CN203301696U - Microphone - Google Patents
Microphone Download PDFInfo
- Publication number
- CN203301696U CN203301696U CN2013203299389U CN201320329938U CN203301696U CN 203301696 U CN203301696 U CN 203301696U CN 2013203299389 U CN2013203299389 U CN 2013203299389U CN 201320329938 U CN201320329938 U CN 201320329938U CN 203301696 U CN203301696 U CN 203301696U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- microphone
- shell
- passage
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003292 glue Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 230000005236 sound signal Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Abstract
The utility model discloses a microphone which comprises a circuit board and a housing. The circuit board and the housing enclose a packaging structure in a sealing manner via fixing glue, and a sound hole for receiving sound signals is arranged in the packaging structure, wherein a channel communicating the inner and outer of the packaging structure is arranged between the circuit board and the housing. The size of the channel is adjusted to adjust the frequency response curve of the microphone, thereby satisfying requirements of clients.
Description
Technical field
The utility model relates to the acoustical-electrical transducer technical field, more specifically, relates to a kind of microphone.
Background technology
Along with the progress of society and the development of technology, in recent years, along with the electronic product volumes such as mobile phone, notebook computer constantly reduce, people are also more and more higher to the performance requirement of these portable electronic products, thereby also require that the volume of supporting electronic component with it constantly reduces, performance and consistency improve constantly.Under this background, as the microphone products field of one of strength member of above-mentioned portable electronic products, also released a lot of novel products.
Conventional microphone comprises wiring board and shell, wiring board and shell seal to surround by fixing glue and form encapsulating structure, on encapsulating structure, be provided with the sound hole that receives voice signal, usually between shell and wiring board by fixing glue by its whole sealings, the microphone of this structure, its frequency response curve is very restricted to a certain extent, and can not meet client's demand, needs thus to design a kind of novel microphone.
The utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of a kind of microphone that can improve the microphone frequency response curve.
For addressing the above problem the utility model by the following technical solutions: a kind of microphone, comprise wiring board and shell, described wiring board and described shell seal to surround by fixing glue and form encapsulating structure; Described encapsulating structure is provided with the sound hole that receives voice signal, wherein, between described wiring board and described shell, is provided with the passage that is communicated with inside and outside described encapsulating structure.
A kind of preferred version, the local protrusion in the described wiring board position relative with described shell forms plural boss, between described boss, forms described passage, and described fixing glue is filled in described wiring board and the described shell link position beyond described passage.
A kind of preferred version, described passage is a kind of local passage that forms that protrudes by in board substrate, welding resistance or Copper Foil.
Another preferred version, the local protrusion in the described side wall of outer shell position relative with described wiring board forms plural boss, between described boss, form described passage, described fixing glue is filled in described wiring board and the described shell link position beyond described passage.
A kind of preferred version, described sound hole is arranged on described shell.
Another preferred version, described sound hole is arranged on described wiring board.
Utilize above-mentionedly according to microphone described in the utility model, due to microphone of the present utility model, comprise wiring board and shell, described wiring board and described shell seal to surround by fixing glue and form encapsulating structure; Described encapsulating structure is provided with the sound hole that receives voice signal, wherein, between wiring board and shell, is provided with the passage that is communicated with inside and outside encapsulating structure, can by the size of regulating this passage, regulate the frequency response curve of microphone, and product is met customer need.
Below in conjunction with accompanying drawing, the utility model is described in detail.
The accompanying drawing explanation
Fig. 1 is the generalized section of the utility model embodiment mono-microphone.
Fig. 2 is the generalized section of the utility model embodiment bis-microphones.
Embodiment
Below with reference to accompanying drawing, specific embodiment of the utility model is described in detail.
Embodiment mono-: as shown in Figure 1, the microphone in the utility model, comprise wiring board 1 and shell 2, and described wiring board 1 and described shell 2 surround and form encapsulating structure by fixing glue 3 sealings; On wiring board 1, be provided with the sound hole (not doing signs in figure) that receives voice signal, wherein, between described wiring board 1 and described shell 2, be provided with the passage 4 that is communicated with inside and outside described encapsulating structure.This passage 4, for by local protrusion of board substrate, forming two boss, forms described passage 4 between described two boss, passage also can utilize welding resistance on wiring board or Copper Foil and be processed to form certainly, at this, does not just describe one by one.Fixing glue 3 is filled in the described wiring board 1 and described shell 2 link positions beyond passage 4, realizes the fixing of wiring board 1 and shell 2.
Utilize above-mentionedly according to microphone described in the utility model, due to microphone of the present utility model, comprise wiring board and shell, described wiring board and described shell seal to surround by fixing glue and form encapsulating structure; Described encapsulating structure is provided with the sound hole that receives voice signal, wherein, between wiring board and shell, is provided with the passage that is communicated with inside and outside encapsulating structure, can by the size of regulating this passage, regulate the frequency response curve of microphone, and product is met customer need.
Embodiment bis-: as shown in Figure 2, the microphone in the utility model, comprise wiring board 1 and shell 2, and described wiring board 1 and described shell 2 surround and form encapsulating structure by fixing glue 3 sealings; On shell 2, be provided with the sound hole (not doing signs in figure) that receives voice signal, wherein, between described wiring board 1 and described shell 2, be provided with the passage 4 that is communicated with inside and outside described encapsulating structure.This passage 4 is that described shell 2 sidewall locations local protrude relative with described wiring board 1 forms two boss, between described boss, forms described passage 4, and described fixing glue 3 is filled in the described wiring board 1 and described shell 2 link positions beyond described passage.
Utilize above-mentionedly according to microphone described in the utility model, due to microphone of the present utility model, comprise wiring board and shell, described wiring board and described shell seal to surround by fixing glue and form encapsulating structure; Described encapsulating structure is provided with the sound hole that receives voice signal, wherein, between wiring board and shell, is provided with the passage that is communicated with inside and outside encapsulating structure, can by the size of regulating this passage, regulate the frequency response curve of microphone, and product is met customer need.
Above demonstration and described basic principle of the present utility model and principal character.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.
Claims (6)
1. a microphone, comprise wiring board and shell, and described wiring board and described shell seal to surround by fixing glue and form encapsulating structure;
Described encapsulating structure is provided with the sound hole that receives voice signal, it is characterized in that:
Between described wiring board and described shell, be provided with and be communicated with the inside and outside passage of described encapsulating structure.
2. microphone as claimed in claim 1, it is characterized in that: the local protrusion in the described wiring board position relative with described shell forms plural boss, between described boss, form described passage, described fixing glue is filled in described wiring board and the described shell link position beyond described passage.
3. microphone as claimed in claim 2, is characterized in that: the passage that described passage forms for a kind of local protrusion by in board substrate, welding resistance or Copper Foil.
4. microphone as claimed in claim 1, it is characterized in that: the local protrusion in the described side wall of outer shell position relative with described wiring board forms plural boss, between described boss, form described passage, described fixing glue is filled in described wiring board and the described shell link position beyond described passage.
5. microphone as claimed in claim 1, it is characterized in that: described sound hole is arranged on described shell.
6. microphone as claimed in claim 1, it is characterized in that: described sound hole is arranged on described wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203299389U CN203301696U (en) | 2013-06-08 | 2013-06-08 | Microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203299389U CN203301696U (en) | 2013-06-08 | 2013-06-08 | Microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203301696U true CN203301696U (en) | 2013-11-20 |
Family
ID=49577673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203299389U Expired - Lifetime CN203301696U (en) | 2013-06-08 | 2013-06-08 | Microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203301696U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764017A (en) * | 2014-12-16 | 2016-07-13 | 北京卓锐微技术有限公司 | Silicon capacitance microphone |
-
2013
- 2013-06-08 CN CN2013203299389U patent/CN203301696U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764017A (en) * | 2014-12-16 | 2016-07-13 | 北京卓锐微技术有限公司 | Silicon capacitance microphone |
| CN105764017B (en) * | 2014-12-16 | 2019-01-29 | 山东共达电声股份有限公司 | A kind of silicon capacitor microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131120 |