CN212422429U - Resin-rich copper-clad plate - Google Patents
Resin-rich copper-clad plate Download PDFInfo
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- CN212422429U CN212422429U CN201921239556.0U CN201921239556U CN212422429U CN 212422429 U CN212422429 U CN 212422429U CN 201921239556 U CN201921239556 U CN 201921239556U CN 212422429 U CN212422429 U CN 212422429U
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Abstract
The utility model discloses a resin-rich copper-clad plate, which belongs to the field of copper-clad laminates, and comprises a resin-rich layer, wherein a copper foil is fixedly adhered to the lower end surface of the resin-rich layer, a breathable layer is fixedly adhered to the lower end surface of the copper foil, a plurality of micro air holes are arranged inside the breathable layer, an anti-corrosion layer is fixedly adhered to the lower end surface of the breathable layer, an enhancement layer is fixedly adhered to the lower end surface of the anti-corrosion layer, a base material layer is fixedly adhered to the lower end surface of the enhancement layer, the lower end surface and the upper end surface of the base material layer have the same structure, the thickness of the base material layer is 50 microns, the weather resistance, the water resistance and the corrosion resistance of the copper; the design of the air permeable layer can reduce the temperature of the copper-clad plate and prolong the service life of the copper-clad plate, and the design of the air permeable holes can enable the temperature of the copper-clad plate to be dissipated outwards from the air permeable holes so as to reduce the temperature of the copper-clad plate; the design of the enhancement layer greatly improves the strength of the copper-clad plate.
Description
Technical Field
The utility model relates to a cover copper foil laminate field, more specifically say, relate to a rich resin copper-clad plate.
Background
The surface of the article requires a special surface layer, called the surface layer. The gel coat resin added with pigment (commonly called gel coat) is generally adopted, and the common resin added with powder filler can be adopted to replace the common resin or directly use a glass fiber surface felt. The surface layer is high in resin content, so the resin is also called a resin-rich layer. The surface layer can not only beautify the product, but also protect the product from being corroded by surrounding media, improve the weather resistance, the water resistance and the corrosion resistance of the product, and has the function of prolonging the service life of the product.
In the existing resin-rich copper-clad plate, a plurality of copper-clad plates can be stacked together in the processing and transportation processes, so that the copper-clad plate is damaged by pressure inside and has quality problems; meanwhile, after the copper-clad plate is manufactured into the circuit board, electrical components on the surface of most of the circuit board can emit heat when running, so that the temperature of the circuit board is increased and aged, and the service life of the circuit board is shortened. Accordingly, there is a need for improvements in the art.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the prior art, the utility model aims to provide a resin-rich copper-clad plate, the design of the resin-rich layer can improve the weather resistance, water resistance and corrosion resistance of the copper-clad plate, and prolong the service life of the copper-clad plate; the design of the air permeable layer can reduce the temperature of the copper-clad plate and prolong the service life of the copper-clad plate, and the design of the air permeable holes can enable the temperature of the copper-clad plate to be dissipated outwards from the air permeable holes so as to reduce the temperature of the copper-clad plate; the design of the enhancement layer greatly improves the strength of the copper-clad plate.
In order to solve the above problems, the utility model adopts the following technical proposal.
A resin-rich copper-clad plate comprises a resin-rich layer, wherein a copper foil is fixedly adhered to the lower end face of the resin-rich layer, a breathable layer is fixedly adhered to the lower end face of the copper foil, a plurality of micro air vents are formed in the breathable layer, an anti-corrosion layer is fixedly adhered to the lower end face of the breathable layer, an enhancement layer is fixedly adhered to the lower end face of the anti-corrosion layer, a base material layer is fixedly adhered to the lower end face of the enhancement layer, the lower end face and the upper end face of the base material layer are identical in structure, the thickness of the base material layer is 50 micrometers, and the resin-rich layer can improve weather resistance, water resistance and corrosion resistance of the copper-clad plate and prolong the service life of; the design of the air permeable layer can reduce the temperature of the copper-clad plate and prolong the service life of the copper-clad plate, and the design of the air permeable holes can enable the temperature of the copper-clad plate to be dissipated outwards from the air permeable holes so as to reduce the temperature of the copper-clad plate; the design of the enhancement layer greatly improves the strength of the copper-clad plate.
Furthermore, the resin-rich layer is formed by mixing a surface layer and epoxy resin, the thickness of the resin-rich layer is 20 microns, and the design of the resin-rich layer can improve the weather resistance, the water resistance and the corrosion resistance of the copper-clad plate and prolong the service life of the copper-clad plate.
Furthermore, the thickness of the breathable layer is 30 microns, the breathable layer is made of phenolic epoxy resin materials, the temperature of the copper-clad plate can be reduced through the design of the breathable layer, and the service life of the copper-clad plate is prolonged.
Furthermore, the air holes in the air permeable layer are communicated with each other, the size of the air holes is different, and the design of the air holes can enable the temperature of the copper-clad plate to be dissipated outwards from the air holes, so that the temperature of the copper-clad plate is reduced.
Furthermore, the enhancement layer is made of bisphenol A epoxy resin material, the thickness of the enhancement layer is 20-30 microns, and the strength of the copper-clad plate is greatly improved due to the design of the enhancement layer.
Compared with the prior art, the utility model has the advantages of:
(1) the design of the resin-rich layer can improve the weather resistance, water resistance and corrosion resistance of the copper-clad plate and prolong the service life of the copper-clad plate; the design of the air permeable layer can reduce the temperature of the copper-clad plate and prolong the service life of the copper-clad plate, and the design of the air permeable holes can enable the temperature of the copper-clad plate to be dissipated outwards from the air permeable holes so as to reduce the temperature of the copper-clad plate; the design of the enhancement layer greatly improves the strength of the copper-clad plate.
(2) The resin-rich layer is prepared by mixing a surface layer and epoxy resin, the thickness of the resin-rich layer is 20 microns, the design of the resin-rich layer can improve the weather resistance, water resistance and corrosion resistance of the copper-clad plate, and the service life of the copper-clad plate is prolonged.
(3) The thickness of the breathable layer is 30 microns, the breathable layer is made of phenolic epoxy resin materials, the temperature of the copper-clad plate can be reduced through the design of the breathable layer, and the service life is prolonged.
(4) The air holes in the air permeable layer are communicated with each other, the sizes of the air holes are different, and the design of the air holes can enable the temperature of the copper-clad plate to be dispersed outwards from the air holes, so that the temperature of the copper-clad plate is reduced.
(5) The enhancement layer is made of bisphenol A epoxy resin material, the thickness of the enhancement layer is 20-30 microns, and the design of the enhancement layer greatly improves the strength of the copper-clad plate.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is an enlarged cross-sectional view of the overall structure of the present invention.
The reference numbers in the figures illustrate:
1 resin-rich layer, 11 copper foil, 12 air-permeable layer, 13 air-permeable hole, 14 anti-corrosion layer, 15 enhancement layer and 16 base material layer.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.
Referring to fig. 1-2, a resin-rich copper-clad plate comprises a resin-rich layer 1, and referring to fig. 1-2, a copper foil 11 is fixedly adhered to the lower end face of the resin-rich layer 1, a breathable layer 12 is fixedly adhered to the lower end face of the copper foil 11, a plurality of micro air vents 13 are arranged inside the breathable layer 12, an anti-corrosion layer 14 is fixedly adhered to the lower end face of the breathable layer 12, an enhancement layer 15 is fixedly adhered to the lower end face of the anti-corrosion layer 14, a substrate layer 16 is fixedly adhered to the lower end face of the enhancement layer 15, the lower end face and the upper end face of the substrate layer 16 have the same structure, and the thickness of the substrate layer 16 is 50 micrometers.
Referring to fig. 2, the resin rich layer 1 is formed by mixing a surface layer and epoxy resin, the thickness of the resin rich layer 1 is 20 micrometers, the design of the resin rich layer 1 can improve the weather resistance, water resistance and corrosion resistance of the copper-clad plate, the service life of the copper-clad plate is prolonged, the thickness of the breathable layer 12 is 30 micrometers, the breathable layer 12 is made of novolac epoxy resin materials, the temperature of the copper-clad plate can be reduced through the design of the breathable layer 12, and the service life of the copper-clad plate is prolonged.
Referring to fig. 2, the air holes 13 in the air permeable layer 12 are communicated with each other, the sizes of the air holes 13 are different, the design of the air holes 13 can enable the temperature of the copper-clad plate to be dissipated outwards from the air holes, the temperature of the copper-clad plate is reduced, the reinforcing layer 15 is made of bisphenol a epoxy resin materials, the thickness of the reinforcing layer 15 is 20-30 microns, and the design of the reinforcing layer 15 greatly improves the strength of the copper-clad plate.
During processing, the laminated copper clad laminate is placed between heating plates of a press, high-temperature and high-pressure lamination forming processing is carried out, lamination is completed through three different process control stages of pre-heating, hot pressing and cooling, and then solidification forming is completed, the design of the resin-rich layer 1 can improve weather resistance, water resistance and corrosion resistance of the copper clad laminate, and the service life of the copper clad laminate is prolonged; the design of the air permeable layer 12 can reduce the temperature of the copper-clad plate and prolong the service life of the copper-clad plate, and the design of the air permeable holes 13 can enable the temperature of the copper-clad plate to be dissipated outwards from the air permeable holes so as to reduce the temperature of the copper-clad plate; the design of the enhancement layer 15 greatly improves the strength of the copper-clad plate.
The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.
Claims (5)
1. The resin-rich copper-clad plate comprises a resin-rich layer (1) and is characterized in that: the laminated wood floor is characterized in that a copper foil (11) is fixedly adhered to the lower end face of the resin-rich layer (1), a breathable layer (12) is fixedly adhered to the lower end face of the copper foil (11), a plurality of micro air vents (13) are arranged inside the breathable layer (12), an anti-corrosion layer (14) is fixedly adhered to the lower end face of the breathable layer (12), an enhancement layer (15) is fixedly adhered to the lower end face of the anti-corrosion layer (14), a base material layer (16) is fixedly adhered to the lower end face of the enhancement layer (15), the lower end face and the upper end face of the base material layer (16) are identical in structure, and the thickness of the base material layer (16) is 50 microns.
2. The resin-rich copper-clad plate according to claim 1, characterized in that: the resin-rich layer (1) is prepared by mixing a surface layer and epoxy resin, and the thickness of the resin-rich layer (1) is 20 microns.
3. The resin-rich copper-clad plate according to claim 1, characterized in that: the thickness of the air-permeable layer (12) is 30 microns, and the air-permeable layer (12) is made of novolac epoxy resin materials.
4. The resin-rich copper-clad plate according to claim 1, characterized in that: the air holes (13) in the air permeable layer (12) are communicated with each other, and the sizes of the air holes (13) are different.
5. The resin-rich copper-clad plate according to claim 1, characterized in that: the reinforcing layer (15) is made of bisphenol A epoxy resin materials, and the thickness of the reinforcing layer (15) is 20-30 micrometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921239556.0U CN212422429U (en) | 2019-08-02 | 2019-08-02 | Resin-rich copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921239556.0U CN212422429U (en) | 2019-08-02 | 2019-08-02 | Resin-rich copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212422429U true CN212422429U (en) | 2021-01-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921239556.0U Active CN212422429U (en) | 2019-08-02 | 2019-08-02 | Resin-rich copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212422429U (en) |
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2019
- 2019-08-02 CN CN201921239556.0U patent/CN212422429U/en active Active
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