CN103525587A - Weak-alkaline water-based circuit board cleaning agent and preparation method thereof - Google Patents
Weak-alkaline water-based circuit board cleaning agent and preparation method thereof Download PDFInfo
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- CN103525587A CN103525587A CN201310523469.9A CN201310523469A CN103525587A CN 103525587 A CN103525587 A CN 103525587A CN 201310523469 A CN201310523469 A CN 201310523469A CN 103525587 A CN103525587 A CN 103525587A
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Abstract
The invention relates to a weak-alkaline water-based circuit board cleaning agent prepared from the raw materials of, by weight: 2-3 parts of sodium phosphate, 4-6 parts of alkyl phenol polyoxyethylene ether, 5-9 parts of caprylin, 4-6 parts of propylene glycol monomethyl ether acetate, 1-2 parts of Span-80, 4-5 parts of nonylphenol polyoxyethylene ether, 30-40 parts of ethanol, 3-4 parts of fatty alcohol polyoxyethylene ether ammonium sulfate, 4-5 parts of an auxiliary agent, and 100-120 parts of deionized water. The cleaning agent provided by the invention is weakly alkaline, and has low surface tension. The agent is suitable for circuit board and part cleaning. With the cleaning agent, welding flux, rosin, organics, dust, and the like can be effectively removed, and static electricity can be eliminated. The cleaning agent has low corrosion, and is safe and reliable to use. The treatment and discharge of waste cleaning agent are convenient, and ozone layer is not damaged. With the auxiliary agent provided by the invention, a protective film is formed on the surface of the circuit board, such that air is isolated, and the circuit board is prevented from being corroded by water and other molecules in the atmosphere. Therefore, oxidation and short-circuit can be prevented, and a next step of manufacturing process can be conveniently carried out.
Description
Technical field
The present invention relates to clean-out system field, relate in particular to a kind of alkalescent water base circuit board clean-out system and preparation method thereof.
Background technology
Along with the high speed development of unicircuit, the volume of circuit card is more and more less, and electronic component is more and more less, and density is increasing.If the dirt dust of the inside does not clean up in making processes, likely can cause the problems such as short circuit, corrosion, affect the normal operation of circuit card.At present majority circuit plate sanitising agent is all made with organism, and cleaning effect is good, is difficult for causing the problems such as short circuit, corrosion, and still, organic compound not only cost is high, and contaminate environment, damage the ozone layer, harmful to HUMAN HEALTH.Also have minority waterborne cleaning agent, but cleaning performance is limited, has security risk, require further improvement formula, technique, to reach clean thorough, pollution-free, the object of corroding little, healthy, circuit safety, reducing costs.
Summary of the invention
The object of the present invention is to provide a kind of alkalescent water base circuit board clean-out system and preparation method thereof, this clean-out system has that corrodibility is little, environmental protection, anlistatig advantage.
Technical scheme of the present invention is as follows:
A base circuit board clean-out system, is characterized in that being made by the raw material of following weight part: sodium phosphate 2-3, alkylphenol polyoxyethylene 4-6, caprylin 5-9, propylene glycol methyl ether acetate 4-6, Arlacel-80 1-2, polyoxyethylene nonylphenol ether 4-5, ethanol 30-40, AESA 3-4, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, n-BMA 3-4,2.4.6-tri-(dimethylamino methyl) phenol 1-2, phenylformic acid monoethanolamine 2-3, oxidation inhibitor 1035 1-2, ethanol 15-18; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30
-40 minutes, obtain.
The preparation method of described alkalescent water base circuit board clean-out system, it is characterized in that comprising the following steps: deionized water, sodium phosphate, alkylphenol polyoxyethylene, propylene glycol methyl ether acetate, Arlacel-80, polyoxyethylene nonylphenol ether, ethanol, AESA are mixed, under 800-1100 rev/min of stirring, speed with 6-8 ℃/minute is heated to 50-60 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
Beneficial effect of the present invention
Clean-out system of the present invention is weakly alkaline, and surface tension is low; Be applicable to the cleaning of circuit card and part, can effectively remove welding agent, rosin, organism, dust etc., and can eliminate static, there is corrodibility little, safe and reliable, be convenient to the processing discharge of discarded clean-out system, the advantage such as do not damage the ozone layer.Auxiliary agent of the present invention can form protective membrane at circuit board surface, and isolated air, prevents water and other molecule open circuit potential plates in atmosphere, and anti-oxidant, anti-short circuit, facilitates next step manufacture craft to carry out.
Embodiment
A base circuit board clean-out system, by following weight part (kilogram) raw material make: sodium phosphate 2.5, alkylphenol polyoxyethylene 5, caprylin 7, propylene glycol methyl ether acetate 5, Arlacel-80 1.5, polyoxyethylene nonylphenol ether 4.5, ethanol 37, AESA 4, auxiliary agent 5, deionized water 108;
Described auxiliary agent by following weight part (kilogram) raw material make: Silane coupling reagent KH-570 2.6, phytic acid 1.6, n-BMA 3.6,2.4.6-tri-(dimethylamino methyl) phenol 1.6, phenylformic acid monoethanolamine 2.6, oxidation inhibitor 1,035 1.6, ethanol 16; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 65 ℃, stirs after 25 minutes, then adds other remaining component, is warming up to 83 ℃, stirs 36 minutes, obtains.
The preparation method of described alkalescent water base circuit board clean-out system, it is characterized in that comprising the following steps: deionized water, sodium phosphate, alkylphenol polyoxyethylene, propylene glycol methyl ether acetate, Arlacel-80, polyoxyethylene nonylphenol ether, ethanol, AESA are mixed, under 800-1100 rev/min of stirring, speed with 6-8 ℃/minute is heated to 50-60 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
This alkalescent water base circuit board clean-out system is used for cleaning copper printed circuit board (PCB), through 10 times of amplification detection of Olympus microscope, surface is clean without pollutents such as obvious rosin, scolding tin, greasy dirt, fingerprints, cleaning solution resistivity is greater than 2*106 Ω .cm, First Pass Yield reaches 82%, is better than normal level.
Claims (2)
1. an alkalescent water base circuit board clean-out system, is characterized in that being made by the raw material of following weight part: sodium phosphate 2-3, alkylphenol polyoxyethylene 4-6, caprylin 5-9, propylene glycol methyl ether acetate 4-6, Arlacel-80 1-2, polyoxyethylene nonylphenol ether 4-5, ethanol 30-40, AESA 3-4, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, n-BMA 3-4,2.4.6-tri-(dimethylamino methyl) phenol 1-2, phenylformic acid monoethanolamine 2-3, oxidation inhibitor 1035 1-2, ethanol 15-18; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30
-40 minutes, obtain.
2. the preparation method of alkalescent water base circuit board clean-out system according to claim 1, it is characterized in that comprising the following steps: deionized water, sodium phosphate, alkylphenol polyoxyethylene, propylene glycol methyl ether acetate, Arlacel-80, polyoxyethylene nonylphenol ether, ethanol, AESA are mixed, under 800-1100 rev/min of stirring, speed with 6-8 ℃/minute is heated to 50-60 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
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CN201310523469.9A CN103525587A (en) | 2013-10-30 | 2013-10-30 | Weak-alkaline water-based circuit board cleaning agent and preparation method thereof |
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CN201310523469.9A CN103525587A (en) | 2013-10-30 | 2013-10-30 | Weak-alkaline water-based circuit board cleaning agent and preparation method thereof |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109705999A (en) * | 2019-01-09 | 2019-05-03 | 常熟东南相互电子有限公司 | Cleaning agent and its application method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1162630A (en) * | 1996-04-16 | 1997-10-22 | 北京中咨能海咨询公司 | Carbon deposit cleaning agent for gas water heater |
CN103102807A (en) * | 2012-11-13 | 2013-05-15 | 铜陵祥云消防科技有限责任公司 | Gas-phase corrosion inhibition antirust agent containing modified montmorillonite powder |
CN103147079A (en) * | 2013-02-04 | 2013-06-12 | 安徽省繁昌县皖南阀门铸造有限公司 | Metal rust-preventative oil containing terpene resin T-120 |
-
2013
- 2013-10-30 CN CN201310523469.9A patent/CN103525587A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1162630A (en) * | 1996-04-16 | 1997-10-22 | 北京中咨能海咨询公司 | Carbon deposit cleaning agent for gas water heater |
CN103102807A (en) * | 2012-11-13 | 2013-05-15 | 铜陵祥云消防科技有限责任公司 | Gas-phase corrosion inhibition antirust agent containing modified montmorillonite powder |
CN103147079A (en) * | 2013-02-04 | 2013-06-12 | 安徽省繁昌县皖南阀门铸造有限公司 | Metal rust-preventative oil containing terpene resin T-120 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109705999A (en) * | 2019-01-09 | 2019-05-03 | 常熟东南相互电子有限公司 | Cleaning agent and its application method |
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Application publication date: 20140122 |
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