CN102098880B - Surface processing method of PCB (printed circuit board) - Google Patents
Surface processing method of PCB (printed circuit board) Download PDFInfo
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- CN102098880B CN102098880B CN 201110040782 CN201110040782A CN102098880B CN 102098880 B CN102098880 B CN 102098880B CN 201110040782 CN201110040782 CN 201110040782 CN 201110040782 A CN201110040782 A CN 201110040782A CN 102098880 B CN102098880 B CN 102098880B
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Abstract
The invention discloses a surface processing method of a PCB (printed circuit board), mainly comprising the following steps: electroplating nickel, and evenly coating a layer of metal nickel on the PCB; electroplating a nickel palladium alloy, and coating a layer of nickel palladium alloys on the nickel surface of the PCB, wherein as for the liquid medicine, the temperature of the liquid medicine is 60-64 DEG C, the concentration of palladium ions is 6-9 g/L, the concentration of nickel ions is 5-8 g/L, and the PH value is 4.6-5.8; and electroplating aurum, coating an aurum layer with the thickness of 0.1 mu m on the nickel palladium alloy surface of the PCB. A step of electroplating the nickel palladium alloys is added between the step of electroplating nickel and the step of electroplating aurum, so that the circuit board is sequentially coated with a nickel layer, a nickel palladium alloy layer and an aurum layer. As the nickel palladium alloy has excellent performance, and the nickel palladium alloy is used as the intermediate layer between the nickel and the aurum, the usage amount of aurum is reduced. The method provided the invention can reduce the cost under the condition of not affecting aurum wiring performance and wearing performance.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, in particular, relate to a kind of surface treatment method of printed substrate.
Background technology
The Chinese of PCB (Printed Circuit Board) is a printed substrate; On insulating substrate; By predetermined design, form printed wiring that the particular conductivity figure forms, printed component or, be one of vitals of electronics industry by the product of both be combined intos with metallic copper.Though the metallic copper of printed substrate is good components and parts solder side and electric signal transmitter; But it is oxidized easily that metallic copper exposes in air; Cupric oxide then can hinder the molten wet and electric conductivity of scolding tin; So can on copper face, apply a kind of stable material usually, for example on copper face, apply nickel dam and gold layer.Gold in surface treatment, application the most extensive, its excellent electric conductivity, contact performance, welding performance, high-temp resisting high-humidity resisting, corrosion resistance are that other metals are incomparable.
In the technology of printed substrate electronickelling gold, mainly comprise and electroplate hard gold process and electroplating mild alloy technology.
In electroplating hard gold process, mainly be on the copper face of printed substrate, to apply nickel dam and alloy-layer, in alloy-layer, foreign metals such as cobalt occupy 0.3%, and gold occupies 99.7%, and such alloy is called as hard gold.Electroplate the surface coating layer of hard gold as dynamic linker, for guaranteeing that golden face constantly not having tangible cut under the friction situation, causes nickel dam to be exposed to oxidation affects electric conductivity in the air, the thickness of gold layer generally also is more than the 0.5 μ m.Because it has certain resistance to wear, thereby has a wide range of applications at aspects such as precision instrumentation, printed circuit board, integrated circuit, shell, electric contacts.
In electroplating mild alloy technology, be on the copper face of printed substrate, to apply nickel dam and gold layer, in gold, do not add other impurity, gold content is more than 99.9%, and such gold is called as soft gold.The main purpose of electroplating mild alloy is to beat gold thread; Be that circuit with chip and printed substrate couples together, accomplish the complete of electrical property, the material of gold thread is a proof gold; The composition of Gold plated Layer also is a proof gold; Both consistences of composition have been guaranteed the stable of its connection, and in order to guarantee to beat the reliability of gold thread, the thickness of gold layer is generally more than the 0.5 μ m.
In research and practice process to prior art, inventor of the present invention finds that there is following problem in prior art:
In electroplating hard gold process and electroplating mild alloy technology; For the routing performance and hard golden anti-wear performance that guarantees soft gold; The thickness of gold layer all requires more than 0.5 μ m, because the use amount of gold is too high, so improved the cost that print circuit board surface is handled greatly.
Therefore, how to reduce the cost of print circuit board surface processing method, become the problem that needs most solution at present.
Summary of the invention
In view of this, purpose of design of the present invention is, a kind of surface treatment method of printed substrate is provided, with reduce the gold use amount, thereby reduce cost.
The embodiment of the invention is achieved in that
A kind of surface treatment method of printed substrate may further comprise the steps:
Electronickelling applies layer of metal nickel uniformly on printed substrate;
The electronickelling palldium alloy at the nickel surface of printed substrate, plates one deck Ni-Pd alloy, and in soup, fluid temperature is 60-64 ℃, and palladium ion concentration is 6-9g/L, and nickel ion concentration is 5-8g/L, and pH value is 4.6-5.8;
Electrogilding, on the Ni-Pd alloy surface of printed substrate, plating thickness is the gold layer of 0.1 μ m.
Preferably, in the surface treatment method of above-mentioned printed substrate, after electronickelling, adopt water to clean the printed substrate that is coated with metallic nickel.
Preferably, in the surface treatment method of above-mentioned printed substrate, after the electronickelling palldium alloy, adopt water to clean the printed substrate that is coated with Ni-Pd alloy.
Preferably, in the surface treatment method of above-mentioned printed substrate, before electrogilding, carry out oil removing, washing, little erosion, washing, acidleach, washing processing successively.
Preferably, in the surface treatment method of above-mentioned printed substrate, in the said gold layer, the content of gold is more than 99.9%.
Preferably, in the surface treatment method of above-mentioned printed substrate, in the said gold layer, the content of gold is 99.7%, and the content of foreign metal is 0.3%.
Compared with prior art, the technical scheme that provides of present embodiment has the following advantages and characteristics:
In scheme provided by the invention, between electronickelling and electrogilding, increased the flow process of an electronickelling palldium alloy, so that be coated with nickel dam, Ni-Pd alloy layer and gold layer in the circuit board successively.Because Ni-Pd alloy has excellent performance, thus with Ni-Pd alloy as the intermediate layer between nickel and the gold, can reduce golden use.Therefore, the surface treatment method of printed substrate provided by the invention can reduce cost under the situation that does not influence gold layer routing performance and crocking resistance.
Description of drawings
In order to be illustrated more clearly in the present invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the flow chart of the surface treatment method of printed substrate provided by the present invention;
Fig. 2 is the sectional view that utilizes the made product of surface treatment method provided by the present invention.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The embodiment of the invention provides a kind of surface treatment method of printed substrate, mainly may further comprise the steps:
Electronickelling applies layer of metal nickel uniformly on printed substrate;
The electronickelling palldium alloy at the nickel surface of printed substrate, plates one deck Ni-Pd alloy, and in soup, fluid temperature is 60-64 ℃, and palladium ion concentration is 6-9g/L, and nickel ion concentration is 5-8g/L, and pH value is 4.6-5.8;
Electrogilding, on the Ni-Pd alloy surface of printed substrate, plating thickness is the gold layer of 0.1 μ m.
In the above-described embodiments, between electronickelling and electrogilding, increased the flow process of an electronickelling palldium alloy, so that be coated with nickel dam, Ni-Pd alloy layer and gold layer in the circuit board successively.Because Ni-Pd alloy has excellent performance, thus with Ni-Pd alloy as the intermediate layer between nickel and the gold, can reduce golden use.Therefore, the surface treatment method of printed substrate provided by the invention can reduce cost under the situation that does not influence gold layer routing performance and crocking resistance.
See also shown in Figure 1ly, shown in Figure 1 is the concrete treatment step of surface treatment method of printed substrate, comprising:
In step 10 shown in Figure 1, if for electroplating hard gold process, then be plated in the lip-deep gold layer of Ni-Pd alloy of printed substrate, the content of gold is 99.7%, the content of foreign metals such as cobalt is 0.3%; If be electroplating mild alloy technology, then be plated in the lip-deep gold layer of Ni-Pd alloy of printed substrate, the content of gold is more than 99.9%.
See also shown in Figure 2ly, shown in Figure 2, on the copper face 10 of printed substrate, be coated with nickel dam 11, Ni-Pd alloy layer 12 and gold layer 13 successively for utilizing the sectional view of the made product of above-mentioned surface treatment method.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed device of embodiment, because it is corresponding with the embodiment disclosed method, so description is fairly simple, relevant part is partly explained referring to method and is got final product.
Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments among this paper.Therefore, the present invention will can not be restricted to these embodiment shown in this paper, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (6)
1. the surface treatment method of a printed substrate is characterized in that, may further comprise the steps:
Electronickelling applies layer of metal nickel uniformly on printed substrate;
The electronickelling palldium alloy at the nickel surface of printed substrate, plates one deck Ni-Pd alloy, and in soup, fluid temperature is 60-64 ℃, and palladium ion concentration is 6-9g/L, and nickel ion concentration is 5-8g/L, and pH value is 4.6-5.8;
Electrogilding, on the Ni-Pd alloy surface of printed substrate, plating thickness is the gold layer of 0.1 μ m.
2. the surface treatment method of printed substrate according to claim 1 is characterized in that, after electronickelling, adopts water to clean the printed substrate that is coated with metallic nickel.
3. the surface treatment method of printed substrate according to claim 2 is characterized in that, after the electronickelling palldium alloy, adopts water to clean the printed substrate that is coated with Ni-Pd alloy.
4. the surface treatment method of printed substrate according to claim 3 is characterized in that, before electrogilding, carries out oil removing, washing, little erosion, washing, acidleach, washing processing successively.
5. the surface treatment method of printed substrate according to claim 1 is characterized in that, in the said gold layer, the content of gold is more than 99.9%.
6. the surface treatment method of printed substrate according to claim 1 is characterized in that, in the said gold layer, the content of gold is 99.7%, and the content of foreign metal is 0.3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201110040782 CN102098880B (en) | 2011-02-18 | 2011-02-18 | Surface processing method of PCB (printed circuit board) |
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| CN 201110040782 CN102098880B (en) | 2011-02-18 | 2011-02-18 | Surface processing method of PCB (printed circuit board) |
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| CN102098880A CN102098880A (en) | 2011-06-15 |
| CN102098880B true CN102098880B (en) | 2012-12-26 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103002666B (en) * | 2011-09-08 | 2017-07-18 | 深圳市励高表面处理材料有限公司 | A kind of method for washing of printed circuit board acidic plating nickel gold |
| CN103857206A (en) * | 2012-12-06 | 2014-06-11 | 珠海方正科技多层电路板有限公司 | Golden finger plate manufacturing method, golden finger plate and printed circuit board |
| CN104244566A (en) * | 2014-09-16 | 2014-12-24 | 深圳市布局电路有限公司 | Circuit board with nickel and palladium alloy clad layer and production method of circuit board |
| CN106711654A (en) * | 2015-07-14 | 2017-05-24 | 鸿富锦精密工业(武汉)有限公司 | Connector terminal and electroplating method thereof |
| CN105350046A (en) * | 2015-10-23 | 2016-02-24 | 衢州顺络电路板有限公司 | Circuit board for replacing golden metal strips and manufacturing method of circuit board |
| CN105657982A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Circuit board surface coating process |
| CN114900970A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI251920B (en) * | 2003-10-17 | 2006-03-21 | Phoenix Prec Technology Corp | Circuit barrier structure of semiconductor package substrate and method for fabricating the same |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |