CN203193888U - Mems microphone - Google Patents
Mems microphone Download PDFInfo
- Publication number
- CN203193888U CN203193888U CN 201320137114 CN201320137114U CN203193888U CN 203193888 U CN203193888 U CN 203193888U CN 201320137114 CN201320137114 CN 201320137114 CN 201320137114 U CN201320137114 U CN 201320137114U CN 203193888 U CN203193888 U CN 203193888U
- Authority
- CN
- China
- Prior art keywords
- metal forming
- encapsulating structure
- hole
- wiring board
- sound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000005236 sound signal Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Abstract
The utility model discloses an MEMS microphone comprising a packaging structure formed by a circuit board and a shell, the circuit board is provided with a sound hole used for receiving a sound signal, and the surface of the circuit board is provided with metal foil used for shielding, wherein the metal foil on the surface of the circuit board and around the sound hole extends to the inside of the sound hole. Therefore, interference electromagnetic wave entering the inside of the product through the sound hole is shielded, and the electromagnetic shielding effect of the product is further improved.
Description
Technical field
The utility model relates to the acoustical-electrical transducer technical field, more specifically, relates to a kind of MEMS microphone.
Background technology
Along with the progress of society and the development of technology, in recent years, along with electronic product volumes such as mobile phone, notebook computer constantly reduce, people are also more and more higher to the performance requirement of these portable electronic products, thereby require also with it that the volume of supporting electronic component constantly reduces, performance and consistency improve constantly.Under this background, also released a lot of novel products as the microphone products field of one of strength member of above-mentioned portable electronic products, be representative products with the MEMS microphone wherein.
Conventional MEMS microphone comprises the encapsulating structure that is formed by wiring board and shell encirclement, described wiring board is provided with the sound hole that receives voice signal, described PCB surface is provided be used to the metal forming that shields, usually relative with sound hole wiring board position does not have metal forming to cover, the part electromagnetic interference signal can enter into microphone inside by sound hole on the wiring board, thereby influences properties of product.Need to design a kind of novel MEMS microphone thus.
The utility model content
In view of the above problems, the purpose of this utility model provides a kind of while and can shield the electromagnetic interference signal that enters by the sound hole, makes further guaranteed a kind of MEMS microphone of shield effectiveness.
MEMS microphone of the present utility model, comprise by wiring board and shell and surround the encapsulating structure that forms, described wiring board is provided with the sound hole that receives voice signal, described PCB surface is provided be used to the metal forming that shields, wherein, described PCB surface sound hole metal forming on every side extends into described sound inside, hole.
A kind of preferred version, described metal forming are Copper Foil.
A kind of preferred version, the metal forming on the described PCB surface are to be arranged on the described PCB surface of described encapsulating structure inside.
A kind of preferred version, the metal forming on the described PCB surface are to be arranged on the described PCB surface of described encapsulating structure outside.
A kind of preferred version, metal forming on the described PCB surface is to be arranged on the described PCB surface of the described PCB surface of described encapsulating structure inside and described encapsulating structure outside, and the metal forming around the sound hole on described wiring board two surfaces all extends into described sound inside, hole.
Another preferred version, metal forming on the described PCB surface is to be arranged on the described PCB surface of the described PCB surface of described encapsulating structure inside and described encapsulating structure outside, and the metal forming around the outside described wiring board sound of the inner or described encapsulating structure of the described encapsulating structure hole extends into described sound inside, hole.
Utilize above-mentionedly according to MEMS microphone of the present utility model, enter the interference electromagnetic wave of product inside because the metal forming around the described PCB surface sound hole has extended into the hole internal shield of described sound by the sound hole, improved the effectiveness of product more.
Description of drawings
Fig. 1 is the profile of the utility model embodiment one MEMS microphone.
Fig. 2 is the profile of the utility model embodiment two MEMS microphones.
Fig. 3 is the profile of the utility model embodiment three MEMS microphones.
Fig. 4 is the profile of the utility model embodiment four MEMS microphones.
Fig. 5 is the profile of the utility model embodiment five MEMS microphones.
Embodiment
Below with reference to accompanying drawing specific embodiment of the utility model is described in detail.
Embodiment one: as shown in Figure 1, MEMS microphone of the present utility model, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, described wiring board 1 is provided with the sound hole 10 that receives voice signal, the inner described wiring board of described encapsulating structure 1 surface is provided be used to the metal forming 11 that shields, wherein, the metal forming 11 around the hole, described wiring board 1 surface 10 extends into described sound 10 inside, hole, can shield the interference electromagnetic wave that enters product inside by sound hole 10.
As realizing a kind of optimized technical scheme of the utility model, described metal forming 11 is Copper Foil.
Utilize above-mentioned according to MEMS microphone of the present utility model, because the metal forming 11 around the hole, described wiring board 1 surface 10 has extended into hole 10 internal shields of described sound and has entered the interference electromagnetic wave of product inside by sound hole 10, has improved the effectiveness of product more.
Embodiment two: as shown in Figure 2, MEMS microphone of the present utility model, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, described wiring board 1 is provided with the sound hole 10 that receives voice signal, the outside described wiring board of described encapsulating structure 1 surface is provided be used to the metal forming 11 that shields, wherein, the metal forming 11 around the hole, described wiring board 1 surface 10 extends into described sound 10 inside, hole, can shield the interference electromagnetic wave that enters product inside by sound hole 10.
As realizing a kind of optimized technical scheme of the utility model, described metal forming 11 is Copper Foil.
Utilize above-mentioned according to MEMS microphone of the present utility model, because the metal forming 11 around the hole, described wiring board 1 surface 10 has extended into hole 10 internal shields of described sound and has entered the interference electromagnetic wave of product inside by sound hole 10, has improved the effectiveness of product more.
Embodiment three: as shown in Figure 3, MEMS microphone of the present utility model, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, described wiring board 1 is provided with the sound hole 10 that receives voice signal, the outside described wiring board of described encapsulating structure 1 surface upward and on the inner described PCB surface of described encapsulating structure all is provided with respectively be used to the metal forming 11 that shields, wherein, metal forming 11 around the sound hole, 1 liang of surface of described wiring board 10 all extends into described sound 10 inside, hole, can shield the interference electromagnetic wave that enters product inside by sound hole 10.
As realizing a kind of optimized technical scheme of the utility model, described metal forming 11 is Copper Foil.
Utilize above-mentioned according to MEMS microphone of the present utility model, because the metal forming 11 around the sound hole, 1 liang of surface of described wiring board 10 all extends into described sound 10 inside, hole, shield the interference electromagnetic wave that enters product inside by sound hole 10, improved the effectiveness of product more.
Embodiment four: MEMS microphone of the present utility model, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, described wiring board 1 is provided with the sound hole 10 that receives voice signal, the outside described wiring board of described encapsulating structure 1 surface upward and on the inner described PCB surface of described encapsulating structure all is provided with respectively be used to the metal forming 11 that shields, wherein, metal forming 11 around the hole, described encapsulating structure inner described wiring board 1 surface 10 extends into described sound 10 inside, hole, can shield the interference electromagnetic wave that enters product inside by sound hole 10.
As realizing a kind of optimized technical scheme of the utility model, described metal forming 11 is Copper Foil.
Utilize above-mentioned according to MEMS microphone of the present utility model, because MEMS microphone of the present utility model, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, described wiring board 1 is provided with the sound hole 10 that receives voice signal, the outside described wiring board of described encapsulating structure 1 surface upward and on the inner described PCB surface of described encapsulating structure all is provided with respectively be used to the metal forming 11 that shields, wherein, metal forming 11 around the hole, described encapsulating structure inner described wiring board 1 surface 10 extends into described sound 10 inside, hole, shield the interference electromagnetic wave that enters product inside by sound hole 10, improved the effectiveness of product more.
Embodiment five: MEMS microphone of the present utility model, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, described wiring board 1 is provided with the sound hole 10 that receives voice signal, the outside described wiring board of described encapsulating structure 1 surface upward and on the inner described PCB surface of described encapsulating structure all is provided with respectively be used to the metal forming 11 that shields, wherein, metal forming 11 around the hole, described encapsulating structure outside described wiring board 1 surface 10 extends into described sound 10 inside, hole, can shield the interference electromagnetic wave that enters product inside by sound hole 10.
As realizing a kind of optimized technical scheme of the utility model, described metal forming 11 is Copper Foil.
Utilize above-mentioned according to MEMS microphone of the present utility model, because MEMS microphone of the present utility model, comprise by wiring board 1 and shell 2 and surround the encapsulating structure that forms, described wiring board 1 is provided with the sound hole 10 that receives voice signal, the outside described wiring board of described encapsulating structure 1 surface upward and on the inner described PCB surface of described encapsulating structure all is provided with respectively be used to the metal forming 11 that shields, wherein, metal forming 11 around the hole, described encapsulating structure outside described wiring board 1 surface 10 extends into described sound 10 inside, hole, shield the interference electromagnetic wave that enters product inside by sound hole 10, improved the effectiveness of product more.
More than show and described basic principle of the present utility model and principal character.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.
Claims (6)
1. MEMS microphone, comprise by wiring board and shell and surround the encapsulating structure that forms, described wiring board is provided with the sound hole that receives voice signal, described PCB surface is provided be used to the metal forming that shields, and it is characterized in that: the metal forming around the described PCB surface sound hole extends into described sound inside, hole.
2. MEMS microphone as claimed in claim 1, it is characterized in that: described metal forming is Copper Foil.
3. MEMS microphone as claimed in claim 1, it is characterized in that: the metal forming on the described PCB surface is to be arranged on the described PCB surface of described encapsulating structure inside.
4. MEMS microphone as claimed in claim 1, it is characterized in that: the metal forming on the described PCB surface is to be arranged on the described PCB surface of described encapsulating structure outside.
5. MEMS microphone as claimed in claim 1, it is characterized in that: the metal forming on the described PCB surface is to be arranged on the described PCB surface of the described PCB surface of described encapsulating structure inside and described encapsulating structure outside, and the metal forming around the sound hole on described wiring board two surfaces all extends into described sound inside, hole.
6. MEMS microphone as claimed in claim 1, it is characterized in that: the metal forming on the described PCB surface is to be arranged on the described PCB surface of the described PCB surface of described encapsulating structure inside and described encapsulating structure outside, and the metal forming around the outside described wiring board sound of the inner or described encapsulating structure of the described encapsulating structure hole extends into described sound inside, hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320137114 CN203193888U (en) | 2013-03-25 | 2013-03-25 | Mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320137114 CN203193888U (en) | 2013-03-25 | 2013-03-25 | Mems microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203193888U true CN203193888U (en) | 2013-09-11 |
Family
ID=49110710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320137114 Expired - Lifetime CN203193888U (en) | 2013-03-25 | 2013-03-25 | Mems microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203193888U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484093A (en) * | 2017-09-26 | 2017-12-15 | 深圳市芯易邦电子有限公司 | MEMS condenser microphone |
-
2013
- 2013-03-25 CN CN 201320137114 patent/CN203193888U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484093A (en) * | 2017-09-26 | 2017-12-15 | 深圳市芯易邦电子有限公司 | MEMS condenser microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130911 |
|
| CX01 | Expiry of patent term |