CN107851501A - Inductance element and its manufacture method - Google Patents
Inductance element and its manufacture method Download PDFInfo
- Publication number
- CN107851501A CN107851501A CN201680045397.3A CN201680045397A CN107851501A CN 107851501 A CN107851501 A CN 107851501A CN 201680045397 A CN201680045397 A CN 201680045397A CN 107851501 A CN107851501 A CN 107851501A
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- resin bed
- cylindrical conductor
- metal film
- inductance element
- main surface
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- 238000000034 method Methods 0.000 title claims description 84
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229920005989 resin Polymers 0.000 claims abstract description 142
- 239000011347 resin Substances 0.000 claims abstract description 142
- 230000003746 surface roughness Effects 0.000 claims abstract description 22
- 238000009713 electroplating Methods 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims description 87
- 239000002184 metal Substances 0.000 claims description 87
- 239000004020 conductor Substances 0.000 claims description 69
- 238000009826 distribution Methods 0.000 claims description 54
- 239000011248 coating agent Substances 0.000 claims description 49
- 238000000576 coating method Methods 0.000 claims description 49
- 239000010949 copper Substances 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 238000000227 grinding Methods 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 18
- 238000007772 electroless plating Methods 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 230000007613 environmental effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 93
- 239000010410 layer Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 150000002632 lipids Chemical class 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 235000011194 food seasoning agent Nutrition 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F17/062—Toroidal core with turns of coil around it
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
A kind of inductance element is provided, its characteristic and environmental reliability are excellent.Inductance element (1a) possessed coil electrode (4) includes：Multiple metallic pins (5a, 5b), upper surface is exposed to the upper surfaces of resin bed (2) to multiple above-mentioned metallic pins (5a, 5b) respectively, and lower surface is exposed to the lower surface (2b) of resin bed (2)；And multiple Wiring patterns (6a, 6b), multiple above-mentioned Wiring patterns (6a, 6b) respectively by the upper surface of defined metallic pin (5a, 5b) each other or lower surface is connected to each other, the upper surface (2a) of resin bed (2) and the surface roughness (Rz1) of lower surface (2b) are formed must be bigger than the upper surface of each metallic pin and the surface roughness of lower surface, and by electroplating in the upper surface of resin bed (2) (2a), lower surface (2b) formed with each Wiring pattern (6a, 6b).
Description
Technical field
The present invention relates to a kind of inductance element and its manufacture method including resin bed and inductance electrode.
Background technology
In the electronic equipment using high-frequency signal, the element for preventing noise is used as using inductance element sometimes.
In this element, formed sometimes through the cylindrical conductor for being erected on resin bed and the distribution electrode on the surface for being formed at resin bed
Inductance electrode.In this case, cylindrical conductor is formed by via conductor, metallic pin etc., and distribution electrode is for example led by having used
The printed patterns of electrical thickener are formed.In order to the impedance value of inductance electrode is suppressed it is relatively low come realize characteristic improve, in recent years
Work out a kind of technology that distribution electrode is formed by plating.Due to electroplating film, organic solvent etc. unlike conductive paste is non-
Metal ingredient is less, thus can realize the Low ESR of distribution electrode.Easily peeled off however, the plating being formed on resin bed is present
The problem of.Thus, as shown in figure 8, proposing a kind of reduce by electroplating the distribution formed in resin layer surface in the prior art
The technology that electrode peels off from resin bed (with reference to patent document 1).
In this case, printed wiring board 100 has：Internal layer circuit substrate 101, above-mentioned internal layer circuit substrate 101
Formed by glass epoxy resin etc.；Resin bed 102, above-mentioned resin bed 102 are laminated in the upper surface 101a of internal layer circuit substrate 101
On；And distribution electrode 103, above-mentioned distribution electrode 103 are formed on resin bed 102 by plating.Existed by electroless plating
Groove 102a wall forms the metal films such as copper, then, using above-mentioned metal film as power supply film, landfill groove 102a is electroplated by being electrolysed
Inside, so as to form distribution electrode 103, wherein, above-mentioned groove 102a is formed at the surface of resin bed 102.In this way, with simply
Situation of the distribution electrode plating on the surface of resin bed 102 is compared, can be increased between resin bed 102 and distribution electrode 103
Contact area, thus distribution electrode 103 can be reduced from the peeling on resin bed 102.
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 2010-80862 publications are (with reference to paragraph 0049~0050, Fig. 6~Fig. 8
Deng).
The content of the invention
The technical problems to be solved by the invention
However, even if by with the existing identical method of printed wiring board 100 formed inductance element distribution electrode,
Because the clinging force of the electroplating film (distribution electrode) on resin bed will not change in itself, thus distribution electrode is still suffered from because outside should
Power, hot pressing and the worry peeled off.
The present invention in view of above-mentioned technical problem and make, its object is to provide a kind of characteristic and reliability it is excellent inductance member
Part.
Technical scheme used by solution technical problem
To achieve these goals, inductance element of the invention includes resin bed and inductance electrode, above-mentioned inductance electrode bag
Include：First cylindrical conductor, above-mentioned first cylindrical conductor are disposed in the state of the main surface of above-mentioned resin bed is exposed in end face
In above-mentioned resin bed；And electrodeposited coating, above-mentioned electrodeposited coating have the part to connect with the above-mentioned end face of above-mentioned first cylindrical conductor
The part to connect with the above-mentioned main surface with above-mentioned resin bed, the surface roughness on the above-mentioned main surface of above-mentioned resin bed is than above-mentioned
The surface roughness of the above-mentioned end face of first cylindrical conductor is big.
According to said structure, by the way that the part being formed on the main surface of resin bed of inductance electrode is set into electrodeposited coating,
So as to which compared with the situation of above-mentioned part is formed by conductive paste, the Low ESR of inductance electrode can be realized, thus can improve
The characteristics such as the Q values of inductance electrode.
In addition, by making the main surface of resin bed become coarse, so as to increase the tight of the main surface of electrodeposited coating and resin bed
Paste intensity, thus can disadvantage, i.e. electrodeposited coating of reduction when forming above-mentioned part (electrodeposited coating) with electroplating film from the stripping on resin bed
Fall.On the other hand, when the end face of cylindrical conductor becomes coarse, with producing cavity at the connecting portion of electrodeposited coating sometimes, but
, must be smaller than the roughness on the main surface of resin bed by the way that the roughness of the end face of cylindrical conductor is set in the present invention, so as to anti-
The only bonding strength of empty caused, electrodeposited coating and cylindrical conductor caused by the connecting portion in electrodeposited coating and cylindrical conductor
Heating, broken string when reducing, connect the increase of impedance, being powered etc..In addition, in general, resin bed is close to by force with electrodeposited coating
Spend than cylindrical conductor and electrodeposited coating to be close to intensity small.According to the present invention, by setting and must being led than column the main surface of resin bed
The end face of body is coarse, so as to improve the close property of resin bed and electrodeposited coating, while can keep cylindrical conductor and plating well
The connection of layer.
In addition, above-mentioned electrodeposited coating can also have：First metal film, above-mentioned first metal film are configured at above-mentioned resin bed
Above-mentioned main surface；And second metal film, above-mentioned second metallic diaphragm are laminated on above-mentioned first metal film.According to said structure, example
Such as, the first metal film is formed by using electroless plating, and the second metal film is formed by being electrolysed to electroplate, so as to easily
Increase the total thickness of electrodeposited coating.
In addition, it may be desirable to, above-mentioned electrodeposited coating and above-mentioned first cylindrical conductor are using identical metal as main component.
According to said structure, the connection impedance of electrodeposited coating and cylindrical conductor can be reduced, and improve the connection of electrodeposited coating and cylindrical conductor
Reliability.
In addition, above-mentioned main component can also be copper.According to said structure, the drop of the D.C. resistance of inductance electrode can be realized
It is low, and can further realize the reduction of the connection impedance of electrodeposited coating and cylindrical conductor.
In addition it is also possible in the following way：Above-mentioned inductance electrode also includes the second cylindrical conductor, and above-mentioned second column is led
Body is disposed in above-mentioned resin bed in the state of the above-mentioned main surface of above-mentioned resin bed is exposed in end face, and above-mentioned electrodeposited coating also has
The part to connect with the above-mentioned end face of above-mentioned second cylindrical conductor, by above-mentioned first cylindrical conductor and above-mentioned second cylindrical conductor
Connection.In this case, it can realize and to be made up of the first cylindrical conductor, the second cylindrical conductor and the electrodeposited coating that connects both
The Low ESR of inductance electrode, and electrodeposited coating can be reduced from the peeling on resin bed.Further, since the first cylindrical conductor, second
The end face of cylindrical conductor does not have the main rough surface of resin bed, thus can prevent by electrodeposited coating and the first cylindrical conductor, second
Reduction, the connection impedance of the bonding strength of empty caused, electrodeposited coating and cylindrical conductor caused by the connecting portion of cylindrical conductor
Increase, heating when being powered, broken string etc..
In addition it is also possible to it is equipped with iron-core coil between above-mentioned first cylindrical conductor and above-mentioned second cylindrical conductor.
In this case, the inductance value of inductance electrode can easily be increased.
In addition, above-mentioned electrodeposited coating can also have the section that the direction towards the above-mentioned main surface away from above-mentioned resin bed expands
Shape.According to said structure, due to when inductance electrode is powered, in the first cylindrical conductor and the second cylindrical conductor and electrodeposited coating
Thermal capacitance caused by connecting portion easily expands direction release towards electrodeposited coating, thus can improve the heat dissipation characteristics of inductance element.In addition,
The thermal conductivity that can suppress during by being powered sends a telegraph the increase of the impedance value of sense electrode.
In addition, above-mentioned first cylindrical conductor can also be metallic pin.Because metallic pin is by being cut to metal wire rod
The formation such as processing are cut, thus ratio resistance is smaller than the ratio resistance of via conductor, columnar electrode etc..Thus, inductance electrode can be realized
Overall Low ESR, so as to the inductance characteristic such as can put forward high q-factor.
In addition, in the manufacture method of the inductance element of the present invention, above-mentioned inductance element includes：Resin bed；And inductance electricity
Pole, above-mentioned inductance electrode have the first cylindrical conductor of the inside for being disposed in above-mentioned resin bed and are formed at the master of above-mentioned resin bed
The distribution electrode on surface, it is characterized in that, including：Process is arranged, in above-mentioned arranging process, above-mentioned first cylindrical conductor is arranged
In the inside of the above-mentioned resin bed containing filler；Grinding or grinding process, in above-mentioned grinding or grinding process, to above-mentioned resin
The above-mentioned main surface of layer is ground or is ground, so that the end face of above-mentioned first cylindrical conductor is exposed to above-mentioned main surface；And
Distribution electrode forming process, in above-mentioned distribution electrode forming process, by electroplating on the above-mentioned main surface of above-mentioned resin bed
Form distribution electrode, above-mentioned wired electric have the part that connects with the above-mentioned end face of above-mentioned first cylindrical conductor and with above-mentioned tree
The part that the above-mentioned main surface of lipid layer connects, in above-mentioned grinding or grinding process, in grinding or grinding, by making above-mentioned tree
The above-mentioned filler on the above-mentioned main surface of lipid layer comes off, so that the surface roughness on the above-mentioned main surface of above-mentioned resin bed is than above-mentioned
The surface roughness of the above-mentioned end face of first cylindrical conductor is big.
According to said structure, by making the filler of resin bed come off in grinding or grinding, so that the main table of resin bed
The surface roughness in face is bigger than the surface roughness of the end face of the first cylindrical conductor, thus can easily realize the main table of resin bed
The difference of the surface roughness of face and the end face of the first cylindrical conductor.Thus, it can easily manufacture such as Q values that characteristic and environment can
By the excellent inductance element of property.
In addition, distribution electrode forming process can also have：Formed by electroless plating to the above-mentioned of above-mentioned resin bed
The process for the first metal film that the substantially whole surface on main surface is covered；The second metallic diaphragm is laminated on by being electrolysed plating
The process of above-mentioned first metal film；The region for being used to be formed above-mentioned distribution electrode of above-mentioned second metal film is entered by diaphragm
The process of row covering；And remove not covered by said protection film for above-mentioned first metal film and above-mentioned second metal film by etching
The process of the part of lid.
In this case, by electroless plating in distribution electrode, without power supply film resin bed main surface
It is upper to form (the first metal film), and the first metal film is set to film of powering, the second metal film is formed by being electrolysed to electroplate, thus energy
Only by electroplating the distribution electrode formed on resin bed, and can be by being laminated in the second metal film of the first metal film easily
Increase the thickness of distribution electrode.In addition, according to the forming method of above-mentioned distribution electrode, due to not formed in the end of distribution electrode
Angle, above-mentioned end are in gentle curve form, thus can disperse inductance electrode during energization by the curved surface of the end of distribution electrode
Stress during thermal expansion.
In addition, distribution electrode forming process can also have：Formed by electroless plating to the above-mentioned of above-mentioned resin bed
The process for the first metal film that the substantially whole surface on main surface is covered；Use by diaphragm to above-mentioned first metal film
In the process that the part formed outside the part of above-mentioned distribution electrode is covered；The second metal film is laminated by being electrolysed plating
In above-mentioned first metal film not by the process of the part of said protection film covering；The process for removing said protection film；It is and logical
The process that overetch removes the part by said protection film covering of above-mentioned first metal film.
In this case, diaphragm is carried out to the part being used to be formed outside the part of distribution electrode of the first metal film
Covering.That is, the opening formed with the shape in distribution electrode on diaphragm.In this case, the formation opening of diaphragm
Partially due to surface tension etc. with defined contact angle moisten extend.When filling this opening by the second metal film, energy
The shape that the section of distribution electrode is formed as expanding towards the direction on the main surface away from resin bed.In this case, due to
When inductance electrode is powered, thermal capacitance is easily towards the expansion of distribution electrode caused by the connecting portion of the first cylindrical conductor and distribution electrode
Evolution can produce the excellent inductance element of heat dissipation characteristics to release.
In addition, distribution electrode forming process can also have：Formed by electroless plating to the above-mentioned of above-mentioned resin bed
The process for the first metal film that the substantially whole surface on main surface is covered；Use by diaphragm to above-mentioned first metal film
In the process that the part for forming above-mentioned distribution electrode is covered；By above-mentioned first metal film of etching removal not by above-mentioned guarantor
The process of the part of cuticula covering；The process for removing the diaphragm；And the second metallic diaphragm is laminated on by being electrolysed plating
Above-mentioned first metal film by above-mentioned etching and the process of remaining part.
According to the forming method of above-mentioned distribution electrode, due to not forming angle in the end of distribution electrode, above-mentioned end is in flat
Slow curve form, thus stress when can disperse to be powered by the curved surface of the end of distribution electrode during inductance electrode thermal expansion.
Invention effect
According to the present invention, by the way that the part being formed on the main surface of resin bed of inductance electrode is set into electrodeposited coating, from
And compared with the situation of above-mentioned part is formed by conductive paste, the Low ESR of inductance electrode can be realized, thus electricity can be improved
The characteristics such as the Q values of sense electrode.In addition, by setting the main surface of resin bed coarse, so as to improve electrodeposited coating and resin bed
Intensity is close on main surface, thus can reduce electrodeposited coating from the peeling on resin bed.Further, since the end face of cylindrical conductor does not have
The main rough surface of resin bed, thus can prevent caused by cavity caused by the connecting portion of electrodeposited coating and cylindrical conductor, electricity
Heating, broken string when the reduction of the bonding strength of coating and cylindrical conductor, the increase for connecting impedance, energization etc..
Brief description of the drawings
Fig. 1 is the sectional view of the inductance element of first embodiment of the invention.
Fig. 2 is the top view of Fig. 1 inductance element.
Fig. 3 is the partial sectional view of Fig. 1 inductance element.
Fig. 4 is the partial sectional view of the inductance element of second embodiment of the invention.
Fig. 5 is the figure for representing the Wiring pattern adjacent with Fig. 4 inductance element.
Fig. 6 is the partial sectional view of the inductance element of third embodiment of the invention.
Fig. 7 is the stereogram of the inductance element of four embodiment of the invention.
Fig. 8 is the sectional view by electroplating the existing printed wiring board formed with the distribution electrode on resin bed.
Embodiment
(first embodiment)
The inductance element of first embodiment of the invention is illustrated referring to figs. 1 to Fig. 3.In addition, Fig. 1 is cuing open for inductance element
View, Fig. 2 are the top views of inductance element, and Fig. 3 is the partial sectional view of inductance element.In addition, in fig. 2, it is exhausted to omit diagram
Edge overlay film 7a, 7b.
As shown in FIG. 1 to 3, the inductance element 1a of present embodiment includes：Resin bed 2, above-mentioned resin bed 2 are buried wired
Enclose iron core 3；And coil electrode 4 (equivalent to " the inductance electrode " of the present invention), above-mentioned coil electrode 4 is wound on iron-core coil 3
Around, inductance element 1a is installed in using on the electronic equipments such as the mobile phone of high-frequency signal.
Resin bed 2 is formed such as the resin as epoxy resin, and is equipped with iron-core coil 3 and multiple metallic pins described later
5a、5b.In addition, in the present embodiment, resin bed 2 is formed by the epoxy resin containing filler 8, and two interareas of resin bed 2
(upper surface 2a and lower surface 2b) is formed as rectangle.Filler 8 both can be the inorganic material such as silica or aluminum oxide, can also
It is organic material, but prioritizing selection, compared with metallic pin 5a, 5b, malleability, the ductility of the resin bed 2 after solidification are small, mechanical strength
Also low material.
The magnetic material that iron-core coil 3 is used as in general iron-core coil by Mn-Zn ferrites etc. is formed.In addition, this implementation
The iron-core coil 3 of mode is formed as circular.
Coil electrode 4 includes multiple metallic pin 5a, 5b, and multiple above-mentioned metallic pin 5a, 5b are exposed in respective upper surface
The upper surface 2a of resin bed 2, and lower surface be exposed to the lower surface 2a of insulating barrier 2 in the state of be configured at iron-core coil 3
Around.Each metallic pin 5a, 5b are typically used as wired electric by Cu, Au, Ag, Al, Fe or Cu class alloy (for example, Cu-Ni alloys) etc.
The metal material of pole is formed.In addition, can be by being sheared to the metal wire rod formed by any of above-mentioned metal material
Processing etc. forms each metallic pin 5a, 5b.
Here, as shown in Fig. 2 each metallic pin 5a, 5b are made up of multiple inner metal pin 5a and multiple outside metallic pin 5b,
Wherein, inner peripheral surface arrangements of multiple above-mentioned inner metal pin 5a along iron-core coil 3, multiple above-mentioned outside metallic pin 5b are with respective
Outer peripheral face of the multipair mode along iron-core coil 3 is formed with each inner metal pin 5a to arrange.Here, each metallic pin 5a, 5b difference
Equivalent to " the first cylindrical conductor or the second cylindrical conductor " of the present invention.In addition, in the present embodiment, each metallic pin 5a, 5b
Cross section (section on the direction vertical with length direction of metallic pin) be formed as circular, but above-mentioned cross section is not limited to
In circle, such as rectangle etc. can be used variously-shaped.Moreover it is possible to replace metal using such as via conductor or columnar electrode
Sell 5a, 5b.
In addition, each paired inner metal pin 5a upper surface and outside metallic pin 5b upper surface respectively by located at
One of the upper surface 2a of resin bed 2 upside Wiring pattern 6a and connect.In addition, inner metal pin 5a lower surface with it is interior
The adjacent outside metallic pin 5b's in outside metallic pin 5b paired side metallic pin 5a regulation side (in fig. 2 be clockwise)
Lower surface is connected by Wiring pattern 6b on the downside of one of the lower surface 2b for being formed at resin bed 2 respectively.
Now, each upside Wiring pattern 6a is configured at the inner circumferential side of iron-core coil 3 in respective one end, and the other end is matched somebody with somebody
It is placed in the state of the outer circumferential side of iron-core coil, along winding axially (circumference of the iron-core coil 3) arrangement of coil electrode 4.In addition,
Each downside Wiring pattern 6b similarly, is configured at the inner circumferential side of iron-core coil 3, and the other end is configured at line in respective one end
Enclose in the state of the outer circumferential side of iron core, axially arranged along the winding of coil electrode 4.Now, each Wiring pattern 6a, 6b have and gold
Category pin 5a, 5b part (connecting portion) to connect and the part to connect with the upper surface 2a or lower surface 2b of resin bed 2.It is in addition, each
Upside Wiring pattern 6a, downside Wiring pattern 6b are respectively equivalent to " electrodeposited coating " of the present invention.
Wiring pattern 6a is formed by the first metal film 6a1 and the second metal film 6a2 double-decker, and Wiring pattern 6b is by
One metal film 6b1 and the second metal film 6b2 double-decker are formed, wherein, above-mentioned first metal film 6a1,6a2 by Cu or
Ag, Al etc. metal plating (electroless plating) formation, above-mentioned second metal film 6a2,6b2 is again by Cu or Ag, Al etc.
Metal plating (electrolysis plating) is laminated in first metal film 6a1,6b1.In addition, in the present embodiment, the first metal film 6a1,
6b1, second metal film 6a2,6b2 are formed by the metal using Cu as main component.By above-mentioned each metallic pin 5a, 5b, it is each on
Side Wiring pattern 6a and each downside Wiring pattern 6b attachment structure formed with coil electrode 4, wherein, above-mentioned coil electrode 4 is in
Helical coil is around in around the iron-core coil 3 of ring-type.
Insulating coating 7a is laminated with the upper surface 2a of resin bed 2, wherein, above-mentioned insulating coating 7a is used for each upside
Wiring pattern 6a is protected, and is laminated with insulating coating 7b on the lower surface 2b of resin bed 2, and above-mentioned insulating coating 7b is used for pair
Each downside Wiring pattern 6b is protected.Insulating coating 7a, 7b can be by forming such as epoxy resin, polyimide resin.
In addition, as shown in figure 3, be close to intensity with the desired of resin bed 2 to obtain each Wiring pattern 6a, 6b, will set
The upper surface 2a of lipid layer 2, lower surface 2b surface roughness form more coarse.Now, the upper surface 2a of resin bed 2, under
Surface 2b surface roughness Rz1 is formed as the surface roughness of the upper and lower end face than inner metal pin 5a, outside metallic pin 5b
Rz2 is big (Rz1 ＞ Rz2).In addition, in the present embodiment, 10 mean roughness are used in the comparison of surface roughness
(Rz), but as long as at least one party in 10 mean roughness Rz and arithmetic average roughness Ra, the upper surface of resin bed 2
2a, lower surface 2b surface roughness are formed must be more coarse than inner metal pin 5a, outside metallic pin 5b surface roughness.
(inductance element 1a manufacture method)
Then, one of inductance element 1a manufacture method is illustrated.First, the rule on the main surface of supporting substrates are passed through
Positioning is put and erects each metallic pin 5a, 5b, then, the resin containing filler 8 is flowed into connecing for supporting substrates and each metallic pin 5a, 5b
Contact portion is divided and makes its solidification, so as to which each metallic pin 5a, 5b to be fixed on to the main surface of supporting substrates.Now, resin both can be
Thermosetting resin can also be thermoplastic resin, but in the present embodiment, use heat cured epoxy resin.In addition, this reality
Each metallic pin 5a, the 5b for applying mode are formed by the metal using Cu as main component.
Then, iron-core coil 3 is configured at each inner metal pin 5a arrangement circle (inner circumferential circle) and each outside metallic pin 5b
Arrangement circle (periphery circle) between region.
Then, make to flow into the main surface of supporting substrates until each metallic pin 5a, 5b and coil iron with above-mentioned resin of the same race
Core 3 is buried and it is solidified (arranging process).
Then, supporting substrates, then, the upper following table of the resin to having buried each metallic pin 5a, 5b and iron-core coil 3 are removed
Face is ground or is ground to form resin bed 2 (grinding or grinding process).Now, the upper surface of each metallic pin is made to be exposed to tree
The upper surface 2a of lipid layer 2, the lower surface of each metallic pin is exposed to the lower surface 2b of resin bed 2, and carry out the thickness of resin bed 2
Degree control.In addition, grinding-material or below removing material Shi Yong ﹟ 600 now, make upper surface 2a, the following table of resin bed 2
Face 2b filler 8 comes off, or the amount of grinding or stock removal of increase resin so that the upper surface 2a of resin bed 2, lower surface 2b
The surface roughness Rz2 that surface roughness Rz1 becomes the upper and lower end face than each metallic pin 5a, 5b is big.
Then, substantially formed by non-electrolytic plating method in the upper surface 2a of resin bed 2, lower surface 2b in whole surface
First copper film (relative to " the first metal film " of the present invention).Now, not only the upper surface 2a of resin bed 2, lower surface 2b by into
Film, side is also by film forming.
Then, using the first copper film as power supply film, and by electrolytic plating method by the second copper film (equivalent to the present invention
" the second metal film ") it is laminated in above-mentioned first copper film.
Then, the upper surface 2a in resin bed 2, on the 2b of lower surface respectively with pattern formed diaphragm, with to the second copper film
Each upside Wiring pattern 6a of formation, downside Wiring pattern 6b region covered.Print process or exposure method can be used to be formed
Above-mentioned pattern.
Then, the first copper film, the second copper film covered using etching solution to unprotected film carries out wet etching, so as to shape
Into each upside Wiring pattern 6a, downside Wiring pattern 6b.Here, from formed the first copper film process to etching process equivalent to
" the distribution electrode forming process " of the present invention.
Then, diaphragm is removed by wetting or seasoning, and by for protecting each Wiring pattern 6a, 6b insulation to cover
Film 7a, 7b are layered on the upper surface 2a of resin bed 2, lower surface 2b, to complete inductance element 1a.
Thus, according to above-mentioned embodiment, due to forming distribution electrode by plating, thus with passing through conductive paste shape
Situation into above-mentioned distribution electrode is compared, and can realize the Low ESR of coil electrode 4, can thereby improve the spies such as the Q values of coil electrode 4
Property.In addition, by using metallic pin 5a, the 5b of metal ingredient more than via conductor by each upside Wiring pattern 6a, downside distribution
Pattern 6b connections, so as to further realize the Low ESR of coil electrode 4.
In addition, must be thicker than metallic pin 5a, 5b upper and lower end face by the way that the upper surface 2a of resin bed 2, lower surface 2b are formed
It is rough, so as to which each Wiring pattern 6a, 6b become big with the intensity of being close to of resin bed 2, thus it can reduce and wiring diagram is formed by electroplating film
Disadvantage, Wiring pattern 6a, 6b during case 6a, 6b are peeled off from resin bed 2.Further, since each metallic pin 5a, 5b upper and lower side
Face does not have that the upper surface 2a of resin bed 2, lower surface 2b are coarse, thus can reduce by Wiring pattern 6a, 6b and metallic pin 5a, 5b
Connecting portion at caused by caused by cavity, the reduction of Wiring pattern 6a, 6b and metallic pin 5a, 5b bonding strength, connection hinder
Anti- increase, heating when being powered, broken string etc..
In addition, each Wiring pattern 6a, 6b are formed as the of first metal film 6a1,6b1 of electroless plating and electrolysis plating
Two metal film 6a2,6b2 double-decker, thus the first metal film 6a1 can be formed on the resin bed 2 for not possessing function of supplying power,
It can easily increase Wiring pattern 6a, 6b thickness by being electrolysed second metal film 6a2,6b2 of plating simultaneously.
In addition, in the present embodiment, Wiring pattern 6a, 6b and metallic pin 5a, 5b are using Cu as main component, thus energy
Reduce the connection impedance between Wiring pattern 6a, 6b and metallic pin 5a, 5b, and Wiring pattern 6a, 6b and metallic pin can be improved
5a, 5b connection reliability.In addition, the D.C. resistance for reducing coil electrode 4 can be realized.
Further, since metallic pin 5a, 5b are by carrying out shearing etc. to metal wire rod to be formed, thus compare path
The ratio resistance of conductor, columnar electrode etc. is small.Thus, the overall Low ESR of coil electrode 4 can be realized, so as to can for example put forward high q-factor
Deng inductance characteristic.
(second embodiment)
Reference picture 4 illustrates to the inductance element of second embodiment of the invention.In addition, Fig. 4 is the partial cutaway of inductance element
View, it is figure corresponding with Fig. 3.
As shown in figure 4, the inductance member for the first embodiment that the inductance element 1b and 1~Fig. 3 of reference picture of present embodiment illustrate
Part 1a differences are that each Wiring pattern 6a, 6b structure are different.The inductance element 1a of other structures and first embodiment
It is identical, thus by marking same-sign so that their description is omitted.
In this case, as shown in figure 4, each Wiring pattern 6a, 6b with the main surface of resin bed 2 (upper surface 2a or
Lower surface 2b) cross sectional shape on vertical direction has the shape that the direction towards the main surface away from resin bed 2 expands.It is above-mentioned
This cross sectional shape can be formed by following this manufacture method.
(inductance element 1b manufacture method)
In this case, distribution electrode forming process is different from the inductance element 1a of first embodiment manufacture method.Tool
For body, upper surface 2a, lower surface 2b to resin bed 2 are ground or are ground, then by non-electrolytic plating method in resin
The upper surface 2a of layer 2, lower surface 2b substantially whole surface form the first copper film (equivalent to " the first metal film " of the present invention).
Now, the upper surface 2a except resin bed 2, in addition to the 2b of lower surface, also film forming has the first copper film for side.
Then, diaphragm is layered in the upper surface 2a of resin bed 2, lower surface 2b respectively by print process or exposure method
On first copper film.Now, the upper surface 2a in resin bed 2, the pattern for carrying out diaphragm on the 2b of lower surface respectively are formed, will
The region overlay formed outside each Wiring pattern 6a, 6b part.Now, on diaphragm formed with copying each Wiring pattern
6a, 6b multiple openings.
Then, the second copper film is layered in the first copper film (equivalent to " the second metal film " of the present invention) by being electrolysed plating
Unprotected film covering part on.That is, copper facing is separated out to be embedded among each opening of diaphragm.In addition, to diaphragm
When being laminated, formed each opening partially due to surface tension etc. is moistened with defined contact angle extends.When passing through the second bronze medal
When film fills this opening, each Wiring pattern 6a, 6b cross sectional shape can turn into towards the main surface (upper surface away from resin bed 2
2a or lower surface 2b) the shape that expands of direction.
Then, the diaphragm on upper surface 2a, the lower surface 2b of resin bed 2 is removed by wetting or seasoning.
Then, by wet etching remove the first copper film by diaphragm cover part, with formed each Wiring pattern 6a,
6b。
Then, by be layered in for insulating coating 7a, 7b for protecting each Wiring pattern 6a, 6b resin bed 2 upper surface 2a,
On the 2b of lower surface, to complete inductance element 1b.
According to said structure, each Wiring pattern 6a, 6b have towards the side of upper surface 2a or lower surface 2b away from resin bed 2
To the cross sectional shape expanded.In this way, due to when coil electrode 4 is powered, in metallic pin 5a, 5b and Wiring pattern 6a, 6b company
Heat caused by socket part etc. easily expands direction release towards Wiring pattern 6a, 6b, thus can improve inductance element 1b radiating
Characteristic.In addition, the increase of the impedance value of the thermal conductivity induced coil electrode 4 during by being powered can be suppressed.
In addition, formed by the pattern of diaphragm to form each Wiring pattern 6a, 6b, thus for example with to conductive paste
Printed and compared with forming the situation of Wiring pattern, improve Wiring pattern 6a, 6b dimensional accuracy.Thus, such as Fig. 5 institutes
Show, adjacent Wiring pattern 6a, 6b interval W can be reduced, realize Wiring pattern 6a, 6b spacing stricturization.
(the 3rd embodiment)
Reference picture 6 illustrates to the inductance element of third embodiment of the invention.In addition, Fig. 6 is the partial cutaway of inductance element
View, it is figure corresponding with Fig. 3.
As shown in fig. 6, the electricity for the first embodiment that the inductance element 1c and 1~Fig. 3 of reference picture of present embodiment illustrate
Sensing unit 1a differences are that each Wiring pattern 6a, 6b forming method are different.The electricity of other structures and first embodiment
Sensing unit 1a is identical, thus by marking same-sign so that their description is omitted.In addition, following, the manufacture to inductance element 1c
Method illustrates.
(inductance element 1c manufacture method)
In this case, the process and first before the upper surface 2a of resin bed 2, lower surface 2b are ground or be ground
The inductance element 1a of embodiment is identical, then, by non-electrolytic plating method by the first copper film (equivalent to " the first of the present invention
Metal film ") form upper surface 2a in resin bed 2, substantially in whole surface of lower surface 2b.Now, it is upper except resin bed 2
Outside surface 2a, lower surface 2b, also film forming has the first copper film for side.
Then, the upper surface 2a in resin bed 2, on the 2b of lower surface, shape is used for the first copper film by diaphragm respectively
Covered into Wiring pattern 6a, 6b part.The covering of diaphragm is carried out using print process or exposure method.
Then, the part that the unprotected film of the first copper film covers is removed by wet etching, then, by wetting or
Seasoning removes upper surface 2a, the lower surface 2b diaphragm of resin bed 2.
Then, the second copper film is layered in remaining the (equivalent to " the second metal film " of the present invention) by being electrolysed plating
On one copper film, to form each Wiring pattern 6a, 6b.Now, as shown in fig. 6, each Wiring pattern 6a, 6b are formed as end in gentle
Curve form.
Finally, by be layered in for insulating coating 7a, 7b for protecting each Wiring pattern 6a, 6b resin bed 2 upper surface 2a,
On the 2b of lower surface, to complete inductance element 1c.
According to said structure, due to not forming angle in each Wiring pattern 6a, 6b end, the end is in gentle curved
Shape, thus can be by the curved surface of Wiring pattern 6a, 6b end come stress during scattered be powered during 4 thermal expansion of coil electrode.
(the 4th embodiment)
Reference picture 7 illustrates to the inductance element of four embodiment of the invention.In addition, Fig. 7 is the stereogram of inductance element.
As shown in fig. 7, the electricity for the first embodiment that the inductance element 1d and 1~Fig. 3 of reference picture of present embodiment illustrate
Sensing unit 1a differences are that the structure of inductance electrode 40 is different and is not provided with iron-core coil 3.Other structures are implemented with first
The inductance element 1a of mode is identical, thus by marking same-sign so that their description is omitted.
In this case, inductance electrode 40 is by two metallic pins 50a, 50b and the matching somebody with somebody in U-shaped in top view
Line pattern 60 is formed, wherein, two above-mentioned respective upper surfaces of metallic pin 50a, 50b are exposed to the upper surface 2a of resin bed 2, and
And lower surface is exposed to the lower surface 2b of resin bed 2, above-mentioned Wiring pattern 60 is formed at the upper surface 2a of resin bed 2, by two
Metallic pin 50a, 50b upper surface are connected to each other.In addition, insulating coating 70 is laminated with the upper surface 2a of resin bed 2, it is above-mentioned
Insulating coating 70 covers to Wiring pattern 60.In addition, in the present embodiment, two metallic pins 50a, 50b lower surface
It is exposed to the lower surface 2b of resin bed 2, the electrode of external connection of these lower surfaces as inductance element 1d.
According to said structure, can be obtained in the inductance element 1d for do not arrange iron-core coil 3 and the electricity of first embodiment
Sensing unit 1a identical effects.
In addition, the invention is not limited in the respective embodiments described above, without departing from spirit of the invention, moreover it is possible to above-mentioned
Various changes are carried out outside content.For example, it is also possible to each Wiring pattern 6a, 6b, 60 are set to single layer structure.In such case
Under, each Wiring pattern 6a, 6b, 60 only can also be formed by electroless plating.
In addition it is also possible to by different metals formed each Wiring pattern 6a, 6b, 60 first metal film 6a1,6b1 and
Second metal film 6a2,6b2.
In addition, it is not limited to Wiring pattern 6a, 6b that metallic pin 5a, 5b, 50a, 50b end face are connected to each other, 60,
Also it can apply the present invention to be connected to the grounding electrode of the external connection of the end face of metallic pin.
In addition, although situation of the resin bed 2 containing filler is illustrated in the respective embodiments described above, but as long as structure
As the upper surface 2a of resin bed 2, lower surface 2b surface roughness than metallic pin 5a, the table of 5b, 50a, 50b upper and lower end face
Surface roughness is big, then can also not necessarily contain filler.
In addition it is also possible to it is configured to be not provided with insulating coating 7a, 7b, 70.
Industrial utilizability
The present invention can be widely used in including in the various inductance elements of resin bed and inductance electrode.
(symbol description)
1a~1d inductance elements；
2 resin beds；
2a upper surfaces (main surface)；
2b lower surfaces (main surface)；
3 iron-core coils；
4 coil electrodes (inductance electrode)；
5a, 5b, 50a, 50b metallic pin (the first cylindrical conductor, the second cylindrical conductor)；
6a, 6b, 60 Wiring patterns (electrodeposited coating)；
The metal film of 6a1,6b1 first；
The metal film of 6a2,6b2 second；
8 fillers；
40 inductance electrodes.
Claims (12)
1. a kind of inductance element, including resin bed and inductance electrode,
Characterized in that,
The inductance electrode includes：
First cylindrical conductor, first cylindrical conductor are disposed in the state of the main surface of the resin bed is exposed in end face
In the resin bed；And
Electrodeposited coating, the electrodeposited coating have the part that connects with the end face of first cylindrical conductor and with the resin bed
The part that connects of the main surface,
Rough surface of the surface roughness on the main surface of the resin bed than the end face of first cylindrical conductor
Degree is big.
2. inductance element as claimed in claim 1, it is characterised in that
The electrodeposited coating has：First metal film, first metal film are configured at the main surface of the resin bed；And
Second metal film, second metallic diaphragm are laminated on first metal film.
3. inductance element as claimed in claim 1 or 2, it is characterised in that
The electrodeposited coating and first cylindrical conductor are using identical metal as main component.
4. inductance element as claimed in claim 3, it is characterised in that
The main component is copper.
5. such as inductance element according to any one of claims 1 to 4, it is characterised in that
The inductance electrode also includes the second cylindrical conductor, and second cylindrical conductor is exposed in end face described in the resin bed
It is disposed in the state of main surface in the resin bed,
The electrodeposited coating also has the part to connect with the end face of second cylindrical conductor, and first column is led
Body is connected with second cylindrical conductor.
6. inductance element as claimed in claim 5, it is characterised in that
Iron-core coil is equipped between first cylindrical conductor and second cylindrical conductor.
7. such as inductance element according to any one of claims 1 to 6, it is characterised in that
The electrodeposited coating has the cross sectional shape that the direction towards the main surface away from the resin bed expands.
8. such as inductance element according to any one of claims 1 to 7, it is characterised in that
First cylindrical conductor is metallic pin.
9. a kind of manufacture method of inductance element, wherein, the inductance element includes：
Resin bed；And inductance electrode, the inductance electrode have the first cylindrical conductor of the inside for being disposed in the resin bed
And the distribution electrode on the main surface of the resin bed is formed at,
The manufacture method is characterised by, including：
Process is arranged, in the arranging process, first cylindrical conductor is disposed in the resin bed containing filler
It is internal；
Grinding or grinding process, it is described grinding or grinding process in, the main surface of the resin bed is ground or
Grinding, so that the end face of first cylindrical conductor is exposed to the main surface；And
Distribution electrode forming process, in the distribution electrode forming process, by electroplating the main table in the resin bed
Form distribution electrode on face, the wired electric have the part that connects with the end face of first cylindrical conductor and with institute
The part that the main surface of resin bed connects is stated,
In the grinding or grinding process, in grinding or grinding, by making described in the main surface of the resin bed
Filler comes off, so that the end face of the surface roughness on the main surface of the resin bed than first cylindrical conductor
Surface roughness it is big.
10. the manufacture method of inductance element as claimed in claim 9, it is characterised in that
Distribution electrode forming process has：
The first gold medal covered to the substantially whole surface on the main surface of the resin bed is formed by electroless plating
Belong to the process of film；
The process that second metal layer is laminated on to first metal film is electroplated by being electrolysed；
The process for being used to be formed the region of the distribution electrode and being covered by diaphragm to second metal film；And
By the work for etching the part not covered by the diaphragm for removing first metal film and second metal film
Sequence.
11. the manufacture method of inductance element as claimed in claim 9, it is characterised in that
Distribution electrode forming process has：
The first gold medal covered to the substantially whole surface on the main surface of the resin bed is formed by electroless plating
Belong to the process of film；
The part being used to be formed outside the part of the distribution electrode of first metal film is covered by diaphragm
Process；
Second metallic diaphragm is laminated on to the part not covered by the diaphragm of first metal film by electrolysis plating
Process；
The process for removing the diaphragm；And
Process by etching the part covered by the diaphragm for removing first metal film.
12. the manufacture method of inductance element as claimed in claim 9, it is characterised in that
Distribution electrode forming process has：
The first gold medal covered to the substantially whole surface on the main surface of the resin bed is formed by electroless plating
Belong to the process of film；
The process for being used to be formed the part of the distribution electrode and being covered by diaphragm to first metal film；
Process by etching the part not covered by the diaphragm for removing first metal film；
The process for removing the diaphragm；And
The second metallic diaphragm is laminated on being etched by described and remaining part for first metal film by being electrolysed plating
Process.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-155106 | 2015-08-05 | ||
| JP2015155106 | 2015-08-05 | ||
| PCT/JP2016/072884 WO2017022813A1 (en) | 2015-08-05 | 2016-08-04 | Inductor component and method for producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107851501A true CN107851501A (en) | 2018-03-27 |
| CN107851501B CN107851501B (en) | 2020-01-07 |
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| CN201680045397.3A Active CN107851501B (en) | 2015-08-05 | 2016-08-04 | Inductance element and manufacturing method thereof |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11682519B2 (en) |
| JP (1) | JP6311841B2 (en) |
| CN (1) | CN107851501B (en) |
| WO (1) | WO2017022813A1 (en) |
Cited By (1)
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| CN112242222A (en) * | 2019-07-18 | 2021-01-19 | 株式会社村田制作所 | Base body |
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|---|---|---|---|---|
| KR102080653B1 (en) | 2018-05-23 | 2020-02-24 | 삼성전기주식회사 | Coil component |
| JP7135923B2 (en) * | 2019-02-15 | 2022-09-13 | 株式会社村田製作所 | inductor components |
| JP7081575B2 (en) * | 2019-09-30 | 2022-06-07 | 株式会社村田製作所 | Coil parts |
| JP7310979B2 (en) * | 2019-09-30 | 2023-07-19 | 株式会社村田製作所 | coil parts |
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|---|---|
| US11682519B2 (en) | 2023-06-20 |
| CN107851501B (en) | 2020-01-07 |
| JPWO2017022813A1 (en) | 2018-05-24 |
| US20180158607A1 (en) | 2018-06-07 |
| WO2017022813A1 (en) | 2017-02-09 |
| JP6311841B2 (en) | 2018-04-18 |
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