CN106784026A - A kind of solar cell wiring board and preparation method thereof - Google Patents
A kind of solar cell wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN106784026A CN106784026A CN201611146604.2A CN201611146604A CN106784026A CN 106784026 A CN106784026 A CN 106784026A CN 201611146604 A CN201611146604 A CN 201611146604A CN 106784026 A CN106784026 A CN 106784026A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- solar cell
- wiring board
- cell wiring
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000011889 copper foil Substances 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 16
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 239000011651 chromium Substances 0.000 claims description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- -1 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000012752 auxiliary agent Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 claims description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000000470 constituent Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000005029 tin-free steel Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02021—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a kind of solar cell wiring board and preparation method thereof, including：Solar battery sheet and resin base material, are coated with adhesive layer on resin base material, Copper Foil is compounded with adhesive layer, and etching forms circuit on Copper Foil, and the surface of circuit is coated with anti-oxidation coating；Circuit is engaged with solar battery sheet by low temperature scolding tin.The solar cell wiring board is prepared simply, and has preferable inoxidizability and solderability in the presence of a harsh environment.
Description
Technical field
The present invention relates to technical field of solar batteries, more particularly to a kind of solar cell wiring board and its preparation side
Method.
Background technology
Solar energy is a kind of clean and environment-friendly energy of new renewable sustainable use, and development and utilization solar energy turns into
The important content of the strategy of sustainable development is formulated in countries in the world, and is also preferably research contents using solar energy, improves the sun
The generating efficiency of energy is also important research topic.
The content of the invention
It is an object of the invention to propose a kind of solar cell wiring board and preparation method thereof, have in the presence of a harsh environment
Preferable inoxidizability and solderability.
It is that, up to this purpose, the present invention uses following technical scheme：
A kind of solar cell wiring board, including：Solar battery sheet and resin base material, are coated with the resin base material
Adhesive layer, is compounded with Copper Foil on the adhesive layer, etching forms circuit on the Copper Foil, and the surface of the circuit is coated with anti-
Oxide coating；The circuit is engaged with the solar battery sheet by low temperature scolding tin.
Wherein, Zn content is 0.5~25mg/m in the anti-oxidation coating2, nickel content be 0.5~10mg/m2, chromium content
It is 0.5~8mg/m2。
Wherein, the adhesive layer includes the component of following weight portion：20~100 parts of resin；1~5 part of curing agent；Auxiliary agent
0.1~0.5 part；0.1~0.5 part of filler；5~10 parts of solvent；The thickness of the adhesive layer is 8~20 μm.
Wherein, the resin is the mixing of one or more in polyurethane, epoxy resin, acrylic resin.
Wherein, the resin base material be PEN (PEN), polyethylene terephthalate (PET),
The mixing of one or more in polyimides (PI)；The thickness of the resin base material is 45~125um.
Wherein, the thickness of the Copper Foil is 10~45um.
The Copper Foil carried out microetch treatment before etching forms the circuit.
A kind of preparation method of above-mentioned solar cell wiring board, comprises the following steps：
Step A：Adhesive is prepared, even spread adhesive forms after adhesive layer composite copper foil and ripe on the resin base material
Change forms flexible copper-clad plate；
Step B：Smooth surface (S faces) to the Copper Foil in the step A carries out microetch treatment, is prevented with the Copper Foil for removing Copper Foil
Sheath, exposes Copper Foil basic unit；
Step C：Copper Foil after being processed through the step B is etched to form circuit, is cleaned and is dried；
Step D：Anti-oxidation coating is electroplated on circuit in the step C；
Step E：Circuit after being processed through the step D is engaged with solar battery sheet by low temperature scolding tin.
Wherein, the Copper Foil in the step B etches 30s~60s in concentration is sulfuric acid-hydrogen peroxide micro etching solution.
Wherein, the Copper Foil in the step C is through the dry film post-exposure of fitting, development, in the chlorination that concentration is 200~300g/L
It is etched in iron etching solution, etch process parameters are：Temperature is 40~60 DEG C, and pressure is 1.5~3kg/cm2, etching period
It is 2~4min.
Beneficial effects of the present invention are：The present invention proposes a kind of solar cell wiring board and preparation method thereof, prepares letter
It is single, and there is preferable inoxidizability and solderability in the presence of a harsh environment.
Brief description of the drawings
Fig. 1 is the structural representation that a kind of solar cell wiring board that the present invention is provided connects solar battery sheet；
Fig. 2 a are a kind of structural representations of solar cell wiring board that the present invention is provided；
Fig. 2 b are the A-A sectional views in Fig. 2 a；
Fig. 2 c are a kind of solar cell wiring board in Fig. 2 a structural representations before the etch；
Fig. 2 d are a kind of structural representation of solar cell wiring board in Fig. 2 c after microetch；
Fig. 2 e are a kind of structural representation of solar cell wiring board in Fig. 2 d after dry film of fitting；
Fig. 2 f are a kind of structural representation of solar cell wiring board in Fig. 2 e after circuit is etched；
Fig. 2 g are a kind of structural representation of solar cell wiring board in Fig. 2 f after dry film is peeled off；
Fig. 2 h are a kind of structure of solar cell wiring board in Fig. 2 g after Copper Foil plates anti-oxidation coating
Schematic diagram.
In figure：1- solar cell wiring boards；2- resin base materials；3- circuits；41- Copper Foils basic unit；42- Copper Foil overcoats；
4- Copper Foils；5- dry films；6- adhesive layers；The anti-oxidation coating of 7-；8- solar battery sheets.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
As shown in Figure 1, Figure 2 shown in a and Fig. 2 b, a kind of solar cell wiring board 1 proposed by the present invention, including：Solar-electricity
Pond piece 8 and resin base material 2, are coated with adhesive layer 6 on resin base material 2, Copper Foil 4 is compounded with adhesive layer 6, are lost on Copper Foil 4
Form circuit 3 quarter, the surface of circuit 3 is coated with anti-oxidation coating 7；Circuit 3 is engaged with solar battery sheet 8 by low temperature scolding tin.
The solar cell wiring board 1 has preferable inoxidizability and solderability in the presence of a harsh environment.
Embodiment
In the present embodiment, resin base material 2 is polyethylene terephthalate (PET), in thickness gathering to benzene for 50um
The adhesive that 8um is coated with naphthalate (PET) forms adhesive layer 6, then 20um Copper Foils are combined on adhesive layer 6
4, form flexible copper-clad plate through curing.As shown in Figure 2 c.Wherein, Copper Foil 4 includes Copper Foil basic unit 41 and for preventing Copper Foil basic unit
The Copper Foil overcoat 42 of 41 oxidations, wherein, in Copper Foil overcoat 42：Zn content is 33.68mg/m2, nickel content be 11.79mg/
m2, chromium content 7.2mg/m2.The thickness of flexible copper-clad plate is 78um, TD=340mm, MD=340mm.
It is 4 samples of 170mm*170mm by the cutting of above-mentioned flexible copper-clad plate, these samples is labeled as：Sample 1, sample
Product 2, sample 3 and sample 4.By sample 1,3 three samples of sample 2 and sample etched in sulfuric acid-hydrogen peroxide micro etching solution 30s~
Taken out after 60s, cleaned up with clear water, the Copper Foil overcoat 42 of Copper Foil 4 is etched away, expose Copper Foil basic unit 41, such as schemed
Shown in 2d.It is whether complete to judge its Copper Foil overcoat 42 with EDS testers determination sample 1, sample 2 and the constituent content of sample 3
Etch away entirely.
To be again exposed after above-mentioned 4 samples laminating 40um dry films 5, developed, then be 2KG/cm in temperature 50 C pressure2
Taken out after etching 3min during concentration is 250mol/L iron chloride etching solutions down, to etch circuit 3, clean dry with clear water
Only, 4 170mm*170mm samples are obtained.Wherein, the structure of sample 1, sample 2 and sample 3 is as shown in Figure 2 e.
By above-mentioned 4 samples carry out peel off the operation of dry film 5, wherein, sample 4 etch and peel off dry film 5 during, its
Constituent content loss in Copper Foil overcoat 42, is reduced to：Zn content 26.35mg/m2, nickel content 10.41mg/m2, chromium content
5.01mg/m2.Above-mentioned sample 1 by etching process, sample 2 and sample 3 are electroplated by anti-oxidation treatment trough, is formed
Anti-oxidation coating 7, makes in anti-oxidation coating 7 each element amount respectively in following scope：Zinc-plated amount 0mg/m2, 0.5mg/m2~
10mg/m2, 10mg/m2~20mg/m2；Nickel plating amount 0mg/m2, 0.5mg/m2~5mg/m2, 5mg/m2~10mg/m2；Tin Free Steel
0mg/m2, 0.5mg/m2~3mg/m2, 3mg/m2~5mg/m2.By the constituent content of the anti-oxidation coating 7 of EDS measurements determinations.
Structure of sample 1, sample 2 and sample 3 is as shown in Fig. 2 f to Fig. 2 h during this.
Above-mentioned 4 samples and raw sample are cut to the size of 5cm*5cm, are 42%, bi content by being coated with Theil indices
57%, silver 1% low temperature tin cream at 160 DEG C~180 DEG C heating and melting, 4 samples of visual observations can solderability.Again will be upper
Stating 4 samples and raw sample carries out 85 DEG C, the aging 24h tests of 85%RH, estimates oxygen-proof property and scolding tin adherence.
Above-mentioned raw sample and sample 1 to the testing result of the solderability, oxygen-proof property and scolding tin adherence of sample 4 see below
Table：
| Project | Anti-oxidation coating constituent content (mg/m2) | Solderability | Oxygen-proof property | Scolding tin adherence |
| Sample 1 | Zn=0, Ni=0, Cr=0 | It is excellent | Difference | It is excellent |
| Sample 2 | Zn=8.12, Ni=4.76, Cr=2.96 | It is excellent | Well | It is excellent |
| Sample 3 | Zn=18.56, Ni=9.29, Cr=4.19 | Well | Well | Well |
| Sample 4 | Zn=26.35, Ni=10.41, Cr=5.01 | Difference | It is excellent | Difference |
| Raw sample | Zn=33.68, Ni=11.79, Cr=7.2 | Difference | It is excellent | Difference |
From the above, it is seen that a kind of solar cell wiring board proposed by the present invention, prepares simply, and in severe ring
There is preferable inoxidizability and solderability under border.In addition, the FPC passes through scolding tin by solar battery sheet 8 and circuit
3 engagements, can both improve heat sinking function, internal resistance reduced, also with fine oxygen-proof property and processability.
Know-why of the invention is described above in association with specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and can not by any way be construed to limiting the scope of the invention.Based on explanation herein, the technology of this area
Personnel associate other specific embodiments of the invention by would not require any inventive effort, these modes fall within
Within protection scope of the present invention.
Claims (10)
1. a kind of solar cell wiring board, it is characterised in that including：Solar battery sheet (8) and resin base material (2), it is described
Adhesive layer (6) is coated with resin base material (2), Copper Foil (4) is compounded with the adhesive layer (6), lost on the Copper Foil (4)
Form circuit (3) quarter, the surface of the circuit (3) is coated with anti-oxidation coating (7)；The circuit (3) and the solar cell
Piece (8) is engaged by low temperature scolding tin.
2. a kind of solar cell wiring board according to claim 1, it is characterised in that in the anti-oxidation coating (7)
Zn content is 0.5~25mg/m2, nickel content be 0.5~10mg/m2, chromium content be 0.5~8mg/m2。
3. a kind of solar cell wiring board according to claim 1, it is characterised in that the adhesive layer (6) includes
The component of following weight portion：20~100 parts of resin；1~5 part of curing agent；0.1~0.5 part of auxiliary agent；0.1~0.5 part of filler；It is molten
5~10 parts of agent；The thickness of the adhesive layer (6) is 8~20 μm.
4. a kind of solar cell wiring board according to claim 3, it is characterised in that the resin is polyurethane, ring
The mixing of one or more in oxygen tree fat, acrylic resin.
5. a kind of solar cell wiring board according to claim 1, it is characterised in that the resin base material (2) is poly-
In (ethylene naphthalate) (PEN), polyethylene terephthalate (PET), polyimides (PI) one or more
Mixing；The thickness of the resin base material (2) is 45~125um.
6. a kind of solar cell wiring board according to claim 1, it is characterised in that the thickness of the Copper Foil (4) is
10~45um.
7. a kind of solar cell wiring board according to claim 1 and 2, it is characterised in that the Copper Foil (4) is in etching
Microetch treatment is carried out before forming the circuit (3).
8. a kind of preparation method of solar cell wiring board of claim 1 is used for, it is characterised in that comprised the following steps：
Step A：Adhesive is prepared, even spread adhesive forms adhesive layer (6) composite copper foil afterwards on resin base material (2)
(4) and curing form flexible copper-clad plate；
Step B：Top surface to the Copper Foil (4) in the step A carries out microetch treatment, is protected with the Copper Foil for removing Copper Foil (4)
Layer (42), exposes Copper Foil basic unit (41)；
Step C：Copper Foil (4) after being processed through the step B is etched to mold to form circuit (3), is cleaned and is dried；
Step D：Anti-oxidation coating (7) is electroplated on circuit (3) in the step C；
Step E：Circuit (3) after being processed through the step D is engaged with solar battery sheet (8) by low temperature scolding tin.
9. a kind of preparation method of solar cell wiring board according to claim 8, it is characterised in that the step B
In Copper Foil (4) 30s~60s is etched in sulfuric acid-hydrogen peroxide micro etching solution.
10. a kind of preparation method of solar cell wiring board according to claim 8, it is characterised in that the step C
In Copper Foil (4) through fit dry film (5) post-exposure, development, lost in the iron chloride etching solution that concentration is 200~300g/L
Carve, etch process parameters are：Temperature is 40~60 DEG C, and pressure is 1.5~3kg/cm2, etching period is 2~4min.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611146604.2A CN106784026A (en) | 2016-12-13 | 2016-12-13 | A kind of solar cell wiring board and preparation method thereof |
| PCT/CN2017/109777 WO2018107922A1 (en) | 2016-12-13 | 2017-11-07 | Solar cell circuit board and preparation method therefor, and solar cell |
| JP2018600028U JP3224280U (en) | 2016-12-13 | 2017-11-07 | Solar cell substrate and solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611146604.2A CN106784026A (en) | 2016-12-13 | 2016-12-13 | A kind of solar cell wiring board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106784026A true CN106784026A (en) | 2017-05-31 |
Family
ID=58880684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611146604.2A Pending CN106784026A (en) | 2016-12-13 | 2016-12-13 | A kind of solar cell wiring board and preparation method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3224280U (en) |
| CN (1) | CN106784026A (en) |
| WO (1) | WO2018107922A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107325489A (en) * | 2017-08-14 | 2017-11-07 | 通威太阳能（安徽）有限公司 | A kind of anticorrosion epoxy novolac glue and its application in battery dies etching technique |
| WO2018107922A1 (en) * | 2016-12-13 | 2018-06-21 | 苏州城邦达力材料科技有限公司 | Solar cell circuit board and preparation method therefor, and solar cell |
| WO2018107924A1 (en) * | 2016-12-13 | 2018-06-21 | 苏州城邦达力材料科技有限公司 | Flexible circuit board and preparation method, and solar photovoltaic assembly |
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| CN106784026A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of solar cell wiring board and preparation method thereof |
-
2016
- 2016-12-13 CN CN201611146604.2A patent/CN106784026A/en active Pending
-
2017
- 2017-11-07 WO PCT/CN2017/109777 patent/WO2018107922A1/en active Application Filing
- 2017-11-07 JP JP2018600028U patent/JP3224280U/en active Active
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| CN101374388A (en) * | 2008-03-28 | 2009-02-25 | 苏陟 | Method for preparing fine line flexible circuit board with high peeling strength |
| CN102265711A (en) * | 2008-12-26 | 2011-11-30 | 吉坤日矿日石金属株式会社 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018107922A1 (en) * | 2016-12-13 | 2018-06-21 | 苏州城邦达力材料科技有限公司 | Solar cell circuit board and preparation method therefor, and solar cell |
| WO2018107924A1 (en) * | 2016-12-13 | 2018-06-21 | 苏州城邦达力材料科技有限公司 | Flexible circuit board and preparation method, and solar photovoltaic assembly |
| CN107325489A (en) * | 2017-08-14 | 2017-11-07 | 通威太阳能（安徽）有限公司 | A kind of anticorrosion epoxy novolac glue and its application in battery dies etching technique |
| CN107325489B (en) * | 2017-08-14 | 2019-07-16 | 通威太阳能（安徽）有限公司 | A kind of anticorrosion epoxy-phenol glue and its application in battery dies etching technique |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018107922A1 (en) | 2018-06-21 |
| JP3224280U (en) | 2019-12-12 |
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Application publication date: 20170531 |