CN203691587U

CN203691587U - Ultra-thin acoustic cavity channel structure of MIC

Info

Publication number: CN203691587U
Application number: CN201420041667.1U
Authority: CN
Inventors: 黄茂昭; 陈堃; 杨秀文
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2014-01-22
Filing date: 2014-01-22
Publication date: 2014-07-02
Anticipated expiration: 2024-01-22

Abstract

The utility model discloses an ultra-thin acoustic cavity channel structure of a MIC. The ultra-thin acoustic cavity channel structure comprises a front housing, a rubber sleeve, and a MIC disposed on the front face of the mainboard. The rubber sleeve is adhered to the front face of the mainboard and forms a sealed cavity. The MIC is positioned on one side in the cavity of the rubber sleeve. An avoidance space is formed between a position of a working hole of the MIC and an inner end face of the rubber sleeve. The back side of the mainboard is connected with the front housing in a sealed manner. A channel stretching to a side face of the front housing is disposed inside the front housing. The mainboard is provided with a through hole which is positioned in one side of the MIC and communicates with the cavity of the rubber sleeve and the channel of the front housing. The cavity of the rubber sleeve and the channel of the front housing form a complete acoustic cavity channel structure having good sealed performance of the MIC. The ultra-thin acoustic cavity channel structure solves the conflict between the mainboard layout and the appearance of the product in the design of the acoustic cavity channel of the MIC, enables more choices for the location layout of a sound pickup hole of the MIC, and meanwhile, saves the sealed space in the thickness direction of the MIC and solves a problem of thickness of the product.

Description

The ultra-thin sound chamber channel design of a kind of MIC

Technical field

The utility model relates to mobile communication equipment technical field, more particularly, relates to the ultra-thin sound chamber channel design of a kind of MIC.

Background technology

In recent years, along with the volume of the electronic product such as mobile phone, panel computer constantly reduces, people are also more and more higher to the performance requirement of these portable electronic products, thereby the volume of structure that also requires to coordinate with it the electronic component of installing constantly reduces, performance and consistency improve constantly.

At present, MIC(microphone in electronic product on market) sound chamber passage generally design at the one side of mainboard, carry out the layout of passage, but be subject to like this impact of motherboard layout larger, easily conflict mutually with the appearance requirement of product, the limited location system in pickup hole, meanwhile, in the channels designs process of the MIC of one side sound chamber, because sealing need to design from one side, thickness direction is required high, can have influence on the thickness of product, be unfavorable for the development trend of microminiaturized and ultrathin.

Utility model content

The purpose of this utility model is to overcome above-mentioned defect of the prior art, and the ultra-thin sound chamber channel design of a kind of MIC is provided, and it can solve appearance requirement and the afoul problem of thickness of motherboard layout and product in the sound chamber channels designs of MIC.

For achieving the above object, the technical scheme that the utility model provides is as follows: the ultra-thin sound chamber channel design of a kind of MIC, it comprises procapsid, gum cover and be arranged on the MIC on the front of mainboard, described gum cover is bonded on the front of described mainboard and is formed with a cavity, described MIC is positioned at cavity one side of described gum cover, between the position, working hole place of described MIC and the inner face of described gum cover, be formed with and keep away bit space, the back side of described mainboard and described procapsid are tightly connected, the inside of described procapsid offers the passage that leads to its side, described mainboard offers and is positioned at a side of described MIC and by the through hole of the passage conducting of the cavity of described gum cover and described procapsid.

As preferably, in technique scheme, described gum cover is mutually bonding with the front of described mainboard by double faced adhesive tape.

As preferably, in technique scheme, the back side of described mainboard is tightly connected by foam and described procapsid.

As preferably, in technique scheme, described gum cover is set to silica gel sheath.

Compared with prior art, the beneficial effects of the utility model are:

Gum cover of the present utility model is bonded on the front of mainboard and has formed ultra-thin seal audio cavity, between the position, working hole place of MIC and the inner face of gum cover, be formed with and keep away bit space, the back side and the procapsid of mainboard are tightly connected, the cavity of gum cover and the passage of procapsid are conducted by the through hole that is opened in procapsid, form the sound chamber channel design of MIC complete, good airproof performance, the afoul problem of appearance requirement that it has solved motherboard layout and product in the sound chamber channels designs of MIC, makes the location layout in the pickup hole of MIC can have more more options; Meanwhile, the utility model has been saved the seal cavity of the thickness direction of MIC, has solved the thickness problem of product.

Brief description of the drawings

Fig. 1 is the vertical view of the ultra-thin sound chamber channel design of MIC described in the utility model;

Fig. 2 is the stereochemical structure profile along A-A ' line in Fig. 1;

Fig. 3 is the profile along A-A ' line in Fig. 1;

Fig. 4 is the profile along C-C ' line in Fig. 1.

Include in the drawings:

1---procapsid, 2---gum cover, 3---mainboard, 4---MIC, 5---cavity, 6------passage, 8---through hole, 9---double faced adhesive tape, the 10---foam of keeping away bit space, 7.

Below in conjunction with drawings and Examples, the ultra-thin sound chamber channel design of MIC described in the utility model is described further.

Embodiment

Be below the preferred example of the ultra-thin sound chamber channel design of MIC described in the utility model, therefore do not limit protection range of the present utility model.

Please refer to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, there is shown the ultra-thin sound chamber channel design of a kind of MIC, it comprises procapsid 1, gum cover 2 and is arranged on the MIC4 on the front of mainboard 3.In the present embodiment, preferred, gum cover 2 is set to silica gel sheath, and gum cover 2 is bonded on the front of mainboard 3 and is formed with a cavity 5, and MIC4 is positioned at cavity 5 one sides of gum cover 2.Wherein, gum cover 2 is made ultrathin design on inner face, makes to be formed with and to keep away bit space 6 between the position, working hole place of MIC4 and the inner face of gum cover 2.In addition, because the inner face of gum cover 2 has been made ultrathin design, the structural configuration that therefore also needs the periphery that calculates gum cover 2 to support, avoids gum cover 2 to block the working hole of MIC4.

In the present embodiment, gum cover 2 is mutually bonding with the front of mainboard 3 by double faced adhesive tape 9.Gum cover 2 and double faced adhesive tape 9 have been combined to form the Ultrathin sealed sound chamber in MIC4 front like this.This need explanation, gum cover 2 also can adopt other adhesives and mainboard 3 bonding, be not limited to the double faced adhesive tape 9 in this enforcement.

In the present embodiment, the back side of mainboard 3 is installed on procapsid 1, and preferably, the back side of mainboard 3 is tightly connected by foam 10 and procapsid 1, and it has prevented that the position between mainboard 3 and procapsid 1 from gas leakage situation occurring.

In the present embodiment, the inside of procapsid 1 offers the passage 7 that leads to its side, mainboard 3 offer be positioned at a side of MIC4 and by the cavity of gum cover 25 through hole 8 with passage 7 conductings of procapsid 1, the cavity 5 of gum cover 2 has formed the sound chamber channel design of MIC complete, good airproof performance by this through hole 8 and the passage 7 of procapsid 1.

In sum, the utility model has solved the afoul problem of appearance requirement of motherboard layout and product in the sound chamber channels designs of MIC, makes the location layout in the pickup hole of MIC can have more more options; Meanwhile, the utility model has been saved the seal cavity of the thickness direction of MIC, has solved the thickness problem of product.

Above-described embodiment is preferably execution mode of the utility model; but execution mode of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection range of the present utility model.

Claims

1. the ultra-thin sound chamber channel design of a MIC, it is characterized in that: comprise procapsid (1), gum cover (2) and be arranged on the MIC(4 on the front of mainboard (3)), described gum cover (2) is bonded on the front of described mainboard (3) and is formed with a cavity (5), described MIC(4) be positioned at cavity (5) one sides of described gum cover (2), described MIC(4) position, working hole place and the inner face of described gum cover (2) between be formed with and keep away bit space (6), the back side of described mainboard (3) and described procapsid (1) are tightly connected, the inside of described procapsid (1) offers the passage (7) that leads to its side, described mainboard (3) offers and is positioned at described MIC(4) a side and by the through hole (8) of passage (7) conducting of the cavity of described gum cover (2) (5) and described procapsid (1).

2. the ultra-thin sound chamber channel design of a kind of MIC according to claim 1, is characterized in that: described gum cover (2) is mutually bonding with the front of described mainboard (3) by double faced adhesive tape (9).

3. the ultra-thin sound chamber channel design of a kind of MIC according to claim 1, is characterized in that: the back side of described mainboard (3) is tightly connected by foam (10) and described procapsid (1).

4. the ultra-thin sound chamber channel design of a kind of MIC according to claim 1, is characterized in that: described gum cover (2) is set to silica gel sheath.