CN110996639B

CN110996639B - Low-cost non-metal shielding cover and preparation method thereof

Info

Publication number: CN110996639B
Application number: CN201911121397.9A
Authority: CN
Inventors: 崔国超; 唐荣政
Original assignee: Shanghai Allied Industrial Co ltd
Current assignee: Shanghai Allied Industrial Co ltd
Priority date: 2019-11-15
Filing date: 2019-11-15
Publication date: 2021-06-11
Anticipated expiration: 2039-11-15
Also published as: CN110996639A

Abstract

A preparation method of a low-cost non-metal shielding case and a metal shielding case prepared by the preparation method relate to electrons. A preparation method of a low-cost non-metallic shielding case comprises the following steps: injection molding PPS + 40% GF plastic particles to obtain a plastic substrate; step two: plating copper on the outer surface of the plastic substrate to form a chemical copper plating layer; step three: electroplating copper outside the chemical copper plating layer to form an electroplated copper layer; step four: electroplating nickel outside the electroplated copper layer to form an electroplated nickel layer; step five: plating tin outside the electroplated nickel layer to form an electroplated tin layer. The low-cost non-metallic shielding cover obtained by the preparation method disclosed by the patent is low in cost, and can save more than 30% of cost compared with a metallic shielding cover.

Description

Low-cost non-metal shielding cover and preparation method thereof

Technical Field

The invention relates to the field of electronics, in particular to an electromagnetic shielding case.

Background

In order to ensure stable operation of electronic components, a shielding case is usually required to cover the operating electronic components to reduce the influence of electromagnetic waves on the electronic components. The shielding cover is usually made of metal materials such as stainless steel, magnesium-aluminum alloy and the like, and the excellent conduction performance of the metal materials can achieve a good shielding effect. However, the metal shield is expensive, and the manufacturing process is complicated, especially for large-sized shields, the cost is very high.

Disclosure of Invention

The invention aims to provide a method for preparing a low-cost non-metal shielding case so as to solve the problems.

It is also an object of the present invention to provide a low cost non-metallic shielding cage.

A preparation method of a low-cost non-metallic shielding case is characterized by comprising the following steps:

the method comprises the following steps: carrying out injection molding on PPS + 40% GF plastic particles to obtain a plastic substrate;

step two: plating copper on the outer surface of the plastic substrate to form a chemical copper plating layer;

step three: electroplating copper outside the chemical copper plating layer to form an electroplated copper layer;

step four: electroplating nickel outside the electroplated copper layer to form an electroplated nickel layer;

step five: plating tin outside the electroplated nickel layer to form an electroplated tin layer.

Before the second step, the plastic substrate may be immersed in an activating agent for activation treatment. Or spraying an activating agent on the surface of the plastic substrate to perform activation treatment.

The low-cost non-metallic shield cover is characterized by comprising a plastic substrate, wherein a chemical copper plating layer covers the outer surface of the plastic substrate, an electric copper plating layer covers the outer surface of the chemical copper plating layer, an electric nickel plating layer covers the outer surface of the electric copper plating layer, and an electric tin plating layer covers the outer surface of the electric nickel plating layer.

The plastic substrate is obtained by injection molding PPS + 40% GF plastic particles.

The PPS and 40 percent of GF plastic particles are polyphenylene sulfide with the glass fiber content of 40 percent.

The thickness of electroplated copper layer is not less than 10um, the thickness of electroplated nickel layer is not less than 5um, the thickness of electroplated tin layer is not less than 3 um.

Has the advantages that:

1. the product has high strength and light weight, and the weight can be reduced by more than 40%.

2. The product preparation process is mature, and the yield is high.

3. The shielding performance can reach over 90 db;

4. the cost is low, and the cost can be saved by more than 30% compared with a metal shielding cover.

Drawings

FIG. 1 is a bottom view of a plastic substrate;

fig. 2 is a top view of a plastic substrate.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific drawings.

A preparation method of a low-cost non-metallic shielding case comprises the following steps: injection molding PPS + 40% GF plastic particles to obtain a plastic substrate; step two: plating copper on the outer surface of the plastic substrate to form a chemical copper plating layer; step three: electroplating copper outside the chemical copper plating layer to form an electroplated copper layer; step four: electroplating nickel outside the electroplated copper layer to form an electroplated nickel layer; step five: plating tin outside the electroplated nickel layer to form an electroplated tin layer. Before the second step, the plastic substrate may be immersed in an activating agent for activation treatment. Or spraying an activating agent on the surface of the plastic substrate to perform activation treatment. The thickness of the electroplated copper layer is not less than 10um, preferably 10um-14 um. The thickness of the electroplated nickel layer is not less than 5um, preferably 5um-7 um. The thickness of the tin plating layer is not less than 3um, preferably 3um to 4 um.

The low-cost non-metallic shielding case comprises a plastic substrate, wherein a chemical copper plating layer covers the outer surface of the plastic substrate, an electric copper plating layer covers the outer surface of the chemical copper plating layer, an electric nickel plating layer covers the outer surface of the electric copper plating layer, and an electric tin plating layer covers the outer surface of the electric nickel plating layer. The thickness of the electroplated copper layer is not less than 10um, preferably 10um-14 um. The thickness of the electroplated nickel layer is not less than 5um, preferably 5um-7 um. The thickness of the tin plating layer is not less than 3um, preferably 3um to 4 um.

With regard to the structure of the plastic substrate, refer to fig. 1 and 2

The plastic substrate can be selected to have different structures according to needs. Preferably, the plastic substrate comprises a bottom plate 1 in a square plate shape, and side plates 2 surrounding the bottom plate 1, wherein the side plates 2 are perpendicular to the bottom plate 1; the plastic base plate further comprises a support plate located within the side plate 2, the support plate being perpendicular to the base plate 1. The support plate is composed of a transverse support plate 3 and a longitudinal support plate. The number of the transverse supporting plates 3 is two, the two transverse supporting plates 3 are arranged in parallel, and two ends of each transverse supporting plate are connected with the side plate 2, so that the space in the side plate 2 is divided into three subspaces; two longitudinal supporting plates are respectively arranged in each of the three subspaces, the longitudinal supporting plates are parallel to each other, and two ends of each longitudinal supporting plate are respectively connected with one of the side plates 2 or the transverse supporting plates 3, so that the space in the side plate 2 is divided into nine subspaces; the nine subspaces are not all equal in area. The design with the areas not being equal can not only make the patent adapt to the shielded outlines of different upper end faces, and finally make the shielded object locate in a certain subspace, on one hand, the shielded position can be limited, on the other hand, the side wall of the subspace can be used for shielding and protecting the side face of the shielded object. The plastic substrate further comprises connecting columns, at least one connecting column 4 is arranged in each of the nine subspaces, and bolt holes are formed in the connecting columns 4. Each connecting column 4 is connected with the side wall of at least one of the nine subspaces. The bottom plate 1 is preferably provided with openings 5 which penetrate through the bottom plate at positions corresponding to the bolt holes and are communicated with the bolt holes. During electroplating or chemical plating, the opening 5 can be used as a hole position for hanging or fixing the plastic substrate, so that the electroplating or chemical plating operation is convenient. In addition, the design of the opening 5 is convenient for a user to screw in the bolt from top to bottom and fix the patent at a required place. The upper port of the opening 5 is preferably in a bell mouth shape, and the caliber of the opening is gradually reduced from top to bottom. The design of horn mouth form, on the one hand the convenience covers comparatively even change cladding material or plating layer in horn mouth department, and on the other hand, along with the tightening of bolt, the distance between nut and the horn mouth reduces gradually, until laminating completely, is favorable to blockking electromagnetic signal.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A preparation method of a low-cost non-essential metal shielding case is characterized by comprising the following steps:

the method comprises the following steps: injection molding PPS + 40% GF plastic particles to obtain a plastic substrate;

step five: plating tin outside the electroplated nickel layer to form an electroplated tin layer;

the plastic substrate comprises a bottom plate in a square plate shape and side plates surrounding the bottom plate, and the side plates are perpendicular to the bottom plate;

the plastic substrate further comprises a supporting plate positioned in the side plate, and the supporting plate is perpendicular to the bottom plate. The supporting plates are composed of two transverse supporting plates and two longitudinal supporting plates, the two transverse supporting plates are arranged in parallel, and the two ends of each transverse supporting plate are connected with the side plate, so that the space in the side plate is divided into three subspaces; two longitudinal supporting plates are respectively arranged in each of the three subspaces, the longitudinal supporting plates are parallel to each other, and two ends of each longitudinal supporting plate are respectively connected with one of the side plates or the transverse supporting plates, so that the space in each side plate is divided into nine subspaces; the nine subspaces are not all equal in area.

2. The method of claim 1, wherein before the second step, the plastic substrate is immersed in an activating agent for activation or an activating agent is sprayed on the surface of the plastic substrate for activation.

3. The method for preparing the low-cost non-metallic shielding case according to claim 1, wherein the PPS + 40% GF plastic particles are polyphenylene sulfide with a glass fiber content of 40%.

4. The method of claim 1, wherein the thickness of the copper electroplating layer is not less than 10um, the thickness of the nickel electroplating layer is not less than 5um, and the thickness of the tin electroplating layer is not less than 3 um.

5. The low-cost non-metallic shielding case is characterized by comprising a plastic substrate, wherein a chemical copper plating layer covers the outer surface of the plastic substrate, an electric copper plating layer covers the outer surface of the chemical copper plating layer, an electric nickel plating layer covers the outer surface of the electric copper plating layer, and an electric tin plating layer covers the outer surface of the electric nickel plating layer;

the plastic base plate also comprises a supporting plate positioned in the side plate, and the supporting plate is vertical to the bottom plate;

the supporting plates are composed of two transverse supporting plates and two longitudinal supporting plates, the two transverse supporting plates are arranged in parallel, and the two ends of each transverse supporting plate are connected with the side plate, so that the space in the side plate is divided into three subspaces; two longitudinal supporting plates are respectively arranged in each of the three subspaces, the longitudinal supporting plates are parallel to each other, and two ends of each longitudinal supporting plate are respectively connected with one of the side plates or the transverse supporting plates, so that the space in each side plate is divided into nine subspaces; the nine subspaces are not all equal in area.

6. The low-cost non-essential metal shielding case according to claim 5, wherein the plastic substrate is injection molded from PPS + 40% GF plastic pellets.

7. The low-cost non-metallic shield of claim 5, wherein the thickness of the copper electroplating layer is not less than 10um, the thickness of the nickel electroplating layer is not less than 5um, and the thickness of the tin electroplating layer is not less than 3 um.