US20090321267A1 - Method for surface treating plastic products - Google Patents

Method for surface treating plastic products Download PDF

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Publication number
US20090321267A1
US20090321267A1 US12/333,435 US33343508A US2009321267A1 US 20090321267 A1 US20090321267 A1 US 20090321267A1 US 33343508 A US33343508 A US 33343508A US 2009321267 A1 US2009321267 A1 US 2009321267A1
Authority
US
United States
Prior art keywords
surface treating
copper layer
plastic products
plastic substrate
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/333,435
Inventor
Jong-Yi Su
Cheng-Shin Chen
Ren-Ning Wang
Yun-Chen Mao
Zhi-Feng Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Futaihong Precision Industry Co Ltd
FIH Hong Kong Ltd
Original Assignee
Shenzhen Futaihong Precision Industry Co Ltd
FIH Hong Kong Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Futaihong Precision Industry Co Ltd, FIH Hong Kong Ltd filed Critical Shenzhen Futaihong Precision Industry Co Ltd
Assigned to SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED reassignment SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHENG-SHIN, LIN, Zhi-feng, MAO, Yun-chen, SU, JONG-YI, WANG, REN-NING
Publication of US20090321267A1 publication Critical patent/US20090321267A1/en
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes

Definitions

  • the present invention relates to methods for surface treating plastic products, particularly to a method for surface treating plastic products by which the plastic products can present both shiny appearance and dull appearance.
  • electroplating or painting is typically employed to treat plastic housings of electronic devices, e.g., mobile telephones, personal digital assistants, or MP3 players.
  • the plastic housings treated by electroplating may be favored by consumers because of their attractive metal appearance and good abrasive resistance.
  • a method for surface treating plastic products may include following steps.
  • a plastic substrate is provided.
  • the substrate may be made of electroplatable material, such as acrylonitrile-butadiene-styrene (ABS) resin.
  • ABS acrylonitrile-butadiene-styrene
  • a pretreatment may be applied to the plastic substrate.
  • the substrate is degreased using an alkali-based cleaning solution to remove any oil stains from its surface.
  • the substrate is etched to roughen the surface.
  • the etching treatment can improve adhesion of the surface of the substrate.
  • the degreased substrate can be immersed in a heated mixed solution of chromic acid and sulfuric acid. Then, the etched substrate is activated in an acidic colloid solution containing a noble metal compound (e.g., palladium compound).
  • a noble metal compound e.g., palladium compound
  • At least one electroconductive coating is formed on the surface of the pretreated substrate by a method of electro-less plating.
  • a copper coating may be deposited on the substrate.
  • a nickel coating may be further formed on the copper coating.
  • a copper layer is formed on the electroconductive coating by electroplating.
  • the electroplating procedure is carried out, for example, in an bath containing copper sulfate or cupric pyrophosphate.
  • the substrate having the copper layer is immersed in a protecting solution containing about 20 to 120 g/l (gram per liter) potassium dichromate for about 1 to 5 minutes.
  • This process protects the electroplated copper layer from oxidation and forming an oxide coating which may reduce adhesion of the copper layer to a subsequent plating coating.
  • the electrolysis process is carried out in the protecting solution using a graphite or carbon board as an anode, the substrate as a cathode, and the protecting solution as an electrolyte, at a current density in an approximate range from 0.5 to 2 A/dm2 (ampere per square decimeter).
  • the copper layer is partially etched using a laser to form a rough area.
  • the rough area can be in any form of figures, signs, and characters.
  • the substrate is degreased using an alkali-based cleaning solution to remove oil stains and/or other smudginess.
  • the substrate is cleaned using a solution containing hydrochloric acid and sulfuric acid to neutralize the residual alkali-based cleaning solution on the substrate.
  • a top coating is formed on the copper layer by electroplating.
  • the material of the top coating may be selected from chrome, copper-tin alloy, nickel, zinc and tin.
  • the copper layer forms a rough area
  • the area of the top coating corresponding to the rough area presents a dusky appearance
  • the other portion of the top coating presents a shiny appearance

Abstract

A method for surface treating plastic products is provided. The method includes the steps of providing a plastic substrate, the plastic substrate being made of electroplatable material; forming at least one electroconductive coating on the plastic substrate surface by electro-less plating; forming a copper layer on the electroconductive coating by electroplating; partially etching the surface of the copper layer using a laser to form a rough area; and forming a top coating on the copper layer by electroplating. Both shiny appearance and dusky appearance of the plastic substrate can be present by this method.

Description

    BACKGROUND
  • 1. Field of the Invention
  • The present invention relates to methods for surface treating plastic products, particularly to a method for surface treating plastic products by which the plastic products can present both shiny appearance and dull appearance.
  • 2. Description of Related Art
  • Various surface decorating technologies are used in manufacturing housings of electronic devices. For example, in order to obtain decorative effect, electroplating or painting is typically employed to treat plastic housings of electronic devices, e.g., mobile telephones, personal digital assistants, or MP3 players. The plastic housings treated by electroplating may be favored by consumers because of their attractive metal appearance and good abrasive resistance.
  • However, surfaces of the plastic housings treated by electroplating usually only present one of the shiny appearance or dull appearance. Thus, electroplated plastic housings are static in appearance and so are not as attractive as they could be.
  • Therefore, there is room for improvement within the art.
    • DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
  • In a present embodiment, a method for surface treating plastic products may include following steps.
  • In a first step, a plastic substrate is provided. The substrate may be made of electroplatable material, such as acrylonitrile-butadiene-styrene (ABS) resin.
  • In a second step, a pretreatment may be applied to the plastic substrate. During the pretreatment step, the substrate is degreased using an alkali-based cleaning solution to remove any oil stains from its surface. After degreasing, the substrate is etched to roughen the surface. The etching treatment can improve adhesion of the surface of the substrate. During etching treatment, for example, the degreased substrate can be immersed in a heated mixed solution of chromic acid and sulfuric acid. Then, the etched substrate is activated in an acidic colloid solution containing a noble metal compound (e.g., palladium compound).
  • In a third step, at least one electroconductive coating is formed on the surface of the pretreated substrate by a method of electro-less plating. For example, a copper coating may be deposited on the substrate. It is understood that a nickel coating may be further formed on the copper coating.
  • In a fourth step, a copper layer is formed on the electroconductive coating by electroplating. The electroplating procedure is carried out, for example, in an bath containing copper sulfate or cupric pyrophosphate.
  • In a fifth step, the substrate having the copper layer is immersed in a protecting solution containing about 20 to 120 g/l (gram per liter) potassium dichromate for about 1 to 5 minutes. This process protects the electroplated copper layer from oxidation and forming an oxide coating which may reduce adhesion of the copper layer to a subsequent plating coating. It is better to employ an electrolysis process to treat the substrate during the fifth step. The electrolysis process is carried out in the protecting solution using a graphite or carbon board as an anode, the substrate as a cathode, and the protecting solution as an electrolyte, at a current density in an approximate range from 0.5 to 2 A/dm2 (ampere per square decimeter).
  • In a sixth step, the copper layer is partially etched using a laser to form a rough area. The rough area can be in any form of figures, signs, and characters.
  • In a seventh step, the substrate is degreased using an alkali-based cleaning solution to remove oil stains and/or other smudginess.
  • In a eighth step, the substrate is cleaned using a solution containing hydrochloric acid and sulfuric acid to neutralize the residual alkali-based cleaning solution on the substrate.
  • In a ninth step, a top coating is formed on the copper layer by electroplating. The material of the top coating may be selected from chrome, copper-tin alloy, nickel, zinc and tin.
  • As mentioned above, because the copper layer forms a rough area, the area of the top coating corresponding to the rough area presents a dusky appearance, and the other portion of the top coating presents a shiny appearance.
  • It should be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (11)

1. A method for surface treating plastic products comprising:
providing a plastic substrate, the plastic substrate being made of electroplatable material;
forming at least one electroconductive coating on a surface of the plastic substrate by electro-less plating;
forming a copper layer on the electroconductive coating by electroplating;
partially etching the copper layer using a laser to form a rough area; and forming a top coating on the copper layer by electroplating.
2. The method for surface treating plastic products as claimed in claim 1, further comprising dipping the plastic substrate with the copper layer in a protecting solution before etching the copper layer.
3. The method for surface treating plastic products as claimed in claim 2, wherein the protecting solution contains about 20 to 120 g/l potassium dichromate.
4. The method for surface treating plastic products as claimed in claim 2, wherein the plastic substrate with the copper layer is immersed in the protecting solution for about 1 to 5 minutes.
5. The method for surface treating plastic products as claimed in claim 2, further comprising employing an electrolysis process to treat the copper layer using the plastic substrate as a cathode, the protecting solution as the electrolyte while the plastic substrate with the copper layer is immerged in the protecting solution.
6. The method for surface treating plastic products as claimed in claim 5, wherein the electrolysis process is carried out at a current density in an approximate range from 0.5 to 2 A/dm2.
7. The method for surface treating plastic products as claimed in claim 2, further comprising a step of degreasing the plastic substrate after etching the copper layer.
8. The method for surface treating plastic products as claimed in claim 1, wherein the at least one electroconductive coating includes a copper coating.
9. The method for surface treating plastic products as claimed in claim 8, wherein the at least one electroconductive coating further includes a nickel coating formed on the copper coating.
10. The method for surface treating plastic products as claimed in claim 1, wherein the top coating is selected from a group consisting of chrome, copper-zinc alloy, nickel, zinc, and tin.
11. The method for surface treating plastic products as claimed in claim 1, further comprising degreasing, etching, and activating the plastic substrate surface before the electro-less plating.
US12/333,435 2008-06-27 2008-12-12 Method for surface treating plastic products Abandoned US20090321267A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810302387.0 2008-06-27
CN2008103023870A CN101613862B (en) 2008-06-27 2008-06-27 Plastic surface processing method

Publications (1)

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US20090321267A1 true US20090321267A1 (en) 2009-12-31

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CN (1) CN101613862B (en)

Cited By (1)

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US20120211370A1 (en) * 2011-02-22 2012-08-23 Ibiden Co., Ltd. Method for manufacturing wiring board

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CN102586828A (en) * 2012-04-01 2012-07-18 惠州建邦精密塑胶有限公司 Electroplating process
FR3004735B1 (en) * 2013-04-23 2015-07-03 Dourdin PROCESS FOR REALIZING METALLIC PARTS
CN103433622A (en) * 2013-08-22 2013-12-11 广西容县风采印业有限公司 Method for using laser for marking plastic film
CN104014468B (en) * 2014-06-16 2016-06-08 佛山市宝力马植物纤维制品有限公司 Realize the processing treatment technique of the bright mist in plastic shell surface with body
CN104972283B (en) * 2015-07-16 2017-06-16 广东欧珀移动通信有限公司 The method for improving mobile terminal metal outer frame appearance power
CN106435676B (en) * 2016-11-25 2019-02-26 捷开通讯(深圳)有限公司 The surface treatment method of electronic equipment metal shell
CN111372369B (en) * 2018-12-25 2023-07-07 奥特斯科技(重庆)有限公司 Component carrier with component shielding and method for producing the same
CN110996639B (en) * 2019-11-15 2021-06-11 上海阿莱德实业股份有限公司 Low-cost non-metal shielding cover and preparation method thereof
CN111343793A (en) * 2020-03-12 2020-06-26 电子科技大学 Surface metallization method for printed circuit composite dielectric substrate
CN114919139A (en) * 2022-05-27 2022-08-19 温州金瑞祥金银制品有限公司 Matte forming method for artware

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US20120211370A1 (en) * 2011-02-22 2012-08-23 Ibiden Co., Ltd. Method for manufacturing wiring board

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Publication number Publication date
CN101613862A (en) 2009-12-30
CN101613862B (en) 2011-07-27

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AS Assignment

Owner name: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., C

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SU, JONG-YI;CHEN, CHENG-SHIN;WANG, REN-NING;AND OTHERS;REEL/FRAME:021969/0907

Effective date: 20081209

Owner name: FIH (HONG KONG) LIMITED, HONG KONG

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SU, JONG-YI;CHEN, CHENG-SHIN;WANG, REN-NING;AND OTHERS;REEL/FRAME:021969/0907

Effective date: 20081209

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION