CN209218444U - Connection line structure and its electronic equipment on a kind of substrate - Google Patents
Connection line structure and its electronic equipment on a kind of substrate Download PDFInfo
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- CN209218444U CN209218444U CN201821350652.8U CN201821350652U CN209218444U CN 209218444 U CN209218444 U CN 209218444U CN 201821350652 U CN201821350652 U CN 201821350652U CN 209218444 U CN209218444 U CN 209218444U
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- substrate
- connection line
- layer
- line structure
- roughening treatment
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Abstract
The utility model relates to electronics fields; disclose the connection line structure and its electronic equipment on a kind of substrate; the connection line structure includes the roughening treatment layer formed in substrate surface treated technique; and the contact structure that a structured metal layer forms line construction and the connection line construction is sprayed, prints, coats, adsorbs or covered on the roughening treatment layer, the structured metal layer is made of one or more layers metallic particles or powder coating.The utility model forms the connection lines such as connecting line, circuit diagram, antenna or induction coil structure or EMC shielded layer using spraying, printing, coating, the structured metal layer for adsorbing or covering on substrate, to substitute connecting line, circuit diagram, antenna, the induction coil on existing electronic equipment, EMC shielded layer, simple process is at low cost, high production efficiency, yield is high, water pollution-free, and connection line structure occupies little space, and optimizes the structure of electronic product.
Description
Technical field
The utility model relates to electronics field, in particular to connection line structure and its electronics on a kind of substrate are set
It is standby.
Background technique
In present electronic product, line map is usually to be printed on pcb board or FPC flexible circuit board, these line maps
May include antenna structure, circuit structure etc., the antenna or circuit structure on pcb board or FPC flexible circuit board with
The mode of external connection is complicated, occupies larger space；As FPC flexible circuit board is needed using FPC connector.
In addition, LDS antenna technology is laser direct structuring technique (Laser-Direct-structuring), calculating is utilized
Machine shines laser throwing on molded three-dimensional plastic device, according to the movement of the TRAJECTORY CONTROL laser of conductive pattern several
Second time in, circuit pattern is activated.On molding plastic stent, directly changed on bracket using laser technology
Plating forms metal antenna pattern；So as to directly by antenna it is radium-shine in terminal enclosure.LDS production cost is higher, work
Skill process has electroplating technology, has pollution to environment；For example, existing wireless charging receiving terminal (in mobile phone) coil overall volume compared with
Greatly, occupied space.
In addition, when electronic product is using the structures such as non-metal shell, in order to solve Electro Magnetic Compatibility (EMC,
Electromagnetic Compatibility) the problem of, shielded layer, existing screen can be generally set on non-metal shell
It covers layer and generally realizes that shield effectiveness is undesirable, and qualification rate is low and with high costs using artificial stickup electromagnetic shielding material.
Utility model content
The utility model discloses the connection line structures and its electronic equipment on a kind of substrate, it is intended to solve in pcb board
Perhaps FPC flexible circuit board, which forms line map and antenna is formed or corrected on substrate, has technological deficiency, also
Have and exactly solves the problems, such as EMC shield effectiveness and cost.
In order to solve the above technical problems, the utility model provides the connection line structure on a kind of substrate, the company
Wiring line structure includes the roughening treatment layer formed in substrate surface treated technique, and is sprayed on the roughening treatment layer
Apply, print, coat, adsorb or cover the contact junction that a structured metal layer forms line construction and the connection line construction
Structure, the structured metal layer are made of one or more layers metallic particles or powder coating.
Further, the area of the roughening treatment layer is more than or equal to the structured metal layer.
Optionally, the structured metal layer is spelter coating, Zinc alloy coated, tin coating, tin alloy coating, aluminized coating, aluminium
One of alloy coat, copper coating or copper alloy coating or multiple combinations constitute one or more layers.
Preferably, the line construction includes at least connecting line, circuit diagram, antenna or induction coil.The route knot
Structure can be multiple line segments, can be square box, can be hollow matrix, be also possible to circular ring type matrix etc..
Preferably, the substrate is non-metal base plate or including forming the non-metal base plate, table on metallic substrates
Layer be insulator substrate or surface be non-conductor substrate, the substrate surface formation roughening treatment layer, with
And a structured metal layer is sprayed, printed, coated, adsorb or covered on the roughening treatment layer and forms EMC shielded layer.
Preferably, the wire casing of the substrate forms the roughening treatment layer, spray, print on the roughening treatment layer,
Coat, adsorb or cover one that an at least structured metal layer forms EMC shielded layer or circuit connecting wire or antenna
Point.
Preferably, the structured metal layer is circle, rectangle, triangle, ellipse, irregular polygon, line segment, circle
Arc, letter, text, symbol, number in any one shape or any various shapes constitutional diagram.
Optionally, the width of the structured metal layer, area and thickness are respectively a, s and h, wherein a >=0.01mm, and s >=
0.01mm2, h >=0.002mm.
Based on the same inventive concept, the utility model additionally provides a kind of electronic equipment, and the electronic equipment has substrate
On, it is provided with the connection line structure on the substrate.
Optionally, the electronic equipment includes smart phone, tablet computer, intelligent appliance, intelligent wearable device and electricity
The electronic control part of device equipment.
Connection line structure and its electronic equipment on the substrate of the utility model, using the structured metal layer of spraying in base
Connecting line, circuit diagram, antenna or induction coil connection line structure or EMC screen are formed on plate (shell of such as electronic equipment)
Layer is covered, to substitute the existing connecting line formed on an electronic device, circuit diagram, antenna, induction coil or EMC shielded layer, work
Skill is simply at low cost, high production efficiency, and yield is high, water pollution-free, and connection line structure occupies little space, and optimizes electronics
The structure of product.
Detailed description of the invention
Attached drawing is to be used to provide a further understanding of the present invention, and constitute part of specification, and following
Specific embodiment be used to explain the utility model together, but should not constitute the limitation of the utility model, in the accompanying drawings:
Fig. 1 is the structural schematic diagram one of the connection line structure in the utility model on substrate；
Fig. 2 is the structural schematic diagram two of the connection line structure in the utility model on substrate；
Fig. 3 is the structural schematic diagram three of the connection line structure in the utility model on substrate；
Fig. 4 is the structural schematic diagram four of the connection line structure in the utility model on substrate；
Fig. 5 is the structural schematic diagram five of the connection line structure in the utility model on substrate；
Fig. 6 is the schematic cross-section of structured metal layer in the utility model；
Fig. 7 be the utility model relates to a kind of substrate on EMC shielding layer structure schematic diagram；
Fig. 8 be the utility model relates to another schematic diagram of substrate structure.
Specific embodiment
Specific embodiment of the present utility model is described in detail below in conjunction with attached drawing.It should be understood that herein
Described specific embodiment is only used for describing and explaining the present invention, and is not meant to limit the utility model.
Embodiment 1
As shown in figure 5, the connection line structure on a kind of substrate provided by the utility model, the connection line structure
Including the roughening treatment layer 101 formed in substrate surface treated technique, and spraying, print on the roughening treatment layer 101
The contact structure that a structured metal layer forms line construction and the connection line construction is brushed, coats, adsorbs or covers, it is described
Structured metal layer is made of one or more layers metallic particles or powder coating.
Wherein, the area of the roughening treatment layer 101 is more than or equal to the structured metal layer 103.
Optionally, it is various nonconducting nonmetallic to can be plastic casing, glass filament case, ceramic shell etc. for substrate 10
Substrate can also improve electric property by forming structured metal layer on metallic substrates or substrate is composite material base
Plate etc..
When substrate 10 is non-metal base plate, need to coat a zinc grain coating on the roughening treatment layer 101 of substrate 10
Or zinc powder coating 102, enable structured metal layer 103 to form line pattern in substrate 10.Structured metal layer 103 needs
When 10 surface of substrate coats or sprays, in order to guarantee between the two can stable bond, need using zinc grain coating or
Person's zinc powder coating 102 is used as " binder ", to form stable structure sheaf.Therefore, at this point, structured metal layer forms multilayer
Structure.
Optionally, the structured metal layer 103 be spelter coating, Zinc alloy coated, tin coating, tin alloy coating, aluminized coating,
One of aluminium alloy covered, copper coating or copper alloy coating or multiple combinations constitute one or more layers.When substrate 10 is gold
When belonging to substrate, directly shape can be sprayed, is printed, is coated, adsorbed or covered on the roughening treatment layer 101 of metal substrate
At structured metal layer 103.
Preferably, the structured metal layer 103 is the phosphor bronze particle or powder coating of one layer of fine and close Wear-resistant corrosion-resistant.
Phosphor bronze particle or powder coating make contact have good wearability, corrosion resistance, inoxidizability, thus the company of greatly improving
The overall performance of link.
Preferably, the line construction includes at least connecting line, circuit diagram, antenna or induction coil
As shown in Figs. 1-5, the line construction can be multiple line segments, can be square box, can be hollow matrix,
It can be circular ring type matrix etc..Corresponding structured metal layer can form circuit road part circuit structure.Structured metal layer
It can be used as an antenna, antenna is not limited to LDS antenna, further includes printed antenna, in-mould injection antenna, double-shot moulding antenna
Deng；It can also be used as induction coil etc..
As shown in fig. 7, the substrate 10 is the substrate that surface is insulator or non-conductor, in metal substrate 110 or
120 surface of non-metal base plate formed roughening treatment layer, and on the roughening treatment layer spray, print, coating, absorption or
Person covers a structured metal layer 103 and forms EMC shielded layer.
As shown in figure 8, the wire casing 130 of the substrate 10 forms the roughening treatment layer, sprayed on the roughening treatment layer
It applies, print, coat, adsorb or covers an at least structured metal layer and form EMC shielded layer or circuit connecting wire or antenna
A part.The substrate is the substrate that surface is insulator or non-conductor, in the roughening that the surface of the substrate is formed
Process layer, and spray, print, coat, adsorb or cover a structured metal layer on the roughening treatment layer and form EMC screen
Cover layer.
Preferably, the structured metal layer is circle, rectangle, triangle, ellipse, irregular polygon, line segment, circle
The constitutional diagram of any one shape or any various shapes in arc, letter and number.Those skilled in the art can root
Quasi- figure is needed according to actual, it is not necessary to above-mentioned shape is sticked to, to match actual production.
Optionally, the width of the structured metal layer, area and thickness are respectively a, s and h, wherein a >=0.01mm, and s >=
0.01mm2, h >=0.002mm.
Embodiment 2
Based on the same inventive concept, the utility model additionally provides a kind of electronic equipment, and the electronic equipment has above-mentioned
Substrate, the connection line structure being provided in embodiment 1 on the substrate.
For those skilled in the art, above-mentioned electronic equipment includes smart phone, tablet computer and intelligent appliance
And the electronic control part of intelligent wearable device or some other electrical equipment, and these selections are not limited to, secondly in text
Mentioned substrate can may be individual center shells for the shell of band plate, herein can be according to those skilled in the art
The specific requirements of member make a choice, and the protection not as the utility model limits.
Connection line structure and its electronic equipment on the substrate of the utility model, using the structured metal layer of spraying in base
Connecting line, circuit diagram, EMC shielded layer, antenna or induction coil connection line are formed on plate (shell of such as electronic equipment)
Structure, so that the existing connecting line formed on an electronic device, circuit diagram, EMC shielded layer, antenna or induction coil are substituted,
Simple process is at low cost, high production efficiency, and yield is high, water pollution-free, and connection line structure occupies little space, and optimizes electricity
The structure of sub- product.
The embodiments of the present invention is explained in detail in conjunction with attached drawing above, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall in the protection scope of the utility model.
Claims (10)
1. the connection line structure on a kind of substrate, which is characterized in that the connection line structure be included in substrate through surface at
The roughening treatment layer that science and engineering skill is formed, and a gold medal is sprayed, prints, coats, adsorbs or covered on the roughening treatment layer
Belong to structure sheaf to form line construction and connect the contact structure of the line construction, the structured metal layer is by one or more layers gold
Metal particles or powder coating are constituted.
2. the connection line structure on substrate according to claim 1, which is characterized in that the area of the roughening treatment layer
More than or equal to the structured metal layer.
3. the connection line structure on substrate according to claim 2, which is characterized in that the structured metal layer is that zinc applies
One in layer, Zinc alloy coated, tin coating, tin alloy coating, aluminized coating, aluminium alloy covered, copper coating or copper alloy coating
Kind or multiple combinations constitute one or more layers.
4. the connection line structure on substrate according to claim 1, which is characterized in that the line construction includes at least
Connecting line, circuit diagram, antenna and induction coil.
5. the connection line structure on substrate according to claim 1, which is characterized in that the substrate is non-metal base plate
Either including forming the non-metal base plate on metallic substrates, the substrate that surface layer is insulator or surface be non-conductor
Substrate, in the roughening treatment layer that the substrate surface is formed, and spraying, printing, coating, absorption on the roughening treatment layer
Or it covers a structured metal layer and forms EMC shielded layer.
6. the connection line structure on substrate according to claim 1, which is characterized in that the wire casing of the substrate forms institute
Roughening treatment layer is stated, sprays, print, coat, adsorb or cover an at least structured metal layer shape on the roughening treatment layer
At EMC shielded layer.
7. the connection line structure on substrate according to claim 1, which is characterized in that the wire casing of the substrate forms institute
Roughening treatment layer is stated, sprays, print, coat, adsorb or covers an at least structured metal layer on the roughening treatment layer and exist
Circuit connecting wire is formed in the wire casing.
8. the connection line structure on substrate according to claim 1, which is characterized in that the structured metal layer is circle
Shape, rectangle, triangle, ellipse, irregular polygon, line segment, circular arc, letter, text, symbol, number in it is any one
The constitutional diagram of kind shape or any various shapes.
9. the connection line structure on substrate according to claim 1, which is characterized in that the width of the structured metal layer
Degree, area and thickness are respectively a, s and h, wherein a >=0.01mm, s >=0.01mm2, h >=0.002mm.
10. a kind of electronic equipment, which is characterized in that the electronic equipment has on substrate, is arranged on the substrate just like power
Benefit requires connection line structure described in 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821350652.8U CN209218444U (en) | 2018-08-21 | 2018-08-21 | Connection line structure and its electronic equipment on a kind of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821350652.8U CN209218444U (en) | 2018-08-21 | 2018-08-21 | Connection line structure and its electronic equipment on a kind of substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209218444U true CN209218444U (en) | 2019-08-06 |
Family
ID=67453023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821350652.8U Active CN209218444U (en) | 2018-08-21 | 2018-08-21 | Connection line structure and its electronic equipment on a kind of substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209218444U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108738229A (en) * | 2018-08-21 | 2018-11-02 | 深圳市泽华永盛技术有限公司 | A kind of connection line structure on substrate and its electronic equipment |
-
2018
- 2018-08-21 CN CN201821350652.8U patent/CN209218444U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108738229A (en) * | 2018-08-21 | 2018-11-02 | 深圳市泽华永盛技术有限公司 | A kind of connection line structure on substrate and its electronic equipment |
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