材料有限公司 Cleaning solution and method for cleaning PCB tin removing groove by using same
CN108546601A (en) * 2018-04-09 2018-09-18 苏州龙腾万里化工科技有限公司 A kind of electronic product cleaning agent and preparation method thereof
CN110846151A (en) * 2019-11-22 2020-02-28 深圳市伯斯特科技有限公司 Water-based solder paste cleaning agent, and preparation process and cleaning method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052138A (en) * 1989-12-02 1991-06-12 山东大学 A kind of clean-out system that is used for electronic industry and preparation method thereof
CN103215595A (en) * 2013-02-04 2013-07-24 安徽省繁昌县皖南阀门铸造有限公司 Metal rust-preventive oil comprising sorbitan monooleate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052138A (en) * 1989-12-02 1991-06-12 山东大学 A kind of clean-out system that is used for electronic industry and preparation method thereof
CN103215595A (en) * 2013-02-04 2013-07-24 安徽省繁昌县皖南阀门铸造有限公司 Metal rust-preventive oil comprising sorbitan monooleate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104279465A (en) * 2014-10-28 2015-01-14 合肥京东方光电科技有限公司 Backlight module and display device
CN105886154A (en) * 2016-04-08 2016-08-24 苏州龙腾万里化工科技有限公司 Environment-friendly efficient concentrated tin paste cleaning agent and preparation method thereof
CN106190649A (en) * 2016-07-11 2016-12-07 广州安达净水材料有限公司 Cleaning solution and method for cleaning PCB tin removing groove by using same
CN106190649B (en) * 2016-07-11 2019-06-28 广州安达净水材料有限公司 Cleaning solution and method for cleaning PCB tin removing groove by using same
CN108546601A (en) * 2018-04-09 2018-09-18 苏州龙腾万里化工科技有限公司 A kind of electronic product cleaning agent and preparation method thereof
CN110846151A (en) * 2019-11-22 2020-02-28 深圳市伯斯特科技有限公司 Water-based solder paste cleaning agent, and preparation process and cleaning method thereof

Similar Documents

Publication Publication Date Title
CN103555443A (en) Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent
CN103555431A (en) Printed circuit board cleaning agent and preparation method thereof
CN112522037A (en) Neutral water-based cleaning agent for cleaning PCB and preparation method thereof
CN107357142B (en) Aqueous photoresist stripping liquid and preparation method thereof
CN103555452A (en) Emulsion type cleaning agent for printed circuit board and preparation method for emulsion type cleaning agent
CN103525586A (en) Printed circuit board cleaning agent and preparation method thereof
CN103555434A (en) Quick circuit board cleaning agent and preparation method thereof
CN103540426A (en) Waterborne printed circuit board cleaning agent and preparation method thereof
CN103540463A (en) Environment-friendly circuit board cleaning agent and preparation method thereof
CN103571664A (en) Environment-friendly solar silicon wafer cleaning agent and preparation method thereof
CN103540459A (en) Water-based printed circuit board welding flux cleaning agent and preparation method thereof
CN103540440A (en) Weakly alkaline sterilizing printed circuit board cleaning agent and preparation method thereof
CN103571647A (en) Solar grade silicon wafer water-based cleaning agent and preparation method thereof
CN103525585A (en) Corrosion-inhibition circuit board cleaning agent and preparation method thereof
CN107868729B (en) Degumming composition and preparation method and application thereof
CN103526220A (en) Copper printed circuit board cleaning agent and preparation method thereof
CN103525582A (en) Weak-alkaline printed circuit board cleaning agent and preparation method thereof
CN103525575A (en) Low-surface-energy printed circuit board cleaning agent and preparation method thereof
CN103525568A (en) Comprehensive printed circuit board cleaning agent and preparation method thereof
CN103555455A (en) Weak-acidity printed circuit board cleaning agent and preparation method thereof
CN103555440A (en) Corrosion-resistant and bactericidal printed circuit board cleaning agent and preparation method thereof
CN103555456A (en) Computer circuit board cleaning agent and preparation method thereof
CN103540462A (en) Water-based acid printed circuit board cleaning agent and preparation method thereof
CN103525587A (en) Weak-alkaline water-based circuit board cleaning agent and preparation method thereof
CN103555445A (en) Water-based antibacterial circuit board cleaning agent and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20140205

RJ01 Rejection of invention patent application after publication