CN101374388A - Method for preparing fine line flexible circuit board with high peeling strength - Google Patents
Method for preparing fine line flexible circuit board with high peeling strength Download PDFInfo
- Publication number
- CN101374388A CN101374388A CNA2008100270927A CN200810027092A CN101374388A CN 101374388 A CN101374388 A CN 101374388A CN A2008100270927 A CNA2008100270927 A CN A2008100270927A CN 200810027092 A CN200810027092 A CN 200810027092A CN 101374388 A CN101374388 A CN 101374388A
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- CN
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- Prior art keywords
- layer
- matrix
- circuit board
- thin copper
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000011159 matrix material Substances 0.000 claims abstract description 27
- 238000004544 sputter deposition Methods 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 239000004809 Teflon Substances 0.000 claims abstract description 7
- 229920006362 Teflon® Polymers 0.000 claims abstract description 7
- 239000010935 stainless steel Substances 0.000 claims abstract description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 4
- 229920006267 polyester film Polymers 0.000 claims abstract description 4
- 229920001721 polyimide Polymers 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 58
- 238000012545 processing Methods 0.000 abstract description 11
- 239000011888 foil Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 abstract 1
- 229920006397 acrylic thermoplastic Polymers 0.000 abstract 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 abstract 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 14
- 239000005030 aluminium foil Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910000939 field's metal Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100270927A CN101374388B (en) | 2008-03-28 | 2008-03-28 | Method for preparing fine line flexible circuit board with high peeling strength |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100270927A CN101374388B (en) | 2008-03-28 | 2008-03-28 | Method for preparing fine line flexible circuit board with high peeling strength |
Publications (2)
Publication Number | Publication Date |
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CN101374388A true CN101374388A (en) | 2009-02-25 |
CN101374388B CN101374388B (en) | 2010-06-02 |
Family
ID=40448229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2008100270927A Active CN101374388B (en) | 2008-03-28 | 2008-03-28 | Method for preparing fine line flexible circuit board with high peeling strength |
Country Status (1)
Country | Link |
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CN (1) | CN101374388B (en) |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101699939B (en) * | 2009-11-05 | 2011-04-06 | 深南电路有限公司 | Method for rolling PCB |
CN102233699A (en) * | 2010-04-29 | 2011-11-09 | 南亚塑胶工业股份有限公司 | Extremely thin copper foil using ultralow ridge copper foil as carrier and manufacturing method of extremely thin copper foil |
CN102281721A (en) * | 2011-05-20 | 2011-12-14 | 深圳市崇达电路技术股份有限公司 | Manufacture method of printed circuit board with surface-pressure covering film |
CN102036509B (en) * | 2009-09-25 | 2013-03-27 | 北大方正集团有限公司 | Method for electroplating blind hole and through hole of circuit board |
CN103135335A (en) * | 2011-11-29 | 2013-06-05 | 北大方正集团有限公司 | Negative plate manufacture method and device for printed circuit board |
CN103974549A (en) * | 2014-05-26 | 2014-08-06 | 深圳市智武科技有限公司 | Manufacturing method for circuit board line |
CN105637985A (en) * | 2013-10-14 | 2016-06-01 | 韩国生产技术研究院 | Method for manufacturing circuit board |
WO2016086468A1 (en) * | 2014-12-02 | 2016-06-09 | 广州方邦电子有限公司 | Flexible copper-clad plate having high peel strength and manufacture method thereof |
CN106304615A (en) * | 2015-06-24 | 2017-01-04 | Jx金属株式会社 | The manufacture method of Copper foil with carrier, laminate, printing distributing board, e-machine and printing distributing board |
CN106304614A (en) * | 2015-06-24 | 2017-01-04 | Jx金属株式会社 | The manufacture method of Copper foil with carrier, laminate, printing distributing board, e-machine and printing distributing board |
CN106455310A (en) * | 2015-08-06 | 2017-02-22 | Jx金属株式会社 | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device |
CN106455341A (en) * | 2015-08-06 | 2017-02-22 | Jx金属株式会社 | Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device |
CN106585046A (en) * | 2016-11-28 | 2017-04-26 | 珠海亚泰电子科技有限公司 | Manufacturing process of ultramicro thin copper-clad plate and five-axis laminating machine matched with same |
CN106784026A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of solar cell wiring board and preparation method thereof |
CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
CN108718485A (en) * | 2018-06-07 | 2018-10-30 | 珠海元盛电子科技股份有限公司 | A kind of semi-additive process technology of the two-sided FPC of manufacture filament thickness copper |
CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN109097750A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN109097749A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN109097748A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN109097751A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN110418507A (en) * | 2019-08-19 | 2019-11-05 | 台山市精诚达电路有限公司 | High-frequency high-speed flexible electric circuit board manufacturing process |
CN110978576A (en) * | 2019-12-20 | 2020-04-10 | 江门市德众泰工程塑胶科技有限公司 | Preparation method of liquid crystal polymer film |
CN113386416A (en) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | Heat-conducting double-sided copper-clad plate and preparation method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107227457A (en) * | 2016-03-24 | 2017-10-03 | 琦芯科技股份有限公司 | Copper foil with carrier with sputtering type inorganic composite film and preparation method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1109086C (en) * | 2000-07-19 | 2003-05-21 | 湖北省化学研究所 | Reaction-type flame-retarding adhesive for flexible PCB and its preparing process |
CN1527656A (en) * | 2003-09-19 | 2004-09-08 | 波 曹 | Magnetically controlled sputtering process of making printed circuit board |
CN1984526B (en) * | 2005-12-15 | 2011-01-12 | 古河电气工业株式会社 | Ultrathin copper foil with carrier and printed circuit board |
-
2008
- 2008-03-28 CN CN2008100270927A patent/CN101374388B/en active Active
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102036509B (en) * | 2009-09-25 | 2013-03-27 | 北大方正集团有限公司 | Method for electroplating blind hole and through hole of circuit board |
CN101699939B (en) * | 2009-11-05 | 2011-04-06 | 深南电路有限公司 | Method for rolling PCB |
CN102233699A (en) * | 2010-04-29 | 2011-11-09 | 南亚塑胶工业股份有限公司 | Extremely thin copper foil using ultralow ridge copper foil as carrier and manufacturing method of extremely thin copper foil |
CN102233699B (en) * | 2010-04-29 | 2013-10-16 | 南亚塑胶工业股份有限公司 | Extremely thin copper foil using ultralow ridge copper foil as carrier and manufacturing method of extremely thin copper foil |
CN102281721A (en) * | 2011-05-20 | 2011-12-14 | 深圳市崇达电路技术股份有限公司 | Manufacture method of printed circuit board with surface-pressure covering film |
CN103135335A (en) * | 2011-11-29 | 2013-06-05 | 北大方正集团有限公司 | Negative plate manufacture method and device for printed circuit board |
CN105637985B (en) * | 2013-10-14 | 2018-06-08 | 韩国生产技术研究院 | The manufacturing method of circuit board |
CN105637985A (en) * | 2013-10-14 | 2016-06-01 | 韩国生产技术研究院 | Method for manufacturing circuit board |
CN103974549A (en) * | 2014-05-26 | 2014-08-06 | 深圳市智武科技有限公司 | Manufacturing method for circuit board line |
WO2016086468A1 (en) * | 2014-12-02 | 2016-06-09 | 广州方邦电子有限公司 | Flexible copper-clad plate having high peel strength and manufacture method thereof |
CN106304615B (en) * | 2015-06-24 | 2019-01-08 | Jx金属株式会社 | The manufacturing method of Copper foil with carrier, laminate, printing distributing board, e-machine and printing distributing board |
CN106304614A (en) * | 2015-06-24 | 2017-01-04 | Jx金属株式会社 | The manufacture method of Copper foil with carrier, laminate, printing distributing board, e-machine and printing distributing board |
CN106304615A (en) * | 2015-06-24 | 2017-01-04 | Jx金属株式会社 | The manufacture method of Copper foil with carrier, laminate, printing distributing board, e-machine and printing distributing board |
CN106455310A (en) * | 2015-08-06 | 2017-02-22 | Jx金属株式会社 | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device |
CN106455341A (en) * | 2015-08-06 | 2017-02-22 | Jx金属株式会社 | Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device |
CN106455310B (en) * | 2015-08-06 | 2019-11-01 | Jx金属株式会社 | The manufacturing method of Copper foil with carrier, laminate, the manufacturing method of printing distributing board and e-machine |
CN106455341B (en) * | 2015-08-06 | 2019-08-09 | Jx金属株式会社 | The manufacturing method of Copper foil with carrier, laminate, the manufacturing method of printing distributing board and e-machine |
CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
CN106585046B (en) * | 2016-11-28 | 2019-08-23 | 珠海亚泰电子科技有限公司 | Manufacturing process of ultramicro thin copper-clad plate and five-axis laminating machine matched with same |
CN106585046A (en) * | 2016-11-28 | 2017-04-26 | 珠海亚泰电子科技有限公司 | Manufacturing process of ultramicro thin copper-clad plate and five-axis laminating machine matched with same |
CN106784026A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of solar cell wiring board and preparation method thereof |
CN109097751A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN109097750A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN109097748A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN109097749A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
CN108718485A (en) * | 2018-06-07 | 2018-10-30 | 珠海元盛电子科技股份有限公司 | A kind of semi-additive process technology of the two-sided FPC of manufacture filament thickness copper |
CN108718485B (en) * | 2018-06-07 | 2021-02-02 | 珠海元盛电子科技股份有限公司 | Semi-additive technology for manufacturing fine-wire thick-copper double-sided FPC |
CN110418507A (en) * | 2019-08-19 | 2019-11-05 | 台山市精诚达电路有限公司 | High-frequency high-speed flexible electric circuit board manufacturing process |
CN110418507B (en) * | 2019-08-19 | 2020-11-06 | 台山市精诚达电路有限公司 | Manufacturing process of high-frequency high-speed flexible circuit board |
CN110978576A (en) * | 2019-12-20 | 2020-04-10 | 江门市德众泰工程塑胶科技有限公司 | Preparation method of liquid crystal polymer film |
CN110978576B (en) * | 2019-12-20 | 2021-09-10 | 江门市德众泰工程塑胶科技有限公司 | Preparation method of liquid crystal polymer film |
CN113386416A (en) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | Heat-conducting double-sided copper-clad plate and preparation method thereof |
Also Published As
Publication number | Publication date |
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CN101374388B (en) | 2010-06-02 |
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Address after: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee after: GUANGZHOU FANGBANG ELECTRONICS CO., LTD. Address before: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee before: Guangzhou Fangbang Electronic Co., Ltd. |