CN219227929U - Circuit board and circuit board assembly - Google Patents

Abstract

The present disclosure relates to a circuit board and circuit board assembly, the circuit board comprising: a laminated structure; a connection plate provided on one side surface of the laminated structure in a thickness direction; the jack penetrating through the laminated structure in the thickness direction is arranged on the laminated structure, an accommodating groove communicated with the jack is arranged on the connecting plate, and the peripheral side wall of the accommodating groove is located on the outer side of the peripheral side wall of the jack in the radial direction of the jack. The solder mask layer and the electroplated layer on the connecting plate of the circuit board are provided with the accommodating grooves which are suitable for accommodating the soldering flux overflowed in the jacks, so that the soldering flux can be prevented from overflowing and polluting the bonding pads in one-time soldering of the circuit board.

Description

Circuit board and circuit board assembly

Technical Field

The disclosure relates to the technical field of circuit board packaging, in particular to a circuit board and a circuit board assembly.

Background

With the continuous development of technology, the functions of electronic devices are increasing. In order to fully utilize the limited space inside the electronic equipment, circuit board assemblies and devices are widely used by various manufacturers. Because the device with the jack is required to be welded on part of the circuit board assembly. After the device is welded, solder paste and soldering flux still overflow outwards, a bonding pad of a circuit board is polluted, and the bonding pad can cause the problem of poor subsequent welding due to foreign matters.

As such, it is desirable to avoid contamination of the soldered portions of the circuit board assembly during the soldering process. At present, all manufacturers have no measures for improving the problems, and only can accept bad losses caused by solder paste or soldering flux pollution.

Disclosure of Invention

To overcome the problems in the related art, the present disclosure provides a circuit board comprising: a laminated structure; a connection plate provided on one side surface of the laminated structure in a thickness direction; the jack penetrating through the laminated structure in the thickness direction is arranged on the laminated structure, the connecting plate is provided with an accommodating groove communicated with the jack, and the peripheral side wall of the accommodating groove is located on the outer side of the peripheral side wall of the jack in the radial direction of the jack.

In some embodiments, the laminate structure comprises: a first side surface and a second side surface in a thickness direction, the connection plate being provided on the first side surface.

In some embodiments, the laminate structure comprises: and the two side plate parts of the laminated structure in the stacking direction are all insulating plates.

In some embodiments, the connection plate comprises: and the accommodating groove penetrates through the electroplated layer and the solder mask layer in the thickness direction.

In some embodiments, the receiving groove includes: a first accommodating groove provided on the solder resist layer; a second accommodating groove provided on the plating layer; wherein the first receiving groove is in communication with the second receiving groove, the first receiving groove having a size smaller than the second receiving groove.

In some embodiments, the peripheral side wall of the first receiving groove is located inside the peripheral side wall of the second receiving groove in a radial direction of the insertion hole.

In some embodiments, a distance of the peripheral side wall of the first accommodation groove from the peripheral side wall of the second accommodation groove in a radial direction of the insertion hole is not less than 0.1mm.

In some embodiments, the electroplated layer is configured as an electroplated copper layer and the solder mask is configured as an ink layer.

According to a second aspect of embodiments of the present disclosure, there is provided a circuit board assembly comprising a circuit board as in any one of the first aspects of the present disclosure; the device is arranged on the circuit board, a pin is arranged on the device, and the pin is inserted into the jack.

In some embodiments, the length of the foot is less than the length of the receptacle.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

the solder mask and the electroplated layer on the connecting plate of the circuit board are provided with the accommodating grooves, the accommodating grooves are suitable for accommodating the soldering flux overflowed in the jacks, and the soldering pads can be prevented from being overflowed and polluted by the soldering flux in one-time welding of the circuit board.

Compared with the related art, the circuit board and the circuit board assembly provided by the disclosure only need to modify the solder mask layer and the electroplated layer of the circuit board, do not need to increase additional working procedures, and cannot bring about the rising of production cost. In practical application, the shape and the size of the accommodating groove can be flexibly adjusted according to the connecting plate and the internal circuit of the circuit board, so that the operability is high and the fault tolerance is high.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a bottom view of a circuit board according to a related art.

Fig. 2 is a block diagram of a circuit board assembly according to an exemplary embodiment.

Fig. 3 is a bottom view of a circuit board according to an exemplary embodiment.

Fig. 4 is a schematic diagram of a circuit board according to an exemplary embodiment.

Reference numerals:

circuit board assembly 500, device 400, pins 410, circuit board 300, pads 310;

the connecting plate 200, the first accommodating groove 201, the second accommodating groove 202, the solder resist layer 210 and the electroplated layer 220;

a laminated structure 100, a jack 101, a conductive plate 110, an insulating plate 120;

jack 101', circuit board 300', pads 310', pins 410'.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the disclosure as detailed in the scope of the claims.

In the related art, with the continuous development of technology, functions of electronic devices are increasing. In order to fully utilize the limited space inside the electronic equipment, circuit board assemblies and devices are widely used by various manufacturers. Since the components with the sockets 101 'are soldered to portions of the circuit board 300' assembly. After the pins 410' of the device are soldered to the circuit board 300', the soldering flux still overflows outwards to pollute the soldering pads 310' of the circuit board 300', and the soldering pads 310' can cause the problem of poor subsequent soldering due to contamination of foreign matters.

The electronic device referred to in the present disclosure may also be referred to as a Terminal device, a Terminal, a User Equipment (UE), a Mobile Station (MS), an electronic device (MT), etc., and is a device that provides voice and/or data connectivity to a User. For example, the electronic device may be a handheld device, an in-vehicle device, or the like having a wireless connection function. Currently, examples of the electronic device 1 may be: a smart Phone (Mobile Phone), a pocket computer (Pocket Personal Computer, PPC), a palm top computer, a personal digital assistant (Personal Digital Assistant, PDA), a notebook computer, a tablet computer, a wearable device, or a vehicle-mounted device, etc. In addition, in the case of a vehicle networking (V2X) communication system, the electronic device may also be an in-vehicle device. It should be understood that embodiments of the present disclosure are not limited by the particular technology and particular device configuration employed by the electronic device.

Fig. 1 is a bottom view of a circuit board according to a related art. Fig. 2 is a block diagram of a circuit board assembly according to an exemplary embodiment. Fig. 3 is a bottom view of a circuit board according to an exemplary embodiment. Fig. 4 is a schematic diagram of a circuit board according to an exemplary embodiment.

As shown in fig. 1, the device pins 410 'of the circuit board assembly are disposed in the sockets 101' of the circuit board 300', and during this process, the flux in the sockets 101' flows along the inner walls of the sockets 101', and finally infiltrates into the pads 310' of the circuit board 300', so that the subsequent soldering effect is affected by the contaminated pads 310'. Currently, those skilled in the art have no means to ameliorate the above problems, and can only accept the undesirable loss of flux contaminating the solder pad 310'.

To solve the above technical problems, embodiments of the present disclosure provide a circuit board 300 and a circuit board assembly 500.

In some embodiments, the circuit board 300 includes: a laminated structure 100; a connection plate 200, the connection plate 200 being provided at one side surface of the laminated structure 100 in the thickness direction; wherein the laminated structure 100 is provided with an insertion hole 101 penetrating the laminated structure 100 in a thickness direction, the connection plate 200 is provided with an accommodation groove communicating with the insertion hole 101, and a circumferential side wall of the accommodation groove is located outside the circumferential side wall of the insertion hole 101 in a radial direction of the insertion hole 101.

In some embodiments, to assist in connecting external components to the circuit board 300, solder paste and flux are often provided on the peripheral side walls of the receptacle 101. The soldering flux is suitable for improving heat conduction, assisting in melting solder paste, removing oxides on the peripheral side wall of the jack 101, reducing the surface tension of the welded material and preventing the secondary oxidation of the welded material.

In some embodiments, the insertion hole 101 is disposed on the laminated structure 100 and penetrates the laminated structure 100 in the thickness direction of the laminated structure 100, the connection board 200 is provided with a receiving groove adapted to receive the soldering flux, and the insertion hole 101 communicates with the receiving groove of the laminated structure 100. When flux overflows from the peripheral side wall of the insertion hole 101, the flux can naturally slide into the accommodating groove of the connection board 200, so that the flux is prevented from overflowing onto the bonding pad 310 of the connection board 200 and polluting the bonding pad 310.

Specifically, the side of the connection board 200 away from the laminated structure 100 is provided with a pad 310, and when components outside the circuit board 300 are soldered inside the insertion hole 101 of the circuit board 300, flux on the inner wall of the insertion hole 101 overflows along the peripheral side wall of the insertion hole 101.

The peripheral side wall of the accommodating groove is located at the outer side of the peripheral side wall of the jack 101 in the radial direction, when the soldering flux overflows from the jack 101, the soldering flux can naturally slide into the accommodating groove along the peripheral side wall of the jack 101, so that the soldering flux is prevented from overflowing onto the bonding pads 310 of the connecting plate 200, the bonding pads 310 of the connecting plate 200 are polluted, and secondary welding of the connecting plate 200 and other components or other circuit boards is affected.

In some embodiments, the laminate structure 100 includes: a first side and a second side in the thickness direction, the connection plate 200 being provided on the first side.

In some embodiments, when other components enter the jack 101 from the second side to communicate with the circuit board 300, the flux in the jack 101 may overflow along the inner sidewall of the jack 101 toward the connection board 200, and when the flux flows out of the jack 101 onto a side of the connection board 200 where the bonding pad 310 is disposed, the bonding pad 310 of the connection board 200 may be contaminated by the overflow flux, which affects the secondary soldering of the connection board 200 with other components or other circuit boards.

Accordingly, the connection board 200 is provided with a receiving groove, and when the connection board 200 is disposed on the first side of the laminated structure 100, the insertion hole 101 of the laminated structure 100 is communicated with the receiving groove on the connection board 200, and the receiving groove is adapted to receive the flowing flux, so as to prevent the flux from flowing onto the side of the connection board 200 far from the laminated structure 100, and the pollution pad 310 affects the soldering of other components of the circuit board 300.

Specifically, when components outside the circuit board 300 are soldered inside the insertion hole 101 of the circuit board 300, flux on the inner wall of the insertion hole 101 overflows along the peripheral side wall of the insertion hole 101. The receiving groove can receive the flux flowing out of the insertion hole 101, and prevent the flux from flowing onto a side of the connection board 200 where the bonding pad 310 is disposed, contaminating the bonding pad 310 of the connection board 200, and affecting connection of the circuit board 300 with other circuit components.

The peripheral side wall of the accommodating groove is located at the outer side of the peripheral side wall of the jack 101 in the radial direction, when the soldering flux overflows from the jack 101, the soldering flux can naturally slide into the accommodating groove along the peripheral side wall of the jack 101, so that the soldering flux is prevented from overflowing to pollute the bonding pad 310 of the connecting plate 200, and secondary welding of the connecting plate 200 and other components or other circuit boards is prevented.

In some embodiments, the laminate structure 100 includes: a plurality of conductive plates 110 and insulating plates 120 are stacked in this order, and both side plate portions of the stacked structure 100 in the stacking direction are the insulating plates 120.

The conductive plate 110 is internally provided with a circuit suitable for communication between an external component and the circuit board 300, and the external component can be electrically connected to the circuit board 300 through the conductive plate 110 exposed in the insertion hole 101. Insulating plates 120 are provided on both the first and second sides of the laminated structure 100 to facilitate manual connection with external components or connection plates 200.

Specifically, the conductive plate 110 and the insulating plate 120 are provided with a flux and a solder paste on the exposed portions of the insertion holes 101, the flux and the solder paste being adapted to assist the external components in making electrical connection with the circuit board 300.

When external components are electrically connected to the circuit board 300 through the socket 101, the flux and the solder paste on the peripheral side wall of the socket 101 are melted, and the melted flux overflows along the peripheral side wall of the socket 101 toward the connection board 200.

In some embodiments, the insulating plate 120 may act to retard solder paste from spilling, and when melted solder paste and flux spills on the stacked conductive plate 110 and insulating plate 120 in the direction of the connection plate 200, the stacked insulating plate 120 may solidify solder paste on the peripheral side walls of the receptacle 101 before contacting the connection plate 200, thereby retarding solder paste from spilling.

However, the insulating plate 120 or the conductive plate 110 cannot block the flow of the combustion improver, and the soldering flux still continues to slide down toward the connecting plate 200.

Therefore, when the soldering flux overflows along the peripheral side wall of the jack 101 towards the direction of the connecting plate 200, the soldering flux can flow into the accommodating groove on the connecting plate 200, and the accommodating groove is suitable for accommodating the soldering flux and preventing the soldering flux from overflowing onto the bonding pad 310 of the connecting plate 200, so that the soldering pad 310 is prevented from being polluted by the soldering flux, and the soldering of the connecting plate 200 and other components or other circuit boards is influenced.

In some embodiments, the connection board 200 includes: a plating layer 220 and a solder resist layer 210 are stacked, the plating layer 220 being provided on one side of the stacked structure 100 in the thickness direction, the solder resist layer 210 being provided on the plating layer 220, the receiving groove penetrating through the plating layer 220 and the solder resist layer 210 in the thickness direction.

In some embodiments, the receiving groove includes: a first accommodating groove 201, wherein the first accommodating groove 201 is arranged on the solder mask layer 210; a second accommodating groove 202, the second accommodating groove 202 being provided on the plating layer 220; the first accommodation groove 201 and the second accommodation groove 202 together construct an accommodation space for the flux.

In some embodiments, the plating layer 220 is internally provided with internal wires that are communicated with external components, and each component on the circuit board 300 is electrically connected with the circuit board 300, so that in practical production applications, the second accommodating groove 202 needs to avoid the internal wires during the opening process, so that the opening of the second accommodating groove 202 is prevented from affecting the normal use of the circuit board 300.

In some embodiments, the shape and the size of the accommodating groove can be flexibly adjusted according to the internal circuit of the electroplated layer 220, so that the operability is high and the fault tolerance is high.

In some embodiments, the first receiving groove 201 communicates with the second receiving groove 202, and the first receiving groove 201 has a smaller size than the second receiving groove 202.

The first accommodation groove 201 and the second accommodation groove 202 together constitute an accommodation groove suitable for retention of flux. Because the size of the first receiving groove 201 is smaller than that of the second receiving groove 202, the flux can naturally slide down into the second receiving groove 202 when overflowing the first receiving groove 201.

In some embodiments, when the plurality of first receiving grooves 201 and the second receiving groove 202 are stacked in the receiving space, the volume of the receiving groove may be increased. On the other hand, the flux can be uniformly left in the accommodating groove.

In some embodiments, the peripheral side wall of the first receiving groove 201 is located inside the peripheral side wall of the second receiving groove 202 in the radial direction of the insertion hole 101.

On the plating layer 220 and the solder resist layer 210 arranged in a stacked manner, the inner space of the receiving groove is configured as a stepped space. The stepped shape of the receiving slot increases the volume more suitable for receiving flux than a rectangular receiving slot. The solder mask layer 210 has a protective circuit function to prevent the plating layer 220 from being exposed to the outside, thereby causing a short circuit.

In some embodiments, the distance between the peripheral side wall of the first accommodation groove 201 and the peripheral side wall of the second accommodation groove 202 in the radial direction of the insertion hole 101 is not less than 0.1mm.

In practical applications, the design that the inner diameter of the second accommodating groove 202 is smaller than that of the first accommodating groove 201 has the function of protecting the circuit, so as to prevent the circuit board 300 from being shorted due to the exposed electroplated layer 220, so as to avoid the short circuit phenomenon caused by the exposed copper in the practical production process.

In some embodiments, the electroplated layer 220 is configured as an electroplated copper layer and the solder mask layer 210 is configured as an ink layer.

The arrangement of the ink layer is beneficial to blocking the flow of the soldering flux in the accommodating groove, and on the other hand, the ink layer can wrap the electroplated layer 220 to prevent the copper layer of the electroplated layer 220 from being exposed, so that the short circuit phenomenon occurs in the using process.

In some embodiments, the ink layer has a certain plasticity, i.e., the ink retains its pre-deformation properties after being deformed by an external force. The plasticity of the ink is beneficial to improving the printing precision, and can resist external force scratch, thermal shock and mechanical stripping, improve the impact resistance of the circuit board 300 in the micro-drop process and prolong the service life of the circuit board 300.

Based on the same conception, a second aspect of the disclosed embodiments provides a circuit board assembly 500 comprising a circuit board 300 as described in any of the first aspects of the disclosure; a device 400, wherein the device 400 is arranged on the circuit board 300, a pin 410 is arranged on the device 400, and the pin 410 is inserted into the jack 101.

Specifically, the conductive plate 110 and the insulating plate 120 are provided with a flux and a solder paste on the exposed portion of the insertion hole 101, the flux and the solder paste being adapted to assist the pins 410 of the device 400 in making electrical connection with the circuit board 300.

When pins 410 of device 400 are electrically connected to circuit board 300 through sockets 101, the flux and solder paste on the peripheral side walls of sockets 101 are melted, and the melted flux overflows along the peripheral side walls of sockets 101 toward connection board 200.

When melted flux and solder paste overflow in the direction of the connection plate 200, the solder paste may solidify on the peripheral side wall of the insertion hole 101 due to the retarding action of the insulating plate 120. However, the insulating plate 120 or the conductive plate 110 cannot block the flow of the combustion improver, and the soldering flux still continues to overflow toward the connecting plate 200 until it overflows into the accommodating groove of the connecting plate 200.

The receiving groove is adapted to receive the flux, and to block the flux from spilling onto the pads 310 of the circuit board 300, thereby preventing the flux from contaminating the pads 310 and affecting the soldering of the circuit board 300 to other components or other circuit boards.

In some embodiments, the insulating board 120 has the function of protecting the inner layer from mechanical damage and chemical corrosion, from moisture contact with water vapor, from contact with conductors, etc., which can enhance the connection strength of the circuit board 300 and extend the service life.

In some embodiments, the length of the foot 410 is less than the length of the receptacle 101.

The device 400 is adapted to be electrically connected to the circuit board 300 by positioning the pins 410 within the sockets 101, wherein solder paste and flux on the inner wall of the sockets 101 are melted by the heat, and the solder paste and flux slide down along the inner wall of the sockets 101 toward the connection board 200. Since the insulating plate 120 in the laminated structure 100 has a promoting effect on the solidification of the solder paste, the insulating plate 120 can solidify the solder paste in the insertion hole 101 to block the solder paste from slipping down. The flux is not blocked and continues to slide down toward the connection plate 200.

When the soldering flux overflows to the edge of the laminated structure 100, the soldering flux naturally enters into the accommodating groove of the connecting board 200, and the accommodating groove is provided with a stepped structure, so that the soldering flux can be blocked and accommodated in the accommodating groove, and can be prevented from overflowing onto the bonding pads 310 of the connecting board 200, polluting the bonding pads 310 and affecting the connection of the circuit board 300 with other components or other circuit boards.

If the length of the pins 410 exceeds the length of the sockets 101, solder paste or flux disposed at the edge of the stacked structure 100 may slide down, and the surface of the plating layer 220 in the accommodating groove may cause the solder paste flowing into the accommodating groove to melt, so the length of the pins 410 of the device 400 should be smaller than the length of the sockets 101.

The circuit board and the circuit board assembly provided by the embodiment of the disclosure can thoroughly solve the problem that the soldering flux overflows from the pollution pad 310 in the jack 101 of the circuit board 300 to influence the secondary welding of the circuit board 300. The scheme only needs to modify the solder mask layer 210 and the electroplated layer 220 of the circuit board 300, does not need to add additional working procedures, and does not bring about the rise of the cost of the circuit board 300 and the circuit board assembly 500. In practical application, the shape and the size of the accommodating groove can be flexibly adjusted according to the connecting plate 200 and the internal circuit of the circuit board 300, so that the operability is high and the fault tolerance is high.

It should be appreciated that the circuit board 300 and the circuit board assembly 500 provided in the embodiments of the present disclosure implement the above-described functions, and include corresponding hardware structures and/or software modules for performing the respective functions. The disclosed embodiments may be implemented in hardware or a combination of hardware and computer software, in combination with the various example elements and algorithm steps disclosed in the embodiments of the disclosure. Whether a function is implemented as hardware or computer software driven hardware depends upon the particular application and design constraints imposed on the solution. Those skilled in the art may implement the described functionality using different approaches for each particular application, but such implementation is not to be considered as beyond the scope of the embodiments of the present disclosure.

The specific manner in which the various modules perform the operations of the circuit board 300 and the circuit board assembly 500 of the above embodiments have been described in detail in connection with the embodiments of the method, and will not be described in detail herein.

It is understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "center," "longitudinal," "transverse," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing the present embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation.

It will be further understood that "connected" includes both direct connection where no other member is present and indirect connection where other element is present, unless specifically stated otherwise.

It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims (10)

1. A circuit board, comprising:

a laminated structure;

a connection plate provided on one side surface of the laminated structure in a thickness direction; wherein the method comprises the steps of

The utility model discloses a jack, including the jack, the jack is provided with the jack, be provided with on the stacked structure in the thickness direction link up the stacked structure, be provided with on the connecting plate with the holding tank of jack intercommunication, the week lateral wall of holding tank is in the radial of jack is located the outside of the week lateral wall of jack.

2. The circuit board of claim 1, wherein the circuit board is configured to,

the laminated structure includes: a first side surface and a second side surface in a thickness direction, the connection plate being provided on the first side surface.

3. The circuit board of claim 1, wherein the circuit board is configured to,

the laminated structure includes: and the two side plate parts of the laminated structure in the stacking direction are all insulating plates.

4. The circuit board of claim 1, wherein the circuit board is configured to,

the connection plate includes: and the accommodating groove penetrates through the electroplated layer and the solder mask layer in the thickness direction.

5. The circuit board of claim 4, wherein the circuit board is further configured to,

the accommodation groove includes:

a first accommodating groove arranged on the solder mask layer

A second accommodating groove provided on the plating layer; wherein the method comprises the steps of

The first accommodating groove is communicated with the second accommodating groove, and the size of the first accommodating groove is smaller than that of the second accommodating groove.

6. The circuit board of claim 5, wherein the circuit board is further configured to,

the peripheral side wall of the first accommodation groove is located inside the peripheral side wall of the second accommodation groove in the radial direction of the insertion hole.

7. The circuit board of claim 6, wherein the circuit board is further configured to,

the distance between the peripheral side wall of the first accommodating groove and the peripheral side wall of the second accommodating groove in the radial direction of the insertion hole is not less than 0.1mm.

8. The circuit board of claim 4, wherein the circuit board is further configured to,

the electroplated layer is configured as an electroplated copper layer and the solder mask layer is configured as an ink layer.

9. A circuit board assembly, comprising:

the circuit board of any one of claims 1-8;

the device is arranged on the circuit board, a pin is arranged on the device, and the pin is inserted into the jack.

10. The circuit board assembly of claim 9, wherein the circuit board assembly further comprises a plurality of circuit boards,

the length of the standing foot is smaller than that of the jack.

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