CN107868729B - Degumming composition and preparation method and application thereof - Google Patents
Degumming composition and preparation method and application thereof Download PDFInfo
- Publication number
- CN107868729B CN107868729B CN201711036887.XA CN201711036887A CN107868729B CN 107868729 B CN107868729 B CN 107868729B CN 201711036887 A CN201711036887 A CN 201711036887A CN 107868729 B CN107868729 B CN 107868729B
- Authority
- CN
- China
- Prior art keywords
- degumming
- diethylene glycol
- composition
- preparation
- degumming composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
Abstract
The invention discloses a degumming composition. The degumming composition comprises the following components in percentage by mass: 21% of dimethyl carbonate, 27% of diethylene glycol monohexyl ether, 47% of diethylene glycol monobutyl ether and 5% of water. The degumming composition provided by the invention has the advantages of low cost, less pollution, short degumming time, strong permeability, no corrosion to a substrate, strong degumming effect, no dead angle and no residue, and can provide technical support for the development of industrial cleaning agents.
Description
Technical Field
The invention belongs to the field of industrial cleaning, and particularly relates to a degumming composition as well as a preparation method and application thereof.
Background
Parts of the circuit board are usually fixed by adopting red glue, the red glue is a polyolefin compound, is usually red and also has yellow color and the like, and is widely used in the field of circuit boards as an SMT material, however, when the circuit board is recycled, how to make the red glue more effectively fall off is an industrial problem.
In the prior art, chlorinated hydrocarbon solvents such as trichloroethylene and the like are used for washing, but the detergent has high toxicity on one hand and has a corrosive effect on a PCB substrate on the other hand, and no industrial eluent for red glue is available at present.
Disclosure of Invention
The present invention is directed to a degumming composition in accordance with the deficiencies of the prior art. The degumming composition has the advantages of complete no corrosion to base materials, excellent degumming performance, simple and convenient post-treatment, high degumming speed and the like.
Another object of the present invention is to provide a process for the preparation of the above degumming composition.
Still another object of the present invention is to provide the use of the above degumming composition in the preparation of degumming cleaning agents.
The purpose of the invention is realized by the following technical scheme:
the degumming composition comprises the following components in percentage by mass:
21 percent of dimethyl carbonate,
27 percent of diethylene glycol monohexyl ether,
47 percent of diethylene glycol monobutyl ether,
5 percent of water
In the degumming composition formed by dimethyl carbonate, diethylene glycol monohexyl ether and diethylene glycol monobutyl ether, the degumming composition can penetrate into an interface between the base material and the rubber layer and destroy the connection between the base material and the rubber layer, so that the rubber layer is completely separated from the base body, and excellent degumming effect is obtained. The degumming effect is good without any residue.
The preparation method of the degumming composition comprises the following steps: and uniformly mixing the components to obtain the degumming composition.
The degumming composition is applied to the preparation of the red rubber cleaning agent of the circuit board.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the degumming composition provided by the invention has the advantages of low cost, less pollution, short degumming time, strong seepage force, no corrosion to a substrate, strong degumming effect, no dead angle and no residue, and the components are water-based components, thereby being nontoxic and environment-friendly.
Detailed Description
The present invention is further illustrated by the following specific examples, which are not intended to limit the invention in any way. Reagents, methods and apparatus used in the present invention are conventional in the art unless otherwise indicated.
Unless otherwise indicated, reagents and materials used in the present invention are commercially available.
The preparation method of the degumming composition comprises the following steps: the raw materials are fed according to a specified proportion at room temperature, and then are uniformly stirred by a stirrer, and the raw materials are prepared and used without curing.
Example (b):
the substrate is a PCB board, and the coating on the PCB board is red glue. The thickness of the red glue is 3 mm.
The degumming composition has the following formula:
| raw materials | Mass ratio (%) |
| Carbonic acid dimethyl ester | 21 |
| Diethylene glycol monohexyl ether | 27 |
| Diethylene glycol monobutyl ether | 47 |
| Water (W) | 5 |
Comparative example 1:
the substrate is a PCB board, and the coating on the PCB board is red glue. The thickness of the red glue is 3 mm.
The degumming composition has the following formula:
| raw materials | Mass ratio (%) |
| Diethylene glycol monohexyl ether | 27 |
| Diethylene glycol monobutyl ether | 47 |
| Water (W) | 26 |
Comparative example 2:
the substrate is a PCB board, and the coating on the PCB board is red glue. The thickness of the red glue is 3 mm.
The degumming composition has the following formula:
| raw materials | Mass ratio (%) |
| Carbonic acid dimethyl ester | 45 |
| Diethylene glycol monobutyl ether | 50 |
| Water (W) | 5 |
Comparative example 3:
the substrate is a PCB board, and the coating on the PCB board is red glue. The thickness of the red glue is 3 mm.
The degumming composition has the following formula:
| raw materials | Mass ratio (%) |
| Carbonic acid dimethyl ester | 48 |
| Diethylene glycol monohexyl ether | 47 |
| Water (W) | 5 |
Preparing a corresponding red glue film on a circuit board substrate in the embodiment, soaking and cleaning the red glue film by using the degumming agent provided in the embodiment and the comparative example, and testing the degumming efficiency by using the method comprising the following steps: the place coated with the red glue on the circuit board is coated with the degumming agent, and the red glue on the circuit board base material is completely separated. The damage condition of the circuit board substrate is observed by a microscope, no change is caused to no damage under the microscope, the foaming phenomenon of the circuit board substrate is slight damage, and the dissolution phenomenon is serious damage.
Table 1 shows the degumming effect in the examples and comparative examples:
TABLE 1
| Example numbering | t (degumming)/min | Degumming situation | Damage condition |
| Examples | 4 | The glue layer is completely separated from the surface of the PCB | No corrosion of PCB surface |
| Comparative example 1 | 20 | The glue layer is not separated from the surface of the PCB | No corrosion of PCB surface |
| Comparative example 2 | 20 | The glue layer is not separated from the surface of the PCB | No corrosion of PCB surface |
| Comparative example 3 | 20 | The glue layer is not separated from the surface of the PCB | No corrosion of PCB surface |
The cleaning agent provided by the embodiment of the invention has a very good cleaning effect, can completely separate the red glue from the surface of the PCB within 5 minutes, does not leave dead angles, is free from corrosion and damage, and shows that the cleaning efficiency and the cleaning degree of the degumming agent provided by the invention achieve better effects on the protection of the PCB.
It is to be understood that the above examples are illustrative only for the purpose of clarity of description and are not intended to limit the embodiments. Variations or modifications in different forms may occur to those skilled in the art upon reading the foregoing description. And are neither required nor exhaustive of all embodiments. And obvious changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (3)
1. The degumming composition for removing the red glue on the recovered circuit board is characterized by comprising the following components in percentage by mass:
21 percent of dimethyl carbonate,
27 percent of diethylene glycol monohexyl ether,
47 percent of diethylene glycol monobutyl ether,
and 5% of water.
2. A process for the preparation of the degumming composition according to claim 1, comprising the steps of: and uniformly mixing the components to obtain the degumming composition.
3. Use of the degumming composition according to claim 1 for the preparation of red gum cleaning agents for circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711036887.XA CN107868729B (en) | 2017-10-30 | 2017-10-30 | Degumming composition and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711036887.XA CN107868729B (en) | 2017-10-30 | 2017-10-30 | Degumming composition and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107868729A CN107868729A (en) | 2018-04-03 |
| CN107868729B true CN107868729B (en) | 2020-11-03 |
Family
ID=61752641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711036887.XA Expired - Fee Related CN107868729B (en) | 2017-10-30 | 2017-10-30 | Degumming composition and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107868729B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108949391A (en) * | 2018-08-17 | 2018-12-07 | 佛山市森昂生物科技有限公司 | A kind of adhesive sticker detergent |
| CN110484383B (en) * | 2019-09-05 | 2022-03-18 | 广东荣强化学有限公司 | Acrylic emulsion sealant degumming agent composition and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102533475B (en) * | 2011-12-26 | 2013-04-24 | 东莞优诺电子焊接材料有限公司 | Touch screen washing agent |
| CN102703256B (en) * | 2012-06-15 | 2013-10-16 | 东莞优诺电子焊接材料有限公司 | Multifunctional water-based cleaning agent |
| CN103160398B (en) * | 2013-04-03 | 2014-08-06 | 东莞市剑鑫电子材料有限公司 | Red glue cleaning agent |
| AR100873A1 (en) * | 2014-06-17 | 2016-11-09 | Clariant Produkte Deutschland Gmbh | PROCESS FOR TAKING OUT COMPOSITIONS CONTAINING TRIGLYCERIDES |
-
2017
- 2017-10-30 CN CN201711036887.XA patent/CN107868729B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN107868729A (en) | 2018-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107868729B (en) | Degumming composition and preparation method and application thereof | |
| KR20090074730A (en) | An Etching or Plating Process and Resist Ink | |
| CN107124831A (en) | The surface treatment method of PCB | |
| CN104232344B (en) | A kind of water base cleaner in environmental protection for wiring board | |
| CN106707702A (en) | Dry film removing solution for copper alloy indium tin oxide plated conductive film and preparation method thereof | |
| CN103555431A (en) | Printed circuit board cleaning agent and preparation method thereof | |
| CN104371838B (en) | A kind of cleaning agent of cleaning circuit plate and preparation method thereof | |
| CN105462707A (en) | Water-based cleaning agent and preparation method and application thereof | |
| CN105728986B (en) | A kind of leave scaling powder | |
| KR20110098474A (en) | Paint stripper composition and manufacturing method thereof | |
| CN104231713B (en) | Paint remover and paint removing method thereof | |
| CN108084788B (en) | Processing-resistant water-based glass protective ink and preparation method thereof | |
| CN114231089A (en) | Water-fading water-based protective ink and preparation method thereof | |
| CN113844125A (en) | Production method of high-elasticity copper plate | |
| CN103540426A (en) | Waterborne printed circuit board cleaning agent and preparation method thereof | |
| KR100982341B1 (en) | Cleaning composition containing trichloroethylene or tetrachloroethylene | |
| CN105886154A (en) | Environment-friendly efficient concentrated tin paste cleaning agent and preparation method thereof | |
| CN113741159A (en) | PI film stripping liquid and preparation method and stripping method thereof | |
| CN105295514A (en) | Paint remover | |
| CN103937627B (en) | A kind of cleaning agent for patch capacitor | |
| CN112662097A (en) | Preparation of water-soluble flame-retardant protective film | |
| CN104293500A (en) | Chemical agent used for cleaning printed circuit boards | |
| CN109055029B (en) | Alkaline cleaning agent for PCB (printed circuit board) and preparation method thereof | |
| JP2021519839A (en) | Compositions and methods for cleaning and stripping | |
| CN106519781B (en) | Powder coating paint removing composition and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201103 Termination date: 20211030 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |