CN107493530A - The sound conduction component of terminal device and its microphone, leading note part - Google Patents

The sound conduction component of terminal device and its microphone, leading note part Download PDF

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Publication number
CN107493530A
CN107493530A CN201710673203.0A CN201710673203A CN107493530A CN 107493530 A CN107493530 A CN 107493530A CN 201710673203 A CN201710673203 A CN 201710673203A CN 107493530 A CN107493530 A CN 107493530A
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CN
China
Prior art keywords
leading note
microphone
sound
support
buffer
Prior art date
Application number
CN201710673203.0A
Other languages
Chinese (zh)
Inventor
曾元清
Original Assignee
广东欧珀移动通信有限公司
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Publication date
Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Priority to CN201710673203.0A priority Critical patent/CN107493530A/en
Publication of CN107493530A publication Critical patent/CN107493530A/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/08Mouthpieces; Microphones; Attachments therefor
    • H04R1/083Special constructions of mouthpieces

Abstract

This application provides the sound conduction component of a kind of terminal device and its microphone, leading note part, the leading note part includes the different leading note supports and buffer body of material hardness, and the hardness of leading note support material is more than the hardness of buffer body material;One side end face of leading note support is provided with sound inlet, and top surface is provided with sender, and bottom surface is oppositely arranged with top surface, and bottom surface is connected provided with leading note groove, sound inlet and sender by leading note groove;Location structure is additionally provided with top surface, location structure is used to position microphone;Buffer body is surrounded on the periphery of sound inlet on end face.The structure type combined by the hard plastic leading note support and soft rubber buffer body two parts that design leading note part, on the one hand it can ensure that leading note part can be with the sealing and buffering connection of terminal device, on the other hand the bulk strength of leading note part can also be improved, improves the quality of sound conduction;In addition, also by setting location structure to realize the positioning to microphone.

Description

The sound conduction component of terminal device and its microphone, leading note part

Technical field

The present invention relates to the technical field of terminal device microphone voice conducting structure, is specifically related to a kind of terminal device And its sound conduction component, the leading note part of microphone.

Background technology

As the electronic equipments such as the development of electronic equipment, mobile phone have become indispensable one in people's work and life Part.The electronic equipments such as mobile phone typically all include microphone, and the setting relation between microphone and mobile phone shell is usually:Mike Microphone aperture in the direct face mobile phone shell of wind is set either by turning sound structure by the microphone on microphone and mobile phone shell Hole indirect communication.

The content of the invention

On the one hand the embodiment of the present application provides a kind of leading note part of microphone, it is different that the leading note part includes material hardness Leading note support and buffer body, the hardness of the leading note support material is more than the hardness of the buffer body material;Wherein, it is described One side end face of leading note support is provided with sound inlet, and top surface is provided with sender, and bottom surface is oppositely arranged with the top surface, on the bottom surface Provided with leading note groove, the sound inlet is connected with the sender by the leading note groove;Location structure is additionally provided with the top surface, The location structure is used to position microphone;The buffer body is surrounded on the sound inlet on the end face Periphery.

On the other hand the embodiment of the present application also provides a kind of sound conduction component of microphone, conducting subassembly includes Mike Leading note part any one of wind, sealed bolster plate and above-described embodiment;The sealed bolster plate is covered on the leading note part Bottom surface, to form leading note passage with the leading note groove, the side of the microphone is connected with circuit board, opposite side on the other side Sound inlet is set, and the sound inlet of the microphone corresponds to the sender of the leading note part, and then the microphone is received Enter from the sound inlet of the leading note part, and pass through the sound of the leading note channel transfer.

Further, the embodiment of the present application provides a kind of terminal device, and the terminal device includes fore shell, rear shell, circuit Microphone voice conducting subassembly any one of plate and above-described embodiment;The sealed bolster plate abuts the fore shell, institute The end face that rear shell is stated with the leading note support is abutted, and the rear shell is provided with into sound passage, the sound inlet pair of the leading note support Enter sound passage described in Ying Yu, the buffer body of the leading note part is located between the rear shell and the leading note support, to described Sealing and buffering connection between leading note support and the rear shell.

The terminal device and its sound conduction component, the leading note part of microphone that the embodiment of the present application provides, are led by design The structure type that the hard plastic leading note support and soft rubber buffer body two parts of sound part combine, on the one hand can ensure leading note On the other hand part can also improve the bulk strength of leading note part, improve sound with the sealing and buffering connection of terminal device The quality of conduction;In addition, also by setting location structure to realize the positioning to microphone.

Brief description of the drawings

Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings Accompanying drawing.

Fig. 1 is the overall structure diagram of the embodiment of the application microphone leading note part one;

Fig. 2 is the side view of leading note part in Fig. 1 embodiments;

Fig. 3 is A-A sectional view of the leading note part along dotted line position in Fig. 1 embodiments;

Fig. 4 is the bottom view of leading note part in Fig. 1 embodiments;

Fig. 5 is that the structure of leading note part in Fig. 1 embodiments disassembles schematic diagram;

Fig. 6 is the structure schematic cross-sectional view of another embodiment of the application microphone leading note part;

Fig. 7 is the overall structure diagram of the another embodiment of the application microphone leading note part;

Fig. 8 is that the structure of leading note part in Fig. 7 embodiments disassembles schematic diagram;

Fig. 9 is the structure schematic cross-sectional view of the embodiment of sound conduction component one of the application microphone;

Figure 10 is the structural blast schematic diagram of sound conduction component in Fig. 9 embodiments;

Figure 11 is that the structure of the application leading note part another embodiment disassembles schematic diagram;

Figure 12 is the overall structure diagram of the application leading note support a further embodiment;

Figure 13 is the structure schematic cross-sectional view of the another embodiment of the application leading note part;

Figure 14 is the structure schematic cross-sectional view of another embodiment of sound conduction component of the application microphone;

Figure 15 is the partial structurtes schematic cross-sectional view of the embodiment of the application terminal device one;

Figure 16 is the partial structurtes schematic cross-sectional view of another embodiment of the application terminal device.

Embodiment

With reference to the accompanying drawings and examples, the present invention is described in further detail.It is emphasized that following implement Example is merely to illustrate the present invention, but the scope of the present invention is not defined.Likewise, following examples are only the portion of the present invention Point embodiment and not all embodiments, the institute that those of ordinary skill in the art are obtained under the premise of creative work is not made There are other embodiments, belong to the scope of protection of the invention.

Term " first " in the present invention, " second ", " the 3rd " are only used for describing purpose, and it is not intended that instruction or dark Show relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, " first ", " second ", " are defined At least one this feature can be expressed or be implicitly included to three " feature.In description of the invention, " multiple " be meant that to It is few two, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present invention Such as up, down, left, right, before and after ...) it is only used for explaining the phase under a certain particular pose (as shown in drawings) between each part To position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith Become.In addition, term " comprising " and " having " and their any deformations, it is intended that cover non-exclusive include.Such as comprising The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and It is alternatively also to include the step of not listing or unit, or alternatively also includes for these processes, method, product or equipment Intrinsic other steps or unit.

Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe can wrap in conjunction with the embodiments In at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and Implicitly understand, embodiment described herein can be combined with other embodiments.

Microphone on terminal device is typically all by sound conduction part and ft connection, rather than microphone enters Through hole in the direct corresponding housing of sound hole is set.Because on the one hand leading note part needs the function with sound conduction, it is also necessary to protect There is the connection of pooling feature, therefore conducting piece of the prior art is generally overall soft rubber between card and terminal device housing Structural member made of glue, it is the shortcomings that this kind of structure because its entirety is made of soft material, needs to be provided with inside it and lead The passage of sound, it is well known that soft material can deform when being squeezed, and so as to cause leading note channel deformation, and then make sound Distortion phenomenon in communication process be present;In addition, the conducting piece of soft material holds very much in injection molding process in sound-delivery channel Burr is easily formed, and then noise can be brought, influences the conductive mass of sound.For above-mentioned technical problem, the application will provide as Under solution.

In addition, it is necessary to explanation, the terminal device in the application can include mobile phone, tablet personal computer, notebook computer, Wearable device etc. has the electronic equipment of microphone.

Also referring to Fig. 1 and Fig. 2, Fig. 1 is the overall structure diagram of the embodiment of the application microphone leading note part one, figure 2 be the side view of leading note part in Fig. 1 embodiments, and in the embodiment, leading note part 100 includes the different leading note support of material hardness 110 and buffer body 120, the hardness of the material of leading note support 110 is more than the hardness of the material of buffer body 120.Wherein, leading note support 110 specific material can be the hard plastics such as ABS, POM, PS, PMMA, PC, PET, PBT, PPO, PP, PE, PA, PVC.And delay Rushing body 120 can then be made up of the soft material such as rubber, foam.Those skilled in the art can under above-mentioned guiding theory according into The actual demand of this grade is voluntarily chosen, and is not specifically limited herein.

Specifically, the leading note support 110 includes top surface 111, end face 112, bottom surface 113 and side 114.Bottom surface 113 It is oppositely arranged with top surface 111.The top surface 111 further comprises the first plane 1111, the second plane 1112 and flat located at first Joint face 1113 between the plane 1112 of face 1111 and second, joint face 1113 can be for inclined curved surfaces or perpendicular to described First plane 1111 and the second plane 1112 are faced directly.

The top margin of end face 112 and base are connected with the second plane 1112 and bottom surface 113 respectively, alternatively, in this implementation Example in, the included angle B between 112 end faces and bottom surface 113 is acute angle so that leading note part 100 can preferably with terminal device shell Between installation coordinate, specific fit structure form will be described in detail in the embodiment below, certainly, in other embodiment In, included angle B can also be right angle or obtuse angle.

Side 114 connects top surface 111, end face 112 and bottom surface 113, so with top surface 111, end face 112 and bottom surface 113 are collectively forming the complete appearance profile of leading note support 110.

In the present embodiment, alternatively, the distance between the second plane 1112 and bottom surface 113 H1 are more than the first plane 1111 The distance between bottom surface 113 H2, to form difference in height in the first plane 1111 and the position of the second plane 1112.On end face 112 Provided with sound inlet 115, the first plane 1111 is provided with sender 116.

Also referring to Fig. 3 and Fig. 4, Fig. 3 is that A-A sectional view of the leading note part along dotted line position, Fig. 4 are in Fig. 1 embodiments The bottom view of leading note part in Fig. 1 embodiments, bottom surface 113 are provided with leading note groove 117, and sound inlet 115 and sender 116 are by leading Sound groove 117 connects.It is flat that microphone (not showing in figure, concrete structure refers to the detailed description in subsequent embodiment) is installed on first On face 1111, and it is correspondingly arranged with the sender 116 in the first plane 1111.

Referring to Fig. 5, the structure that Fig. 5 is leading note part in Fig. 1 embodiments disassembles schematic diagram, and in the present embodiment, leading note branch The first storage tank 1121 of sound inlet 115 is provided around on the end face 112 of frame 110, the appearance profile of buffer body 120 and first are held Put groove 1121 to be adapted, and be embedded in the first storage tank 1121, ensure that the ring week of sound inlet 115 is all embedded and hold first The buffer body 120 put in groove 1121 surrounds.

Alternatively, the buffer body 120 is embedded at by way of integrated injection molding in the first storage tank 1121, and buffer body 120 lateral surface is higher by the end face of the first storage tank 1121 (referring to Fig. 3), i.e. the part of buffer body 120 is embedded at the first storage tank In 1121, it is to be understood that if the lateral surface of buffer body 120 is not higher by the end face of the first storage tank 1121, i.e. buffer body 120 are disposed entirely within the structure type in the first storage tank 1121, then buffer body 120 can not be realized in leading note support 110 and end The purpose of sealing and buffering connection between end equipment housing.

In addition, please continue to refer to Fig. 1 and Fig. 4, positioning cams can also be set on the side 114 of the leading note support 110 (1141,1142), for positioning action of the leading note part 100 in installation process.

The leading note part that the present embodiment provides, by the hard plastic leading note support and soft rubber buffer body that design leading note part The structure type that two parts integrated injection molding combines, it on the one hand can ensure sealing and buffering company that leading note part can be with terminal device (soft buffer body) is connect, on the other hand can also improve the bulk strength (hard leading note support) of leading note part, improves sound conduction Quality.

Referring to Fig. 6, Fig. 6 is the structure schematic cross-sectional view of another embodiment of the application microphone leading note part, it is real with upper one Apply unlike example, the storage tank of storage tank or setting compared with shallow structure can be not provided with the present embodiment on leading note support 110 (for a upper embodiment), buffer body 120 is sticked on the end face 112 of leading note support 110, likewise, buffer body 120 Sound inlet 115 on end face 112 is set.

Leading note part structure in the embodiment, by will delay made of leading note support made of hard material and soft material Rush body to bond together, making leading note part, its overall structure is more in the case where meeting sealing, buffering connection and bulk strength Simply, either leading note support, buffer body single part process costs or the assembly cost of leading note support and buffer body It is all lower.

Also referring to Fig. 7 and Fig. 8, Fig. 7 is the overall structure diagram of the another embodiment of the application microphone leading note part, Fig. 8 is that the structure of leading note part in Fig. 7 embodiments disassembles schematic diagram, and in the embodiment, buffer body 120 includes buffer main portion 121 And rib 122,121 structures annular in shape of main body are buffered, rib 122 is structure as a whole with buffer main portion 121, and to It is extended on the outside of the cyclic structure of buffer main portion 121.

The end face 112 of leading note support 110 is provided with the first storage tank 1121, the second plane 1112 enterprising one of top surface 111 Step is provided with the second storage tank 11121 connected with the first storage tank 1121, and buffer main portion 121 is embedded at the first storage tank 1121 Interior, rib 122 is embedded in the second storage tank 11121.

Alternatively, the shape of integrated injection molding is again may be by between the buffer body 120 and leading note support 110 in the embodiment Formula is connected, and a nanometer salient point (not shown) can be set respectively in the first storage tank 1121 and the second storage tank 11121, to strengthen Connected between leading note support 110 and rib 122, the effect of the rib 122 is in buffer body 120 and leading note support 110 1 Strengthen the coupling force between buffer body 120 and leading note support 110 in body injection moulding process.

The leading note part that the present embodiment provides, the mode that its buffer body again may be by integrated injection molding with leading note support connect Connect, by setting rib on buffer body, coupling force between buffer body and leading note support can be improved, strengthen buffer body with Connected between leading note support.

Also referring to Fig. 9 and Figure 10, Fig. 9 is the structure section view of the embodiment of sound conduction component one of the application microphone Schematic diagram, Figure 10 are the structural blast schematic diagrames of sound conduction component in Fig. 9 embodiments.The conducting subassembly includes but is not limited to lead Sound part 100, microphone 200 and sealed bolster plate 300.Wherein, the structure of the leading note part 100 can be appointing in above-described embodiment Meaning is a kind of, and simply a kind of structure of leading note part 100 is illustrated in the diagram of the present embodiment.

Specifically, sealed bolster plate 300 is covered on the bottom surface 113 of leading note part 100, with leading note on leading note part bottom surface 113 Groove 117 forms leading note passage, and the sound inlet of microphone 200 corresponds to the sender 116 of leading note part, and then makes microphone 200 can The sound inlet 115 received from leading note part (being specially leading note support 110) enters, and passes through the sound of leading note channel transfer.

Alternatively, in the present embodiment, microphone 200 can be fixed on circuit board 400, and circuit board 400 is led corresponding The position of sound part sender 116 is provided with through hole 410, and the first plane 1111 of microphone 200 and leading note part leading note support 110 is located at electricity The both sides of road plate 400, it is in the present embodiment diagram:Microphone 200 is located at the top of circuit board 400, microphone 200 and circuit On the one hand the setting relation of plate 400 plays a part of microphone 200 and electrically connected with circuit board 400, on the other hand also act as to wheat The effect that gram wind 200 is fixed.

The sound inlet of microphone 200 corresponds to the through hole 410 of circuit board 400.Alternatively, circuit board 400 and leading note support Sealing gasket 500 is folded between 110 the first plane 1111, sealing gasket 500 plays circuit board 400 and leading note support 110 first Connection and sealing function between plane 1111.

Due to the position of the first plane 1111 of leading note support 110 (in Fig. 2 H2 thinner compared to the position of the second plane 1112 Less than H1), therefore microphone 200 and circuit board 400 are connected with the position of the first plane 1111 of leading note support 110, can be with Reduce the overall installation thickness bottom of conducting subassembly, and then be advantageous to the thin design of terminal device.

Wherein, sound is in the transmission path of the conducting subassembly:Enter from the sound inlet 115 on leading note support 110, then The leading note passage being collectively forming via leading note groove 117 on sealed bolster plate 300 and leading note part bottom surface 113, then from leading note support 110 Sender 116 spread out of, and pass through after the through hole 410 on circuit board 400 be passed to microphone 200 sound inlet.

The microphone voice conducting subassembly that the present embodiment provides, its leading note part is by hard plastic leading note support and soft rubber The structure type that buffer body two parts integrated injection molding combines, on the one hand can ensure leading note part can with the sealing of terminal device and Buffering connection (soft buffer body), it on the other hand can also improve the bulk strength (hard leading note support) of leading note part, raising sound The quality of sound conduction;In addition, being collectively forming leading note passage using leading note groove on sealed bolster plate and leading note part bottom surface, sound is set to exist Transmitted in controlled range, ensure that the continuity and accuracy of sound conduction.

Figure 11 is referred to, Figure 11 is that the structure of the application leading note part another embodiment disassembles schematic diagram, in the embodiment Leading note part 100 includes the different leading note supports 110 and buffer body 120 of material hardness, likewise, the material of leading note support 110 Hardness is greater than the hardness of the material of buffer body 120.

Wherein, a side end face 112 of leading note support 110 is provided with sound inlet 115, and top surface 111 is provided with sender 116, equally , sender 116 is arranged in the first plane 1111 of top surface 111, on leading note support 110 detailed construction feature and lead The technical characteristics such as the material of sound support 110 and buffer body 120, refer to the associated description of above-described embodiment, here is omitted. By emphasis description and the difference of previous embodiment in the present embodiment.

Bottom surface 113 is oppositely arranged with top surface 111, and bottom surface 113 (does not show, concrete structure can join provided with leading note groove in figure Read the structure in Fig. 3, Fig. 5 embodiment), sound inlet 115 is connected with sender 116 by leading note groove.

The buffer body 120 includes buffer main portion 121 and at least a holding section 122, buffer main portion 121 are annularly tied Structure, at least a holding section 122 and the integrative-structure of buffer main portion 121, and extend to the cyclic structure outside of buffer main portion 121 Set.It is provided around on end face 112 in the storage tank 1121 of sound inlet on end face 115 and is correspondingly arranged with holding section 122 Slot 1122, buffer main portion 121 are embedded in storage tank 1121, and the then engaging corresponding with slot 1122 of holding section 122 Coordinate, realize being connected together for leading note support 110 and buffer body 120.

The concrete structure of the holding section 122 can be to set the shape to match therewith in barb shape, with slot 1122 Snap fit;In addition, the size of slot 1122 may be arranged as the appearance profile undersized than holding section 122, so that Holding section 122 can be installed in slot 1122 in the form of interference fit.Leading note support 110 and buffering in the present embodiment Body 120 can be separately formed structural member, be then combined together by holding section 122 and the installation of slot 1122, with shape Into the leading note part 100 of complete structure.

Alternatively, buffer body 120 includes at least two holding sections 122, and at least two holding sections 122 are uniformly distributed in buffering In the ring week of main part 121, further, in the diagram of the present embodiment, the quantity of holding section 122 is four, uniformly and two-by-two The relative ring for being arranged at buffer main portion 121 week.

Further, location structure can also be set in the first plane 1111 of the leading note support 110 in the present embodiment 600, location structure 600 is used to position microphone.Alternatively, in the present embodiment diagram, location structure 600 is multiple Locating dowel 610, locating dowel 610 can be realized by clamping the outside (not showing specific fixed structure form in figure) of microphone casing body To the positioning for the microphone being installed in the first plane 1111, or locating dowel 610 can also be by between microphone casing body Connected using screw (not showing specific fixed structure form in figure) and realize the microphone that is installed in the first plane 1111 is determined Position.

The leading note part that the present embodiment provides, realized and connected by the cooperation of snap-in structure between its leading note support and buffer body Connect, the structure of the leading note part is simple, and assembling is easy.

Figure 12 is referred to, Figure 12 is the overall structure diagram of the application leading note support a further embodiment, compared to foregoing Unlike embodiment, the location structure being arranged in the present embodiment on top surface be locating slot 620, the shape of locating slot 620 and The appearance profile of microphone is adapted, and is connected with the sender 116 of leading note support 110, so that microphone can at least partly be set It is placed in locating slot 620, and the sound inlet of microphone is corresponded to the sender 116 of the leading note support 110.In the embodiment Positioning slot structure, except the positioning function to microphone, also have the function that to be fixedly connected, specific structure refers to subsequently The associated description of conducting subassembly embodiment.

Further it should be noted that the connection of the buffer body (not shown) and leading note support 110 in the present embodiment Form can be clamping or integrated injection molding, referring specifically to the associated description of previous embodiment.

The leading note part structure that the embodiment provides, by setting locating slot to realize the positioning to microphone, make positioning more Accurately, while also there is good fixation to microphone.

Refer to Figure 13, Figure 13 is the structure schematic cross-sectional view of the another embodiment of the application leading note part, in the embodiment, is led Sound part 100 includes the different leading note supports 110 and buffer body 120 of material hardness, and the hardness of the material of leading note support 110, which is more than, to be delayed Rush the hardness of the material of body 120.Phase in above-described embodiment is referred on leading note support 110 and 120 specific material of buffer body The description of pass.Also repeat no more herein.

The leading note support 110 equally includes top surface, end face 112, bottom surface 113 and side 114.Bottom surface 113 and top surface 111 It is oppositely arranged.The top surface further comprises the first plane 1111, the second plane 1112 and located at the first plane 1111 and second Joint face 1113 between plane 1112, joint face 1113 can be for inclined curved surfaces or perpendicular to first plane 1111 With facing directly for the second plane 1112.

The top margin of end face 112 and base are connected with the second plane 1112 and bottom surface 113 respectively, alternatively, in this implementation In example, alternatively, the angle (not indicated in figure) between 112 end faces and bottom surface 113 is similarly acute angle, so that leading note part 100 can Coordinated with the preferably installation between terminal device shell, specific fit structure form will be carried out in the embodiment below It is described in detail, certainly, in other embodiments, the angle between 112 end faces and bottom surface 113 can also be right angle or obtuse angle.

Side 114 connects top surface 111, end face 112 and bottom surface 113, so with top surface 111, end face 112 and bottom surface 113 are collectively forming the complete appearance profile of leading note support 110.End face 112 is provided with sound inlet 115, is set in the first plane 1111 There is sender 116.Unlike previous embodiment, in the embodiment, between sound inlet 115 and sender 116 by located at Leading note passage 118 inside leading note support 110 connects, that is, forms the leading note passage 118 of complete structure, and is no longer semi-open knot The leading note groove of structure and the complete leading note channel design of sealed bolster plate fit form.The structure type of this kind of leading note passage can make sound Propagated completely in leading note support 110, and then can preferably ensure the quality of sound transmission.

Alternatively, in the present embodiment, locating slot 620, locating slot are additionally provided with the first plane 1111 of leading note support 110 620 shape and the appearance profile of microphone are adapted, and are connected with the sender 116 of leading note support 110, so that microphone can It is at least partially arranged in locating slot 620, and the sound inlet of microphone is corresponded to the sender 116 of leading note support 110.

Likewise, the type of attachment of the buffer body 120 and leading note support 110 in the present embodiment can be clamping or one Injection etc., referring specifically to the associated description of previous embodiment, is also no longer described in detail herein.

The leading note part structure that embodiment provides, by setting the leading note passage positioned at leading note internal stent, sound can be made complete Propagated entirely in leading note support, and then can preferably ensure the quality of sound transmission.

Figure 14 is referred to, Figure 14 is the structure section view signal of another embodiment of sound conduction component of the application microphone Figure, the conducting subassembly include but is not limited to leading note part 100 and microphone 200.Wherein, the structure of the leading note part 100 can be Any one in above-described embodiment, simply a kind of structure of leading note part 100 is illustrated in the diagram of the present embodiment.

Unlike Fig. 9 embodiments, leading note passage 118 is located at the inside of leading note support 110 in the embodiment, therefore not Need to set sealed bolster plate structure again.Alternatively, in the present embodiment, the side of microphone 200 can be fixed on circuit board 400 On, the opposite side of microphone 200 sets sound inlet 210, i.e., the microphone 200 in the present embodiment is located at circuit board 400 and leading note Between support 110.

The sound inlet 210 of microphone 200 corresponds to the sender 116 of leading note part, and then microphone 200 is received from leading The sound inlet 115 of sound part (being specially leading note support 110) enters, and the sound transmitted by leading note passage 118.

In addition, locating slot (not indicated in figure), locating slot are additionally provided with the present embodiment in the first plane of leading note support Shape and the appearance profile of microphone 200 be adapted, and connected with the sender 116 of leading note support 110, so that microphone 200 can be at least partially arranged in locating slot, and the sound inlet 210 of microphone 200 is corresponded to the sender of leading note support 110 116。

In the present embodiment, sound is in the transmission path of conducting subassembly:Enter from the sound inlet 115 on leading note support 110, Then through the leading note passage 118 inside leading note support 110, then spread out of from the sender 116 on leading note support 110, afterwards directly The sound inlet 210 of incoming microphone 200.

The microphone voice conducting subassembly that the present embodiment provides, its leading note part is by hard plastic leading note support and soft rubber The structure type that buffer body two parts integrated injection molding combines, on the one hand can ensure leading note part can with the sealing of terminal device and Buffering connection (soft buffer body), it on the other hand can also improve the bulk strength (hard leading note support) of leading note part, raising sound The quality of sound conduction;In addition, by setting the leading note passage positioned at leading note internal stent, it can both simplify the entirety of conducting subassembly Structure, also sound can be made to be propagated completely in leading note support, and then can preferably ensure the quality of sound transmission.

Further, Figure 15 is referred to, Figure 15 is the partial structurtes schematic cross-sectional view of the embodiment of the application terminal device one, Terminal device in the application can include the electricity that mobile phone, tablet personal computer, notebook computer, wearable device etc. have microphone Sub- equipment.

The terminal device can be included any one of fore shell 700, rear shell 800, circuit board 400 and above-described embodiment Microphone voice conducting subassembly.The present embodiment diagram is schematically illustrated by taking conducting subassembly in Fig. 9 as an example.

In this terminal device embodiment, the bottom surface of sealed bolster plate 300 abuts fore shell 700, and the top surface of sealed bolster plate 300 is with leading The leading note groove 117 of sound support 110 cooperatively forms leading note passage;Rear shell 800 abuts from side with the end face 112 of leading note support 110. Rear shell 800, which is provided with into sound passage 810, the sound inlet 115 of leading note support 110, to be corresponded into sound passage 810.The buffering of leading note part Body 120 is located between rear shell 800 and the end face 112 of leading note support 110, to close between leading note support 110 and rear shell 800 Envelope and buffering connection.Label 900 can be display screen in figure.

No longer it is described in detail herein on fore shell 700 and the detail technical features of rear shell 800, and the concrete structure of conducting subassembly Feature then refers to the associated description of above-described embodiment.

In addition, referring to Figure 16, Figure 16 is the partial structurtes schematic cross-sectional view of another embodiment of the application terminal device, should In embodiment, the bottom surface 113 of leading note support 110 abuts fore shell 700, and rear shell 800 abuts with the end face 112 of leading note support 110, after It is again provided with shell 800 into sound passage 810, the sound inlet 115 of leading note support 110 corresponds to be delayed into sound passage 810, leading note part Rush body 120 to be located between rear shell 800 and leading note support 110, to the sealing between leading note support 110 and rear shell 800 and delay Punching connection.The thing different from a upper embodiment, no longer sets sealed bolster plate in the embodiment, but the bottom surface of leading note support 110 113 directly abut fore shell 700.

And for the structure type that the conducting subassembly in Figure 14 and fore shell, rear shell coordinate, it is corresponding with above-described embodiment similar It is identical, no longer it is described in detail one by one herein.

The terminal device that the embodiment of the present application provides, its leading note part is by hard plastic leading note support and soft rubber buffer body The structure type that two parts integrated injection molding combines, it on the one hand can ensure that leading note part can connect with the sealing between rear shell and buffering (soft buffer body) is connect, on the other hand can also improve the bulk strength (hard leading note support) of leading note part, improves sound conduction Quality.

The section Example of the present invention is the foregoing is only, is not thereby limited the scope of the invention, every utilization The equivalent device or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations Technical field, be included within the scope of the present invention.

Claims (10)

  1. A kind of 1. leading note part of microphone, it is characterised in that the leading note part include the different leading note support of material hardness and Buffer body, the hardness of the leading note support material are more than the hardness of the buffer body material;Wherein, the side of the leading note support End face is provided with sound inlet, and top surface is provided with sender, and bottom surface is oppositely arranged with the top surface, and the bottom surface is provided with leading note groove, institute Sound inlet is stated to connect by the leading note groove with the sender;Location structure, the location structure are additionally provided with the top surface For being positioned to microphone;The buffer body is surrounded on the periphery of the sound inlet on the end face.
  2. 2. leading note part according to claim 1, it is characterised in that the location structure is multiple locating dowels, the positioning Post realizes positioning to the microphone or by being utilized between microphone casing body by clamping the outside of microphone casing body Mode connects for screw realizes the positioning to the microphone.
  3. 3. leading note part according to claim 1, it is characterised in that location structure is to be arranged on the leading note cradle top surface Locating slot, the shape of the locating slot and the appearance profile of microphone are adapted, and are connected with the sender of the leading note support, So that the microphone can be at least partially arranged in the locating slot, and the sound inlet of the microphone is set to correspond to described lead The sender of sound support.
  4. 4. leading note part according to claim 1, it is characterised in that enter described in being provided around on the end face of the leading note support First storage tank of sound hole, the buffer body are embedded in first storage tank.
  5. 5. leading note part according to claim 4, it is characterised in that the buffer body is embedded at by way of integrated injection molding In first storage tank.
  6. 6. leading note part according to claim 4, it is characterised in that the buffer body is embedded at described by way of engaging In first storage tank.
  7. 7. leading note part according to claim 1, it is characterised in that the top surface of the leading note support further comprises that first is flat Face, the second plane and the joint face between first plane and the second plane, second plane and the bottom surface The distance between be more than the distance between first plane and the bottom surface, the top margin of the end face and base respectively with it is described Second plane and bottom surface connection, the sender and the location structure are in first plane.
  8. 8. leading note part according to claim 7, it is characterised in that the angle between the end face and bottom surface of the leading note support For acute angle.
  9. A kind of 9. sound conduction component of microphone, it is characterised in that the conducting subassembly include microphone, sealed bolster plate and Leading note part described in claim any one of 1-8;The sealed bolster plate is covered on the bottom surface of the leading note part, with the leading note Groove forms leading note passage, and the side of the microphone is connected with circuit board, and opposite side on the other side sets sound inlet, the wheat The sound inlet of gram wind corresponds to the sender of the leading note part, and then the microphone is received from the leading note part and enter sound Hole enters, and passes through the sound of the leading note channel transfer.
  10. 10. a kind of terminal device, it is characterised in that the terminal device includes fore shell, rear shell, circuit board and claim 9 Described microphone voice conducting subassembly;The sealed bolster plate abuts the fore shell, the rear shell and the end of the leading note support Face abuts, and the rear shell is provided with into sound passage, the sound inlet of the leading note support enters sound passage, the leading note corresponding to described in The buffer body of part is located between the rear shell and the leading note support, to close between the leading note support and the rear shell Envelope and buffering connection.
CN201710673203.0A 2017-08-08 2017-08-08 The sound conduction component of terminal device and its microphone, leading note part CN107493530A (en)

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CN201710673203.0A CN107493530A (en) 2017-08-08 2017-08-08 The sound conduction component of terminal device and its microphone, leading note part

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CN201710673203.0A CN107493530A (en) 2017-08-08 2017-08-08 The sound conduction component of terminal device and its microphone, leading note part

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109040882A (en) * 2018-08-01 2018-12-18 宇龙计算机通信科技(深圳)有限公司 microphone sealing structure and terminal device

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Publication number Priority date Publication date Assignee Title
CN103152661A (en) * 2012-12-14 2013-06-12 上海华勤通讯技术有限公司 Microphone sealing device
CN203193830U (en) * 2012-09-26 2013-09-11 东莞宇龙通信科技有限公司 Sound guiding structure and mobile device comprising same
US20150086036A1 (en) * 2013-09-25 2015-03-26 Sony Corporation Packaging component and packaging method for microphone and electronic device
CN205987258U (en) * 2016-09-07 2017-02-22 上海展扬通信技术有限公司 Microphone seal structure and terminal equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203193830U (en) * 2012-09-26 2013-09-11 东莞宇龙通信科技有限公司 Sound guiding structure and mobile device comprising same
CN103152661A (en) * 2012-12-14 2013-06-12 上海华勤通讯技术有限公司 Microphone sealing device
US20150086036A1 (en) * 2013-09-25 2015-03-26 Sony Corporation Packaging component and packaging method for microphone and electronic device
CN205987258U (en) * 2016-09-07 2017-02-22 上海展扬通信技术有限公司 Microphone seal structure and terminal equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109040882A (en) * 2018-08-01 2018-12-18 宇龙计算机通信科技(深圳)有限公司 microphone sealing structure and terminal device

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