CN115584502A - Efficient tin stripping agent for PCB - Google Patents
Efficient tin stripping agent for PCB Download PDFInfo
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- CN115584502A CN115584502A CN202211162639.0A CN202211162639A CN115584502A CN 115584502 A CN115584502 A CN 115584502A CN 202211162639 A CN202211162639 A CN 202211162639A CN 115584502 A CN115584502 A CN 115584502A
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- pcb
- stripping agent
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- tin stripping
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 58
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 21
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims abstract description 12
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims abstract description 12
- 239000002253 acid Substances 0.000 claims abstract description 12
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 claims abstract description 12
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims abstract description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims abstract description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 6
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims abstract description 6
- 239000001103 potassium chloride Substances 0.000 claims abstract description 6
- 235000011164 potassium chloride Nutrition 0.000 claims abstract description 6
- 239000011780 sodium chloride Substances 0.000 claims abstract description 6
- 239000008367 deionised water Substances 0.000 claims abstract description 5
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- -1 imidazoline amide Chemical class 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 11
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 9
- 239000003223 protective agent Substances 0.000 claims description 8
- 239000003112 inhibitor Substances 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 7
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 6
- BWHOZHOGCMHOBV-UHFFFAOYSA-N Benzalacetone Natural products CC(=O)C=CC1=CC=CC=C1 BWHOZHOGCMHOBV-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 claims description 6
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 claims description 6
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims description 6
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 claims description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 6
- BWHOZHOGCMHOBV-BQYQJAHWSA-N trans-benzylideneacetone Chemical compound CC(=O)\C=C\C1=CC=CC=C1 BWHOZHOGCMHOBV-BQYQJAHWSA-N 0.000 claims description 6
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 3
- PTLXXCCTGURQMN-UHFFFAOYSA-N CC1OP(O)(=O)OP(=O)(OO)O1 Chemical compound CC1OP(O)(=O)OP(=O)(OO)O1 PTLXXCCTGURQMN-UHFFFAOYSA-N 0.000 claims description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- 125000003282 alkyl amino group Chemical group 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- WPKYZIPODULRBM-UHFFFAOYSA-N azane;prop-2-enoic acid Chemical compound N.OC(=O)C=C WPKYZIPODULRBM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004359 castor oil Substances 0.000 claims description 3
- 235000019438 castor oil Nutrition 0.000 claims description 3
- 150000002191 fatty alcohols Chemical class 0.000 claims description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 3
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 229920000768 polyamine Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 3
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 3
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 claims description 3
- 235000010234 sodium benzoate Nutrition 0.000 claims description 3
- 239000004299 sodium benzoate Substances 0.000 claims description 3
- 235000010288 sodium nitrite Nutrition 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 3
- 229960002317 succinimide Drugs 0.000 claims description 3
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052802 copper Inorganic materials 0.000 abstract description 25
- 239000010949 copper Substances 0.000 abstract description 25
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- 230000035699 permeability Effects 0.000 abstract description 6
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 230000001590 oxidative effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910001432 tin ion Inorganic materials 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention relates to an efficient tin stripping agent for a PCB (printed circuit board), which comprises the following components in parts by mass: 34 to 76 parts of mixed acid, 2 to 4 parts of ferric chloride, 3 to 6 parts of copper sulfate, 4 to 8 parts of potassium chloride, 4 to 8 parts of sodium chloride, 4 to 8 parts of ammonia chloride, 6 to 10 parts of ferric nitrate, 0.5 to 1.5 parts of sodium dodecyl sulfate, 6 to 10 parts of hydroxylamine hydrochloride, 6 to 10 parts of propylene glycol and the balance of deionized water. The mixed acid has strong oxidizing property and can effectively dissolve the absorption layer, and the sodium dodecyl sulfate can increase the permeability of the high-efficiency tin stripping agent for the PCB to the tin layer. The propylene glycol increases the permeability of the high-efficiency tin stripping agent for the PCB to the tin layer by reducing the surface tension of the high-efficiency tin stripping agent for the PCB. The hydroxylamine hydrochloride has certain oxidation resistance and can effectively protect the copper path. The efficient tin stripping agent for the PCB has high removal efficiency of the tin layer on the surface of the copper circuit of the PCB, and meets the requirement of efficient production of the PCB.
Description
Technical Field
The invention relates to the field of PCB processing, in particular to an efficient tin stripping agent for a PCB.
Background
A PCB, i.e., a printed wiring board, which is called a printed board for short, is one of important parts in the electronic industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating base plate, a connecting lead and a welding pad for assembling and welding electronic elements, and has double functions of a conducting circuit and the insulating base plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is beneficial to realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board after assembly and debugging can be used as an independent spare part, so that the exchange and maintenance of the whole machine product are facilitated. At present, printed wiring boards have been used very widely in the manufacture of electronic products.
However, in the process of manufacturing the PCB, the tin layer on the surface of the copper path of the PCB needs to be removed by using the tin stripping agent, but the traditional tin stripping agent has low efficiency in removing the tin layer on the surface of the copper path of the PCB, and the requirement of high-efficiency production of the PCB cannot be met.
Disclosure of Invention
Therefore, the efficient solder stripping agent for the PCB is necessary to solve the technical problems that the traditional solder stripping agent is low in removing efficiency of a tin layer on the surface of a copper path of the PCB and cannot meet the requirement of efficient production of the PCB.
The efficient tin stripping agent for the PCB comprises the following components in parts by mass: 34 to 76 parts of mixed acid, 2 to 4 parts of ferric chloride, 3 to 6 parts of copper sulfate, 4 to 8 parts of potassium chloride, 4 to 8 parts of sodium chloride, 4 to 8 parts of ammonia chloride, 6 to 10 parts of ferric nitrate, 0.5 to 1.5 parts of sodium dodecyl sulfate, 6 to 10 parts of hydroxylamine hydrochloride, 6 to 10 parts of propylene glycol and the balance of deionized water.
In one embodiment, the high-efficiency tin stripping agent for the PCB further comprises 0.2-0.8 part by mass of a protective agent.
In one embodiment, the protective agent comprises the following components in parts by mass: 20 to 30 parts of benzotriazole, 5 to 10 parts of imidazoline amide, 20 to 30 parts of mercaptobenzothiazole, 5 to 10 parts of isopropyl benzene, 5 to 10 parts of vulcanized castor oil, 10 to 20 parts of ammonium acrylate and 5 to 10 parts of diethylenetriamine.
In one embodiment, the high-efficiency solder stripper for the PCB further comprises 0.5-1.5 parts by mass of a corrosion inhibitor.
In one embodiment, the corrosion inhibitor comprises the following components in parts by mass: 20 to 30 parts of polyethylene polyamine, 10 to 15 parts of alkyl amino alcohol, 15 to 25 parts of sodium tripolyphosphate, 10 to 20 parts of sodium silicate, 12 to 16 parts of sodium nitrite, 3 to 5 parts of hydroxy ethylidene diphosphate, 4 to 9 parts of imidazoline and 4 to 9 parts of furfural.
In one embodiment, the high-efficiency solder stripping agent for the PCB further comprises 0.1 to 2 parts by mass of a brightener.
In one embodiment, the brightener comprises the following components in parts by mass: 20 to 30 parts of thiourea, 16 to 25 parts of sodium benzoate, 20 to 30 parts of succinimide solution, 20 to 30 parts of polyethylene glycol octyl phenyl ether-10 to 30 parts of benzalacetone and 10 to 12 parts of benzalacetone.
In one embodiment, the high-efficiency tin stripping agent for the PCB further comprises 1-2 parts by mass of a surfactant.
In one embodiment, the surfactant comprises the following components in parts by mass: 50 to 80 parts of nonylphenol polyoxyethylene ether, 4 to 10 parts of ethylene glycol butyl ether, 8 to 16 parts of polyether, 6 to 12 parts of fatty alcohol ether and 6 to 12 parts of polyoxyethylene pyrrolidone.
In one embodiment, the mixed acid comprises the following components in parts by mass: 12 to 24 parts of hydrochloric acid, 8 to 20 parts of sulfuric acid, 12 to 20 parts of nitric acid, 8 to 24 parts of phosphoric acid, 8 to 24 parts of oxalic acid, 8 to 20 parts of citric acid and 12 to 20 parts of amino sulfuric acid.
In the working process of the high-efficiency tin stripping agent for the PCB, the mixed acid has strong oxidizing property and can effectively dissolve the absorption layer, the ferric chloride, the copper sulfate, the potassium chloride, the sodium chloride, the ammonia chloride and the ferric nitrate can increase the solubility to tin ions, and on the other hand, the concentration of the copper ions is improved, so that the copper layer can be effectively prevented from being dissolved. The sodium dodecyl sulfate can increase the permeability of the high-efficiency tin stripping agent for the PCB to the tin layer, thereby further increasing the dissolving speed of the high-efficiency tin stripping agent for the PCB to the absorption layer. The propylene glycol can increase the permeability of the high-efficiency tin stripping agent for the PCB to the tin layer by reducing the surface tension of the high-efficiency tin stripping agent for the PCB, thereby further increasing the dissolving speed of the high-efficiency tin stripping agent for the PCB to the absorption layer. The hydroxylamine hydrochloride has certain oxidation resistance and can effectively protect the copper path. The efficient tin stripping agent for the PCB has high removal efficiency of the tin layer on the surface of the copper circuit of the PCB, and meets the requirement of efficient production of the PCB.
Drawings
FIG. 1 is a diagram showing the components of the high-efficiency solder stripper for PCB board in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the present invention provides a high efficiency solder stripper for a PCB, which comprises the following components in parts by mass: 34 to 76 parts of mixed acid, 2 to 4 parts of ferric chloride, 3 to 6 parts of copper sulfate, 4 to 8 parts of potassium chloride, 4 to 8 parts of sodium chloride, 4 to 8 parts of ammonia chloride, 6 to 10 parts of ferric nitrate, 0.5 to 1.5 parts of sodium dodecyl sulfate, 6 to 10 parts of hydroxylamine hydrochloride, 6 to 10 parts of propylene glycol and the balance of deionized water.
In the working process of the high-efficiency tin stripping agent for the PCB, the mixed acid has strong oxidizing property and can effectively dissolve the absorption layer, the ferric chloride, the copper sulfate, the potassium chloride, the sodium chloride, the ammonia chloride and the ferric nitrate can increase the solubility to tin ions, and on the other hand, the concentration of the copper ions is improved, so that the copper layer can be effectively prevented from being dissolved. The sodium dodecyl sulfate can increase the permeability of the high-efficiency tin stripping agent for the PCB to the tin layer, thereby further increasing the dissolving speed of the high-efficiency tin stripping agent for the PCB to the absorption layer. The propylene glycol can increase the permeability of the high-efficiency tin stripping agent for the PCB to the tin layer by reducing the surface tension of the high-efficiency tin stripping agent for the PCB, thereby further increasing the dissolving speed of the high-efficiency tin stripping agent for the PCB to the absorption layer. The hydroxylamine hydrochloride has certain oxidation resistance and can effectively protect the copper path. The efficient solder stripping agent for the PCB has high removal efficiency on the solder layer on the surface of the PCB copper path, and meets the requirement of efficient production of the PCB.
In order to further increase the oxidability of the high-efficiency tin stripping agent for the PCB, in one embodiment, the mixed acid comprises the following components in parts by mass: 12 to 24 parts of hydrochloric acid, 8 to 20 parts of sulfuric acid, 12 to 20 parts of nitric acid, 8 to 24 parts of phosphoric acid, 8 to 24 parts of oxalic acid, 8 to 20 parts of citric acid and 12 to 20 parts of amino sulfuric acid. The formula of the mixed acid enhances the oxidability of the mixed acid, thereby increasing the oxidability of the high-efficiency tin stripping agent for the PCB so as to increase the working efficiency of the high-efficiency tin stripping agent for the PCB.
In order to increase the protection of the copper path of the PCB, in one embodiment, the high-efficiency solder stripping agent for the PCB further comprises 0.2 to 0.8 parts by mass of a protective agent. Further, in this embodiment, the protective agent includes the following components in parts by mass: 20 to 30 parts of benzotriazole, 5 to 10 parts of imidazoline amide, 20 to 30 parts of mercaptobenzothiazole, 5 to 10 parts of isopropyl benzene, 5 to 10 parts of vulcanized castor oil, 10 to 20 parts of ammonium acrylate and 5 to 10 parts of diethylenetriamine. The benzotriazole is used as an effective anti-oxidation protective agent, can effectively protect a PCB copper circuit and can prevent the PCB copper circuit from rusting. The protective agent can effectively protect the PCB copper circuit, and the PCB is prevented from being damaged by the high-efficiency tin stripping agent.
In order to further increase the protection effect on the copper paths of the PCB, in one embodiment, the high-efficiency tin stripping agent for the PCB further comprises 0.5 to 1.5 parts by mass of a corrosion inhibitor. Further, in this embodiment, the corrosion inhibitor includes the following components in parts by mass: 20 to 30 parts of polyethylene polyamine, 10 to 15 parts of alkyl amino alcohol, 15 to 25 parts of sodium tripolyphosphate, 10 to 20 parts of sodium silicate, 12 to 16 parts of sodium nitrite, 3 to 5 parts of hydroxy ethylidene diphosphate, 4 to 9 parts of imidazoline and 4 to 9 parts of furfural. The corrosion inhibitor can effectively slow down the corrosion of the PCB copper path by the high-efficiency tin removing agent for the PCB, so that the PCB copper path can be rapidly washed after the tin layer on the PCB copper path is removed, and the PCB copper path is prevented from being burnt by the high-efficiency tin removing agent for the PCB in a short time.
In one embodiment, the high-efficiency solder stripping agent for the PCB further comprises 0.1 to 2 parts by mass of a brightening agent for removing impurities such as oil stains, oxides and the like on the copper circuit of the PCB. In this embodiment, the brightener comprises the following components in parts by mass: 20 to 30 parts of thiourea, 16 to 25 parts of sodium benzoate, 20 to 30 parts of succinimide solution, 20 to 30 parts of polyethylene glycol octyl phenyl ether-10 to 30 parts of benzalacetone and 10 to 12 parts of benzalacetone. The brightener can effectively remove impurities such as oil stains, oxides and the like on a PCB copper path, and ensures the cleanness and glossiness of the PCB copper path, thereby ensuring the working stability of the PCB.
In order to further increase the working stability of the high-efficiency tin stripping agent for the PCB, in one embodiment, the high-efficiency tin stripping agent for the PCB further comprises 1 to 2 parts by mass of a surfactant. In one embodiment, the surfactant comprises the following components in parts by mass: 50 to 80 parts of nonylphenol polyoxyethylene ether, 4 to 10 parts of ethylene glycol butyl ether, 8 to 16 parts of polyether, 6 to 12 parts of fatty alcohol ether and 6 to 12 parts of polyoxyethylene pyrrolidone. The surface active agent has increased the mixing uniformity of each component in the high-efficient tin agent that moves back for the PCB board on the one hand, and on the other hand has increased the solubility of each component in deionized water to the high-efficient tin agent that moves back for the PCB board, and secondly, has increased the binding capacity of tin layer on PCB board and the high-efficient tin agent that moves back for the PCB board and the PCB copper way to the dissolution rate of tin layer has been increased with high-efficient tin agent that moves back for the PCB board. Therefore, the working stability of the high-efficiency tin stripping agent for the PCB is improved.
The average data obtained by carrying out a plurality of tin layer removing experiments on the high-efficiency tin stripping agent for the PCB at different temperatures are as follows:
according to the experimental data, the efficient tin removing agent for the PCB can avoid excessive corrosion of a PCB copper circuit when a tin layer is efficiently removed, and can guarantee high stable quality of the PCB when high-efficiency production requirements of the PCB are met.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The efficient tin stripping agent for the PCB is characterized by comprising the following components in parts by mass: 34 to 76 parts of mixed acid, 2 to 4 parts of ferric chloride, 3 to 6 parts of copper sulfate, 4 to 8 parts of potassium chloride, 4 to 8 parts of sodium chloride, 4 to 8 parts of ammonia chloride, 6 to 10 parts of ferric nitrate, 0.5 to 1.5 parts of sodium dodecyl sulfate, 6 to 10 parts of hydroxylamine hydrochloride, 6 to 10 parts of propylene glycol and the balance of deionized water.
2. The efficient tin stripping agent for the PCB as recited in claim 1, further comprising 0.2 to 0.8 parts by mass of a protective agent.
3. The efficient tin stripping agent for the PCB as claimed in claim 2, wherein the protective agent comprises the following components in parts by mass: 20 to 30 parts of benzotriazole, 5 to 10 parts of imidazoline amide, 20 to 30 parts of mercaptobenzothiazole, 5 to 10 parts of isopropyl benzene, 5 to 10 parts of vulcanized castor oil, 10 to 20 parts of ammonium acrylate and 5 to 10 parts of diethylenetriamine.
4. The efficient tin stripping agent for the PCB as recited in claim 1, further comprising 0.5 to 1.5 parts by mass of a corrosion inhibitor.
5. The efficient tin stripping agent for the PCB as recited in claim 4, wherein the corrosion inhibitor comprises the following components in parts by mass: 20 to 30 parts of polyethylene polyamine, 10 to 15 parts of alkyl amino alcohol, 15 to 25 parts of sodium tripolyphosphate, 10 to 20 parts of sodium silicate, 12 to 16 parts of sodium nitrite, 3 to 5 parts of hydroxy ethylidene diphosphate, 4 to 9 parts of imidazoline and 4 to 9 parts of furfural.
6. The efficient solder stripping agent for the PCB as recited in claim 1, further comprising 0.1 to 2 parts by mass of a brightener.
7. The efficient tin stripping agent for the PCB as recited in claim 6, wherein the brightener comprises the following components in parts by mass: 20 to 30 parts of thiourea, 16 to 25 parts of sodium benzoate, 20 to 30 parts of succinimide solution, 20 to 30 parts of polyethylene glycol octyl phenyl ether-10 to 30 parts of benzalacetone and 10 to 12 parts of benzalacetone.
8. The efficient tin stripping agent for the PCB as recited in claim 1, further comprising 1 to 2 parts by mass of a surfactant.
9. The efficient tin stripping agent for the PCB as recited in claim 1, wherein the surfactant comprises the following components in parts by mass: 50 to 80 parts of nonylphenol polyoxyethylene ether, 4 to 10 parts of ethylene glycol butyl ether, 8 to 16 parts of polyether, 6 to 12 parts of fatty alcohol ether and 6 to 12 parts of polyoxyethylene pyrrolidone.
10. The efficient tin stripping agent for the PCB as recited in claim 1, wherein the mixed acid comprises the following components in parts by mass: 12 to 24 parts of hydrochloric acid, 8 to 20 parts of sulfuric acid, 12 to 20 parts of nitric acid, 8 to 24 parts of phosphoric acid, 8 to 24 parts of oxalic acid, 8 to 20 parts of citric acid and 12 to 20 parts of amino sulfuric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211162639.0A CN115584502A (en) | 2022-09-23 | 2022-09-23 | Efficient tin stripping agent for PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211162639.0A CN115584502A (en) | 2022-09-23 | 2022-09-23 | Efficient tin stripping agent for PCB |
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| Publication Number | Publication Date |
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| CN115584502A true CN115584502A (en) | 2023-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211162639.0A Pending CN115584502A (en) | 2022-09-23 | 2022-09-23 | Efficient tin stripping agent for PCB |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5219484A (en) * | 1991-04-25 | 1993-06-15 | Applied Electroless Concepts Inc. | Solder and tin stripper compositions |
| CN101760743A (en) * | 2009-11-09 | 2010-06-30 | 广东奥美特集团有限公司 | Tin stripping liquid |
| CN106190649A (en) * | 2016-07-11 | 2016-12-07 | 广州安达净水材料有限公司 | Cleaning solution and method for cleaning PCB tin removing groove by using same |
| CN107059008A (en) * | 2017-01-11 | 2017-08-18 | 长江大学 | One kind is used to strip scolding tin material tin stripping liquid and preparation method thereof on discarded PCB |
-
2022
- 2022-09-23 CN CN202211162639.0A patent/CN115584502A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5219484A (en) * | 1991-04-25 | 1993-06-15 | Applied Electroless Concepts Inc. | Solder and tin stripper compositions |
| CN101760743A (en) * | 2009-11-09 | 2010-06-30 | 广东奥美特集团有限公司 | Tin stripping liquid |
| CN106190649A (en) * | 2016-07-11 | 2016-12-07 | 广州安达净水材料有限公司 | Cleaning solution and method for cleaning PCB tin removing groove by using same |
| CN107059008A (en) * | 2017-01-11 | 2017-08-18 | 长江大学 | One kind is used to strip scolding tin material tin stripping liquid and preparation method thereof on discarded PCB |
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Application publication date: 20230110 |