CN109961922A - A kind of the integrated molding die casting inductor structure and its preparation process of top coated conductor - Google Patents
A kind of the integrated molding die casting inductor structure and its preparation process of top coated conductor Download PDFInfo
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- CN109961922A CN109961922A CN201910267237.9A CN201910267237A CN109961922A CN 109961922 A CN109961922 A CN 109961922A CN 201910267237 A CN201910267237 A CN 201910267237A CN 109961922 A CN109961922 A CN 109961922A
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- Prior art keywords
- die casting
- casting inductor
- external electrode
- setting area
- integrated molding
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- 238000004512 die casting Methods 0.000 title claims abstract description 83
- 238000002360 preparation method Methods 0.000 title claims abstract description 30
- 238000000465 moulding Methods 0.000 title claims abstract description 28
- 239000004020 conductor Substances 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 239000003973 paint Substances 0.000 claims abstract description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 26
- 210000003298 dental enamel Anatomy 0.000 claims abstract description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000009713 electroplating Methods 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims abstract description 13
- 238000000227 grinding Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000010147 laser engraving Methods 0.000 claims abstract description 6
- 241000278713 Theora Species 0.000 claims abstract description 4
- 238000003801 milling Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 61
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 11
- 239000006247 magnetic powder Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- -1 iron aluminum silicon Chemical compound 0.000 claims description 5
- 239000011863 silicon-based powder Substances 0.000 claims description 5
- 238000005470 impregnation Methods 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 238000002386 leaching Methods 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002103 nanocoating Substances 0.000 description 2
- 238000009745 resin transfer moulding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000002633 protecting effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/125—Other insulating structures; Insulating between coil and core, between different winding sections, around the coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Abstract
The invention discloses a kind of integrated molding die casting inductor structure of top coated conductor and its preparation processes, include material preparation step: being arranged with enamel wire coil in die casting inductor ontology, the ora terminalis of enamel wire coil exposes to die casting inductor ontology；Insulated paint application step: one layer of insulated paint is coated in die casting inductor body outer surface；Laser engraving external electrode region step: the insulated paint of external electrode setting area is removed using radium-shine source；Grinding removes step again: further being removed corresponding this body side surface of die casting inductor of enameled wire ora terminalis using milling apparatus；Copper electroplating layer, nickel layer and tin layers step: the plating of layers of copper, nickel layer and tin layers is successively set to external electrode setting area using plating mode and grinding removes region again.By the above-mentioned means, the present invention is coated a conductive layer at the top for being integrally formed die casting inductor, and this conductive layer is guided to bottom and forms electrode, this electrode can be grounded with PCB, so that extra electromagnetic interference is directed to ground terminal, the interference to route is effectively reduced.
Description
Technical field
The present invention relates to the preparation fields for being integrally formed die casting inductor, more particularly to a kind of one of top coated conductor
Molding molding induction structure and its preparation process.
Background technique
Inductance is one of circuit significant components, can achieve the functions such as filtering, energy storage, resonance, in electronic product day
Tend under miniaturization and the assembly of component high density, Inductive component is able to fast development, and the electromagnetic compatibility the considerations of under, electronics produces
The electromagnetic interference of product eliminates the important requirement for more becoming electronic product.
Chip-shaped integrated molding die casting inductor in the prior art winds the line to be formed with enameled wire including centrally located
It encloses, iron core is pressed into magnetic metallic powder around coil, is coated with high-molecular coating later as protective layer, metal is led
Plasma-based is printed in iron core two-end-point as electrode under-layer, and to connect internal coil, the metals such as last re-plating nickel, tin are with can
It is suitble to using surface mount mode rapid welding on circuit board.
In above structure, magnetic core is since outermost high-molecular coating is only that weatherability protection is used, in practical application
When can exist it is some because route design, application conditions, magnetic material or structure design etc. factors, cause magnetic field to route signal
Or peripheral components cause the situation of interference, such as the inductance that client's original is selected that can interfere signal under PCB when in use, at this time
Route design and inductance must be readjusted to meet safety, and usually require for each associated component to be adjusted, than
It is cumbersome, it wastes time, influences the use satisfaction of client.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of integrated molding die casting inductor structures of top coated conductor
And its preparation process, it is coated a conductive layer at the chip-shaped top for being integrally formed die casting inductor, and this conductive layer is guided the bottom of to
Portion forms electrode, this electrode can be grounded with PCB, so that extra electromagnetic interference is directed to ground terminal, be effectively reduced to route
Interference；If being encountered in use process because of factors such as route design, application conditions, structure designs, cause magnetic field to route signal
Or peripheral components cause interference situation when, do not need readjust route design and associated component, it is convenient practical；Another party
Face is led since the interference at the top of component can be grounded end, then the component above component can will further shorten and inductance
Distance, to reduce finished product height.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of top coated conductor is provided
It is integrally formed die casting inductor structure, including die casting inductor ontology, the center of inside position of the die casting inductor ontology are arranged with paint
Envelope curve coil, the ora terminalis at the enamel wire coil both ends expose to the outer surface of the die casting inductor ontology, the die casting inductor
The outer surface of ontology is provided with layers of copper, and the layers of copper is distributed in the external electrode setting area of the die casting inductor body outer surface,
The external electrode setting area includes the first external electrode setting area and the second external electrode setting area, and the first external electrode is set
Setting region is the both ends positioned at die casting inductor ontology side and the rectangle for being connected respectively internal enamel wire coil
Region, the second external electrode setting area be between the adjacent the first external electrode setting area and not with internal enamel-cover
The rectangular area of line coil connection, the second external electrode setting area include the main setting area of the second external electrode and for being grounded
The second external electrode of function is grounded setting area, and the main setting area of the second external electrode and the second external electrode are grounded setting area
Between be connected to, the non-layers of copper overlay area of the die casting inductor body outer surface is provided with insulated paint, the outer surface of the layers of copper
It is disposed with nickel layer and tin layers.
A kind of integrated molding die casting inductor preparation process of top coated conductor comprising the steps of:
Material preparation step S1: prepare a die casting inductor ontology to be processed, the die casting inductor ontology is by Magnaglo die casting
It forms, the center of inside position of the die casting inductor ontology is arranged with circular enamel wire coil, the enamel wire coil both ends
Ora terminalis expose to the outer surface of the die casting inductor ontology；
Insulated paint application step S2: one layer of insulated paint is coated in the die casting inductor body outer surface that above-mentioned S1 is obtained；
Laser engraving external electrode region step S3: being removed the insulated paint of external electrode setting area using radium-shine source, thus
The die casting inductor of external electrode setting area is exposed.
Grinding removes step S4 again: enameled wire both ends ora terminalis pair in the die casting inductor for being obtained above-mentioned S3 using milling apparatus
The die casting inductor side answered further removes, so that two ora terminalis of enamel wire coil further be exposed；
Copper electroplating layer step S5: layers of copper plating is set to the external electrode setting area and above-mentioned in above-mentioned S3 using plating mode
It is ground in S4 and removes region again；
Electronickelling, tin layers step S6: successively plated with nickel above the layers of copper being electroplated in above-mentioned S5 also with plating mode
Layer and tin layers complete the integrated molding die casting inductor preparation process of top coated conductor.
Preferably, the die casting inductor ontology in the material preparation step S1 is the soft magnetic powder for being 1~100um using partial size
Organic Resin Transfer Moulding is mixed to form.
Preferably, the soft magnetic powder is reduced iron powder, atomized iron powder, iron nickel powder, iron aluminum silicon powder, iron silicochromium powder or iron
Any one in silicon powder.
Preferably, the content of the organic resin is 0.5%~10%.
Preferably, the insulated paint in the insulated paint application step S2 be epoxy resin, acryl resin, phenolic resin,
Any one in silicone resin.
Preferably, the grinding removes in step S4 again and moves corresponding this body side surface of die casting inductor of enameled wire both ends ora terminalis
Except with a thickness of 0.01mm~0.1mm.
Preferably, the electroplating thickness of layers of copper is 1 μm~10 μm in the copper electroplating layer step S5.
Preferably, the electronickelling, the electroplating thickness of nickel layer is 1 μm~10 μm in tin layers step S6, the plating thick of tin layers
Degree is 1 μm~10 μm.
The beneficial effects of the present invention are:
The present invention provides the integrated molding die casting inductor structure and its preparation process of a kind of top coated conductor, chip-shaped
The top for being integrally formed die casting inductor is coated a conductive layer, and this conductive layer is guided to bottom and forms electrode, this electrode can be with
It is grounded with PCB, so that extra electromagnetic interference is directed to ground terminal, the interference to route is effectively reduced；If being met in use process
To designed because of route, application conditions, structure design etc. factors, cause magnetic field to route signal or peripheral components cause interference
When situation, do not need to readjust route design and associated component, it is convenient practical；On the other hand, due to the interference at the top of component
End can be grounded to lead, then the component above component will further can shorten at a distance from inductance, to reduce finished product height.
Detailed description of the invention
Fig. 1 is the present invention a kind of the integrated molding die casting inductor structure and its preparation of top coated conductor
The step process block schematic diagram of technique；
Fig. 2 is that the schematic cross-section for being integrally formed die casting inductor is made in the present invention by material preparation step S1；
Fig. 3 is that the section for being integrally formed die casting inductor is made in the present invention after insulated paint application step S2
Schematic diagram；
Fig. 4 is to be made to be integrally formed molding electricity after the step S3 of laser engraving external electrode region in the present invention
The schematic cross-section of sense；
Fig. 5 is the corresponding stereochemical structure of Fig. 4 state, for embodying the second external electrode setting area；
Fig. 6 is the corresponding other side stereochemical structure of Fig. 4 state, for embodying the first external electrode setting
Region, the second external electrode are grounded setting area；
Fig. 7 is section that integrated molding die casting inductor when removing step S4 state again is ground in the present invention
Face schematic diagram；
Fig. 8 is that Fig. 7 grinding removes the section obtained for being integrally formed die casting inductor after step S4 again and shows
It is intended to；
Fig. 9 is that the obtained section for being integrally formed die casting inductor shows after copper electroplating layer step S5 in the present invention
It is intended to；
Figure 10 is electronickelling in the present invention, integrated molding die casting inductor is made after tin layers step S6
Schematic cross-section.
The components in the drawings are labeled as follows:
1, die casting inductor ontology；2, enamel wire coil；2-A, ora terminalis；2-B, ora terminalis；3, insulated paint；4-A, the first external electrode
Setting area；The main setting area of 4-B1, the second external electrode；4-B2, the second external electrode are grounded setting area；5, layers of copper；6, nickel layer；
7, tin layers；
S1, material preparation step；S2, insulated paint application step；S3, laser engraving external electrode region step；S4, grinding remove again
Step；S5, copper electroplating layer step；S6, electronickelling, tin layers step.
Specific embodiment
The preferred embodiment of invention is described in detail with reference to the accompanying drawing, so that advantages and features of the invention can be more
It is easy to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Embodiment:
As depicted in figs. 1 and 2, the integrated molding die casting inductor structure and its preparation process of a kind of top coated conductor, packet
It includes material preparation step S1: preparing a die casting inductor ontology 1 to be processed, die casting inductor ontology 1 is organic using soft magnetic powder mixing
Resin Transfer Moulding forms, in which: the particle size range of soft magnetic powder is 1~100um, and soft magnetic powder can be because big in this particle size range
Little particle difference makes density improve and promote inductance characteristic；Soft magnetic powder is reduced iron powder, atomized iron powder, iron nickel powder, iron sial
Any one in powder, iron silicochromium powder or iron silicon powder, and the preferentially content of organic resin is 0.5~10%.Die casting inductor sheet
The center of inside position of body 1 is arranged with coil, and coil is circular enamel wire coil 2, the ora terminalis 2-A at 2 both ends of enamel wire coil
The outer surface in die casting inductor ontology 1 and exposing to die casting inductor ontology 1 is drawn with 2-B.
As shown in figures 1 and 3, it insulated paint application step S2: is coated in 1 outer surface of die casting inductor ontology that step S1 is obtained
One layer of insulated paint 3, insulated paint 3 are epoxy resin, acryl resin, phenolic resin, any one in silicone resin, insulated paint 3
Spraying method be roller spray, normal pressure impregnation, vacuum impregnation, high pressure be impregnated in any one, the setting of insulated paint 3 is played
Protecting effect and possess enough inductance characteristics.
As shown in Fig. 4,5 and 6, laser engraving external electrode region step S3: utilize radium-shine source by external electrode setting area
Insulated paint 3 removes, this removal position is the region of subsequent setting external electrode.External electrode setting area includes being located at die casting inductor
The first external electrode setting area 4- of the both ends of 1 side of ontology and the rectangle for being connected respectively internal enamel wire coil 2
A, and between adjacent the first external electrode setting area 4-A and do not connect with internal enamel wire coil 2 the second of rectangle
External electrode setting area, the second external electrode setting area include the main setting area 4-B1 of the second external electrode and for grounding function
The second external electrode be grounded setting area 4-B2, the main setting area 4-B1 of the second external electrode and the second external electrode are grounded setting area
It is connected between 4-B2.After the completion of subsequent plating is made, the second external electrode ground connection setting area 4-B2 be used as it is earthy, if the
Two external electrodes are grounded setting area 4-B2 and PCB ground connection, then generated electric, magnetic field interference can be by second when component operational
External electrode is grounded setting area 4-B2 conducting and falls；Fall further, since the interference at the top of component has been grounded end conducting, then component
The other assemblies of top will further can shorten at a distance from inductance, to reduce the height of finished product.
As shown in Figure 1 and Figure 7, grinding removes step S4 again: the molding electricity for being obtained above-mentioned steps S3 using milling apparatus
The corresponding die casting inductor side enamel wire coil 2 both ends ora terminalis 2-A, 2-B further removes in sense, as shown in the region C in Fig. 7,
To which enamel wire coil 2 liang of ora terminalis 2-A, 2-B further be exposed, the removal thickness of side die casting inductor ontology in this step
For 0.01mm~0.1mm, this, which removes range, can be such that enameled wire 2 sufficiently exposes and possess inductance characteristic, successively pass through above-mentioned steps
The Product Status obtained afterwards is as shown in Figure 8.
As shown in Fig. 1 and Fig. 9, copper electroplating layer step S5: the dispatch from foreign news agency using plating mode by the plating of layers of copper 5 in above-mentioned S3
The region removed again is ground in pole setting area and above-mentioned S4, the electroplating thickness of layers of copper 5 is 1 μm~10 μm, the setting of layers of copper 5
Contact area between two ora terminalis 2-A, 2-B of coil 2 and subsequent nickel electroplated layer can be increased considerably.
As shown in Fig. 1 and Figure 10, electronickelling, tin layers step S6: the copper being electroplated in above-mentioned S5 also with plating mode
5 top of layer successively plates nickel layer 6 and tin layers 7, that is, completes the integrated molding die casting inductor preparation process of top coated conductor wherein:
The electroplating thickness of nickel layer 6 is set as 1 μm~10 μm, layers of copper 5 and tin layers 6 can be made to have preferable associativity in this range；Tin layers
7 electroplating thickness is set as 1 μm~10 μm, inductance can be made to have preferable solderability in this range.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of integrated molding die casting inductor structure of top coated conductor, it is characterised in that: including die casting inductor ontology (1),
The center of inside position of the die casting inductor ontology (1) is arranged with enamel wire coil (2), enamel wire coil (2) both ends
Ora terminalis exposes to the outer surface of the die casting inductor ontology (1), and the outer surface of the die casting inductor ontology (1) is provided with layers of copper
(5), the layers of copper (5) is distributed in the external electrode setting area of die casting inductor ontology (1) outer surface, the external electrode setting
Region includes the first external electrode setting area (4-A) and the second external electrode setting area, the first external electrode setting area (4-
It A is) square positioned at the both ends of die casting inductor ontology (1) side and for being connected respectively internal enamel wire coil (2)
Shape region, the second external electrode setting area be between the adjacent the first external electrode setting area (4-A) and not with
The rectangular area of internal enamel wire coil (2) connection, the second external electrode setting area includes the main setting area of the second external electrode
Domain (4-B1) and for grounding function the second external electrode be grounded setting area (4-B2), the main setting area of the second external electrode
It is connected between (4-B1) and the second external electrode ground connection setting area (4-B2), the non-copper of die casting inductor ontology (1) outer surface
Layer overlay area is provided with insulated paint (3), and the outer surface of the layers of copper (5) is disposed with nickel layer (6) and tin layers (7).
2. a kind of integrated molding die casting inductor preparation process of top coated conductor comprising the steps of:
Material preparation step S1: prepare a die casting inductor ontology (1) to be processed, the die casting inductor ontology (1) is by Magnaglo pressure
It casts, the center of inside position of the die casting inductor ontology (1) is arranged with circular enamel wire coil (2), the enameled wire
The ora terminalis at coil (2) both ends exposes to the outer surface of the die casting inductor ontology (1)；
Insulated paint application step S2: one layer of insulated paint (3) is coated in die casting inductor ontology (1) outer surface that above-mentioned S1 is obtained；
Laser engraving external electrode region step S3: being removed the insulated paint (3) of external electrode setting area using radium-shine source, thus will
The die casting inductor of external electrode setting area exposes.
Grinding removes step S4 again: enameled wire both ends ora terminalis is corresponding in the die casting inductor for being obtained above-mentioned S3 using milling apparatus
Die casting inductor side further removes, so that (2) two ora terminalis of enamel wire coil further be exposed；
Copper electroplating layer step S5: layers of copper (5) plating is set to the external electrode setting area and above-mentioned in above-mentioned S3 using plating mode
It is ground in S4 and removes region again；
Electronickelling, tin layers step S6: nickel layer is successively plated above the layers of copper (5) being electroplated in above-mentioned S5 also with plating mode
(6) and tin layers (7) the integrated molding die casting inductor preparation process of top coated conductor, that is, is completed.
3. a kind of integrated molding die casting inductor preparation process of top coated conductor according to claim 2, feature exist
In: the die casting inductor ontology (1) in the material preparation step S1 is to mix organic tree using the soft magnetic powder that partial size is 1~100um
Rouge die casting forms.
4. a kind of integrated molding die casting inductor preparation process of top coated conductor according to claim 3, feature exist
In: the soft magnetic powder is any in reduced iron powder, atomized iron powder, iron nickel powder, iron aluminum silicon powder, iron silicochromium powder or iron silicon powder
It is a kind of.
5. a kind of integrated molding die casting inductor preparation process of top coated conductor according to claim 4, feature exist
In: the content of the organic resin is 0.5%~10%.
6. a kind of integrated molding die casting inductor preparation process of top coated conductor according to claim 2, feature exist
In: the insulated paint (3) in the insulated paint application step S2 is epoxy resin, in acryl resin, phenolic resin, silicone resin
Any one.
7. a kind of integrated molding die casting inductor preparation process of top coated conductor according to claim 6, feature exist
It is that roller spray, normal pressure impregnation, vacuum impregnation, high pressure contain in: insulated paint spraying method in the insulated paint application step S2
Any one in leaching.
8. a kind of integrated molding die casting inductor preparation process of top coated conductor according to claim 2, feature exist
In: the grinding remove again in step S4 by corresponding this body side surface of die casting inductor of enamel wire coil both ends ora terminalis remove with a thickness of
0.01mm~0.1mm.
9. a kind of integrated molding die casting inductor preparation process of top coated conductor according to claim 2, feature exist
In: the electroplating thickness of layers of copper (5) is 1 μm~10 μm in the copper electroplating layer step S5.
10. a kind of integrated molding die casting inductor preparation process of top coated conductor according to claim 2, feature exist
In: the electroplating thickness of nickel layer (6) is 1 μm~10 μm in the electronickelling, tin layers step S6, and the electroplating thickness of tin layers (7) is 1 μm
~10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910267237.9A CN109961922A (en) | 2019-04-03 | 2019-04-03 | A kind of the integrated molding die casting inductor structure and its preparation process of top coated conductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910267237.9A CN109961922A (en) | 2019-04-03 | 2019-04-03 | A kind of the integrated molding die casting inductor structure and its preparation process of top coated conductor |
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| Publication Number | Publication Date |
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ID=67025597
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| CN201910267237.9A Pending CN109961922A (en) | 2019-04-03 | 2019-04-03 | A kind of the integrated molding die casting inductor structure and its preparation process of top coated conductor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110718386A (en) * | 2019-10-21 | 2020-01-21 | 通友智能装备(江苏)有限公司 | Manufacturing process of integrally formed inductor |
| CN113125504A (en) * | 2021-04-19 | 2021-07-16 | 广西天正钢结构有限公司 | Steel structure weld joint detection process |
| CN113593882A (en) * | 2021-07-21 | 2021-11-02 | 福建省长汀卓尔科技股份有限公司 | 2-17 type samarium-cobalt permanent magnet material and preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110718386A (en) * | 2019-10-21 | 2020-01-21 | 通友智能装备(江苏)有限公司 | Manufacturing process of integrally formed inductor |
| WO2022165992A1 (en) * | 2020-10-19 | 2022-08-11 | 湖南创一电子科技股份有限公司 | Preparation method for metal powder core integrated chip inductor |
| CN113125504A (en) * | 2021-04-19 | 2021-07-16 | 广西天正钢结构有限公司 | Steel structure weld joint detection process |
| CN113125504B (en) * | 2021-04-19 | 2023-01-10 | 广西天正钢结构有限公司 | Steel structure weld joint detection process |
| CN113593882A (en) * | 2021-07-21 | 2021-11-02 | 福建省长汀卓尔科技股份有限公司 | 2-17 type samarium-cobalt permanent magnet material and preparation method and application thereof |
| CN115295299A (en) * | 2022-04-27 | 2022-11-04 | 广东泛瑞新材料有限公司 | Preparation method and application of integrally-formed inductor |
| CN115295299B (en) * | 2022-04-27 | 2023-09-22 | 广东泛瑞新材料有限公司 | Preparation method and application of integrated inductor |
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