CN105350046A - Circuit board for replacing golden metal strips and manufacturing method of circuit board - Google Patents
Circuit board for replacing golden metal strips and manufacturing method of circuit board Download PDFInfo
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- CN105350046A CN105350046A CN201510702216.7A CN201510702216A CN105350046A CN 105350046 A CN105350046 A CN 105350046A CN 201510702216 A CN201510702216 A CN 201510702216A CN 105350046 A CN105350046 A CN 105350046A
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Abstract
The invention relates to a circuit board for replacing golden metal strips and a manufacturing method of the circuit board. The circuit board solves the technical problem that golden metal strips of an existing circuit board are high in cost. The method includes the following steps that firstly, a semi-finished circuit board obtained after resistance welding is pretreated; secondly, alloy electroplating is conducted on the pretreated semi-finished circuit board, at least one alloy layer is formed on the surface of a copper layer of the plug-pull connection position of the semi-finished circuit board, and then semi-finished circuit board obtained after alloy electroplating is washed through water; and thirdly, the electroplated semi-finished circuit board is polish-brushed and dried, so that the finished circuit board is obtained. The circuit board has the beneficial effects that the plug-pull connection position of the circuit board is electroplated with the alloy-plated layer; and under the condition of meeting contact resistance, the oxidation resistance and corrosion resistance of products are improved remarkably compared with a gold finger circuit board, wear resistance is improved remarkably, the application reliability of the products is higher, and manufacturing cost is lower.
Description
Technical field
The invention belongs to circuit card processing and manufacturing technical field, especially relating to a kind of wiring board for replacing golden finger and manufacture method thereof.
Background technology
The design of golden finger is widely used in the wiring board of plug type contact conducting.It requires that golden finger has strong anti-oxidant and corrosion resistance, high wear resisting property and low contact resistance.In existing golden finger wiring board manufacturing technology, be generally carry out electronickelling gold in the surface treatment procedure after welding resistance completes.Along with the application that golden finger wiring board is more extensive in the fields such as medical treatment, safety, aviation, it proposes harsher requirement to the reliability of golden finger wiring board.At present, usually strengthen reliability and the corrosion resistance of application by improving electric golden thickness, this just makes this luxurious golden finger wiring board manufacturing cost higher.Therefore, find quality more reliable, the golden finger wiring board replacement scheme that cost is cheaper just becomes the task of top priority.
In order to solve prior art Problems existing, people have carried out long-term exploration, propose solution miscellaneous.Such as, Chinese patent literature discloses a kind of method, the method manufacturing pcb board and the pcb board [application number: 201310127867.9] that improve golden finger corrosion resistance nature, the invention provides a kind of method improving golden finger corrosion resistance nature, golden finger being immersed in preset concentration is in the hole sealing agent solution of alkalescence, and golden finger is carried out direct current electrolysis treatment.Present invention also offers and a kind ofly manufacture the method for pcb board and a kind of pcb board.The present invention, by carrying out direct current electrolysis to golden finger, makes the metallic impurity in layer gold be electrolyzed to form ion-solubility in hole sealing agent solution, and the active function groups simultaneously in hole sealing agent solution forms fine and close protective layer on gold plate surface.
Such scheme is by passive metal reactive behavior, and strengthen the protection to metal, although improve the corrosion resistance nature of golden finger to a certain extent, the program still fundamentally cannot solve the problem that golden finger is high in manufacturing cost, reliability is low.
Summary of the invention
The object of the invention is for the problems referred to above, a kind of low cost of manufacture is provided, making simple for replacing the wiring board manufacture method of golden finger.
Another object of the present invention is for the problems referred to above, providing a kind of reasonable in design, replacing golden finger circuit card, the wiring board for replacing golden finger that application reliability is high.
For achieving the above object, present invention employs following technical proposal: this is for replacing the wiring board manufacture method of golden finger, and it is characterized in that, present method comprises the following steps:
A, carry out pre-treatment by completing the work in-process circuit card after welding resistance;
B, pretreated work in-process circuit card will be completed carry out alloy plating, it is made to form at least one deck alloy layer on the layers of copper surface of work in-process circuit card plug connection bit, described alloy layer is made up of at least one in chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, lead, platinum, rhodium, palladium, indium, then washes the work in-process circuit card after carrying out alloy plating;
C, the half-finished circuit board completing plating is carried out polish-brush and dries, thus obtained finished circuit board.
Actually add man-hour, by the alloy-plated layer that powers in the plug connection bit of wiring board, under the condition meeting contact resistance, it significantly improves the anti-oxidant of product and corrosion resistance to be compared to golden finger wiring board, also significantly increase wear resisting property, make product application reliability higher, manufacturing cost is lower, preferably, alloy layer here can be chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, plumbous, platinum, rhodium, palladium, the binary alloy that in indium, any one is formed can be chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, plumbous, platinum, rhodium, palladium, in indium, any two kinds of ternary alloys formed, can be chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, plumbous, platinum, rhodium, palladium, any three kinds of quad alloys formed in indium, or chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, plumbous, platinum, rhodium, palladium, any more than four kinds more than five yuan alloys formed in indium.
Above-mentioned for replacing in the wiring board manufacture method of golden finger, in above-mentioned steps B, in above-mentioned steps B, in described alloy layer, the mass fraction of chemical element copper is 5-95 part; In described alloy layer, beyond chemical element copper, the mass fraction of element is 1-95 part.
Above-mentioned for replacing in the wiring board manufacture method of golden finger, in above-mentioned steps B, the electroplating process of described alloy layer is for containing cyanogen process or without cyanogen process.
Above-mentioned for replacing in the wiring board manufacture method of golden finger, in above-mentioned steps B, the plating direct plating of described alloy layer is in layers of copper; Or, be provided with middle layer between described layers of copper and alloy layer, and described middle layer is by any one in chemical element nickel, tin and zinc or multiplely to form.Namely alloy layer plating can direct plating on copper, also at copper surface plating other metals, after nickel, tin, zinc etc., then alloy layer can be plated on these metallic surfaces.
Above-mentioned for replacing in the wiring board manufacture method of golden finger, in above-mentioned steps B, described alloy layer thickness is 25-100000nm.
Above-mentioned for replacing in the wiring board manufacture method of golden finger, the work in-process circuit card pre-treatment of described steps A comprises the following steps:
A, the half-finished circuit board completing welding resistance is carried out oil removing and washes;
B, the half-finished circuit board completing oil removing is carried out microetch and washes;
C, the half-finished circuit board completing microetch is carried out pickling and washes;
D, the half-finished circuit board completing pickling is carried out activating and washing.
Above-mentioned for replacing in the wiring board manufacture method of golden finger, in above-mentioned steps a, except oil temperature is 40-50 DEG C, the oil removing time is 4-6min; In above-mentioned steps b, microetch temperature is 25-35 DEG C, and the microetch time is 1-2min; In above-mentioned steps c, pickling temperature is 25-35 DEG C, and pickling time is 1.5-2.5min; In above-mentioned steps d, activation temperature is 25-35 DEG C, and soak time is 1.5-2.5min.
Above-mentioned for replacing in the wiring board manufacture method of golden finger, in above-mentioned steps B, electroplating temperature is 25-35 DEG C, and pH value is 10-12, and cathode current density is 1.5-2.5A/dm2; In above-mentioned steps C, polish-brush is 800-1200 order, and bake out temperature is 75-85 DEG C.
Above-mentioned for replacing in the wiring board manufacture method of golden finger, the resistivity of described alloy layer is 2-4 μ Ω cm, and the hardness of described alloy layer is 8-12GPa.
Above-mentioned obtain wiring board for replacing golden finger for the wiring board manufacture method replacing golden finger.
Compared with prior art, this advantage for the wiring board and manufacture method thereof that replace golden finger is: owing to adopting plating alloy coating in the plug connection bit of wiring board, under the condition meeting contact resistance, it significantly improves the anti-oxidant of product and corrosion resistance to be compared to golden finger wiring board, also significantly increase wear resisting property, make product application reliability higher, manufacturing cost is lower, and technique used is existing installation and material can realize.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention one.
Fig. 2 is the structural representation of the embodiment of the present invention two.
In figure, half-finished circuit board 1, alloy layer 2, layers of copper 11, middle layer 3.
Below in conjunction with the drawings and specific embodiments, the present invention will be further described in detail.
Embodiment one
As shown in Figure 1, this comprises the following steps for replacing the wiring board manufacture method of golden finger: A, carry out pre-treatment by completing the half-finished circuit board after welding resistance 1, B, pretreated half-finished circuit board 1 will be completed carry out alloy plating, its layers of copper 11 surface plugging connection bit at half-finished circuit board 1 is made to form at least one deck alloy layer 2, described alloy layer 2 is made up of at least one in chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, lead, platinum, rhodium, palladium, indium, then washes the half-finished circuit board 1 after carrying out alloy plating, C, the half-finished circuit board 1 completing plating is carried out polish-brush and dries, thus obtained finished circuit board, preferably, here alloy layer 2 can be chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, plumbous, platinum, rhodium, palladium, the binary alloy that in indium, any one is formed, can be chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, plumbous, platinum, rhodium, palladium, any two kinds of ternary alloys formed in indium, can be chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, plumbous, platinum, rhodium, palladium, any three kinds of quad alloys formed in indium, or chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, plumbous, platinum, rhodium, palladium, any more than four kinds more than five yuan alloys formed in indium.
Particularly, in above-mentioned steps B, in described alloy layer 2, the mass fraction of chemical element copper is 5-95 part; In described alloy layer 2, beyond chemical element copper, the mass fraction of element is 1-95 part, consider real cost of production, alloy layer 2 in the present embodiment can by chemical element copper, zinc and tin, and preferably, the mass fraction of the copper in the present embodiment is 60 parts, the mass fraction of zinc is 25 parts, the mass fraction of tin is 15 parts, and such as, Cu2+ content is 10g/L, Zn2+ content is 6g/L, Sn2+ content is 2g/L.In above-mentioned steps B, the electroplating process of alloy layer 2 is containing cyanogen process or without cyanogen process.Preferably, the electroplating process in the present embodiment is cyanideless electro-plating, and its process also adds inorganic and organic additive accordingly.
Further, in above-mentioned steps B, the plating direct plating of alloy layer 2 is in layers of copper 11, in above-mentioned steps B, alloy layer 2 thickness is 25-100000nm, preferably, here alloy layer thickness is 400nm, and alloy layer resistivity is 3 μ Ω cm, and alloy layer hardness is 10GPa; In above-mentioned steps B, electroplating temperature is 30 DEG C, and pH value is 11, and cathode current density is 2A/dm2; In above-mentioned steps C, polish-brush is 1000 orders, and bake out temperature is 80 DEG C.
Half-finished circuit board 1 pre-treatment of the steps A in the present embodiment comprises the following steps: a, the half-finished circuit board 1 completing welding resistance is carried out oil removing and washes; B, the half-finished circuit board 1 completing oil removing is carried out microetch and washes; C, the half-finished circuit board 1 completing microetch is carried out pickling and washes; D, the half-finished circuit board 1 completing pickling is carried out activating and washing.Preferably, in above-mentioned steps a, except oil temperature is 45 DEG C, the oil removing time is 5min; In above-mentioned steps b, microetch temperature is 30 DEG C, and the microetch time is 1.5min; In above-mentioned steps c, pickling temperature is 30 DEG C, and pickling time is 2min; In above-mentioned steps d, activation temperature is 30 DEG C, and soak time is 2min.
Above-mentioned obtain wiring board for replacing golden finger for the wiring board manufacture method replacing golden finger, actually add man-hour, by the alloy-plated layer that powers in the plug connection bit of wiring board, under the condition meeting contact resistance, it significantly improves the anti-oxidant of product and corrosion resistance to be compared to golden finger wiring board, also significantly increase wear resisting property, make product application reliability higher, manufacturing cost is lower.
Embodiment two
As shown in Figure 2, the structure of the present embodiment, principle and implementation step and embodiment one similar, different places is, when carrying out alloy layer 2 and electroplating, one deck middle layer 3 can be provided with between layers of copper 11 and alloy layer 2, and described middle layer 3 is by any one in chemical element nickel, tin and zinc or multiplely to form, namely alloy layer 2 plating can direct plating in layers of copper 11, also can at other metals of the surperficial plating of layers of copper 11, after nickel, tin, zinc etc., then alloy layer 2 is plated on these metallic surfaces.
Specific embodiment described herein is only to the explanation for example of the present invention's spirit.Those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present invention or surmount the scope that appended claims defines.
Although more employ the terms such as half-finished circuit board 1, alloy layer 2, layers of copper 11, middle layer 3 herein, do not get rid of the possibility using other term.These terms are used to be only used to describe and explain essence of the present invention more easily; The restriction that they are construed to any one additional is all contrary with spirit of the present invention.
Claims (10)
1., for replacing a wiring board manufacture method for golden finger, it is characterized in that, present method comprises the following steps:
A, carry out pre-treatment by completing the half-finished circuit board after welding resistance (1);
B, pretreated half-finished circuit board (1) will be completed carry out alloy plating, it is made to form at least one deck alloy layer (2) on layers of copper (11) surface of half-finished circuit board (1) plug connection bit, described alloy layer (2) is made up of at least one in chemical element copper and chemical element zinc, tin, nickel, cobalt, chromium, silver, gold, iron, lead, platinum, rhodium, palladium, indium, then washes the half-finished circuit board (1) after carrying out alloy plating;
C, the half-finished circuit board (1) completing plating is carried out polish-brush and dries, thus obtained finished circuit board.
2. the wiring board manufacture method for replacing golden finger according to claim 1, is characterized in that, in above-mentioned steps B, in described alloy layer (2), the mass fraction of chemical element copper is 5-95 part; In described alloy layer (2), beyond chemical element copper, the mass fraction of element is 1-95 part.
3. the wiring board manufacture method for replacing golden finger according to claim 2, is characterized in that, in above-mentioned steps B, the electroplating process of described alloy layer (2) is containing cyanogen process or without cyanogen process.
4. the wiring board manufacture method for replacing golden finger according to claim 3, is characterized in that, in above-mentioned steps B, the plating direct plating of described alloy layer (2) is in layers of copper (11); Or, be provided with middle layer (3) between described layers of copper (11) and alloy layer (2), and described middle layer (3) are by any one in chemical element nickel, tin and zinc or multiplely to form.
5. the wiring board manufacture method for replacing golden finger according to claim 4, is characterized in that, in above-mentioned steps B, described alloy layer (2) thickness is 25-100000nm.
6. the wiring board manufacture method for replacing golden finger according to claim 1 or 2 or 3 or 4 or 5, it is characterized in that, half-finished circuit board (1) pre-treatment of described steps A comprises the following steps:
A, the half-finished circuit board (1) completing welding resistance is carried out oil removing and washes;
B, the half-finished circuit board (1) completing oil removing is carried out microetch and washes;
C, the half-finished circuit board (1) completing microetch is carried out pickling and washes;
D, the half-finished circuit board (1) completing pickling is carried out activating and washing.
7. the wiring board manufacture method for replacing golden finger according to claim 6, is characterized in that, in above-mentioned steps a, except oil temperature is 40-50 DEG C, the oil removing time is 4-6min; In above-mentioned steps b, microetch temperature is 25-35 DEG C, and the microetch time is 1-2min; In above-mentioned steps c, pickling temperature is 25-35 DEG C, and pickling time is 1.5-2.5min; In above-mentioned steps d, activation temperature is 25-35 DEG C, and soak time is 1.5-2.5min.
8. the wiring board manufacture method for replacing golden finger according to claim 6, is characterized in that, in above-mentioned steps B, electroplating temperature is 25-35 DEG C, and pH value is 10-12, and cathode current density is 1.5-2.5A/dm2; In above-mentioned steps C, polish-brush is 800-1200 order, and bake out temperature is 75-85 DEG C.
9. the wiring board manufacture method for replacing golden finger according to claim 6, is characterized in that, the resistivity of described alloy layer (2) is 2-4 μ Ω cm, and the hardness of described alloy layer (2) is 8-12GPa.
10. according to obtaining wiring board for replacing golden finger for the wiring board manufacture method replacing golden finger in claim 1-9 described in any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510702216.7A CN105350046A (en) | 2015-10-23 | 2015-10-23 | Circuit board for replacing golden metal strips and manufacturing method of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510702216.7A CN105350046A (en) | 2015-10-23 | 2015-10-23 | Circuit board for replacing golden metal strips and manufacturing method of circuit board |
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Cited By (5)
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| CN106604538A (en) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | Flexible circuit board and preparing method thereof |
| CN106784026A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of solar cell wiring board and preparation method thereof |
| CN106757209A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of method of the chemical nickel plating palldium alloy for wiring board |
| CN110214203A (en) * | 2017-01-30 | 2019-09-06 | 三菱综合材料株式会社 | Terminal for connector material and terminal and wire terminations portion structure |
| WO2023065341A1 (en) * | 2021-10-22 | 2023-04-27 | 京东方科技集团股份有限公司 | Light-emitting substrate and display device |
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