CN204392768U - There is the housing of shielding construction and comprise the electronic equipment with shielding construction housing - Google Patents
There is the housing of shielding construction and comprise the electronic equipment with shielding construction housing Download PDFInfo
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- CN204392768U CN204392768U CN201520060437.4U CN201520060437U CN204392768U CN 204392768 U CN204392768 U CN 204392768U CN 201520060437 U CN201520060437 U CN 201520060437U CN 204392768 U CN204392768 U CN 204392768U
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- housing
- shielding construction
- metal
- shielding
- circuit board
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Abstract
The utility model relates to the housing with shielding construction and comprises the electronic equipment with shielding construction housing, is specifically related to a kind of housing with shielding construction and comprises: substrate; Shielding part, it is that the sidewall vertically extended from substrate is formed, and described sidewall and described substrate surround the inner space for holding electronic components and parts; Wherein, the inwall of described inner space and the end face of described sidewall all have the coat of metal.The utility model by directly arranging shielding construction on housing, makes itself and described housing one-body molded, and, by laser direct structuring technique, shielded metal is plated to shielding construction inside, reaches the effect of shielding.The utility model saves the space waste caused because of increase radome, thus makes electronic product do less and less.
Description
Technical field
The utility model belongs to electronic devices and components accessory field, is specifically related to a kind ofly have the housing of shielding construction and comprise the electronic equipment with shielding construction housing.
Background technology
Existing electronic product does less and less, and the space that the inside leaves electronic devices and components for is also fewer and feweri.Radome, is mainly used in mobile phone, the electronics field such as GPS, is the parts preventing electromagnetic interference (EMI), the element on pcb board and LCM are played to shielding action.The material of radome generally adopts stainless steel that 0.2mm is thick and foreign copper-nickel alloy to be material, and wherein foreign copper-nickel alloy is a kind of metal shield materials of easily upper tin.
At present, when the electronic devices and components of circuit board top need to shield time, additionally can add a radome, be welded on wiring board by surface mount process, thus play the effect of shielding, but this radome has occupied certain space.The shortcoming of prior art: the thickness increasing electronic product, in general, the thickness of radome is between 0.1 ~ 0.3mm, add radome to need to dodge electronic devices and components, thus the gap produced, and the gap of radome and back cover, altogether approximately need the space of 0.4-1.5mm to use, make the inner space of electronic product cause waste.
Utility model content
An object of the present utility model solves at least the problems referred to above or defect, and provide the advantage will illustrated at least below.
The utility model also has an object to there is provided a kind of housing with shielding construction, and it can save the inner space waste caused because radome needs of electronic product.
The utility model also has an object to there is provided a kind of laser direct structuring technique directly to do the coat of metal at housing upper face, reach the shield effectiveness to electronic devices and components.
In order to realize, according to these objects of the present utility model and other advantage, providing a kind of housing with shielding construction, comprising:
Substrate;
Shielding part, it is that the sidewall vertically extended from substrate is formed, and described sidewall and described substrate surround the inner space for holding electronic components and parts;
Wherein, the inwall of described inner space and the end face of described sidewall all have the coat of metal.
Preferably, wherein, shielded metal is plated in the inwall of described inner space by the described coat of metal by laser direct structuring technique, and the end face of described sidewall.
Preferably, wherein, the described coat of metal to be nickel and copper mass ratio be 1: 1 metal mixed coating.
Preferably, wherein, the thickness of the described coat of metal is 2 μm-50 μm.
Preferably, wherein, described inner space has the shape coordinating described electronic devices and components.
Preferably, wherein, described sidewall extends to the circuit board being provided with electronic devices and components, and abuts described circuit board.
Preferably, wherein, the curved shape of described substrate periphery, it is inner that it is inserted into the fastener that described circuit board is arranged.
Preferably, wherein, described fastener is shell fragment or metal handgrip.
The electronic equipment that the purpose of this utility model can also have a housing of shielding construction by a kind of outfit realizes, and this electronic equipment comprises the housing with shielding construction, electronic devices and components and circuit board;
Wherein, described electronic devices and components are fixedly installed on described circuit board.
Preferably, wherein, described circuit board is provided with fastener, described fastener is shell fragment or metal handgrip.
The beneficial effects of the utility model
1, the utility model by directly arranging shielding construction on housing, makes itself and described housing one-body molded, thus save the space waste caused because of increase radome;
2, shielded metal is plated to shielding construction inside by laser direct structuring technique by the utility model, reaches the effect of shielding;
3, the utility model provide nickel and copper mass ratio be 1: 1 metal mixed coating, shield effectiveness is better;
4, the outfit that the utility model provides has the electronic equipment of the housing of shielding construction, saves because the space loss needing shielding construction to cause, and then makes electronic product compact better.
Accompanying drawing explanation
Fig. 1 is the structural representation with the housing of shielding construction described in the utility model;
Fig. 2 is fastener structural representation described in the utility model;
Fig. 3 is the structural representation of the coat of metal described in the utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail, can implements according to this with reference to specification word to make those skilled in the art.
Should be appreciated that used hereinly such as " to have ", one or more other element do not got rid of in " comprising " and " comprising " term or the existence of its combination or interpolation.
Laser direct structuring technique (LDS)-(Laser-Direct-structuring) utilizes computer according to the motion of the TRAJECTORY CONTROL laser of conductive pattern, being thrown by laser shines on molded three-dimensional plastic device, within the time in a few second, activated circuit pattern.On shaping plastics, utilize laser technology on support, directly change plating and form metal level.So a kind of technology, can directly by radium-shine for the coat of metal on the shell of electronic product.
Figure 1 show according to a kind of implementation of the present utility model, comprising:
Substrate 1;
Shielding part 6, it is that the sidewall 2 vertically extended from substrate 1 is formed, and described sidewall 2 and described substrate 1 surround the inner space for holding electronic components and parts;
Directly shielding construction 6 is set on the substrate 1 of housing, makes itself and described housing one-body molded, thus more save space than the situation that housing and radome separate, namely save because increase the space waste that radome causes; At least save the space of 0.4mm-1.5mm.
The inwall of described inner space and the end face of described sidewall all have the coat of metal 3;
Shielded metal is plated in the inwall of described inner space by the described coat of metal 3 by LDS technology, and the end face of described sidewall.Only plastic casing and plastic shielded structure is only had can not to play the effect of screening electron components and parts, plating coating 3 just can reach the effect of shielding, wherein, the described coat of metal 3 to be nickel and copper mass ratio be 1: 1 metal mixed coating, this metal mixed coating is under the prerequisite with shielding action, color and luster is attractive in appearance, tensile strength is high, ductility is good, anticorrosive, is highly suitable for mobile phone shielding, electronic equipment shielding etc.
The thickness of the coat of metal 3 in the present embodiment is 10 μm, reduces a lot than the thickness 0.1mm ~ 0.3mm of existing radome, thus saves the inner space waste caused because shielding needs of electronic product, makes electronic product do less and less.
The inner space of shielding construction 6 has the shape coordinating described electronic devices and components, is a kind of shape coordinating the shielding construction 6 of electronic devices and components shape in the present embodiment as shown in Figure 1; As shown in Figure 3 for the coat of metal 3 coordinates the shape of shielding construction 6, it is the inwall of the inner space of shielding construction 6, and the structure in the end face besieged city of described sidewall 2.This structure cooperatively interacted, on the one hand, shielding construction 6 can be avoided larger than electronic devices and components volume and the space waste caused, on the other hand, it is inner that the structure cooperatively interacted makes shielding construction 6 that electronic devices and components are just contained in shielding construction 6 completely, add upper side wall 2 and extend to the circuit board being provided with electronic devices and components, and abut circuit board, entirety just makes shielding construction 6 to try one's best and electronic devices and components is sealed in the inner space of shielding construction 6, play shielding action, prevent electromagnetic radiation from entering from the place of shielding construction 6 and circuit board contacts.
In addition, shielding construction and circuit board only abut and can not be completely fixed, so the periphery 4 of substrate 1 is set to arc shape, it is inserted into the inside of the fastener 5 that circuit board is arranged, come by stationary housing and circuit board, thus shielding construction with arrange electronic devices and components on circuit boards and be completely fixed and be housed in shielding construction inside, reach the effect of shielding.
Accompanying drawing 2 is a kind of implementation of fastener 5 in the present embodiment, is metal handgrip, and the periphery 4 of described substrate 1 is deep into the centre of described metal handgrip, and the hand-tight periphery 4 holding to described substrate 1 of metal catch, makes housing and circuit board be fixed together.
The electronic equipment that the purpose of this utility model can also have a housing of shielding construction by a kind of outfit realizes, and this electronic equipment comprises the housing with shielding construction, electronic devices and components and circuit board; Described electronic devices and components are fixedly installed on described circuit board, described circuit board are provided with fastener 5, and described fastener is shell fragment or metal handgrip.
To have the housing part application of shielding construction 6 in the electronic device, described electronic equipment is mobile phone, IPAD, computer, GPS etc. electronic product, extends the range of application of the housing with shielding construction.
The embodiment that the utility model also has other selective, such as, described fastener 5 is shell fragment, and the thickness of the described coat of metal is 2 μm or 50 μm and just no longer elaborates here.
Although embodiment of the present utility model is open as above, but it is not restricted to listed in specification and execution mode utilization, it can be applied to various applicable field of the present utility model completely, for those skilled in the art, can easily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit, the utility model is not limited to specific details and illustrates here and the legend described.
Claims (10)
1. there is a housing for shielding construction, it is characterized in that, comprising:
Substrate;
Shielding part, it is that the sidewall vertically extended from substrate is formed, and described sidewall and described substrate surround the inner space for holding electronic components and parts;
Wherein, the inwall of described inner space and the end face of described sidewall all have the coat of metal.
2. have the housing of shielding construction as claimed in claim 1, it is characterized in that, shielded metal is plated in the inwall of described inner space by the described coat of metal by laser direct structuring technique, and the end face of described sidewall.
3. have the housing of shielding construction as claimed in claim 2, it is characterized in that, the described coat of metal is the metal mixed coating that nickel and copper mass ratio are 1:1.
4. have the housing of shielding construction as claimed in claim 3, it is characterized in that, the thickness of the described coat of metal is 2 μm-50 μm.
5. have the housing of shielding construction as claimed in claim 1, it is characterized in that, described inner space has the shape coordinating described electronic devices and components.
6. have the housing of shielding construction as claimed in claim 5, it is characterized in that, described sidewall extends to the circuit board being provided with electronic devices and components, and abuts described circuit board.
7. have the housing of shielding construction as claimed in claim 6, it is characterized in that, the curved shape of described substrate periphery, it is inner that it is inserted into the fastener that described circuit board is arranged.
8. have the housing of shielding construction as claimed in claim 7, it is characterized in that, described fastener is shell fragment or metal handgrip.
9. there is the electronic equipment with the housing of shielding construction as described in any one of claim 1-8, it is characterized in that, comprise the housing with shielding construction, electronic devices and components and circuit board;
Wherein, described electronic devices and components are fixedly installed on described circuit board.
10. electronic equipment as claimed in claim 9, it is characterized in that, described circuit board is provided with fastener, described fastener is shell fragment or metal handgrip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520060437.4U CN204392768U (en) | 2015-01-28 | 2015-01-28 | There is the housing of shielding construction and comprise the electronic equipment with shielding construction housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520060437.4U CN204392768U (en) | 2015-01-28 | 2015-01-28 | There is the housing of shielding construction and comprise the electronic equipment with shielding construction housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204392768U true CN204392768U (en) | 2015-06-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520060437.4U Active CN204392768U (en) | 2015-01-28 | 2015-01-28 | There is the housing of shielding construction and comprise the electronic equipment with shielding construction housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204392768U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017133078A1 (en) * | 2016-02-02 | 2017-08-10 | 京东方科技集团股份有限公司 | Supporting structure for printed circuit board |
-
2015
- 2015-01-28 CN CN201520060437.4U patent/CN204392768U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017133078A1 (en) * | 2016-02-02 | 2017-08-10 | 京东方科技集团股份有限公司 | Supporting structure for printed circuit board |
| US10143078B2 (en) | 2016-02-02 | 2018-11-27 | Boe Technology Group Co., Ltd. | Support device for printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 16, cuixing Road, Hui Xing street, Yubei District, Chongqing Patentee after: Chongqing Lanan Technology Co.,Ltd. Address before: No. 13-2, Jiangying Road, Nanan District, Chongqing, Chongqing Patentee before: CHONGQING BLUEBANK COMMUNICATION TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |