CN108289384A - High TG plates remove gluing method - Google Patents
High TG plates remove gluing method Download PDFInfo
- Publication number
- CN108289384A CN108289384A CN201810059753.8A CN201810059753A CN108289384A CN 108289384 A CN108289384 A CN 108289384A CN 201810059753 A CN201810059753 A CN 201810059753A CN 108289384 A CN108289384 A CN 108289384A
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- China
- Prior art keywords
- plates
- removing glue
- bulk
- remove
- agent solution
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Detergent Compositions (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The present invention relates to a kind of high TG plates to remove gluing method, includes the following steps：It is bulk：High TG plates are put into bulk agent solution and are impregnated, so that the macromolecular chain fracture of the hole wall resin on high TG plates；First wash：With flowing water will be bulk after high TG plates clean, remove remaining bulk agent solution；Removing glue：High TG plates after first wash are impregnated with removing glue agent solution, remove the base material that glue residue thereon and stinging loses high TG plates the；Second wash：The high TG plates after removing glue are cleaned with flowing water, remove remaining removing glue agent solution；Preneutralization：Preneutralization is carried out with preneutralization agent；It neutralizes：It is neutralized with neutralizer；Washing：The high TG plates after neutralization are cleaned with flowing water, remaining preneutralization solution neutralized solution of going out.The present invention only needs to carry out a removing glue processing to high TG plates, can reduce the carrying number of high TG plates, improve throughput rate, and can reduce the damage of high TG plates in the handling process.
Description
Technical field
The present invention relates to wiring board art, especially a kind of high TG plates remove gluing method.
Background technology
It is innovated with the continuous development of electronic product, printed circuit board（PCB）Also gradually to high density, highly integrated, thin
Circuit, small-bore, large capacity, lightening direction are developed, and technology content and complexity are continuously improved.High TG plates（TG≥
170）It is one of the direction of existing PCB enterprises production development, existing PCB enterprises ensure to remove according to 2 progress removing glues of normal removing glue
Glue quality, but for level except tree lace removing glue need twice in and washing after manually plank is taken out and be carried to it is bulk it is preceding again
Secondary removing glue, lost labor is serious and carrying wastes time and in the presence of flower quality hidden danger is wiped, how to ensure removing glue quality, reduce carrying
With it is artificial, have become PCB enterprises urgent problem.
Invention content
Based on this, it is necessary to provide a kind of high TG plates and remove gluing method, include the following steps：
It is bulk：High TG plates are put into bulk agent solution and are impregnated, so that the macromolecular chain fracture of the hole wall resin on high TG plates；
First wash：With flowing water will be bulk after high TG plates clean, remove remaining bulk agent solution；
Removing glue：The high TG plates after first wash are impregnated with removing glue agent solution, remove glue residue thereon and sting the high TG plates of erosion
Base material；
Second wash：The high TG plates after removing glue are cleaned with flowing water, remove remaining removing glue agent solution；
Preneutralization：The basic residual substance for remaining in hole wall after removing glue is neutralized with packet preneutralization agent；
It neutralizes：The manganese residuals for remaining in hole wall after removing glue are neutralized with neutralizer；
Washing：The high TG plates after neutralization are cleaned with flowing water, go out remaining preneutralization solution and neutralization solution.
Wherein preneutralization agent includes sulfuric acid, and sulfuric acid can neutralize remaining alkaline solution, and neutralizer includes hydrogen peroxide, dioxygen
Water has reproducibility, can remaining in the preliminary reduction of carry out such as septivalency manganese, sexavalence manganese and manganese dioxide in hole and in plate face,
It is reduced into soluble divalent manganesetion, septivalency manganese, sexavalence manganese and manganese dioxide etc. is avoided to be brought into follow-up process.
Preferably, the bulk agent solution contains sodium hydroxide, and in leavening agent each ingredient containing measuring intermediate value.
Bulk process is the processing procedure before removing glue, can remove clast and dirt caused by drilling, can be bulk and soft
The base material for changing high TG plates, to promote the erosion of stinging of next stop permanganate, and each component content in bulk agent solution takes intermediate value,
I.e. each specification liquid medicine takes optimum value, if naoh concentration requires 80 ± 10g/L, is actually adjusted to optimum value 80g/L, ensures
Liquid medicine performance is best.
Further, bulk temperature is 65-75 DEG C, and the bulk time is 5-8 minutes.
When carrying out bulk operation, its reaction temperature is increased in certain range, the performance of liquid medicine can be made best,
The utilization rate of liquid medicine is promoted, production efficiency is improved.
Preferably, the ammonium hydroxide containing potassium permanganate and 25% in the removing glue agent solution, and in leavening agent each ingredient content
Intermediate value is taken, wherein the content of the potassium permanganate is 75g/L.
Removing glue agent solution is used to, for carrying out the base material of the high TG plates after bulk softening and glue residue to sting eating away, make hole wall
Epoxy resin form a kind of honey comb like micro- rough surface, with the binding force between the chemical layers of copper of enhancing and epoxy resin base material,
Hole wall separation and the generation of aperture blowing are prevented, and each component content in removing glue agent solution takes intermediate value, i.e. each specification liquid medicine to take
Optimum value is actually adjusted to optimum value 75g/L such as potassium permanganate 75 ± 10g/L of concentration requirement, ensures that liquid medicine performance is best.
Further, removing glue temperature is 75-85 DEG C, and the removing glue time is 12-18 minutes.
When carrying out removing glue operation, its reaction temperature is increased in certain range, the performance of liquid medicine can be made best,
The utilization rate of liquid medicine is promoted, production efficiency is improved.
Preferably, removing glue rate is 0.35-0.45mg/cm2。
Removing glue rate appropriate can ensure the high best adhesive removing amount of TG plates, so that it is guaranteed that hole wall is straight, liquid medicine runs through effect
Most preferably.
The principle of the present invention, effect are further illustrated with reference to above-mentioned technical proposal：
The present invention only needs to carry out a removing glue processing to high TG plates, can reduce the carrying number of high TG plates, improve production speed
Rate, and the damage of high TG plates in the handling process can be reduced.
Specific implementation mode
In order to facilitate the understanding of those skilled in the art, being described in further detail to the present invention below in conjunction with embodiment：
Embodiment 1
A kind of high TG plates remove gluing method, include the following steps：
It is bulk：High TG plates are put into bulk agent solution and are impregnated, so that the macromolecular chain fracture of the hole wall resin on high TG plates；
First wash：With flowing water will be bulk after high TG plates clean, remove remaining bulk agent solution；
Removing glue：The high TG plates after first wash are impregnated with removing glue agent solution, remove glue residue thereon and sting the high TG plates of erosion
Base material；
Second wash：The high TG plates after removing glue are cleaned with flowing water, remove remaining removing glue agent solution；
Preneutralization：The basic residual substance for remaining in hole wall after removing glue is neutralized with the preneutralization agent comprising sulfuric acid；
It neutralizes：The manganese residuals for remaining in hole wall after removing glue are neutralized with the neutralizer comprising hydrogen peroxide；
Washing：The high TG plates after neutralization are cleaned with flowing water, go out remaining preneutralization solution and neutralization solution.
Embodiment 2
A kind of high TG plates remove gluing method, include the following steps：
It is bulk：By high TG plates input sodium hydrate content to be impregnated in the bulk agent solution of 80g/L, so that the hole wall on high TG plates
The macromolecular chain of resin is broken；
First wash：With flowing water will be bulk after high TG plates clean, remove remaining bulk agent solution；
Removing glue：The high TG plates after first wash are impregnated with removing glue agent solution, remove glue residue thereon and sting the high TG plates of erosion
Base material；
Second wash：The high TG plates after removing glue are cleaned with flowing water, remove remaining removing glue agent solution；
Preneutralization：The basic residual substance for remaining in hole wall after removing glue is neutralized with the preneutralization agent comprising sulfuric acid；
It neutralizes：The manganese residuals for remaining in hole wall after removing glue are neutralized with the neutralizer comprising hydrogen peroxide；
Washing：The high TG plates after neutralization are cleaned with flowing water, go out remaining preneutralization solution and neutralization solution.
Embodiment 3
A kind of high TG plates remove gluing method, include the following steps：
It is bulk：It is 80g/L by high TG plates input sodium hydrate content, is impregnated 5-8 minutes in 65-75 DEG C of bulk agent solution,
So that the macromolecular chain fracture of the hole wall resin on high TG plates；
First wash：With flowing water will be bulk after high TG plates clean, remove remaining bulk agent solution；
Removing glue：The high TG plates after first wash are impregnated with 75-85 DEG C of removing glue agent solution 12-18 minutes, are removed thereon
Glue residue and stinging loses the base material of high TG plates the；
Second wash：The high TG plates after removing glue are cleaned with flowing water, remove remaining removing glue agent solution；
Preneutralization：The basic residual substance for remaining in hole wall after removing glue is neutralized with the preneutralization agent comprising sulfuric acid；
It neutralizes：The manganese residuals for remaining in hole wall after removing glue are neutralized with the neutralizer comprising hydrogen peroxide；
Washing：The high TG plates after neutralization are cleaned with flowing water, go out remaining preneutralization solution and neutralization solution.
Embodiment 4
A kind of high TG plates remove gluing method, include the following steps：
It is bulk：It is 80g/L by high TG plates input sodium hydrate content, is impregnated 5-8 minutes in 65-75 DEG C of bulk agent solution,
So that the macromolecular chain fracture of the hole wall resin on high TG plates；
First wash：With flowing water will be bulk after high TG plates clean, remove remaining bulk agent solution；
Removing glue：The high TG plates after first wash are impregnated with 75-85 DEG C of removing glue agent solution 12-18 minutes, are removed thereon
Glue residue and stinging loses the base material of high TG plates the, wherein except peptizing agent contains potassium permanganate and 25% ammonium hydroxide, the potassium permanganate
Content is 75g/L, and removing glue rate is 0.35-0.45mg/cm2。
Second wash：The high TG plates after removing glue are cleaned with flowing water, remove remaining removing glue agent solution；
Preneutralization：The basic residual substance for remaining in hole wall after removing glue is neutralized with the preneutralization agent comprising sulfuric acid；
It neutralizes：The manganese residuals for remaining in hole wall after removing glue are neutralized with the neutralizer comprising hydrogen peroxide；
Washing：The high TG plates after neutralization are cleaned with flowing water, go out remaining preneutralization solution and neutralization solution.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of high TG plates remove gluing method, which is characterized in that include the following steps：
It is bulk：High TG plates are put into bulk agent solution and are impregnated, so that the macromolecular chain fracture of the hole wall resin on high TG plates；
First wash：With flowing water will be bulk after high TG plates clean；
Removing glue：The high TG plates after first wash are impregnated with removing glue agent solution, remove glue residue thereon and sting the high TG plates of erosion
Base material；
Second wash：The high TG plates after removing glue are cleaned with flowing water；
Preneutralization：The basic residual substance for remaining in hole wall after removing glue is neutralized with preneutralization agent；
It neutralizes：The manganese residuals for remaining in hole wall after removing glue are neutralized with neutralizer；
Washing：The high TG plates after neutralization are cleaned with flowing water.
2. high TG plates according to claim 1 remove gluing method, which is characterized in that the bulk agent solution contains hydroxide
Sodium, and in leavening agent each ingredient containing measure intermediate value.
3. high TG plates according to claim 2 remove gluing method, which is characterized in that bulk temperature is 65-75 DEG C, the bulk time
It is 5-8 minutes.
4. high TG plates according to claim 1 remove gluing method, which is characterized in that contain Gao Meng in the removing glue agent solution
Sour potassium and 25% ammonium hydroxide, and in adhesive remover each ingredient containing measure intermediate value, wherein the content of the potassium permanganate be 75g/L.
5. high TG plates according to claim 4 remove gluing method, which is characterized in that removing glue temperature is 75-85 DEG C, when removing glue
Between be 12-18 minutes.
6. high TG plates according to claim 1 remove gluing method, which is characterized in that removing glue rate is 0.35-0.45mg/cm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810059753.8A CN108289384A (en) | 2018-01-22 | 2018-01-22 | High TG plates remove gluing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810059753.8A CN108289384A (en) | 2018-01-22 | 2018-01-22 | High TG plates remove gluing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108289384A true CN108289384A (en) | 2018-07-17 |
Family
ID=62835658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810059753.8A Pending CN108289384A (en) | 2018-01-22 | 2018-01-22 | High TG plates remove gluing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108289384A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867276A (en) * | 2020-12-31 | 2021-05-28 | 南通赛可特电子有限公司 | Horizontal glue removing process for printed circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985040A (en) * | 1998-09-21 | 1999-11-16 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
| JP2002246730A (en) * | 2001-02-13 | 2002-08-30 | Mitsubishi Electric Corp | Method and system for desmearing printed wiring board |
| CN101074118A (en) * | 2006-05-18 | 2007-11-21 | 住友金属矿山株式会社 | Method for manufacturing nickel oxyhydroxide used for battery |
| CN202752272U (en) * | 2012-07-31 | 2013-02-27 | 深圳市化讯应用材料有限公司 | Device capable of cleaning glue refuse in drill hole of printed circuit board (PCB) |
| CN104519664A (en) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | Printed circuit board cleaning method and printed circuit board |
| CN104735927A (en) * | 2013-12-20 | 2015-06-24 | 深圳崇达多层线路板有限公司 | PCB glue removing method in mode of vertically depositing copper wires |
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
-
2018
- 2018-01-22 CN CN201810059753.8A patent/CN108289384A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985040A (en) * | 1998-09-21 | 1999-11-16 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
| JP2002246730A (en) * | 2001-02-13 | 2002-08-30 | Mitsubishi Electric Corp | Method and system for desmearing printed wiring board |
| CN101074118A (en) * | 2006-05-18 | 2007-11-21 | 住友金属矿山株式会社 | Method for manufacturing nickel oxyhydroxide used for battery |
| CN202752272U (en) * | 2012-07-31 | 2013-02-27 | 深圳市化讯应用材料有限公司 | Device capable of cleaning glue refuse in drill hole of printed circuit board (PCB) |
| CN104519664A (en) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | Printed circuit board cleaning method and printed circuit board |
| CN104735927A (en) * | 2013-12-20 | 2015-06-24 | 深圳崇达多层线路板有限公司 | PCB glue removing method in mode of vertically depositing copper wires |
| CN105813390A (en) * | 2016-05-27 | 2016-07-27 | 东莞联桥电子有限公司 | Adhesive removing process for high-TG printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 沈宁一 等: "《镀镍技术问答》", 30 September 1985, 上海科学技术出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867276A (en) * | 2020-12-31 | 2021-05-28 | 南通赛可特电子有限公司 | Horizontal glue removing process for printed circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180717 |