CN103525582A - Weak-alkaline printed circuit board cleaning agent and preparation method thereof - Google Patents
Weak-alkaline printed circuit board cleaning agent and preparation method thereof Download PDFInfo
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- CN103525582A CN103525582A CN201310523578.0A CN201310523578A CN103525582A CN 103525582 A CN103525582 A CN 103525582A CN 201310523578 A CN201310523578 A CN 201310523578A CN 103525582 A CN103525582 A CN 103525582A
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Abstract
The invention relates to a weak-alkaline printed circuit board cleaning agent prepared from the raw materials of, by weight: 3-4 parts of polyoxyethylene polyoxypropylene polyether, 2-3 parts of sodium hydroxide, 1-2 parts of chamomile essential oil, 1-2 parts of dodecyl dimethyl benzyl ammonium chloride, 1-2 parts of coconut oleic acid alkanolamid , 3-5 parts of Tween 80, 30-40 parts of alcohol, 5-6 parts of oleyl alcohol polyoxyethylene ether sodium sulfate, 4-5 parts of an auxiliary agent, and 100-120 parts of deionized water. The cleaning agent provided by the invention has excellent wetting, penetration, emulsification, dispersion, and solubilization functions, and can rapidly remove inorganic dust particles and organics. With the auxiliary agent, a protective film can be formed on the surface of the circuit board, such that air can be isolated, and the circuit board can be prevented from being corroded by water and other molecules in the atmosphere. Therefore, oxidation and short-circuit can be prevented, and the next step of manufacturing process can be conveniently carried out.
Description
Technical field
The present invention relates to clean-out system field, relate in particular to a kind of weakly alkaline cleaning agent for printed circuit board and preparation method thereof.
Background technology
Along with the high speed development of unicircuit, the volume of circuit card is more and more less, and electronic component is more and more less, and density is increasing.If the dirt dust of the inside does not clean up in making processes, likely can cause the problems such as short circuit, corrosion, affect the normal operation of circuit card.At present majority circuit plate sanitising agent is all made with organism, and cleaning effect is good, is difficult for causing the problems such as short circuit, corrosion, and still, organic compound not only cost is high, and contaminate environment, damage the ozone layer, harmful to HUMAN HEALTH.Also have minority waterborne cleaning agent, but cleaning performance is limited, has security risk, require further improvement formula, technique, to reach clean thorough, pollution-free, the object of corroding little, healthy, circuit safety, reducing costs.
Summary of the invention
The object of the present invention is to provide a kind of weakly alkaline cleaning agent for printed circuit board and preparation method thereof, this clean-out system has clean thorough, the fast advantage of cleaning speed.
Technical scheme of the present invention is as follows:
A cleaning agent for printed circuit board, is characterized in that being made by the raw material of following weight part: polyoxyethylene polyoxypropylene polyethers 3-4, sodium hydroxide 2-3, Flos Matricariae chamomillae essential oil 1-2, dodecyl benzyl dimethyl ammonium chloride 1-2, cocinic acid alkylolamide 1-2, tween 80 3-5, ethanol 30-40, Brij sodium sulfate 5-6, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, methyl methacrylate 3-4, oxidation inhibitor 1035 1-2,2-aminoethyl 17 alkenyl imidazoline 1-2, ethanol 15-18; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
The preparation method of described weakly alkaline cleaning agent for printed circuit board, is characterized in that comprising the following steps: each raw material is mixed, under 1000-1200 rev/min of stirring, be heated to 60-70 ℃, stir 45-60 minute, obtain.
Beneficial effect of the present invention
Clean-out system of the present invention has excellent wetting, infiltration, emulsification, dispersion, solublization; to inorganics dust granules, organism, can remove fast; auxiliary agent of the present invention can form protective membrane at circuit board surface; isolated air; prevent water and other molecule open circuit potential plates in atmosphere; anti-oxidant, anti-short circuit, facilitates next step manufacture craft to carry out.
Embodiment
A sterilization cleaning agent for printed circuit board, by following weight part (kilogram) raw material make: polyoxyethylene polyoxypropylene polyethers 4, sodium hydroxide 2, Flos Matricariae chamomillae essential oil 1, dodecyl benzyl dimethyl ammonium chloride 1, cocinic acid alkylolamide 2, tween 80 3, ethanol 30, Brij sodium sulfate 5, auxiliary agent 4, deionized water 100-120;
Described auxiliary agent by following weight part (kilogram) raw material make: Silane coupling reagent KH-570 2.5, phytic acid 1.5, methyl methacrylate 3.5, oxidation inhibitor 1,035 1.5,2-aminoethyl 17 alkenyl imidazolines 1.5, ethanol 16; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 65 ℃, stirs after 25 minutes, then adds other remaining component, is warming up to 83 ℃, stirs 35 minutes, obtains.
The preparation method of described weakly alkaline sterilization cleaning agent for printed circuit board, comprises the following steps: each raw material is mixed, under 1000-1200 rev/min of stirring, be heated to 60-70 ℃, stir 45-60 minute, obtain.
This weakly alkaline sterilization cleaning agent for printed circuit board is used for cleaning copper printed circuit board (PCB), through 10 times of amplification detection of Olympus microscope, surface is clean without pollutents such as obvious rosin, scolding tin, greasy dirt, fingerprints, cleaning solution resistivity is greater than 2*106 Ω .cm, First Pass Yield reaches 85%, is better than normal level.
Claims (2)
1. a weakly alkaline cleaning agent for printed circuit board, is characterized in that being made by the raw material of following weight part: polyoxyethylene polyoxypropylene polyethers 3-4, sodium hydroxide 2-3, Flos Matricariae chamomillae essential oil 1-2, dodecyl benzyl dimethyl ammonium chloride 1-2, cocinic acid alkylolamide 1-2, tween 80 3-5, ethanol 30-40, Brij sodium sulfate 5-6, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, methyl methacrylate 3-4, oxidation inhibitor 1035 1-2,2-aminoethyl 17 alkenyl imidazoline 1-2, ethanol 15-18; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
2. the preparation method of weakly alkaline cleaning agent for printed circuit board according to claim 1, is characterized in that comprising the following steps: each raw material is mixed, under 1000-1200 rev/min of stirring, be heated to 60-70 ℃, stir 45-60 minute, obtain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310523578.0A CN103525582A (en) | 2013-10-30 | 2013-10-30 | Weak-alkaline printed circuit board cleaning agent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310523578.0A CN103525582A (en) | 2013-10-30 | 2013-10-30 | Weak-alkaline printed circuit board cleaning agent and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103525582A true CN103525582A (en) | 2014-01-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310523578.0A Pending CN103525582A (en) | 2013-10-30 | 2013-10-30 | Weak-alkaline printed circuit board cleaning agent and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN103525582A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109013527A (en) * | 2018-08-01 | 2018-12-18 | 芜湖彰鸿工程技术有限公司 | A kind of cleaning method of robot circuit board |
| CN113246341A (en) * | 2021-05-28 | 2021-08-13 | 厦门陆海环保股份有限公司 | Method for preparing high-valued recycled plastic rice by utilizing recycled waste lunch boxes |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101210213A (en) * | 2006-12-31 | 2008-07-02 | S.C.约翰逊父子公司 | Kitchen detergent composition |
| CN102871921A (en) * | 2012-10-15 | 2013-01-16 | 金红叶纸业集团有限公司 | Hand cleaner composition |
| CN103214886A (en) * | 2013-02-04 | 2013-07-24 | 安徽省繁昌县皖南阀门铸造有限公司 | Metal rust-preventive oil comprising butyl acrylate |
-
2013
- 2013-10-30 CN CN201310523578.0A patent/CN103525582A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101210213A (en) * | 2006-12-31 | 2008-07-02 | S.C.约翰逊父子公司 | Kitchen detergent composition |
| CN102871921A (en) * | 2012-10-15 | 2013-01-16 | 金红叶纸业集团有限公司 | Hand cleaner composition |
| CN103214886A (en) * | 2013-02-04 | 2013-07-24 | 安徽省繁昌县皖南阀门铸造有限公司 | Metal rust-preventive oil comprising butyl acrylate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109013527A (en) * | 2018-08-01 | 2018-12-18 | 芜湖彰鸿工程技术有限公司 | A kind of cleaning method of robot circuit board |
| CN113246341A (en) * | 2021-05-28 | 2021-08-13 | 厦门陆海环保股份有限公司 | Method for preparing high-valued recycled plastic rice by utilizing recycled waste lunch boxes |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140122 |
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| RJ01 | Rejection of invention patent application after publication |