CN106190649B - A kind of method that cleaning solution and its cleaning PCB move back molten tin bath - Google Patents
A kind of method that cleaning solution and its cleaning PCB move back molten tin bath Download PDFInfo
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- CN106190649B CN106190649B CN201610542837.8A CN201610542837A CN106190649B CN 106190649 B CN106190649 B CN 106190649B CN 201610542837 A CN201610542837 A CN 201610542837A CN 106190649 B CN106190649 B CN 106190649B
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- cleaning solution
- molten tin
- tin bath
- acid
- cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 194
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 161
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000243 solution Substances 0.000 claims abstract description 137
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 61
- 238000010790 dilution Methods 0.000 claims abstract description 25
- 239000012895 dilution Substances 0.000 claims abstract description 25
- 230000007797 corrosion Effects 0.000 claims abstract description 20
- 238000005260 corrosion Methods 0.000 claims abstract description 20
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 17
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 38
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 33
- 239000002253 acid Substances 0.000 claims description 25
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 20
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 13
- 239000000837 restrainer Substances 0.000 claims description 13
- 235000006408 oxalic acid Nutrition 0.000 claims description 11
- 239000011668 ascorbic acid Substances 0.000 claims description 10
- 235000010323 ascorbic acid Nutrition 0.000 claims description 10
- 229960005070 ascorbic acid Drugs 0.000 claims description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- XIBIADJKGLWYMV-UHFFFAOYSA-N 1-bromo-2-nitropropane-1,3-diol Chemical compound OCC(C(O)Br)[N+]([O-])=O XIBIADJKGLWYMV-UHFFFAOYSA-N 0.000 claims description 7
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims description 6
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 6
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 4
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 4
- -1 2- ethyl imidazol Chemical compound 0.000 claims description 3
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 claims description 3
- GZKVWJAFXAUQFK-UHFFFAOYSA-N N1=CC=CC2=CC=CC=C12.CC=1NC=CN1 Chemical compound N1=CC=CC2=CC=CC=C12.CC=1NC=CN1 GZKVWJAFXAUQFK-UHFFFAOYSA-N 0.000 claims description 3
- LVDKZNITIUWNER-UHFFFAOYSA-N Bronopol Chemical compound OCC(Br)(CO)[N+]([O-])=O LVDKZNITIUWNER-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000005554 pickling Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- PSDYQSWHANEKRV-UHFFFAOYSA-N [S]N Chemical compound [S]N PSDYQSWHANEKRV-UHFFFAOYSA-N 0.000 claims 1
- 239000006210 lotion Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 230000002000 scavenging effect Effects 0.000 abstract description 8
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- NDCQPJCNZBQYAO-UHFFFAOYSA-N 4-[[3-[3-benzoyl-8-(trifluoromethyl)quinolin-4-yl]phenoxy]methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1COC1=CC=CC(C=2C3=CC=CC(=C3N=CC=2C(=O)C=2C=CC=CC=2)C(F)(F)F)=C1 NDCQPJCNZBQYAO-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- VLCMRTMCMQJSKM-UHFFFAOYSA-N phenyl-[4-phenyl-8-(trifluoromethyl)quinolin-3-yl]methanone Chemical compound C=1C=CC=CC=1C(=O)C1=CN=C2C(C(F)(F)F)=CC=CC2=C1C1=CC=CC=C1 VLCMRTMCMQJSKM-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/267—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/20—Industrial or commercial equipment, e.g. reactors, tubes or engines
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The present invention relates to a kind of methods that cleaning solution and its cleaning PCB move back molten tin bath.Cleaning solution of the invention consists of the following mass percentage components: remover 2~5%, sour 20~40%, reducing agent 5~10%, corrosion inhibiter 5~10%, surplus is water；The present invention cleans the method that PCB moves back molten tin bath and moves back molten tin bath the following steps are included: (1) washes with water PCB, removes the spot for moving back molten tin bath surface；(2) cleaning solution is diluted, is cleaned with the cleaning solution after dilution and moves back molten tin bath 2~4 hours, then washed with water and move back molten tin bath；(3) cleaning solution is diluted again, is cleaned with the cleaning solution after dilution again and is moved back molten tin bath 1~2 hour, then washed with water and move back molten tin bath.It can be cleaned under lower temperature (such as 20~35 DEG C), scavenging period is short and cleaning effect is good when it is dirty can effectively to clean the tin that PCB is moved back in molten tin bath, and using cleaning solution of the invention using cleaning solution of the invention.
Description
Technical field
The present invention relates to a kind of cleaning solution and cleaning methods, and in particular to a kind of to move back tin dirt in molten tin bath for cleaning PCB
The method that cleaning solution and its cleaning PCB move back molten tin bath.
Background technique
It is usually tin plating on sheet copper before etching in PCB production, to prevent etching process Chinese medicine aqueous corrosion sheet copper,
It is decorporated tin layers in moving back molten tin bath using tin stripping liquid again.Tin stripping liquid generally contains a large amount of nitric acid, on the one hand the presence of nitric acid makes tin
Dissolution rapidly, on the other hand its oxidisability is adhered to tin with two kinds of valence states to move back in molten tin bath, is with the passing of time then formed and is difficult cleaning
Tin dirt.
Summary of the invention
It is an object of the invention to provide in place of overcome the deficiencies in the prior art, a kind of cleaning temperature is low, scavenging period is short
And cleaning effect it is good for cleaning the cleaning solution that PCB moves back tin dirt in molten tin bath.
Another object of the present invention is to provide a kind of methods for moving back molten tin bath using above-mentioned cleaning solution cleaning PCB.
To achieve the above object, the technical scheme adopted by the invention is as follows: a kind of cleaning solution, by following mass percent
Group is grouped as: remover 2~5%, sour 20~40%, reducing agent 5~10%, corrosion inhibiter 5~10%, surplus is water.
Above-mentioned acid is non-oxidizing acid.
In cleaning solution of the invention, remover can infiltrate into tin dirt with move back molten tin bath and contact and crimp, remove tin dirt rapidly；This
The reducing agent used is invented, the tetravalent tin in tin dirt can be reduced to Bivalent Tin, tin dirt is the β of ease of solubility by α Morphological Transitions
Form；In addition, being hardened due to moving back the dirt in molten tin bath as the time increases, it can effectively be cleaned with acid and be stripped agent and reducing agent
It handles resulting Bivalent Tin dirt and moves back the acid-soluble dirt of other in molten tin bath, also, to prevent acid to be oxidized to Bivalent Tin
Tetravalent tin, acid of the invention use non-oxidizing acid；Meanwhile corrosion inhibiter can reduce acid and PCB is moved back molten tin bath and generated and corrode.
Using cleaning solution of the invention, it is dirty can effectively to clean the tin that PCB is moved back in molten tin bath, and uses cleaning solution of the invention
When, it can be cleaned under lower temperature (such as 20~35 DEG C), scavenging period is short and cleaning effect is good.
As the preferred embodiment of cleaning solution of the present invention, the remover is the bromo- 2- nitro -1,3- of 2- the third two
Alcohol.2- bromo-2-nitro-1,3-propylene glycol is a kind of Tan solid, has halo groups in chemical structure, to metal ion
With stronger stripping performance.
As the preferred embodiment of cleaning solution of the present invention, it is described acid be hydrochloric acid, oxalic acid, citric acid, sulfamic acid,
At least one of fumaric acid；The reducing agent is at least one of hydroxylamine hydrochloride, ascorbic acid, sodium thiosulfate；It is described
Corrosion inhibiter is restrainer and/or 2- alkyl imidazoline.
As the preferred embodiment of cleaning solution of the present invention, the restrainer is multi-purpose restrainer；Institute
Stating 2- alkyl imidazoline is at least one of 2-methylimidazole quinoline, 2- ethyl imidazol(e) quinoline, 2 isopropyl imidazole quinoline.
As the preferred embodiment of cleaning solution of the present invention, the remover is the bromo- 2- nitro -1,3- of 2- the third two
Alcohol, the acid are hydrochloric acid and oxalic acid or hydrochloric acid and sulfamic acid；The reducing agent is ascorbic acid, and the corrosion inhibiter is multi-purpose
Restrainer LAN-826.As the more preferable embodiment of cleaning solution of the present invention, in the cleaning solution, the matter of hydrochloric acid
Measuring percentage is 20~30%, and the mass percent of oxalic acid or sulfamic acid is 5~10%.
In above-mentioned cleaning solution, ascorbic acid has stronger reducing power, and multi-purpose restrainer LAN-826 can effectively prevent
Acid moves back molten tin bath to PCB and generates corrosion.Studies have shown that when selecting the specific remover, acid, reducing agent and corrosion inhibiter, in phase
Under same cleaning temperature, scavenging period is shorter, and cleaning effect is more preferable.
As the preferred forms of cleaning solution of the present invention, the cleaning solution is grouped by the group of following mass percent
At: 2- bromo-2-nitro-1,3-propylene glycol 5%, hydrochloric acid 30%, oxalic acid or sulfamic acid 10%, ascorbic acid 5% are mostly used pickling
Corrosion inhibiter LAN-826 5%, water 45%.Applicant constantly changes the component of cleaning solution and containing for component by numerous studies
Amount, and when comparing different content, different component cleaning solution cleaning effect and scavenging period, discovery: specific contained using described
When the specific components of amount, under identical cleaning temperature, scavenging period is most short, and cleaning effect is best.
Cleaning solution of the invention the preparation method comprises the following steps: weigh each component according to mass percent, mix, obtain cleaning solution.
In addition, the present invention also provides a kind of methods for moving back molten tin bath using above-mentioned cleaning solution cleaning PCB, to realize this mesh
, the technical scheme adopted by the invention is as follows: the method that molten tin bath is moved back using above-mentioned cleaning solution cleaning PCB comprising following steps:
(1) it washes with water PCB and moves back molten tin bath, remove the spot for moving back molten tin bath surface；
(2) cleaning solution is diluted, is cleaned with the cleaning solution after dilution and moves back molten tin bath 2~4 hours, then washed with water and move back tin
Slot；
(3) cleaning solution is diluted again, is cleaned with the cleaning solution after dilution again and is moved back molten tin bath 1~2 hour, then uses water
Molten tin bath is moved back in cleaning.
In above-mentioned steps (2) and step (3), washing with water and moving back molten tin bath is to remove the dirt in cleaning solution and cleaning solution
Stain.When moving back molten tin bath using method cleaning PCB of the invention, it can also be cleaned with matching purge machine, such as ultrasonic cleaning is set
It is standby, it can effectively be removed after cleaning and move back water-soluble stain in molten tin bath, insoluble solid spot, acid-soluble spot, tin dirt, and do not needed
High temperature, scavenging period are shorter.
The preferred embodiment of the method for molten tin bath, the step (2) and step (3) are moved back as cleaning PCB of the present invention
In, with water by 1~4 times of cleaning solution dilution, being cleaned with the cleaning solution after dilution and moving back the temperature of molten tin bath is 20~35 DEG C.
Depending on the dilute strength of cleaning solution depends on actual need, in general, it is diluted after 1~4 times using water and is carried out again
It uses, that is, can reach ideal cleaning effect.In addition, not needing very high temperature when being cleaned using cleaning solution of the invention
Degree, keeping cleaning temperature is 20~35 DEG C, it is however generally that, summer does not need additionally to carry out heat treatment, cold winter
When room temperature is lower, heated.
Move back the preferred embodiment of the method for molten tin bath as cleaning PCB of the present invention, it, will with water in the step (2)
1.5 times of cleaning solution dilution；In the step (3), with water by 4.0 times of cleaning solution dilution.
Compared with prior art, the invention has the benefit that cleaning solution of the invention, is moved back with remover removing PCB
High-valence state tin in tin dirt is restored to lower valency using reducing agent, effectively washs PCB by acid and water and move back by the tin dirt in molten tin bath
Tin dirt in molten tin bath, and corrosion of the acid to molten tin bath is moved back is reduced using corrosion inhibiter.Using cleaning solution of the invention, can effectively clean
PCB moves back the dirt of the tin in molten tin bath, and when use cleaning solution of the invention, can carry out under lower temperature (such as 20~35 DEG C) clear
It washes, scavenging period is short and cleaning effect is good.
The present invention also provides a kind of method that cleaning PCB moves back molten tin bath, this method process conditions are easy to reach, operation letter
Single, cleaning effect is good.
Detailed description of the invention
Fig. 1 is the method flow diagram that molten tin bath is moved back using cleaning solution of the present invention cleaning PCB.
Specific embodiment
Purposes, technical schemes and advantages in order to better illustrate the present invention, below in conjunction with the drawings and specific embodiments pair
The present invention is described further.
Embodiment 1
A kind of embodiment of cleaning solution of the present invention, cleaning solution described in the present embodiment are grouped by the group of following mass percent
At:
Remover: the bromo- 2- nitro -1,3- propylene glycol 5% of 2-；
Acid: hydrochloric acid 30%, oxalic acid 10%；
Reducing agent: ascorbic acid 5%；
Corrosion inhibiter: multi-purpose restrainer LAN-826 5%；
Water: 45%.
The method that molten tin bath is moved back using the cleaning of cleaning solution described in the present embodiment PCB comprising following steps:
(1) it washes with water PCB and moves back molten tin bath, remove the spot for moving back molten tin bath surface；
(2) 1.5 times of cleaning solution are diluted with water, is cleaned with the cleaning solution after dilution and moves back molten tin bath 2 hours, cleaning temperature 25
DEG C, then wash with water and move back molten tin bath；
(3) 4.0 times of cleaning solution are diluted with water again, is cleaned with the cleaning solution after dilution again and moves back molten tin bath 1 hour, cleaning temperature
Degree is 25 DEG C, then washes with water and moves back molten tin bath.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 3 hours, moves back in molten tin bath 95% tin dirt and be removed.
Embodiment 2
A kind of embodiment of cleaning solution of the present invention, the difference of cleaning solution described in cleaning solution and embodiment 1 described in the present embodiment
Be: the acid in cleaning solution described in the present embodiment is made of hydrochloric acid and sulfamic acid, and in cleaning solution, the mass percent of hydrochloric acid is
30%, the mass percent of sulfamic acid is 10%.
The method of molten tin bath is moved back with embodiment 1 using the cleaning of cleaning solution described in the present embodiment PCB.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 3 hours, moves back in molten tin bath 96% tin dirt and be removed.
Embodiment 3
A kind of embodiment of cleaning solution of the present invention, the difference of cleaning solution described in cleaning solution and embodiment 1 described in the present embodiment
Be: in cleaning solution, the mass percent of hydrochloric acid is 20%, and the mass percent of oxalic acid is 8%, and the mass percent of water is
57%.
The method that molten tin bath is moved back using the cleaning of cleaning solution described in the present embodiment PCB comprising following steps:
(1) it washes with water PCB and moves back molten tin bath, remove the spot for moving back molten tin bath surface；
(2) 1.5 times of cleaning solution are diluted with water, is cleaned with the cleaning solution after dilution and moves back molten tin bath 2.5 hours, cleaning temperature 25
DEG C, then wash with water and move back molten tin bath；
(3) 4.0 times of cleaning solution are diluted with water again, is cleaned with the cleaning solution after dilution again and moves back molten tin bath 1.5 hours, cleaned
Temperature is 25 DEG C, then washes with water and moves back molten tin bath.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 4 hours, moves back in molten tin bath 89% tin dirt and be removed.
Embodiment 4
A kind of embodiment of cleaning solution of the present invention, the difference of cleaning solution described in cleaning solution and embodiment 1 described in the present embodiment
Be: the acid in cleaning solution described in the present embodiment is made of hydrochloric acid and sulfamic acid, and in cleaning solution, the mass percent of hydrochloric acid is
25%, the mass percent of sulfamic acid is 5%；And mass percent of the water in cleaning solution is 55%.
The method of molten tin bath is moved back with embodiment 3 using the cleaning of cleaning solution described in the present embodiment PCB.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 4 hours, moves back in molten tin bath 88% tin dirt and be removed.
Embodiment 5
A kind of embodiment of cleaning solution of the present invention, cleaning solution described in the present embodiment are grouped by the group of following mass percent
At:
Remover: the bromo- 2- nitro -1,3- propylene glycol 4% of 2-；
Acid: hydrochloric acid 25%, sulfamic acid 8%；
Reducing agent: ascorbic acid 8%；
Corrosion inhibiter: multi-purpose restrainer LAN-826 6%；
Water: 49%.
The method of molten tin bath is moved back with embodiment 3 using the cleaning of cleaning solution described in the present embodiment PCB.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 4 hours, moves back in molten tin bath 88% tin dirt and be removed.
Embodiment 6
A kind of embodiment of cleaning solution of the present invention, cleaning solution described in the present embodiment are grouped by the group of following mass percent
At:
Remover: the bromo- 2- nitro -1,3- propylene glycol 4% of 2-；
Acid: hydrochloric acid 18%, sulfamic acid 15%；
Reducing agent: ascorbic acid 8%；
Corrosion inhibiter: multi-purpose restrainer LAN-826 6%；
Water: 49%.
The method that molten tin bath is moved back using the cleaning of cleaning solution described in the present embodiment PCB comprising following steps:
(1) it washes with water PCB and moves back molten tin bath, remove the spot for moving back molten tin bath surface；
(2) 1.5 times of cleaning solution are diluted with water, is cleaned with the cleaning solution after dilution and moves back molten tin bath 3 hours, cleaning temperature 25
DEG C, then wash with water and move back molten tin bath；
(3) 4.0 times of cleaning solution are diluted with water again, is cleaned with the cleaning solution after dilution again and moves back molten tin bath 1.5 hours, cleaned
Temperature is 25 DEG C, then washes with water and moves back molten tin bath.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 4.5 hours, moves back in molten tin bath 83% tin dirt and be removed.
Embodiment 7
A kind of embodiment of cleaning solution of the present invention, cleaning solution described in the present embodiment are grouped by the group of following mass percent
At:
Remover: the bromo- 2- nitro -1,3- propylene glycol 5% of 2-；
Acid: hydrochloric acid 30%, citric acid 10%；
Reducing agent: sodium thiosulfate 5%；
Corrosion inhibiter: 2-methylimidazole quinoline 5%；
Water: 45%.
The method that molten tin bath is moved back using the cleaning of cleaning solution described in the present embodiment PCB comprising following steps:
(1) it washes with water PCB and moves back molten tin bath, remove the spot for moving back molten tin bath surface；
(2) 1.5 times of cleaning solution are diluted with water, is cleaned with the cleaning solution after dilution and moves back molten tin bath 3 hours, cleaning temperature 25
DEG C, then wash with water and move back molten tin bath；
(3) 4.0 times of cleaning solution are diluted with water again, is cleaned with the cleaning solution after dilution again and moves back molten tin bath 1.5 hours, cleaned
Temperature is 25 DEG C, then washes with water and moves back molten tin bath.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 4.5 hours, moves back in molten tin bath 80% tin dirt and be removed.
Embodiment 8
A kind of embodiment of cleaning solution of the present invention, cleaning solution described in the present embodiment are grouped by the group of following mass percent
At:
Remover: the bromo- 2- nitro -1,3- propylene glycol 2% of 2-；
Acid: oxalic acid 30%；
Reducing agent: sodium thiosulfate 10%；
Corrosion inhibiter: 2- ethyl imidazol(e) quinoline 10%；
Water: 48%.
The method that molten tin bath is moved back using the cleaning of cleaning solution described in the present embodiment PCB comprising following steps:
(1) it washes with water PCB and moves back molten tin bath, remove the spot for moving back molten tin bath surface；
(2) 4 times of cleaning solution are diluted with water, is cleaned with the cleaning solution after dilution and moves back molten tin bath 4 hours, cleaning temperature is 35 DEG C,
It washes with water again and moves back molten tin bath；
(3) 1.0 times of cleaning solution are diluted with water again, is cleaned with the cleaning solution after dilution again and moves back molten tin bath 1.5 hours, cleaned
Temperature is 35 DEG C, then washes with water and moves back molten tin bath.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 5.5 hours, moves back in molten tin bath 80% tin dirt and be removed.
Embodiment 9
A kind of embodiment of cleaning solution of the present invention, cleaning solution described in the present embodiment are grouped by the group of following mass percent
At:
Remover: the bromo- 2- nitro -1,3- propylene glycol 3% of 2-；
Acid: fumaric acid 20%；
Reducing agent: hydroxylamine hydrochloride 10%；
Corrosion inhibiter: multi-purpose restrainer LAN-826 4%, 2 isopropyl imidazole quinoline 4%；
Water: 59%.
The method that molten tin bath is moved back using the cleaning of cleaning solution described in the present embodiment PCB comprising following steps:
(1) it washes with water PCB and moves back molten tin bath, remove the spot for moving back molten tin bath surface；
(2) it is diluted with water 1 times of cleaning solution, is cleaned with the cleaning solution after dilution and moves back molten tin bath 3 hours, cleaning temperature is 20 DEG C,
It washes with water again and moves back molten tin bath；
(3) 1.5 times of cleaning solution are diluted with water again, is cleaned with the cleaning solution after dilution again and moves back molten tin bath 2.0 hours, cleaned
Temperature is 20 DEG C, then washes with water and moves back molten tin bath.
When the present embodiment cleaning PCB moves back molten tin bath, in the step (2) and step (3), cleaning solution cleans the time for moving back molten tin bath
Altogether it is 5 hours, moves back in molten tin bath 80% tin dirt and be removed.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than protects to the present invention
The limitation of range is protected, although the invention is described in detail with reference to the preferred embodiments, those skilled in the art should
Understand, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the essence of technical solution of the present invention
And range.
Claims (9)
1. a kind of PCB moves back molten tin bath tin dirt cleaning solution, it is characterised in that: the cleaning solution is grouped by the group of following mass percent
At: remover 2~5%, sour 20~40%, reducing agent 5~10%, corrosion inhibiter 5~10%, surplus is water, and the remover is
The bromo- 2- nitro -1,3- propylene glycol of 2-.
2. cleaning solution as described in claim 1, it is characterised in that: the acid is hydrochloric acid, oxalic acid, citric acid, sulfamic acid, richness
At least one of horse acid；The reducing agent is at least one of hydroxylamine hydrochloride, ascorbic acid, sodium thiosulfate；It is described slow
Losing agent is restrainer and/or 2- alkyl imidazoline.
3. cleaning solution as claimed in claim 2, it is characterised in that: the restrainer is multi-purpose restrainer；It is described
2- alkyl imidazoline is at least one of 2-methylimidazole quinoline, 2- ethyl imidazol(e) quinoline, 2 isopropyl imidazole quinoline.
4. cleaning solution as claimed in claim 3, it is characterised in that: the acid is hydrochloric acid and oxalic acid or hydrochloric acid and amino sulphur
Acid；The reducing agent is ascorbic acid, and the corrosion inhibiter is multi-purpose restrainer LAN-826.
5. cleaning solution as claimed in claim 4, it is characterised in that: in the cleaning solution, the mass percent of hydrochloric acid is 20~
30%, the mass percent of oxalic acid or sulfamic acid is 5~10%.
6. cleaning solution as claimed in claim 4, it is characterised in that: the cleaning solution is grouped by the group of following mass percent
At: 2- bromo-2-nitro-1,3-propylene glycol 5%, hydrochloric acid 30%, oxalic acid or sulfamic acid 10%, ascorbic acid 5% are mostly used pickling
Corrosion inhibiter LAN-826 5%, water 45%.
7. the method for moving back molten tin bath using any one of the claim 1~6 cleaning solution cleaning PCB, it is characterised in that: including following
Step:
(1) it washes with water PCB and moves back molten tin bath, remove the spot for moving back molten tin bath surface；
(2) cleaning solution is diluted, is cleaned with the cleaning solution after dilution and moves back molten tin bath 2~4 hours, then washed with water and move back molten tin bath；
(3) cleaning solution is diluted again, is cleaned with the cleaning solution after dilution again and is moved back molten tin bath 1~2 hour, then washed with water
Move back molten tin bath.
8. the method that cleaning PCB moves back molten tin bath as claimed in claim 7, it is characterised in that: in the step (2) and step (3),
With water by 1~4 times of cleaning solution dilution, being cleaned with the cleaning solution after dilution and moving back the temperature of molten tin bath is 20~35 DEG C.
9. the method that cleaning PCB moves back molten tin bath as claimed in claim 8, it is characterised in that:, will be clear with water in the step (2)
Washing lotion dilutes 1.5 times；In the step (3), with water by 4.0 times of cleaning solution dilution.
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| CN107603749A (en) * | 2017-09-15 | 2018-01-19 | 衢州市鼎盛化工科技有限公司 | Cleaning fluid and its application for acid-etched glass slag |
| CN115584502A (en) * | 2022-09-23 | 2023-01-10 | 惠州市永隆电路有限公司 | Efficient tin stripping agent for PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101892489A (en) * | 2010-07-23 | 2010-11-24 | 广州唯普电力科技有限公司 | Cleaning agent for flue dust scale on surface of gas heat exchanger of gas desulfurization system and preparation method thereof |
| CN102757871A (en) * | 2012-06-19 | 2012-10-31 | 瀚宇博德科技（江阴）有限公司 | Cleaning agent for dry-film developing tank of printed circuit board (PCB) and preparation method of cleaning agent |
| CN103555443A (en) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101892489A (en) * | 2010-07-23 | 2010-11-24 | 广州唯普电力科技有限公司 | Cleaning agent for flue dust scale on surface of gas heat exchanger of gas desulfurization system and preparation method thereof |
| CN102757871A (en) * | 2012-06-19 | 2012-10-31 | 瀚宇博德科技（江阴）有限公司 | Cleaning agent for dry-film developing tank of printed circuit board (PCB) and preparation method of cleaning agent |
| CN103555443A (en) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent |
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