CN102098880B - Surface processing method of PCB (printed circuit board) - Google Patents
Surface processing method of PCB (printed circuit board) Download PDFInfo
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- CN102098880B CN102098880B CN 201110040782 CN201110040782A CN102098880B CN 102098880 B CN102098880 B CN 102098880B CN 201110040782 CN201110040782 CN 201110040782 CN 201110040782 A CN201110040782 A CN 201110040782A CN 102098880 B CN102098880 B CN 102098880B
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- nickel
- gold
- circuit board
- layer
- printed circuit
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- 238000003672 processing method Methods 0.000 title description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 56
- 239000010931 gold Substances 0.000 claims abstract description 56
- 229910052737 gold Inorganic materials 0.000 claims abstract description 56
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 34
- 229910001252 Pd alloy Inorganic materials 0.000 claims abstract description 29
- 238000004381 surface treatment Methods 0.000 claims abstract description 24
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 23
- 238000009713 electroplating Methods 0.000 claims abstract description 19
- 229910001453 nickel ion Inorganic materials 0.000 claims abstract description 5
- -1 palladium ions Chemical class 0.000 claims abstract description 3
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 claims abstract 12
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000011248 coating agent Substances 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims abstract 2
- 229910052763 palladium Inorganic materials 0.000 claims abstract 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- 238000005238 degreasing Methods 0.000 claims 1
- 238000002386 leaching Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 40
- 239000010410 layer Substances 0.000 description 28
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 235000014347 soups Nutrition 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 241001657258 Pachycare flavogriseum Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002345 surface coating layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
本发明公开了一种印刷线路板的表面处理方法，主要包括以下步骤：电镀镍，在印刷线路板上均匀的涂覆一层金属镍；电镀镍钯合金，在印刷线路板的镍表面，镀上一层镍钯合金，在药液中，药液温度为60-64℃，钯离子浓度为6-9g/L，镍离子浓度为5-8g/L，PH值为4.6-5.8；电镀金，在印刷线路板的镍钯合金表面，镀上厚度为0.1μm的金层。在电镀镍和电镀金之间增加了一个电镀镍钯合金的流程，可以使在线路板上依次涂覆有镍层、镍钯合金层和金层。由于镍钯合金具有优异的性能，所以用镍钯合金作为镍和金之间的中间层，可以减少了金的使用。因此，本发明提供的方法在不影响金层打线性能和耐摩擦性能的情况下，可以降低成本。
The invention discloses a surface treatment method of a printed circuit board, which mainly includes the following steps: nickel electroplating, uniformly coating a layer of metallic nickel on the printed circuit board; electroplating nickel-palladium alloy, plating the nickel surface on the printed circuit board The upper layer of nickel-palladium alloy, in the chemical solution, the temperature of the chemical solution is 60-64°C, the concentration of palladium ions is 6-9g/L, the concentration of nickel ions is 5-8g/L, and the pH value is 4.6-5.8; electroplating gold , on the nickel-palladium alloy surface of the printed circuit board, a gold layer with a thickness of 0.1 μm is plated. An electroplating nickel-palladium alloy process is added between electroplating nickel and electroplating gold, so that the circuit board can be sequentially coated with nickel layer, nickel-palladium alloy layer and gold layer. Because nickel-palladium alloy has excellent properties, using nickel-palladium alloy as an intermediate layer between nickel and gold can reduce the use of gold. Therefore, the method provided by the present invention can reduce the cost without affecting the wire-bonding performance and friction resistance of the gold layer.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, in particular, relate to a kind of surface treatment method of printed substrate.
Background technology
The Chinese of PCB (Printed Circuit Board) is a printed substrate; On insulating substrate; By predetermined design, form printed wiring that the particular conductivity figure forms, printed component or, be one of vitals of electronics industry by the product of both be combined intos with metallic copper.Though the metallic copper of printed substrate is good components and parts solder side and electric signal transmitter; But it is oxidized easily that metallic copper exposes in air; Cupric oxide then can hinder the molten wet and electric conductivity of scolding tin; So can on copper face, apply a kind of stable material usually, for example on copper face, apply nickel dam and gold layer.Gold in surface treatment, application the most extensive, its excellent electric conductivity, contact performance, welding performance, high-temp resisting high-humidity resisting, corrosion resistance are that other metals are incomparable.
In the technology of printed substrate electronickelling gold, mainly comprise and electroplate hard gold process and electroplating mild alloy technology.
In electroplating hard gold process, mainly be on the copper face of printed substrate, to apply nickel dam and alloy-layer, in alloy-layer, foreign metals such as cobalt occupy 0.3%, and gold occupies 99.7%, and such alloy is called as hard gold.Electroplate the surface coating layer of hard gold as dynamic linker, for guaranteeing that golden face constantly not having tangible cut under the friction situation, causes nickel dam to be exposed to oxidation affects electric conductivity in the air, the thickness of gold layer generally also is more than the 0.5 μ m.Because it has certain resistance to wear, thereby has a wide range of applications at aspects such as precision instrumentation, printed circuit board, integrated circuit, shell, electric contacts.
In electroplating mild alloy technology, be on the copper face of printed substrate, to apply nickel dam and gold layer, in gold, do not add other impurity, gold content is more than 99.9%, and such gold is called as soft gold.The main purpose of electroplating mild alloy is to beat gold thread; Be that circuit with chip and printed substrate couples together, accomplish the complete of electrical property, the material of gold thread is a proof gold; The composition of Gold plated Layer also is a proof gold; Both consistences of composition have been guaranteed the stable of its connection, and in order to guarantee to beat the reliability of gold thread, the thickness of gold layer is generally more than the 0.5 μ m.
In research and practice process to prior art, inventor of the present invention finds that there is following problem in prior art:
In electroplating hard gold process and electroplating mild alloy technology; For the routing performance and hard golden anti-wear performance that guarantees soft gold; The thickness of gold layer all requires more than 0.5 μ m, because the use amount of gold is too high, so improved the cost that print circuit board surface is handled greatly.
Therefore, how to reduce the cost of print circuit board surface processing method, become the problem that needs most solution at present.
Summary of the invention
In view of this, purpose of design of the present invention is, a kind of surface treatment method of printed substrate is provided, with reduce the gold use amount, thereby reduce cost.
The embodiment of the invention is achieved in that
A kind of surface treatment method of printed substrate may further comprise the steps:
Electronickelling applies layer of metal nickel uniformly on printed substrate;
The electronickelling palldium alloy at the nickel surface of printed substrate, plates one deck Ni-Pd alloy, and in soup, fluid temperature is 60-64 ℃, and palladium ion concentration is 6-9g/L, and nickel ion concentration is 5-8g/L, and pH value is 4.6-5.8;
Electrogilding, on the Ni-Pd alloy surface of printed substrate, plating thickness is the gold layer of 0.1 μ m.
Preferably, in the surface treatment method of above-mentioned printed substrate, after electronickelling, adopt water to clean the printed substrate that is coated with metallic nickel.
Preferably, in the surface treatment method of above-mentioned printed substrate, after the electronickelling palldium alloy, adopt water to clean the printed substrate that is coated with Ni-Pd alloy.
Preferably, in the surface treatment method of above-mentioned printed substrate, before electrogilding, carry out oil removing, washing, little erosion, washing, acidleach, washing processing successively.
Preferably, in the surface treatment method of above-mentioned printed substrate, in the said gold layer, the content of gold is more than 99.9%.
Preferably, in the surface treatment method of above-mentioned printed substrate, in the said gold layer, the content of gold is 99.7%, and the content of foreign metal is 0.3%.
Compared with prior art, the technical scheme that provides of present embodiment has the following advantages and characteristics:
In scheme provided by the invention, between electronickelling and electrogilding, increased the flow process of an electronickelling palldium alloy, so that be coated with nickel dam, Ni-Pd alloy layer and gold layer in the circuit board successively.Because Ni-Pd alloy has excellent performance, thus with Ni-Pd alloy as the intermediate layer between nickel and the gold, can reduce golden use.Therefore, the surface treatment method of printed substrate provided by the invention can reduce cost under the situation that does not influence gold layer routing performance and crocking resistance.
Description of drawings
In order to be illustrated more clearly in the present invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the flow chart of the surface treatment method of printed substrate provided by the present invention;
Fig. 2 is the sectional view that utilizes the made product of surface treatment method provided by the present invention.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The embodiment of the invention provides a kind of surface treatment method of printed substrate, mainly may further comprise the steps:
Electronickelling applies layer of metal nickel uniformly on printed substrate;
The electronickelling palldium alloy at the nickel surface of printed substrate, plates one deck Ni-Pd alloy, and in soup, fluid temperature is 60-64 ℃, and palladium ion concentration is 6-9g/L, and nickel ion concentration is 5-8g/L, and pH value is 4.6-5.8;
Electrogilding, on the Ni-Pd alloy surface of printed substrate, plating thickness is the gold layer of 0.1 μ m.
In the above-described embodiments, between electronickelling and electrogilding, increased the flow process of an electronickelling palldium alloy, so that be coated with nickel dam, Ni-Pd alloy layer and gold layer in the circuit board successively.Because Ni-Pd alloy has excellent performance, thus with Ni-Pd alloy as the intermediate layer between nickel and the gold, can reduce golden use.Therefore, the surface treatment method of printed substrate provided by the invention can reduce cost under the situation that does not influence gold layer routing performance and crocking resistance.
See also shown in Figure 1ly, shown in Figure 1 is the concrete treatment step of surface treatment method of printed substrate, comprising:
In step 10 shown in Figure 1, if for electroplating hard gold process, then be plated in the lip-deep gold layer of Ni-Pd alloy of printed substrate, the content of gold is 99.7%, the content of foreign metals such as cobalt is 0.3%; If be electroplating mild alloy technology, then be plated in the lip-deep gold layer of Ni-Pd alloy of printed substrate, the content of gold is more than 99.9%.
See also shown in Figure 2ly, shown in Figure 2, on the copper face 10 of printed substrate, be coated with nickel dam 11, Ni-Pd alloy layer 12 and gold layer 13 successively for utilizing the sectional view of the made product of above-mentioned surface treatment method.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed device of embodiment, because it is corresponding with the embodiment disclosed method, so description is fairly simple, relevant part is partly explained referring to method and is got final product.
Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments among this paper.Therefore, the present invention will can not be restricted to these embodiment shown in this paper, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110040782 CN102098880B (en) | 2011-02-18 | 2011-02-18 | Surface processing method of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110040782 CN102098880B (en) | 2011-02-18 | 2011-02-18 | Surface processing method of PCB (printed circuit board) |
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| Publication Number | Publication Date |
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| CN102098880A CN102098880A (en) | 2011-06-15 |
| CN102098880B true CN102098880B (en) | 2012-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110040782 Expired - Fee Related CN102098880B (en) | 2011-02-18 | 2011-02-18 | Surface processing method of PCB (printed circuit board) |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103002666B (en) * | 2011-09-08 | 2017-07-18 | 深圳市励高表面处理材料有限公司 | A kind of method for washing of printed circuit board acidic plating nickel gold |
| CN103857206A (en) * | 2012-12-06 | 2014-06-11 | 珠海方正科技多层电路板有限公司 | Golden finger plate manufacturing method, golden finger plate and printed circuit board |
| CN104244566A (en) * | 2014-09-16 | 2014-12-24 | 深圳市布局电路有限公司 | Circuit board with nickel and palladium alloy clad layer and production method of circuit board |
| CN106711654A (en) * | 2015-07-14 | 2017-05-24 | 鸿富锦精密工业(武汉)有限公司 | Connector terminal and electroplating method thereof |
| CN105350046A (en) * | 2015-10-23 | 2016-02-24 | 衢州顺络电路板有限公司 | Circuit board for replacing golden metal strips and manufacturing method of circuit board |
| CN105657982A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Circuit board surface coating process |
| CN114900970A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI251920B (en) * | 2003-10-17 | 2006-03-21 | Phoenix Prec Technology Corp | Circuit barrier structure of semiconductor package substrate and method for fabricating the same |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
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| CN102098880A (en) | 2011-06-15 |
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| C14 | Grant of patent or utility model | ||
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| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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| CP03 | Change of name, title or address |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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