CN107484093A - MEMS condenser microphone - Google Patents

MEMS condenser microphone Download PDF

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Publication number
CN107484093A
CN107484093A CN201710893397.5A CN201710893397A CN107484093A CN 107484093 A CN107484093 A CN 107484093A CN 201710893397 A CN201710893397 A CN 201710893397A CN 107484093 A CN107484093 A CN 107484093A
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CN
China
Prior art keywords
metal layer
condenser microphone
circuit
middle plate
mems condenser
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Pending
Application number
CN201710893397.5A
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Chinese (zh)
Inventor
汤小贾
陈小康
Original Assignee
Shenzhen Xinyibang Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xinyibang Electronic Co Ltd filed Critical Shenzhen Xinyibang Electronic Co Ltd
Priority to CN201710893397.5A priority Critical patent/CN107484093A/en
Publication of CN107484093A publication Critical patent/CN107484093A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

The present invention discloses a kind of MEMS condenser microphone, and the MEMS condenser microphone includes：Top plate, top plate are provided with sound inlet, and the madial wall of sound inlet is provided with the first metal layer, and the first metal layer extends to the upper surface of top plate；Middle plate, middle plate has through thereon, the receiving space of lower surface, and the madial wall of receiving space is provided with second metal layer, the upper surface of the lower surface fitting middle plate of top plate, and blocks receiving space, the first metal layer connection second metal layer；And lower plywood, lower plywood are bonded the lower surface of middle plate, and receiving space is blocked, lower plywood is provided with earthed circuit, second metal layer connection earthed circuit.The static discharge in the external world can be conducted to earthed circuit by the MEMS condenser microphone of technical solution of the present invention by the first metal layer; and discharge; so as to reduce extraneous static interference damage to caused by the MEMS condenser microphone; play a part of protecting product, while play to the jamproof ability of radio frequency.

Description

MEMS condenser microphone
Technical field
The present invention relates to sensor packaging techniques field, more particularly to a kind of MEMS condenser microphone.
Background technology
Existing MEMS (Micro-Electro-Mechanical System, Micro Electro Mechanical System) microphone has chi Many advantages, such as very little compact and signal to noise ratio is high, but as the extensive use of microelectric technique and electromagnetic environment become increasingly complex, it is quiet The problems such as Electromagnetic Environmental Effect of discharge of electricity such as electromagnetic interference, causes extreme influence to the performance of electronic product, and static discharge may Inadvertently electronic device is punctured, causes heavy losses.In order to reduce the generation of this phenomenon, it is necessary to existing MEMS Further improvement is made in the encapsulation of microphone.
The content of the invention
The main object of the present invention is to provide a kind of MEMS condenser microphone, it is intended to reduces static discharge to microelectromechanicpositioning Influence, makes the antijamming capability of MEMS microphone good caused by system microphone.
To achieve the above object, MEMS condenser microphone proposed by the present invention, including：
Top plate, the top plate are provided with sound inlet, and the madial wall of the sound inlet is provided with the first metal layer, and described first Metal level is concordant with the upper surface of the top plate or protrudes from the upper surface of the top plate；
Middle plate, the middle plate has through thereon, the receiving space of lower surface, and the madial wall of the receiving space is set There is second metal layer, the lower surface of the top plate is bonded the upper surface of the middle plate, and blocks the receiving space, described The first metal layer connects the second metal layer；And lower plywood, the lower plywood are bonded the lower surface of the middle plate, and seal The receiving space is blocked up, the lower plywood is provided with earthed circuit, and the second metal layer connects the earthed circuit.
Preferably, the first metal layer protrudes from the upper surface of the top plate, and prolongs along the circumference of the sound inlet Stretch to form annular.
Preferably, the annular outside dimension scope that the first metal layer is formed is 0.4mm~0.8mm.
Preferably, the diameter range of the sound inlet is 0.2mm~0.4mm.
Preferably, the lower surface of the top plate is provided with the first circuit and connects the chip assembly of first circuit, institute State chip assembly and block the sound inlet, and be placed in the receiving space；
The lower plywood is provided with second circuit；
The middle plate is provided with connecting portion in the side of the receiving space, and the connecting portion is provided with least two connectors, The connector electrically connects first circuit and second circuit.
Preferably, the connecting portion is provided with least two the first terminal pads being arranged side by side in the upper surface of the middle plate, First terminal pad electrically connects first circuit；
The connecting portion is provided with least 2 second terminal pads in the lower surface of the middle plate, first terminal pad and the The matching of two terminal pads is set, and every one first terminal pad electrically connects one second terminal pad, second connection through the middle plate Disk electrically connects the second circuit.
Preferably, the diameter range of each first terminal pad is 0.2mm~0.5mm；And/or each described second The diameter range of terminal pad is 0.2mm~0.5mm.
Preferably, the one side of the lower plywood connection middle plate is provided with the second circuit, away from the middle plate One side be provided with least two connection pins, the second circuit electrically connects the connection pin through the lower plywood, described the One terminal pad, the second terminal pad and connection pin correspond.
Preferably, the MEMS condenser microphone exports for data signal, and the connection pin includes power supply output and drawn Pin, signal output pin, clock frequency pin and left and right acoustic channels selection pin；And/or the chip assembly senses including MEMS Device and ASIC amplifiers, the MEMS sensor block the sound inlet；And/or the chip assembly includes integral type CMOS Sensor chip.
Preferably, the MEMS condenser microphone is analog signal output, and the connection pin includes power supply output and drawn Pin and signal output pin；And/or the chip assembly includes MEMS sensor and ASIC amplifiers, the MEMS sensor Block the sound inlet.
In technical solution of the present invention, top plate, middle plate and the lower plywood of the MEMS condenser microphone be bonded successively into Row encapsulation, the sound inlet of top plate are used to external acoustic waves being passed to inside MEMS condenser microphone, and the first metal layer passes through the Two metal levels are connected with earthed circuit, and the first metal layer is concordant with the upper surface of top plate or extends to the upper table of top plate Face, that is, the first metal layer can be exposed by the upper surface of top plate, due to the MEMS condenser microphone overall dimensions very Small, when outside air or human hand are touched to the outside of the MEMS condenser microphone, caused static discharge can be via first Metal level is conducted to earthed circuit and discharged, so as to reduce extraneous static interference damage to caused by the MEMS condenser microphone It is bad, play a part of protecting product.
Further, second metal layer is located at the madial wall of receiving space, forms electromagnetic armouring structure, this can be avoided micro- The internal structure of Mechatronic Systems microphone produces electromagnetic interference to external equipment, while prevents the outer bound pair Mechatronic Systems microphone Internal structure produces electromagnetic interference, further protects product.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the top view of the embodiment of MEMS condenser microphone one of the present invention；
Fig. 2 is the exploded perspective view of MEMS condenser microphone in Fig. 1；
Fig. 3 is the exploded perspective view of another embodiment of MEMS condenser microphone of the present invention.
Drawing reference numeral explanation：
Label Title Label Title
100 MEMS condenser microphone 33 Connecting portion
10 Top plate 333 Second terminal pad
11 Sound inlet 50 Lower plywood
111 The first metal layer 51 Connect pin
13 Chip assembly 511 Power supply output pin
131 MEMS sensor 512 Signal output pin
133 ASIC amplifiers 513 Clock frequency pin
30 Middle plate 515 Left and right acoustic channels select pin
31 Receiving space 53 Grounding pin
311 Second metal layer
The realization, functional characteristics and advantage of the object of the invention will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.Base Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its His embodiment, belongs to the scope of protection of the invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention In explaining the relative position relation under a certain particular pose (as shown in drawings) between each part, motion conditions etc., if should When particular pose changes, then directionality instruction also correspondingly changes therewith.
In addition, the description for being related to " first ", " second " etc. in the present invention is only used for describing purpose, and it is not intended that referring to Show or imply its relative importance or imply the quantity of the technical characteristic indicated by indicating.Thus, " first ", " are defined At least one this feature can be expressed or be implicitly included to two " feature.In addition, the technical scheme between each embodiment can To be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical scheme occurs It is conflicting or will be understood that the combination of this technical scheme is not present when can not realize, also not in the protection model of application claims Within enclosing.
Referring to figs. 1 to 3, the present invention proposes a kind of MEMS condenser microphone 100, including：Top plate 10, top plate 10 are set There is sound inlet 11, the madial wall of sound inlet 11 is provided with the first metal layer 111, the upper surface of the first metal layer 111 and top plate 10 Upper surface 113 that is concordant or protruding from top plate；
Middle plate 30, middle plate 30 has through thereon, the receiving space 31 of lower surface, and the madial wall of receiving space 31 is set There are second metal layer 311, the upper surface of the lower surface fitting middle plate 30 of top plate 10, and block receiving space 31, the first gold medal Belong to layer 111 and connect second metal layer 311；And
Lower plywood 50, lower plywood 50 connect the lower surface of middle plate 30, and block receiving space 31, and lower plywood 50 is provided with and connect Ground circuit, second metal layer 311 connect earthed circuit.
Specifically, the first metal layer 111 is respectively arranged on the upper and lower surface of top plate 10, and it is distributed in the upper and lower surface element If or it is at least concordant with the upper surface, the first metal layer 111 on the upper and lower surface is connected by sound inlet 11, in Second metal layer 311 is provided with the receiving space 31 of laminate 30, the second metal layer 311 extends to the upper and lower table of middle plate 30 Face, and laid in the upper and lower surface portion so that the first metal layer 111 of the lower surface of top plate 10 is welded in middle plate 30 The second metal layer 311 of upper surface, so as to which the first metal layer 111 and second metal layer 311 be turned on, lower plywood 50 and middle plate 30 fitting welding so that the second metal layer 311 of middle plate 30 connects with the earthed circuit of lower plywood 50.The top plate 10, The material of middle plate 30 and lower plywood 50 can be glass fibre.
In technical solution of the present invention, top plate 10, middle plate 30 and the lower plywood 50 of the MEMS condenser microphone 100 according to Secondary fitting is packaged, and the sound inlet 11 of top plate 10 is used to external acoustic waves being passed to inside MEMS condenser microphone 100, the One metal level 111 is connected by second metal layer 311 with earthed circuit, the upper surface of the first metal layer 111 and top plate 10 Upper surface that is concordant or extending to top plate 10, that is, the first metal layer 111 can be exposed by the upper surface of top plate 10, due to The overall dimensions very little of the MEMS condenser microphone 100, outside air or human hand are touched to the MEMS condenser microphone 100 Outside when, caused static discharge can be conducted to earthed circuit via the first metal layer 111 and discharge, so as to reduce the external world Electrostatic interference plays a part of protecting product to damage caused by the MEMS condenser microphone 100.
Further, second metal layer 311 is located at the madial wall of the receiving space 31 of middle plate 30, and is covered with the inner side Wall, electromagnetic armouring structure is formed, the internal structure of MEMS condenser microphone 100 can be avoided to produce electromagnetism to external equipment and done Disturb, while prevent the outer bound pair Mechatronic Systems microphone internal structure from producing electromagnetic interference, further protect product.
In one embodiment of the invention, the first metal layer 111 protrudes from the upper surface of top plate 10, and along the week of sound inlet 11 Annular is formed to extension.
Because the overall structure size of the MEMS condenser microphone 100 is smaller, without that the first metal layer 111 is excessive The upper surface of the top plate 10 is laid in, circumferentially extending of the first metal layer 111 along sound inlet 11 is only formed into annular, you can reach Discharged to extraneous electrostatic interference is conducted into ground connection, save material, reduce manufacturing cost.
In one embodiment of the invention, the annular outside dimension scope that the first metal layer 111 is formed is 0.4mm~0.8mm.Should The first metal layer 111 in size range can be while antistatic protection function be realized, materials'use is less.
In one embodiment of the invention, the diameter range of sound inlet 11 is 0.2mm~0.4mm.
The first metal layer 111 is bonded the inwall for being arranged at sound inlet 11, when the first metal layer 111 is only in sound inlet 11 It is interior setting and it is concordant with the upper surface of top plate 10 when, the diameter of the sound inlet 11 is the outside dimension of the first metal layer 111, The first metal layer 111 can have the function that to eliminate outside electrostatic under the structure, and materials are minimum.It is to be appreciated that this first Metal level 111 is better in the upper surface of the top plate 10 laying bigger anti-static effect of scope.
In one embodiment of the invention, the thickness of top plate 10 is 0.2mm~0.3mm.The thickness of middle plate 30 be 0.5mm~ 0.7mm.So that the overall dimensions of MEMS condenser microphone 100 are small, it is applied widely.
In one embodiment of the invention, the lower surface of top plate 10 is provided with the first circuit and connects the chip assembly of the first circuit 13, chip assembly 13 blocks sound inlet 11, and is placed in receiving space 31；
Lower plywood 50 is provided with second circuit；
Middle plate 30 is provided with connecting portion 33 in the side of receiving space 31, and connecting portion 33 is provided with least two connectors, connection Part electrically connects the first circuit and second circuit.
First circuit electrically connects second circuit by connector, realizes the function of acoustic-electric conversion, and chip assembly 13 blocks Sound inlet 11, the sound wave being passed to by sound inlet 11 can be received directly by chip assembly 13, and signal to noise ratio index is high.
Referring to Fig. 1, in one embodiment of the invention, connecting portion 33 is arranged side by side in the upper surface of middle plate 30 provided with least two The first terminal pad (not shown), the first terminal pad electrically connect the first circuit；
Connecting portion 33 is provided with least 2 second terminal pads 333 in the lower surface of middle plate 30, and the first terminal pad connects with second The matching of disk 333 is connect to set, every one first terminal pad through-thickness passes through middle plate 30, electrically connects one second terminal pad 333, the Two terminal pads 333 electrically connect second circuit.
Connecting portion 33 is located at the side of accommodating chamber 31, and larger cloth is provided for the first terminal pad and the second terminal pad 333 Between being empty, the first terminal pad and the connection area of first circuit board can be maximized, and maximize the second terminal pad 333 and the The connection area of two circuits, improve the support strength of middle plate 30.
First circuit has the terminal pad corresponding with the first terminal pad in the lower surface of top plate 10, and second circuit is under The upper surface of laminate 50 has the terminal pad corresponding with the second terminal pad 333, optimizes the line of the first circuit and second circuit Road is laid out.
In one embodiment of the invention, the diameter range of every one first terminal pad is 0.2mm~0.5mm；And/or every 1 The diameter range of two terminal pads 333 is 0.2mm~0.5mm.
Every one first terminal pad is corresponding with the position of one second terminal pad 333, and middle plate 30 is provided with through hole, and every one first Terminal pad is realized with one second terminal pad 333 by a through hole and electrically connected.
In one embodiment of the invention, the one side that lower plywood 50 connects middle plate 30 is provided with second circuit, away from middle plate 30 One side be provided with least two connection pins 51, second circuit is through the electrical connection connection pin 51 of lower plywood 50, the first terminal pad, the Two terminal pads 333 and connection pin correspond.
Connection pin 51 is used to connect external circuit, realizes the connection of MEMS condenser microphone 100 and external circuit, real The function of existing acoustic-electric conversion.
Referring to Fig. 1 and Fig. 2, in one embodiment of the invention, the micro-electro-mechanical microphone 100 is data signal output, Mei Yilian Connecing pin 51 can be connected respectively in each corresponding function circuit in the external world, so as to the connection with external circuit, realize numeral The output of signal.Connection pin 51 includes power supply output pin 511, signal output pin 512, clock frequency pin 513 and a left side R channel selects pin 515, and it is four to connect pin 51 in the embodiment, and respectively power supply output pin 511, signal output is drawn Pin 512, clock frequency pin 513 and left and right acoustic channels selection pin 515；And/or chip assembly 13 includes MEMS sensor 131 With ASIC (Application Specific Integrated Circuit, application specific integrated circuit) amplifier 133, the MEMS Sensor 131 blocks sound inlet 11；And/or chip assembly 13 includes integral type CMOS (Complementary Metal- Oxide-Semiconductor, complementary metal oxide semiconductor) sensor chip (not shown).
Lower plywood 50 is additionally provided with multiple grounding pins 53 away from the one side of middle plate 30, the through-thickness of grounding pin 53 Through lower plywood 50, the earthed circuit of electrical connection lower plywood 50, the externally connected earthed circuit of the grounding pin 53, so as to right MEMS condenser microphone 100 is grounded function.
Referring to Fig. 3, in one embodiment of the invention, the micro-electro-mechanical microphone 100 is analog signal output, each connection pin 51 can be connected respectively in each corresponding function circuit in the external world, so as to the connection with external circuit, realize analog signal Output.Connection pin 51 includes power supply output pin 511 and signal output pin 512, and in the present embodiment, connection pin 51 is two It is individual, respectively power supply output pin 511 and signal output pin 512；And/or chip assembly 13 includes the He of MEMS sensor 131 ASIC amplifiers 133.
In the embodiment of the present invention, the first metal layer 111 is attached at the madial wall of sound inlet 11, and by the inner side of sound inlet 11 Wall extends to the upper and lower surface of top plate 10, and second metal layer 311 is attached at the madial wall of receiving space 31, and empty by accommodating Between 31 madial wall extend to the upper and lower surface of middle plate 30, the first metal layer 111 positioned at the lower surface of top plate 10 is with being located at The second metal layer 311 of the upper surface of middle plate 30 is connected, so as to which the first metal layer 111 and second metal layer 311 be turned on；Position Second metal layer 311 in the lower surface of middle plate 30 is connected with positioned at the earthed circuit of the upper surface of lower plywood 50, so as to will be in The first metal layer 111 of the upper surface of top plate 10 is conducted to earthed circuit so that the electrostatic of contact the first metal layer 111 is by connecing Ground circuit is released.
In technical solution of the present invention, top plate 10, middle plate 30 and lower plywood 50 are to utilize ripe SMT (Surface Mount Technology, surface mounting technology) patch Welding carries out welding fitting, formed a complete SMT patch weld it is micro- Mechatronic Systems sensor transducer part, its signal to noise ratio index encapsulate than present LGA (Land Grid Array, grid array) More than 3dB is improved with the micro-electro-mechanical sensors of QFN (Quad Flat No-lead, quad flat non-pin) encapsulation.Skill of the present invention Art scheme, it is the lower surface that the 133 liang of chips upside-down mountings of MEMS sensor 131 and ASIC amplifiers are fixed on to top plate 10, on It is exposed around the sound inlet 11 of laminate 10 to have the first metal layer 111, it can prevent people from touching product and caused electrostatic breakdown.In Receiving space 31 in laminate 30 is used to accommodate MEMS sensor 131 and ASIC amplifiers 133, the madial wall one of receiving space 31 There is connecting portion 33 side, and the connecting portion 33 is included in the terminal pad of two or four first that the upper surface of middle plate 30 is set, and In the second terminal pad of two or four 333 of the corresponding setting in the lower surface of middle plate 30, each first terminal pad passes through middle level Plate 30 electrically connects one second terminal pad 333, forms independent metal welded disc, and multiple first terminal pads and multiple second connections Disk 333 is arranged side by side respectively, and such layout of middle plate 30 can strengthen patch face of weld product, improves the intensity of encapsulating products.Middle level Plate 30 plays connecting bridge beam action, and the appearance of middle plate 30 to the first circuit of top plate 10 and the second circuit of lower plywood 50 Receive space 31 interior side-wall surface metallization can also reach electromagnetic shielding while grounding connection is played a part of so that this is micro- Mechatronic Systems microphone 100 has to the jamproof ability of radio frequency, further protects the MEMS condenser microphone 100 not to be damaged It is bad.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every at this Under the inventive concept of invention, the equivalent structure transformation made using description of the invention and accompanying drawing content, or directly/use indirectly It is included in other related technical areas in the scope of patent protection of the present invention.

Claims (10)

  1. A kind of 1. MEMS condenser microphone, it is characterised in that including：
    Top plate, the top plate are provided with sound inlet, and the madial wall of the sound inlet is provided with the first metal layer, first metal Layer is concordant with the upper surface of the top plate or or protrudes from the upper surface of the top plate；
    Middle plate, the middle plate has through thereon, the receiving space of lower surface, and the madial wall of the receiving space is provided with the Two metal levels, the lower surface of the top plate is bonded the upper surface of the middle plate, and blocks the receiving space, and described first Metal level connects the second metal layer；And lower plywood, the lower plywood are bonded the lower surface of the middle plate, and block institute Receiving space is stated, the lower plywood is provided with earthed circuit, and the second metal layer connects the earthed circuit.
  2. 2. MEMS condenser microphone as claimed in claim 1, it is characterised in that the first metal layer is protruded from described The upper surface of laminate, and form annular along the circumferentially extending of the sound inlet.
  3. 3. MEMS condenser microphone as claimed in claim 2, it is characterised in that the annular that the first metal layer is formed is outer Footpath size range is 0.4mm~0.8mm.
  4. 4. MEMS condenser microphone as claimed in claim 1, it is characterised in that the diameter range of the sound inlet is 0.2mm~0.4mm.
  5. 5. the MEMS condenser microphone as described in any one in Claims 1-4, it is characterised in that the top plate Lower surface is provided with the first circuit and connects the chip assembly of first circuit, and the chip assembly blocks the sound inlet, and It is placed in the receiving space；
    The lower plywood is provided with second circuit；
    The middle plate is provided with connecting portion in the side of the receiving space, and the connecting portion is provided with least two connectors, described Connector electrically connects first circuit and second circuit.
  6. 6. MEMS condenser microphone as claimed in claim 5, it is characterised in that the connecting portion is upper in the middle plate Surface is provided with least two the first terminal pads being arranged side by side, and first terminal pad electrically connects first circuit；
    The connecting portion is provided with least 2 second terminal pads in the lower surface of the middle plate, and first terminal pad connects with second Connect disk matching to set, every one first terminal pad electrically connects one second terminal pad, the second terminal pad electricity through the middle plate Connect the second circuit.
  7. 7. MEMS condenser microphone as claimed in claim 6, it is characterised in that the diameter model of each first terminal pad Enclose for 0.2mm~0.5mm；And/or the diameter range of each second terminal pad is 0.2mm~0.5mm.
  8. 8. MEMS condenser microphone as claimed in claim 6, it is characterised in that the lower plywood connects the middle plate The second circuit is simultaneously provided with, is provided with least two connection pins away from the one side of the middle plate, the second circuit passes through The lower plywood electrically connects the connection pin, and first terminal pad, the second terminal pad and connection pin correspond.
  9. 9. MEMS condenser microphone as claimed in claim 8, it is characterised in that the MEMS condenser microphone is numeral Signal output, the connection pin include power supply output pin, signal output pin, clock frequency pin and left and right acoustic channels selection Pin；And/or the chip assembly includes MEMS sensor and ASIC amplifiers, enters sound described in the MEMS sensor closure Hole；And/or the chip assembly includes integral type cmos sensor chip.
  10. 10. MEMS condenser microphone as claimed in claim 8, it is characterised in that the MEMS condenser microphone is mould Intend signal output, the connection pin includes power supply output pin and signal output pin；And/or the chip assembly includes MEMS sensor and ASIC amplifiers, the MEMS sensor block the sound inlet.
CN201710893397.5A 2017-09-26 2017-09-26 MEMS condenser microphone Pending CN107484093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710893397.5A CN107484093A (en) 2017-09-26 2017-09-26 MEMS condenser microphone

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Application Number Priority Date Filing Date Title
CN201710893397.5A CN107484093A (en) 2017-09-26 2017-09-26 MEMS condenser microphone

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Publication Number Publication Date
CN107484093A true CN107484093A (en) 2017-12-15

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026902A (en) * 2007-03-28 2007-08-29 梅嘉欣 Microelectromechanical acoustical sensor package structure
TW200844036A (en) * 2007-05-15 2008-11-16 Ind Tech Res Inst Package and packageing assembly of microelectromechanical system microphone
CN201550275U (en) * 2009-09-28 2010-08-11 瑞声声学科技(常州)有限公司 Mems microphone
CN203193883U (en) * 2013-03-25 2013-09-11 歌尔声学股份有限公司 Mems microphone
CN203193888U (en) * 2013-03-25 2013-09-11 歌尔声学股份有限公司 Mems microphone
CN103607688A (en) * 2013-11-19 2014-02-26 歌尔声学股份有限公司 MEMS microphone making method
CN106604189A (en) * 2016-11-30 2017-04-26 歌尔股份有限公司 MEMS microphone
CN207235115U (en) * 2017-09-26 2018-04-13 深圳市芯易邦电子有限公司 MEMS condenser microphone

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026902A (en) * 2007-03-28 2007-08-29 梅嘉欣 Microelectromechanical acoustical sensor package structure
TW200844036A (en) * 2007-05-15 2008-11-16 Ind Tech Res Inst Package and packageing assembly of microelectromechanical system microphone
CN201550275U (en) * 2009-09-28 2010-08-11 瑞声声学科技(常州)有限公司 Mems microphone
CN203193883U (en) * 2013-03-25 2013-09-11 歌尔声学股份有限公司 Mems microphone
CN203193888U (en) * 2013-03-25 2013-09-11 歌尔声学股份有限公司 Mems microphone
CN103607688A (en) * 2013-11-19 2014-02-26 歌尔声学股份有限公司 MEMS microphone making method
CN106604189A (en) * 2016-11-30 2017-04-26 歌尔股份有限公司 MEMS microphone
CN207235115U (en) * 2017-09-26 2018-04-13 深圳市芯易邦电子有限公司 MEMS condenser microphone

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