CN108738229A - A kind of connection line structure on substrate and its electronic equipment - Google Patents
A kind of connection line structure on substrate and its electronic equipment Download PDFInfo
- Publication number
- CN108738229A CN108738229A CN201810956253.4A CN201810956253A CN108738229A CN 108738229 A CN108738229 A CN 108738229A CN 201810956253 A CN201810956253 A CN 201810956253A CN 108738229 A CN108738229 A CN 108738229A
- Authority
- CN
- China
- Prior art keywords
- substrate
- connection line
- line structure
- roughening treatment
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 238000007788 roughening Methods 0.000 claims abstract description 29
- 238000010586 diagram Methods 0.000 claims abstract description 19
- 238000010276 construction Methods 0.000 claims abstract description 12
- 230000006698 induction Effects 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 6
- 239000007921 spray Substances 0.000 claims description 9
- 229910052755 nonmetal Inorganic materials 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 239000000615 nonconductor Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- -1 is printed Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 22
- 239000002923 metal particle Substances 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000013528 metallic particle Substances 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000007639 printing Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910000635 Spelter Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
Abstract
The present invention relates to electronics fields; disclose the connection line structure on a kind of substrate; the connection line structure is included in the roughening treatment layer of substrate surface treated technique formation; and the contact structure that a structured metal layer forms line construction and the connection line construction is sprayed, prints, coats, adsorbs or covered on the roughening treatment layer, the structured metal layer is made of one or more layers metallic particles or powder coating.The present invention using spraying, printing, coating, adsorb the structured metal layer either covered and form the connection lines such as connecting line, circuit diagram, antenna or induction coil structure or EMC shielded layers on substrate, to substitute connecting line, circuit diagram, antenna, the induction coil on existing electronic equipment, EMC shielded layers, it is simple for process at low cost, production efficiency is high, and yield is high, water pollution-free, and connection line structure occupies little space, and optimizes the structure of electronic product.
Description
Technical field
The present invention relates to electronics field, more particularly to the connection line structure on a kind of substrate and its electronic equipment.
Background technology
In present electronic product, line map is typically to be printed on pcb board or FPC flexible PCBs, these line maps
May include antenna structure, circuit structure etc., the antenna or circuit structure on pcb board either FPC flexible PCBs with
The mode of external connection is complicated, occupies larger space；As FPC flexible PCBs need to use FPC connector.
In addition, LDS antenna technologies are laser direct structuring technique (Laser-Direct-structuring), calculating is utilized
Machine shines laser throwing on molded three-dimensional plastic device, according to the movement of the TRAJECTORY CONTROL laser of conductive pattern several
Second time in, activated circuit pattern.On molding plastic stent, directly changed on holder using laser technology
Plating forms metal antenna pattern；So as to directly by antenna it is radium-shine in terminal enclosure.LDS production costs are higher, work
Skill process has electroplating technology, has pollution to environment；For example, existing wireless charging receiving terminal (in mobile phone) coil overall volume compared with
Greatly, occupied space.
In addition, when electronic product is using the structures such as non-metal shell, in order to solve Electro Magnetic Compatibility (EMC,
Electromagnetic Compatibility) the problem of, shielded layer, existing screen can be generally set on non-metal shell
It covers layer and generally realizes that shield effectiveness is undesirable, and qualification rate is low and with high costs using artificial stickup electromagnetic shielding material.
Invention content
The invention discloses the connection line structures and its electronic equipment on a kind of substrate, it is intended to solve in pcb board or
FPC flexible PCBs form line map, and form or correct antenna on substrate and there are problems that technological deficiency, also
It is to solve the problems, such as EMC shield effectiveness and cost.
In order to solve the above technical problems, the present invention provides the connection line structure on a kind of substrate, the connecting line
Line structure is included in the roughening treatment layer of substrate surface treated technique formation, and sprays, prints on the roughening treatment layer
The contact structure that a structured metal layer forms line construction and the connection line construction is brushed, coats, adsorbs or covers, it is described
Structured metal layer is made of one or more layers metallic particles or powder coating.
Further, the area of the roughening treatment layer is more than or equal to the structured metal layer.
Optionally, the structured metal layer is spelter coating, Zinc alloy coated, tin coating, tin alloy coating, aluminized coating, aluminium
One or more combinations in alloy coat, copper coating or copper alloy coating constitute one or more layers.
Preferably, the line construction includes at least connecting line, circuit diagram, antenna or induction coil.The circuit knot
Structure can be multiple line segments, can be square box, can be hollow matrix, can also be circular ring type matrix etc..
Preferably, the substrate is non-metal base plate or including forming the non-metal base plate, table on metallic substrates
Layer be the substrate of insulator or the substrate that surface is non-conductor, in the roughening treatment layer of the surface of substrate formation, with
And a structured metal layer is sprayed, printed, coated, adsorb or covered on the roughening treatment layer and forms EMC shielded layers.
Preferably, the wire casing of the substrate forms the roughening treatment layer, spray, print on the roughening treatment layer,
It coats, adsorb the part for either covering at least structured metal layer formation EMC shielded layers or circuit connecting wire or antenna.
Preferably, the contact structure layer is circle, rectangle, triangle, ellipse, irregular polygon, line segment, circle
The constitutional diagram of arc, letter, word, symbol, any one shape in number or arbitrary various shapes.
Optionally, the width of the structured metal layer, area and thickness are respectively a, s and h, wherein a >=0.01mm, s
>=0.01mm2, h >=0.002mm.
Based on same inventive concept, the present invention also provides a kind of electronic equipment, the electronic equipment has on substrate,
The connection line structure is provided on the substrate.
Optionally, the electronic equipment includes smart mobile phone, tablet computer, intelligent appliance, intelligent wearable device and electricity
The electronic control part of device equipment.
Connection line structure on the substrate of the present invention and its electronic equipment, using the structured metal layer of spraying in substrate
Connecting line, circuit diagram, antenna or induction coil connection line structure or EMC shieldings are formed on (shell of such as electronic equipment)
Layer, to substitute the existing connecting line formed on an electronic device, circuit diagram, antenna, induction coil or EMC shielded layers, technique
Simple at low cost, production efficiency is high, and yield is high, water pollution-free, and connection line structure occupies little space, and optimizes electronics production
The structure of product.
Description of the drawings
Attached drawing is to be used to provide further understanding of the present invention, an and part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but should not constitute the limitation of the present invention, in the accompanying drawings：
Fig. 1 is the structural schematic diagram one of the connection line structure on substrate in the present invention；
Fig. 2 is the structural schematic diagram two of the connection line structure on substrate in the present invention；
Fig. 3 is the structural schematic diagram three of the connection line structure on substrate in the present invention；
Fig. 4 is the structural schematic diagram four of the connection line structure on substrate in the present invention；
Fig. 5 is the structural schematic diagram five of the connection line structure on substrate in the present invention；
Fig. 6 is the schematic cross-section of structured metal layer in the present invention；
Fig. 7 is EMC shielding layer structure schematic diagrames on a kind of substrate of the present invention；
Fig. 8 is another board structure schematic diagram of the present invention.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
Embodiment 1
As shown in figure 5, the connection line structure on a kind of substrate provided by the present invention, the connection line structure include
In the roughening treatment layer 101 that substrate surface treated technique is formed, and sprays, prints, applies on the roughening treatment layer 101
Cover, adsorb or cover the contact structure that a structured metal layer forms line construction and the connection line construction, the metal
Structure sheaf is made of one or more layers metallic particles or powder coating.
Wherein, the area of the roughening treatment layer 101 is more than or equal to the structured metal layer 103.
Optionally, substrate 10 can be that plastic casing, glass filament case, ceramic shell etc. are various nonconducting nonmetallic
Substrate, can also be on metallic substrates by forming structured metal layer to improve electric property or substrate be composite material base
Plate etc..
When substrate 10 is non-metal base plate, need to coat a zinc grain coating on the roughening treatment layer 101 of substrate 10
Or zinc powder coating 102 so that structured metal layer 103 can form line pattern in substrate 10.Structured metal layer 103 needs
When 10 surface of substrate coats or sprays, in order to ensure between the two can stable bond, need using zinc grain coating or
Person's zinc powder coating 102 is used as " binder ", to form stable structure sheaf.Therefore, at this point, structured metal layer forms multilayer
Structure.
Optionally, the structured metal layer 103 be spelter coating, Zinc alloy coated, tin coating, tin alloy coating, aluminized coating,
One or more combinations in aluminium alloy covered, copper coating or copper alloy coating constitute one or more layers.When substrate 10 is gold
When belonging to substrate, directly shape can be sprayed, is printed, is coated, adsorbed or be covered on the roughening treatment layer 101 of metal substrate
At structured metal layer 103.
Preferably, the structured metal layer 103 is the phosphor bronze particle or powder coating of one layer of fine and close Wear-resistant corrosion-resistant.
Phosphor bronze particle or powder coating make contact have good wearability, corrosion resistance, inoxidizability, to the company of greatly improving
The overall performance of link.
Preferably, the line construction includes at least connecting line, circuit diagram, antenna or induction coil
As shown in Figs. 1-5, the line construction can be multiple line segments, can be square box, can be hollow matrix,
It can be circular ring type matrix etc..Corresponding structured metal layer can form circuit road part circuit structure.Structured metal layer
It can be used as an antenna, antenna is not limited to LDS antennas, further includes printed antenna, in-mould injection antenna, double-shot moulding antenna
Deng；It can also be used as induction coil etc..
As shown in fig. 7, the substrate 10 is the substrate that surface is insulator or non-conductor, in metal substrate 110 or
120 surface of non-metal base plate formed roughening treatment layer, and on the roughening treatment layer spray, print, coating, absorption or
Person covers a structured metal layer 103 and forms EMC shielded layers.
As shown in figure 8, the wire casing 130 of the substrate 10 forms the roughening treatment layer, sprayed on the roughening treatment layer
It applies, print, coating, adsorbing and either cover an at least structured metal layer and form EMC shielded layers or circuit connecting wire or antenna
A part.The substrate is the substrate that surface is insulator or non-conductor, in the roughening that the surface of the substrate is formed
Process layer, and spray, print, coat, adsorb or cover a structured metal layer on the roughening treatment layer and form EMC screens
Cover layer.
Preferably, the contact structure layer is circle, rectangle, triangle, ellipse, irregular polygon, line segment, circle
The constitutional diagram of any one shape or arbitrary various shapes in arc, letter and number.Those skilled in the art can root
Quasi- figure is needed according to actual, it is not necessary to above-mentioned shape is sticked to, to match actual production.
Optionally, the width of the structured metal layer, area and thickness are respectively a, s and h, wherein a >=0.01mm, s
>=0.01mm2, h >=0.002mm.
Embodiment 2
Based on same inventive concept, the present invention also provides a kind of electronic equipment, the electronic equipment has aforesaid substrate,
The connection line structure being provided on the substrate in embodiment 1.
For those skilled in the art, above-mentioned electronic equipment includes smart mobile phone, tablet computer and intelligent appliance
And the electronic control part of intelligent wearable device or some other electrical equipment, and these selections are not limited to, secondly in text
Mentioned substrate can be that the shell of band plate may be individual center shells, herein can be according to people in the art
The specific requirements of member make a choice, and the protection not as the present invention limits.
Connection line structure on the substrate of the present invention and its electronic equipment, using the structured metal layer of spraying in substrate
Connecting line, circuit diagram, EMC shielded layers, antenna or induction coil connection line knot are formed on (shell of such as electronic equipment)
Structure, to substitute the existing connecting line formed on an electronic device, circuit diagram, EMC shielded layers, antenna or induction coil, work
Skill is simply at low cost, and production efficiency is high, and yield is high, water pollution-free, and connection line structure occupies little space, and optimizes electronics
The structure of product.
Embodiments of the present invention are explained in detail above in association with attached drawing, but the present invention is not limited to described implementations
Mode.For a person skilled in the art, in the case where not departing from the principle of the invention and spirit, to these embodiments
A variety of change, modification, replacement and modification are carried out, are still fallen in protection scope of the present invention.
Claims (10)
1. the connection line structure on a kind of substrate, which is characterized in that the connection line structure be included in substrate through surface at
The roughening treatment layer that science and engineering skill is formed, and spray, print, coat, adsorb or cover a gold medal on the roughening treatment layer
Belong to structure sheaf to form line construction and connect the contact structure of the line construction, the structured metal layer is by one or more layers gold
Metal particles or powder coating are constituted.
2. the connection line structure on substrate according to claim 1, which is characterized in that the area of the roughening treatment layer
More than or equal to the structured metal layer.
3. the connection line structure on substrate according to claim 2, which is characterized in that the structured metal layer is that zinc applies
One in layer, Zinc alloy coated, tin coating, tin alloy coating, aluminized coating, aluminium alloy covered, copper coating or copper alloy coating
Kind or multiple combinations constitute one or more layers.
4. the connection line structure on substrate according to claim 1, which is characterized in that the line construction includes at least
Connecting line, circuit diagram, antenna and induction coil.
5. the connection line structure on substrate according to claim 1, which is characterized in that the substrate is non-metal base plate
Either including forming the non-metal base plate on metallic substrates, the substrate that surface layer is insulator or surface be non-conductor
Substrate in the roughening treatment layer that the substrate surface is formed, and is sprayed on the roughening treatment layer, is printed, coating, adsorbing
Or it covers a structured metal layer and forms EMC shielded layers.
6. the connection line structure on substrate according to claim 1, which is characterized in that the wire casing of the substrate forms institute
Roughening treatment layer is stated, sprays, print, coat, adsorb or cover an at least structured metal layer shape on the roughening treatment layer
At EMC shielded layers.
7. the connection line structure on substrate according to claim 1, which is characterized in that the wire casing of the substrate forms institute
Roughening treatment layer is stated, sprays, print, coat, adsorb or covers an at least structured metal layer on the roughening treatment layer and exist
Circuit connecting wire is formed in the wire casing.
8. the connection line structure on substrate according to claim 1, which is characterized in that the contact structure layer is circle
It is any one in shape, rectangle, triangle, ellipse, irregular polygon, line segment, circular arc, letter, word, symbol, number
The constitutional diagram of kind shape or arbitrary various shapes.
9. the connection line structure on substrate according to claim 1, which is characterized in that the width of the structured metal layer
Degree, area and thickness are respectively a, s and h, wherein a >=0.01mm, s >=0.01mm2, h >=0.002mm.
10. a kind of electronic equipment, which is characterized in that the electronic equipment has on substrate, is arranged on the substrate just like power
Profit requires the connection line structure described in 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810956253.4A CN108738229A (en) | 2018-08-21 | 2018-08-21 | A kind of connection line structure on substrate and its electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810956253.4A CN108738229A (en) | 2018-08-21 | 2018-08-21 | A kind of connection line structure on substrate and its electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108738229A true CN108738229A (en) | 2018-11-02 |
Family
ID=63942961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810956253.4A Pending CN108738229A (en) | 2018-08-21 | 2018-08-21 | A kind of connection line structure on substrate and its electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108738229A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566356A (en) * | 2020-11-20 | 2021-03-26 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
| WO2023005691A1 (en) * | 2021-07-30 | 2023-02-02 | 长春捷翼汽车零部件有限公司 | Wiring harness production method, nozzle, and wiring harness |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2155058A5 (en) * | 1971-10-05 | 1973-05-18 | Thermonic Sa | |
| WO1998014040A2 (en) * | 1996-09-27 | 1998-04-02 | Jari Ruuttu | A method and a device for shielding an electrical component |
| CN103491755A (en) * | 2013-09-23 | 2014-01-01 | 张家港市锦丰润尔发五金塑料厂 | Plastic cover with electromagnetic shielding function and mobile phone using plastic cover |
| CN105811084A (en) * | 2014-12-31 | 2016-07-27 | 比亚迪股份有限公司 | Antenna module and preparation method thereof |
| CN209218444U (en) * | 2018-08-21 | 2019-08-06 | 东莞美景科技有限公司 | Connection line structure and its electronic equipment on a kind of substrate |
-
2018
- 2018-08-21 CN CN201810956253.4A patent/CN108738229A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2155058A5 (en) * | 1971-10-05 | 1973-05-18 | Thermonic Sa | |
| WO1998014040A2 (en) * | 1996-09-27 | 1998-04-02 | Jari Ruuttu | A method and a device for shielding an electrical component |
| CN103491755A (en) * | 2013-09-23 | 2014-01-01 | 张家港市锦丰润尔发五金塑料厂 | Plastic cover with electromagnetic shielding function and mobile phone using plastic cover |
| CN105811084A (en) * | 2014-12-31 | 2016-07-27 | 比亚迪股份有限公司 | Antenna module and preparation method thereof |
| CN209218444U (en) * | 2018-08-21 | 2019-08-06 | 东莞美景科技有限公司 | Connection line structure and its electronic equipment on a kind of substrate |
Non-Patent Citations (1)
| Title |
|---|
| 许先福, 潘振克, 黄正忠: "电磁屏蔽材料的种类及应用", 安全与电磁兼容, no. 03, pages 19 - 33 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566356A (en) * | 2020-11-20 | 2021-03-26 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
| WO2023005691A1 (en) * | 2021-07-30 | 2023-02-02 | 长春捷翼汽车零部件有限公司 | Wiring harness production method, nozzle, and wiring harness |
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Effective date of registration: 20190111 Address after: 523000 Sixth Floor, Building 2, 33 Tiannan Road, Shigucun, Tangxia Town, Dongguan City, Guangdong Province Applicant after: Dongguan Meijing Technology Co., Ltd. Address before: 518109 Silicon Valley Power & Automotive Electronics Pioneer Park A13 2nd Floor Factory Building, 334 Guiyue Road, Guanlanwabei Community, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province Applicant before: Shenzhen sanze Yongsheng Technology Co. Ltd. |
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