JP3224280U - Solar cell substrate and solar cell - Google Patents

Abstract

A solar cell substrate and a solar cell are provided. The solar cell includes a solar cell (8) and a resin substrate (2), an adhesive layer is applied on the resin substrate (2), a copper foil is composited on the adhesive layer, and the copper foil is etched. Then, a line 3 is formed, an antioxidant plating layer is formed on the surface of the line 3 by plating, and the line 3 and the solar cell 8 are joined by low-temperature solder. [Selection diagram] Fig. 1

Description

The present invention is filed with the Chinese Patent Office on December 13, 2016 and claims the priority of a Chinese patent application having an application number of 2016111466044.2 and the name of “substrate for solar cell and manufacturing method thereof”. The entire contents of which are incorporated herein by reference.

The present invention relates to the technical field of solar cells, and more particularly to a substrate for solar cells and a method for manufacturing the same.

Since solar energy is a renewable and sustainable new eco-energy, the development and use of solar energy has become an important content when countries around the world have a sustainable development strategy. In addition, making better use of solar energy has become a research topic, and how to improve the power generation efficiency by solar energy has become an important research subject.

An object of this invention is to provide the board | substrate for solar cells which has the outstanding oxidation resistance and weldability also in the severe environment, and its manufacturing method.

In order to achieve the above object, the present invention employs the following technical solution.

The substrate for solar cells includes a solar battery cell and a resin base material, an adhesive layer is applied on the resin base material, a copper foil is combined on the adhesive layer, and the copper foil is etched. A line is formed, an anti-oxidation plating layer is formed by plating on the surface of the line, and the line and the solar battery cell are joined by low-temperature solder.

The low temperature solder is bismuth or indium solder, and the melting point temperature is 95 ° C to 135 ° C.

Preferably, in the antioxidant plating layer, the zinc content is 0.5 to 25 mg / m ² , the nickel content is 0.5 to 10 mg / m ² , and the chromium content is 0.5. it is a ~8mg / ^{m 2.}

Preferably, the adhesive layer comprises 20 to 100 parts by weight of resin, 1 to 5 parts by weight of curing agent, 0.1 to 0.5 parts by weight of auxiliary agent, 0.1 to 0.5 parts by weight of filler, and 5 to 5 parts of solvent. Contains 10 parts by weight.

The thickness of the adhesive layer is 8 to 20 μm, preferably 8 to 16 μm, and more preferably 8 to 13 μm. The solvent is water or alcohols.

Preferably, the resin is one or a mixture of several of polyester, epoxy resin, and acrylic resin.

Preferably, the resin base material is one or a mixture of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyimide (PI). The resin base material has a thickness of 45 to 125 μm, preferably 50 to 100 μm, and more preferably 50 to 80 μm.

Preferably, the copper foil has a thickness of 10 to 45 μm, preferably 15 to 42 μm, and more preferably 18 to 40 μm.

Preferably, a micro-etching process is performed on the copper foil before forming the line by etching.

The method for producing the solar cell substrate is as follows:
Copper foil (4) of a flexible copper-clad board provided with the said copper foil (4) compounded on the said resin base material (2) through the said resin base material (2) and the said adhesive bond layer (6). And the step of forming the line (3) by etching;
Forming the antioxidant plating layer (7) by electroplating on the line (3);
Joining the line (3) on which the antioxidation plating layer (7) is formed by electroplating and the solar battery cell (8) with low-temperature solder.

Preferably, the flexible copper is formed by applying an adhesive uniformly on the resin base material (2) to form the adhesive layer (6), and then compounding and aging the copper foil (4). A tension plate is formed.

Preferably, before the line (3) is formed by etching on the copper foil (4), a micro-etching process is performed on the upper surface of the copper foil (4).

Preferably, the micro-etching treatment is to put the copper foil (4) in a sulfuric acid-hydrogen peroxide micro-etching solution and perform etching for 30 to 60 seconds, preferably 40 to 55 seconds, more preferably 40 to 50 seconds.

Preferably, the line (3) is washed and dried before the oxidation plating layer (7) is formed on the line (3) by electroplating. When the antioxidant plating layer (7) is formed by electroplating by washing and drying, it can adhere well to the surface, and the electroplating effect is better.

Preferably, in the step of forming the line (3) by etching on the copper foil (4), a dry film (5) is attached to the copper foil (4), and then exposure and development are performed. Etching with an etchant is performed.

Preferably, the concentration of the ferric chloride etchant is 200 to 300 g / L.

Preferably, the etching temperature is 40 to 60 ° C. and the pressure is 1.5 to 3 kg / cm ² . If it is in the range of the said temperature and pressure, a good etching effect will be acquired.

Preferably, the etching time is 2 to 4 minutes.

The method for producing the solar cell substrate is as follows.
A process for producing an adhesive, forming an adhesive layer by uniformly applying an adhesive on a resin base material, and then aging the composite with copper foil to form a flexible copper-clad plate; and
A micro-etching process is performed on the light smooth surface (S surface) of the copper foil in the step A, the copper foil cover layer of the copper foil is removed, and the copper foil base layer is exposed,
Forming a line by etching on the copper foil after the process B, washing and drying;
Forming an antioxidation plating layer by electroplating on the line in the step C; and
And a step E of joining the line after processing in the step D and the solar battery cell with a low-temperature solder.

Preferably, the copper foil in the step B is put in a sulfuric acid-hydrogen peroxide microetching solution and etched for 30 to 60 s.

Preferably, after a dry film is attached to the copper foil in the step C, exposure and development are performed, and etching is performed on a ferric chloride etchant having a concentration of 200 to 300 g / L. The etching process parameters are a temperature of 40 to 60 ° C., a pressure of 1.5 to 3 kg / cm ² , and an etching time of 2 to 4 min.

This invention provides a solar cell provided with said board | substrate for solar cells.

The present invention provides a substrate for a solar cell and a method for manufacturing the same, which is easy to manufacture and has excellent oxidation resistance and weldability even in a harsh environment.

Hereinafter, in order to explain a specific embodiment of the present invention or a technical solution of the prior art more clearly, drawings necessary for describing the specific embodiment or the technical solution of the prior art will be briefly described. The following drawings are only some of the embodiments of the present invention, and those skilled in the art should understand that other drawings can be obtained from these drawings without creative labor. is there.

It is a structure schematic diagram of the state by which the photovoltaic cell is connected to the board | substrate for solar cells provided by this invention. It is a structure schematic diagram of the substrate for solar cells provided by the present invention. It is AA sectional drawing in FIG. 2a. It is the structure schematic before the board | substrate for solar cells in FIG. 2a is etched. It is the structure schematic diagram after the board | substrate for solar cells in FIG. 2c was micro-etched. It is a structure schematic diagram after a dry film was affixed on the board | substrate for solar cells in FIG. 2d. It is a structure schematic diagram after the circuit | line was formed in the board | substrate for solar cells in FIG. 2e by an etching. It is a structure schematic diagram after peeling a dry film from the board | substrate for solar cells in FIG. 2f. It is a structure schematic diagram after the antioxidant plating layer was plated on the copper foil of the board | substrate for solar cells in FIG. 2g.

The technical solution of the present invention will be described below clearly and completely with reference to the drawings. It should be understood that the described embodiments are only some embodiments of the present invention and not all embodiments. All other embodiments obtained by a person skilled in the art without creative labor based on the embodiments of the present invention fall within the protection scope of the present invention.

As shown in FIGS. 1, 2 a, and 2 b, a solar cell substrate 1 provided by the present invention includes solar cells 8 and a resin base material 2, and an adhesive layer 6 is formed on the resin base material 2. The copper foil 4 is composited on the adhesive layer 6, the line 3 is formed by etching on the copper foil 4, and the antioxidant plating layer 7 is formed by plating on the surface of the line 3. The cell 8 is configured to be joined with low-temperature solder. By joining the solar cell 8 and the line 3 with solder, the heat dissipation performance is improved, the internal resistance is reduced, and the oxidation resistance and workability are improved, so that the oxidation resistance is excellent even in harsh environments. And the board | substrate 1 for solar cells which has weldability was formed.

Example 1
In this embodiment, the resin substrate 2 is made of polyethylene terephthalate (PET). An adhesive layer 6 is formed by applying an adhesive of 8 μm to polyethylene terephthalate (PET) having a thickness of 50 μm, and then a copper foil 4 of 20 μm is combined on the adhesive layer 6 and aging. A tension plate is formed. As shown in FIG. 2 c, the copper foil 4 includes a copper foil base layer 41 and a copper foil cover layer 42 for preventing the copper foil base layer 41 from being oxidized. In the copper foil cover layer 42 is 33.68mg / ^{m 2} content of zinc, the nickel content is 11.79mg / ^{m 2,} the content of chromium is 7.2 mg / ^{m 2.} The thickness of the flexible copper-clad plate is 78 μm, TD = 340 mm, MD = 340 mm.

The adhesive layer 6 contains 50 parts by weight of a resin that is polyester, 3 parts by weight of a curing agent, 0.3 part by weight of an auxiliary agent, 0.3 part by weight of a filler, and 7 parts by weight of a solvent.

The flexible copper-clad plate is cut into four 170 mm × 170 mm samples. These samples are shown as Sample 1, Sample 2, Sample 3 and Sample 4, respectively. Three samples, Sample 1, Sample 2 and Sample 3, are put into a sulfuric acid-hydrogen peroxide microetching solution, etched for 45 s, and then removed and cleaned cleanly with pure water. As a result, as shown in FIG. 2d, the copper foil cover layer 42 of the copper foil 4 is removed by etching, and the copper foil base layer 41 is exposed. In order to determine whether or not the copper foil cover layer 42 has been completely removed by etching, the element contents of Sample 1, Sample 2 and Sample 3 are measured with an EDS measuring apparatus.

After the 40 μm dry film 5 is attached to the above four samples, exposure and development are performed, and further, a ferric chloride etching solution having a concentration of 250 mol / L at a temperature of 50 ° C. and a pressure of ² KG / cm ^2. Etching is performed for 3 minutes, and then the line 3 is formed by etching. Thereafter, the sample is cleanly washed with pure water and dried to form four 170 mm × 170 mm samples. The configuration of sample 1, sample 2 and sample 3 is shown in FIG. 2e.

A process of peeling the dry film 5 is performed on the four samples. In the sample 4, in the process of etching and peeling of the dry film 5, the element content in the copper foil cover layer 42 is lost, the zinc content is 26.35 mg / m ² , and the nickel content is 10. 41 mg / m ² , chromium content is reduced to 5.01 mg / m ² . The anti-oxidation plating layer 7 is formed by performing electroplating with the anti-oxidation treatment groove on the sample 1, the sample 2, and the sample 3 subjected to the above etching treatment. Regarding the amount of each element in the antioxidant plating layer 7 of Sample 1, Sample 2 and Sample 3, the zinc plating amount is 0 mg / m ² , 2 mg / m ² and 15 mg / m ² respectively, and the nickel plating amount is 0 mg / m ² respectively. m ² , 1 mg / m ² , and 8 mg / m ² , and the chrome plating amounts are 0 mg / m ² , 2 mg / m ² , and 4 mg / m ² , respectively. The element content of the antioxidant plating layer 7 is measured by EDS measurement. In the above process, the configurations of Sample 1, Sample 2 and Sample 3 are shown in FIGS. 2f to 2h.

Example 2
In this embodiment, the resin base material 2 is made of polyethylene naphthalate (PEN). An adhesive layer 6 is formed by applying a 20 μm adhesive to polyethylene naphthalate (PEN) having a thickness of 45 μm, then a 10 μm copper foil 4 is combined on the adhesive layer 6 and aging, and then flexible. A copper-clad plate is formed. The copper foil 4 includes a copper foil base layer 41 and a copper foil cover layer 42 for preventing the copper foil base layer 41 from being oxidized. In the copper foil cover layer 42 is 33.68mg / ^{m 2} content of zinc, the nickel content is 11.79mg / ^{m 2,} the content of chromium is 7.2 mg / ^{m 2.} The thickness of the flexible copper-clad plate is 75 μm, and TD = 340 mm and MD = 340 mm.

The adhesive layer 6 contains 20 parts by weight of an epoxy resin, 1 part by weight of a curing agent, 0.1 part by weight of an auxiliary agent, 0.1 part by weight of a filler, and 5 parts by weight of a solvent.

The flexible copper-clad plate is cut into four 170 mm × 170 mm samples. These samples are put into a sulfuric acid-hydrogen peroxide microetching solution, etched for 30 s and then taken out and cleaned cleanly with pure water. As a result, the copper foil cover layer 42 of the copper foil 4 is removed by etching, and the copper foil base layer 41 is exposed. In order to determine whether or not the copper foil cover layer 42 has been completely removed by etching, the element contents of the four samples are measured with an EDS measuring apparatus.

After the 40 μm dry film 5 was attached to the above four samples, exposure and development were performed, and further, ferric chloride having a concentration of 200 mol / L at a temperature of 40 ° C. and a pressure of 1.5 KG / cm ² . Etching with an etchant is performed after 2 minutes, and then the line 3 is formed by etching. Thereafter, the sample is cleaned cleanly with pure water to form four 170 mm × 170 mm samples.

A process of peeling the dry film 5 is performed on the four samples. Antioxidation plating layer 7 is formed by performing electroplating with the antioxidation treatment groove on the above four samples subjected to the etching treatment. Regarding the amount of each element in the antioxidant plating layer 7, the zinc plating amount is 0 mg / m ² , 0.5 mg / m ² , 10 mg / m ² , 20 mg / m ² , and the nickel plating amount is 0 mg / m ^2, respectively. 0.5 mg / m ² , 5 mg / m ² , and 10 mg / m ² , and the chrome plating amounts are 0 mg / m ² , 0.5 mg / m ² , 3 mg / m ² , and 5 mg / m ² , respectively. The element content of the antioxidant plating layer 7 is measured by EDS measurement.

Example 3
In this embodiment, the resin base material 2 is made of polyimide (PI). A 12 μm adhesive is applied to polyimide (PI) having a thickness of 45 μm to form an adhesive layer 6, and then a 45 μm copper foil 4 is combined on the adhesive layer 6 and aged, and then flexible copper-clad A board is formed. The copper foil 4 includes a copper foil base layer 41 and a copper foil cover layer 42 for preventing the copper foil base layer 41 from being oxidized. In the copper foil cover layer 42 is 33.68mg / ^{m 2} content of zinc, the nickel content is 11.79mg / ^{m 2,} the content of chromium is 7.2 mg / ^{m 2.} The thickness of the flexible copper-clad plate is 102 μm, TD = 340 mm, MD = 340 mm.
The adhesive layer 6 contains 100 parts by weight of an acrylic resin, 5 parts by weight of a curing agent, 0.5 parts by weight of an auxiliary agent, 0.5 parts by weight of a filler, and 10 parts by weight of a solvent.

The flexible copper-clad plate is cut into four 170 mm × 170 mm samples. These samples are put in a sulfuric acid-hydrogen peroxide microetching solution, etched for 60 s, taken out, and cleaned cleanly with pure water. As a result, the copper foil cover layer 42 of the copper foil 4 is removed by etching, and the copper foil base layer 41 is exposed. In order to determine whether or not the copper foil cover layer 42 has been completely removed by etching, the element contents of the four samples are measured with an EDS measuring apparatus.

After the 40 μm dry film 5 was attached to the above four samples, exposure and development were performed, and further, ferric chloride having a concentration of 200 mol / L at a temperature of 60 ° C. and a pressure of 1.5 KG / cm ² . Etching with an etching solution is performed for 4 minutes, and then the line 3 is formed by etching. Thereafter, the sample is cleaned cleanly with pure water to form four 170 mm × 170 mm samples.

A process of peeling the dry film 5 is performed on the four samples. Antioxidation plating layer 7 is formed by performing electroplating with the antioxidation treatment groove on the above four samples subjected to the etching treatment. Regarding the amount of each element in the antioxidant plating layer 7, the zinc plating amount is 0.6 mg / m ² , 0.9 mg / m ² , 8 mg / m ² , 15 mg / m ² , respectively, and the nickel plating amount is 0. 6 mg / m ² , 0.9 mg / m ² , 2 mg / m ² and 8 mg / m ² , and the chrome plating amounts are 0.9 mg / m ² , 1 mg / m ² , 2 mg / m ² and 4 mg / m ^{2, respectively.} It is. The element content of the antioxidant plating layer 7 is measured by EDS measurement.

Example 4
In this embodiment, the resin base material 2 is made of polyimide (PI). An adhesive layer 6 is formed by applying an adhesive of 15 μm to polyimide (PI) having a thickness of 100 μm, and then a copper foil 4 of 18 μm is combined on the adhesive layer 6 and aged, and then flexible copper-clad A board is formed. The copper foil 4 includes a copper foil base layer 41 and a copper foil cover layer 42 for preventing the copper foil base layer 41 from being oxidized. In the copper foil cover layer 42 is 33.68mg / ^{m 2} content of zinc, the nickel content is 11.79mg / ^{m 2,} the content of chromium is 7.2 mg / ^{m 2.} The thickness of the flexible copper-clad plate is 133 μm, TD = 340 mm, MD = 340 mm.
The adhesive layer 6 contains 65 parts by weight of an acrylic resin, 4 parts by weight of a curing agent, 0.4 parts by weight of an auxiliary agent, 0.4 parts by weight of a filler, and 8 parts by weight of a solvent.

The flexible copper-clad plate is cut into four 170 mm × 170 mm samples. These samples are put into a sulfuric acid-hydrogen peroxide microetching solution, etched for 50 s and then taken out and cleaned cleanly with pure water. As a result, the copper foil cover layer 42 of the copper foil 4 is removed by etching, and the copper foil base layer 41 is exposed. In order to determine whether or not the copper foil cover layer 42 has been completely removed by etching, the element contents of the four samples are measured with an EDS measuring apparatus.

After the 40 μm dry film 5 was attached to the above four samples, exposure and development were performed, and further ferric chloride having a concentration of 275 mol / L at a temperature of 45 ° C. and a pressure of 2.5 KG / cm ² . Etching with an etching solution is performed for 2.5 minutes, and then the line 3 is formed by etching. Thereafter, the sample is cleaned cleanly with pure water to form four 170 mm × 170 mm samples.

A process of peeling the dry film 5 is performed on the four samples. Antioxidation plating layer 7 is formed by performing electroplating with the antioxidation treatment groove on the above four samples subjected to the etching treatment. Regarding the amount of each element in the antioxidant plating layer 7, the zinc plating amount is 0.6 mg / m ² , 0.9 mg / m ² , 8 mg / m ² , 15 mg / m ² , respectively, and the nickel plating amount is 0. 6 mg / m ² , 0.9 mg / m ² , 2 mg / m ² and 8 mg / m ² , and the chrome plating amounts are 0.9 mg / m ² , 1 mg / m ² , 2 mg / m ² and 4 mg / m ^{2, respectively.} It is. The element content of the antioxidant plating layer 7 is measured by EDS measurement.

Example 5
In this embodiment, the resin substrate 2 is made of polyethylene terephthalate (PET). A 16 μm adhesive is applied to polyethylene terephthalate (PET) having a thickness of 80 μm to form an adhesive layer 6, a 35 μm copper foil 4 is combined on the adhesive layer 6, and after aging, flexible copper A tension plate is formed. The copper foil 4 includes a copper foil base layer 41 and a copper foil cover layer 42 for preventing the copper foil base layer 41 from being oxidized. In the copper foil cover layer 42 is 33.68mg / ^{m 2} content of zinc, the nickel content is 11.79mg / ^{m 2,} the content of chromium is 7.2 mg / ^{m 2.} The thickness of the flexible copper-clad plate is 121 μm, and TD = 340 mm and MD = 340 mm.

The adhesive layer 6 contains 82 parts by weight of a polyester resin, 3.5 parts by weight of a curing agent, 0.35 parts by weight of an auxiliary agent, 0.35 parts by weight of a filler, and 6.5 parts by weight of a solvent.

The flexible copper-clad plate is cut into four 170 mm × 170 mm samples. These samples are put in a sulfuric acid-hydrogen peroxide microetching solution, etched for 35 s, taken out, and cleaned cleanly with pure water. As a result, the copper foil cover layer 42 of the copper foil 4 is removed by etching, and the copper foil base layer 41 is exposed. In order to determine whether or not the copper foil cover layer 42 has been completely removed by etching, the element contents of the four samples are measured with an EDS measuring apparatus.

After the 40 μm dry film 5 is attached to the above four samples, exposure and development are performed, and further, a ferric chloride etching solution having a concentration of 250 mol / L at a temperature of 50 ° C. and a pressure of ³ KG / cm ^2. Etching is performed for 3 minutes and then taken out, whereby the line 3 is formed by etching. Thereafter, the sample is cleaned cleanly with pure water to form four 170 mm × 170 mm samples.

A process of peeling the dry film 5 is performed on the four samples. Antioxidation plating layer 7 is formed by performing electroplating with the antioxidation treatment groove on the above four samples subjected to the etching treatment. Regarding the amount of each element in the antioxidant plating layer 7, the zinc plating amount is 0.6 mg / m ² , 0.9 mg / m ² , 8 mg / m ² , 15 mg / m ² , respectively, and the nickel plating amount is 0. 6 mg / m ² , 0.9 mg / m ² , 2 mg / m ² and 8 mg / m ² , and the chrome plating amounts are 0.9 mg / m ² , 1 mg / m ² , 2 mg / m ² and 4 mg / m ^{2, respectively.} It is. The element content of the antioxidant plating layer 7 is measured by EDS measurement.

Example 6
In this embodiment, the resin base material 2 is made of polyethylene naphthalate (PEN). A 16 μm adhesive is applied to polyethylene naphthalate (PEN) with a thickness of 80 μm to form an adhesive layer 6, and then a 35 μm copper foil 4 is combined on the adhesive layer 6 and aged to be flexible. A copper-clad plate is formed. The copper foil 4 includes a copper foil base layer 41 and a copper foil cover layer 42 for preventing the copper foil base layer 41 from being oxidized. In the copper foil cover layer 42 is 33.68mg / ^{m 2} content of zinc, the nickel content is 11.79mg / ^{m 2,} the content of chromium is 7.2 mg / ^{m 2.} The thickness of the flexible copper-clad plate is 121 μm, and TD = 340 mm and MD = 340 mm.

The adhesive layer 6 contains 82 parts by weight of a polyester resin, 3.5 parts by weight of a curing agent, 0.35 parts by weight of an auxiliary agent, 0.35 parts by weight of a filler, and 6.5 parts by weight of a solvent.

The flexible copper-clad plate is cut into four 170 mm × 170 mm samples. These samples are put in a sulfuric acid-hydrogen peroxide microetching solution, etched for 35 s, taken out, and cleaned cleanly with pure water. As a result, the copper foil cover layer 42 of the copper foil 4 is removed by etching, and the copper foil base layer 41 is exposed. In order to determine whether or not the copper foil cover layer 42 has been completely removed by etching, the element contents of the four samples are measured with an EDS measuring apparatus.

After the 40 μm dry film 5 is attached to the above four samples, exposure and development are performed, and further, a ferric chloride etching solution having a concentration of 250 mol / L at a temperature of 50 ° C. and a pressure of ³ KG / cm ^2. Etching is performed for 3 minutes and then taken out, whereby the line 3 is formed by etching. Thereafter, the sample is cleaned cleanly with pure water to form four 170 mm × 170 mm samples.

A process of peeling the dry film 5 is performed on the four samples. Antioxidation plating layer 7 is formed by performing electroplating with the antioxidation treatment groove on the above four samples subjected to the etching treatment. Regarding the amount of each element in the antioxidant plating layer 7, the zinc plating amount is 0.6 mg / m ² , 0.9 mg / m ² , 8 mg / m ² , 15 mg / m ² , respectively, and the nickel plating amount is 0. 6 mg / m ² , 0.9 mg / m ² , 2 mg / m ² and 8 mg / m ² , and the chrome plating amounts are 0.9 mg / m ² , 1 mg / m ² , 2 mg / m ² and 4 mg / m ^{2, respectively.} It is. The element content of the antioxidant plating layer 7 is measured by EDS measurement.

Experimental Example Four samples in Example 1 and the original sample were cut to a size of 5 cm × 5 cm, the tin content was 42%, the bismuth content was 57%, and the silver content was 1%. A low-temperature solder paste is applied, heated and melted at 160 to 180 ° C., and the weldability of the four samples is visually observed. Furthermore, aging resistance is measured at 85 ° C.-85% RH, 24 h for the above four samples and the original sample, and the oxidation resistance and solder adhesion are visually observed. Among them, the original sample is a flexible copper-clad plate.

The measurement results of weldability, oxidation resistance and solder adhesion of the original sample and samples 1 to 4 are shown in the following table.

As can be seen from the above, the solar cell substrate according to the present invention is easy to manufacture and has excellent oxidation resistance and weldability even in harsh environments. Moreover, since the said flexible circuit board joins the photovoltaic cell 8 and the circuit | line 3 with a solder, while improving heat dissipation performance and reducing internal resistance, it has the outstanding oxidation resistance and workability.

The technical principle of the present invention has been described above with reference to specific embodiments. It should be understood that these descriptions are merely for the purpose of interpreting the principles of the present invention and are not a limitation on the protection scope of the present invention. Based on the above description, those skilled in the art can devise other specific embodiments of the present invention without creative labor. These embodiments also fall within the protection scope of the present invention.

For this reason, the board | substrate for solar cells and its manufacturing method by this invention are easy to manufacture, and have the oxidation resistance and weldability which are excellent also in a severe environment. The solar cell substrate can be applied to the manufacture of solar cells, whereby the solar cells can be used in harsh environments. The solar cell substrate and the manufacturing method thereof can be widely applied in the technical field of solar cells and have enormous economic value.

DESCRIPTION OF SYMBOLS 1 Substrate for solar cells, 2 Resin base material, 3 Lines, 41 Copper foil base layer, 42 Copper foil cover layer, 4 Copper foil, 5 Dry film, 6 Adhesive layer, 7 Antioxidation plating layer, 8 Solar cell.

Claims (20)

A solar battery cell (8) and a resin substrate (2);
An adhesive layer (6) is applied on the resin base material (2), a copper foil (4) is combined on the adhesive layer (6), and a line ( 3) is formed, an anti-oxidation plating layer (7) is formed on the surface of the line (3) by plating, and the line (3) and the solar battery cell (8) are joined by low-temperature solder. A solar cell substrate characterized. In the antioxidant plating layer (7), the zinc content is 0.5 to 25 mg / m ² , the nickel content is 0.5 to 10 mg / m ² , and the chromium content is 0.5. The solar cell substrate according to claim 1, wherein the substrate is ˜8 mg / m ² . The adhesive layer (6) comprises 20 to 100 parts by weight of resin, 1 to 5 parts by weight of curing agent, 0.1 to 0.5 parts by weight of auxiliary agent, 0.1 to 0.5 parts by weight of filler, and 5 to 5 parts of solvent. It contains 10 weight part, The board | substrate for solar cells of Claim 1 characterized by the above-mentioned. 4. The solar cell substrate according to claim 3, wherein the resin is one or a mixture of polyester, epoxy resin, and acrylic resin. The thickness of the said adhesive bond layer (6) is 8-20 micrometers, Preferably it is 8-16 micrometers, More preferably, it is 8-13 micrometers, The board | substrate for solar cells of Claim 1 characterized by the above-mentioned. The solar cell according to claim 1, wherein the resin substrate (2) is one or a mixture of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyimide (PI). Substrate. The thickness of the said resin base material (2) is 45-125 micrometers, Preferably it is 50-100 micrometers, More preferably, it is 50-80 micrometers, The board | substrate for solar cells of Claim 1 characterized by the above-mentioned. The thickness of the said copper foil (4) is 10-45 micrometers, Preferably it is 15-42 micrometers, More preferably, it is 18-40 micrometers, The board | substrate for solar cells of Claim 1 characterized by the above-mentioned. The solar cell substrate according to any one of claims 1 to 8, wherein the copper foil (4) is subjected to a micro-etching process before the line (3) is formed by etching. . It is a manufacturing method used for the substrate for solar cells according to any one of claims 1 to 9,
Copper foil (4) of a flexible copper-clad board provided with the said copper foil (4) compounded on the said resin base material (6) through the said resin base material (6) and the said adhesive bond layer (6). And forming the line (3) by etching;
Forming the antioxidant plating layer (7) by electroplating on the line (3);
Joining the line (3) on which the antioxidation plating layer (7) is formed by electroplating and the solar battery cell (8) with low-temperature solder;
The manufacturing method of the board | substrate for solar cells characterized by including. By applying an adhesive uniformly on the resin base material (2) and forming the adhesive layer (6), the copper foil (4) is combined and aged, thereby forming the flexible copper-clad plate. It forms, The manufacturing method of the board | substrate for solar cells of Claim 10 characterized by the above-mentioned. 11. The solar cell according to claim 10, wherein a micro-etching process is performed on an upper surface of the copper foil (4) before forming the line (3) by etching on the copper foil (4). A method for manufacturing a substrate. The microetching treatment is characterized in that the copper foil (4) is put in a sulfuric acid-hydrogen peroxide microetching solution and etched for 30 s to 60 s, preferably 40 to 55 s, more preferably 40 to 50 s. The manufacturing method of the board | substrate for solar cells as described in any one of. 11. The sun according to claim 10, wherein the line (3) is washed and dried before the oxidation plating layer (7) is formed by electroplating on the line (3). A method for manufacturing a battery substrate. The step of forming the line (3) by etching on the copper foil (4) is performed by applying a dry film (5) to the copper foil (4), exposing and developing, and using a ferric chloride etching solution. Etching is performed, The manufacturing method of the board | substrate for solar cells as described in any one of Claims 10-14 characterized by the above-mentioned. The method for manufacturing a solar cell substrate according to claim 15, wherein the concentration of the ferric chloride etching solution is 200 to 300 g / L. The method for manufacturing a solar cell substrate according to claim 15, wherein the etching temperature is 40 to 60 ° C. and the pressure is 1.5 to 3 kg / cm ² . The method for manufacturing a solar cell substrate according to claim 15, wherein the etching time is 2 to 4 min. It is a manufacturing method used for the substrate for solar cells according to any one of claims 1 to 9,
A flexible copper-clad board is manufactured by manufacturing an adhesive, uniformly applying the adhesive on the resin base material (2) to form an adhesive layer (6), and then aging the copper foil (4). Forming step A;
Performing a micro-etching process on the upper surface of the copper foil (4) in the step A, removing the copper foil cover layer (42) of the copper foil (4), and exposing the copper foil base layer (41);
Forming a line (3) by etching in the copper foil (4) treated in the step B, washing and drying;
Forming an antioxidant plating layer (7) by electroplating on the line (3) in the step C;
A step E of joining the line (3) and the solar battery cell (8) after the treatment in the step D with a low-temperature solder;
The manufacturing method of the board | substrate for solar cells characterized by including. A solar cell comprising the solar cell substrate according to claim 1.