CN207120536U - A kind of aluminum-based copper-clad plate - Google Patents
A kind of aluminum-based copper-clad plate Download PDFInfo
- Publication number
- CN207120536U CN207120536U CN201720422020.7U CN201720422020U CN207120536U CN 207120536 U CN207120536 U CN 207120536U CN 201720422020 U CN201720422020 U CN 201720422020U CN 207120536 U CN207120536 U CN 207120536U
- Authority
- CN
- China
- Prior art keywords
- clad plate
- layer
- prepreg
- aluminum
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 46
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 239000004411 aluminium Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 241000446313 Lamella Species 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000003672 processing method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229940106691 bisphenol a Drugs 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of aluminum-based copper-clad plate, and it includes aluminium base, and the front of the aluminium base is disposed with glass felt layers, the first layer of prepreg, the second layer of prepreg and copper foil layer from the inside to the outside.Aluminum-based copper-clad plate of the present utility model, there is good machining property and dimensional stability.
Description
Technical field
It the utility model is related to copper-clad plate technical field, and in particular to a kind of aluminum-based copper-clad plate.
Background technology
One of the stock of copper-clad plate as PCB, it is to soak supporting material with resin, and one or both sides are coated with copper
A kind of paper tinsel, the board-like material formed through hot pressing, mainly plays interconnection, insulation and support to pcb board.It is existing to cover copper
, it is necessary to the FR4 plates (glass mat) of forming be knocked in the aluminium sheet of forming manually, processing efficiency in the process of plate
It is low, and the dimensional stability of obtained copper-clad plate is poor.Or clog resin in such as corresponding hole of aluminium sheet, but the processing side
Method is not suitable for the aluminium sheet of mounting hole of the processing with aperture >=8mm, and the resin filled in hole easily splits.Due to it is above-mentioned not
The presence of foot, seriously limits the processing and manufacturing of copper-clad plate.
Utility model content
The purpose of this utility model is overcome the deficiencies in the prior art, there is provided a kind of dimensionally stable, machining property
Good aluminum-based copper-clad plate.
To achieve the above object, the utility model uses following technical scheme：
A kind of aluminum-based copper-clad plate, it includes aluminium base, and the front of the aluminium base is disposed with glass felt from the inside to the outside
Layer, the first layer of prepreg, the second layer of prepreg and copper foil layer.
Preferably：The thickness of the aluminium base is 0.3-3.0mm, has hole on the aluminium base, is filled in the hole
There is epoxy resin.
Preferably：The aperture in the hole is not more than 60mm.
Preferably：Ring is impregnated with respectively in the glass felt layers, the first plate solidification lamella and the second layer of prepreg
Oxygen tree fat.
Preferably：The thickness of the glass felt is 200-600 μm；The thickness of first layer of prepreg is 50-200
μm；The thickness of second layer of prepreg is 50-200 μm；The thickness of the copper foil layer is Hoz-4oz.
The beneficial effects of the utility model are, processing method of the present utility model, by using resin filling perforation and pressure
The processing mode that solidification is carried out simultaneously is closed, the processing efficiency of copper-clad plate, and the high yield rate of copper-clad plate are substantially increased, using wide
It is general, but for processing copper-clad plate of the aperture within 60mm.Relative to existing aluminum-based copper-clad plate, by of the present utility model
Processing method processes obtained aluminum-based copper-clad plate, has good machining property and dimensional stability.
Brief description of the drawings
Fig. 1 shows the structural representation of aluminum-based copper-clad plate described in the utility model.
Embodiment
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings.
The utility model provides a kind of processing method of copper-clad plate, and its procedure of processing includes：
1) according to demand, the mode of aluminium base punch die or gong sheet metal forming is formed on the aluminium base has certain pore size
Hole；
2) back side progress oil removing to aluminium base whitens processing and anode is handled, wherein, the oil removing whitens processing bag
Include and the back side of the aluminium base be soaked in alkaline cleaning fluid, as 5-10wt% sodium hydroxide solution in remove aluminium base backboard
The spots such as the greasy dirt in face；The anode processing procedure include by oil removing whiten processing after aluminium base the back side be soaked in alkalescence it is molten
With in one layer of protective oxide layer of the back side of aluminium base generation in liquid；
3) to the aluminium base front carry out surface coarsening processing, the surface coarsening processing procedure include 150 mesh-
The adhesive-bonded fabric polish-brush of 180 mesh presses 5m/min speed grinding process 15-30 minutes, then, by whole aluminium base in 80 DEG C -90 DEG C
It is lower to dry to remove the moisture on aluminium base；
4) the aluminium base front cover glass felt to form glass felt layers, wherein, be impregnated with the glass felt
Epoxy resin, the epoxy resin can use high Tg (glass transition temperature) epoxy resin known in the art and/or low Tg rings
Oxygen tree fat, such as bisphenol A epoxide resin and/or novolac epoxy resin, and the content of the epoxy resin is the glass felt weight
30-95wt%；
5) the first prepreg is covered on the glass felt layers to form the first layer of prepreg, wherein, described first
The thickness of prepreg is 50-200 μm, and epoxy resin is impregnated with first prepreg, and the epoxy resin can be with
Using high Tg (glass transition temperature) epoxy resin known in the art and/or low Tg epoxy resin, as bisphenol A epoxide resin and/
Or novolac epoxy resin, and the content of the epoxy resin is the 40-90wt% of the first prepreg weight；
6) the second prepreg is covered in first layer of prepreg to form the second layer of prepreg, wherein, institute
The thickness for stating the second prepreg is 50-200 μm, and epoxy resin, the asphalt mixtures modified by epoxy resin are impregnated with second prepreg
Fat can use high Tg (glass transition temperature) epoxy resin known in the art and/or low Tg epoxy resin, such as bisphenol-A epoxy tree
Fat and/or novolac epoxy resin, and the content of the epoxy resin is the 40-90wt% of the second prepreg weight；
7) copper foil is covered in second layer of prepreg and forms copper foil layer；
8) the unformed copper-clad plate obtained in step 7) is put into hot press under HTHP in 68-72cmHg vacuum
Spend, carry out vacuum pressing-combining at a temperature of 180-210 DEG C so that the hole that the resin flowing on glass felt is filled and led up on aluminium base produces this
Copper-clad plate described in utility model.
The utility model additionally provides a kind of aluminum-based copper-clad plate for processing to obtain by processing method as described above, its structure
As shown in figure 1, the glass felt layers 2 including aluminium base 1 and the upper surface for being set in turn in the aluminium base 1 from the inside to the outside,
One layer of prepreg 3, the second layer of prepreg 4 and copper foil layer 5.Wherein：The thickness of the aluminium base 1 is 0.3-3.0mm, institute
The thickness for stating glass felt layers 2 is 200-600 μm, and epoxy resin is impregnated with the glass felt layers 2, and the content of the resin
For the 30-95wt% of the weight of glass felt layers 2；The thickness of first layer of prepreg 3 is 50-200 μm；Described the second half
The thickness for solidifying lamella 4 is 50-200 μm；The thickness of the copper foil layer 5 is Hoz-4oz (17.15 μm -137.2 μm).
Relative to existing copper-clad plate process, the utility model is carried out simultaneously using resin filling perforation and pressing solidification
Processing mode, substantially increase the processing efficiency of copper-clad plate, and the high yield rate of copper-clad plate, be widely used, but for plus
Copper-clad plate of the work aperture within 60mm.Relative to existing aluminum-based copper-clad plate, processed by processing method of the present utility model
Obtained aluminum-based copper-clad plate, there is good machining property and dimensional stability.In addition, by adjusting described the first half
The thickness and resin content of cured sheets, the second prepreg and glass felt, it is leading for 0.2-5.0W that can obtain thermal conductivity
Hot aluminum-based copper-clad plate.
The utility model has carried out detailed explanation by preferred embodiment.However, by studying carefully above,
Apparent to change and increase and those of ordinary skill in the art to each embodiment.It is intended that institute
There are these to change and increase to fall in the protection domain of the utility model claims.Term used herein is only to tool
The embodiment of body is illustrated, and it, which is not intended to, limits the utility model.Unless otherwise defined, institute used herein
There is term (including technical term and scientific terminology) identical with the understanding of the utility model one of ordinary skill in the art.
Any modification and improvement carried out to this product, similar in the scope of the claims or category or close material replacement and use,
Belong to the utility model patent protection domain.
Claims (3)
- A kind of 1. aluminum-based copper-clad plate, it is characterised in that：The aluminum-based copper-clad plate includes aluminium base, and the front of the aluminium base is from interior To being disposed with glass felt layers, the first layer of prepreg, the second layer of prepreg and copper foil layer outside；Wherein：The thickness of the aluminium base is 0.3-3.0mm, has hole on the aluminium base, epoxy resin is filled with the hole；Epoxy resin is impregnated with respectively in the glass felt layers, the first plate solidification lamella and the second layer of prepreg.
- 2. aluminum-based copper-clad plate according to claim 1, it is characterised in that：The aperture in the hole is not more than 60mm.
- 3. aluminum-based copper-clad plate according to claim 1, it is characterised in that：The thickness of the glass felt is 200-600 μm；Institute The thickness for stating the first layer of prepreg is 50-200 μm；The thickness of second layer of prepreg is 50-200 μm；The copper foil The thickness of layer is Hoz-4oz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720422020.7U CN207120536U (en) | 2017-04-21 | 2017-04-21 | A kind of aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720422020.7U CN207120536U (en) | 2017-04-21 | 2017-04-21 | A kind of aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207120536U true CN207120536U (en) | 2018-03-20 |
Family
ID=61614964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720422020.7U Expired - Fee Related CN207120536U (en) | 2017-04-21 | 2017-04-21 | A kind of aluminum-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207120536U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106945360A (en) * | 2017-04-21 | 2017-07-14 | 广州市普诺科技有限公司 | The processing method and aluminum-based copper-clad plate of a kind of aluminum-based copper-clad plate |
-
2017
- 2017-04-21 CN CN201720422020.7U patent/CN207120536U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106945360A (en) * | 2017-04-21 | 2017-07-14 | 广州市普诺科技有限公司 | The processing method and aluminum-based copper-clad plate of a kind of aluminum-based copper-clad plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190426 Address after: 513000 North of Jinzhu Avenue, Tsinghua Garden, Yinghua Teahouse, Donghua Town, Yingde City, Qingyuan City, Guangdong Province (Block 4) Patentee after: Qingyuan Puno Photoelectric Technology Co.,Ltd. Address before: 510800 New Area of Huashan First Industrial Zone, Huadu District, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU PUNUO TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 513000 North of Jinzhu Avenue, Tsinghua Garden, Yinghua Teahouse, Donghua Town, Yingde City, Qingyuan City, Guangdong Province (Block 4) Patentee after: Qingyuan Puno Photoelectric Technology Co.,Ltd. Address before: 513000 North of Jinzhu Avenue, Tsinghua Garden, Yinghua Teahouse, Donghua Town, Yingde City, Qingyuan City, Guangdong Province (Block 4) Patentee before: Qingyuan Puno Photoelectric Technology Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180320 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |