CN106686911A - Conducting film production method - Google Patents
Conducting film production method Download PDFInfo
- Publication number
- CN106686911A CN106686911A CN201710170700.9A CN201710170700A CN106686911A CN 106686911 A CN106686911 A CN 106686911A CN 201710170700 A CN201710170700 A CN 201710170700A CN 106686911 A CN106686911 A CN 106686911A
- Authority
- CN
- China
- Prior art keywords
- production method
- wiring board
- conducting film
- circuit board
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Abstract
The invention discloses a conducting film production method. The conducting film production method comprises the following steps of: (1), drilling a circuit board, and removing burr after drilling; (2), putting the circuit board in swelling agent solution to immerse, so that glue slag residual on a drilled hole wall is effectively softened and swelled; (3), putting the circuit board processed in the step (2) in strong alkali solution, so that the glue slag residual on the drilled hole wall is removed; (4), putting the circuit board processed in the step (3) in strong acid solution, so that an alkaline substance residual on the circuit board is neutralized; (5), putting the circuit board processed in the step (4) in micro-etching solution, so that resin on the drilled hole wall has a rough surface; (6), clearing and wetting the drilled hole wall by using conditioner solution, so that an interface, where a conducting layer is easily implanted, is generated; (7), immersing by using an oxidizing agent, so that a conducting polymer is formed in the drilled hole wall; and (8), further catalyzing the conducting polymer, and plating copper on the surface of the conducting polymer. The conducting film production method disclosed by the invention is short in process, free from toxic and harmful substances, such as formaldehyde and methanol, and low in pollution.
Description
Technical field
The present invention relates to the making field of wiring board via, more particularly to a kind of production method of conducting film.
Background technology
At present domestic circuit board plant is mainly using copper facing on the via of electroless copper plating technique assist side, electroless copper plating
Liquid medicine is seriously polluted, technology stability is poor, high cost, has not met the demand of modern society's sustainable development.
The content of the invention
The technical problem to be solved is to provide in a kind of assist side hole the raw Fang Fang for adsorbing one layer of conducting resinl
Method.
The technical problem to be solved is achieved by the following technical programs：A kind of producer of conducting film
Method, the method is comprised the following steps：
（1）The burr after drilling is drilled and removed to wiring board；
（2）Concentration for 90-120g/l bulk agent solution and be heated to 77-88 DEG C, wiring board is put into into bulk agent solution
In soaked, by borehole wall remain glue residue effectively soften, it is bulk；
（3）Prepare strong alkali solution, and strong alkali solution is heated to into 80-88 DEG C, will be through step（2）The wiring board of process is put
In the strong alkali solution, the glue residue remained on drilling holes on circuit board hole wall is removed；
（4）Prepare strongly acidic solution, and strongly acidic solution is heated to into 20-30 DEG C, will be through step（3）The wiring board of process is put
In the strongly acidic solution, by residual alkaline matter neutralization in the circuit board；
（5）By step（4）Wiring board after process is placed in micro-corrosion liquid and carries out microetch, on the borehole wall of the wiring board Jing after microetch
Resin coarse surface is presented；
（6）Borehole wall is soaked using conditioner solvent clean, so as to produce the interface of the easy implantation of operation conductive layer after；
（7）Soak in the oxidant for being placed in permanganate and add borate buffer the wiring board after conditioner is processed,
In the borehole wall Jing after conditioner process, MnO is generated by the resin reaction on permanganate and borehole wall2Oxidation is single
Body, and form electric conductive polymer on the resin of borehole wall；
（8）Using ethene dioxythiophene and sulfonic acids as catalyst, the electric conductive polymer produced in step (7) is carried out
Catalysis, ethene dioxythiophene and sulfonic acids form polymerising ethylene dioxy thiophene with the MnO2 fast reactions on hole wall.
Preferably, between step (1) (2), between step (2) (3), between step (3) (4), between step (4) (5), step
Suddenly between (5) (6), between step (6) (7), step is required to wash wiring board between (7) (8).
Preferably, also need to carry out ultrasonic wave to wiring board between step (1) and step (2) to embathe.
Preferably, the wiring board for being embathed by ultrasonic wave between step (1) and step (2) also needs to carry out water impact
Cleaning.
Preferably, the leavening agent in step (2) is NAOH solution.
Preferably, the strong alkali solution that residual glue residue on drilling holes on circuit board hole wall is removed in step (3) is NAOH and KMNO4
Mixed liquor, the content of NAOH is 35-55g/l, and the content of KMNO4 is 65-95g/l.
Preferably, the strongly acidic solution in step (4) is the H that concentration is 50%2SO4H with 30%2O2, wherein, H2SO4's
Content is 80-140ml/g, H2O2Be 4.5-5.5%.
Preferably, micro-corrosion liquid uses SPS syndiotatic polystyrenes and H in this step (5)2SO4Mixed liquor, need
Mixed liquor is heated to into 25-35 DEG C, wiring board is placed in into immersion in the mixed liquor carries out microetch, wherein, H2SO4Content be 3-
The content of 5%, SPS syndiotatic polystyrene is 30-50g/l.
Preferably, used in this step (6) Na2CO3 solution as whole hole liquid, the content of Na2CO3 is 3-8g/l.
Preferably, the content of this step (7) mesoboric acid is 8-15g/l, and temperature after heating is controlled at 80-90 DEG C.
The present invention has the advantages that：In the present invention by drilling holes on circuit board, soften and remove drilling holes on circuit board
The glue residue remained on hole wall, makes drilling holes on circuit board hole wall that coarse surface is presented by microetch, and then will be drilled by conditioner
Hole wall is soaked, and one layer of electric conductive polymer is formed on borehole wall using oxidant, and on the surface of electric conductive polymer one is entered
In its adsorption copper ion after step catalysis, present invention process flow process is short, without the poisonous and harmful substances such as formaldehyde methyl alcohol, pollution
It is little.
Specific embodiment
A kind of production method of conducting film of the invention is described in further detail below in conjunction with specific embodiment.
In one preferred embodiment, a kind of production method of conducting film of the present invention mainly comprises the steps：
（1）The burr after drilling is drilled and removed to wiring board；
（2）Concentration for 90-120g/l bulk agent solution and be heated to 77-88 DEG C, wiring board is put into into bulk agent solution
In soaked, by borehole wall remain glue residue effectively soften, it is bulk；
（3）Prepare strong alkali solution, and strong alkali solution is heated to into 80-88 DEG C, will be through step（2）The wiring board of process is put
In the strong alkali solution, the glue residue remained on drilling holes on circuit board hole wall is removed；
（4）Prepare strongly acidic solution, and strongly acidic solution is heated to into 20-30 DEG C, will be through step（3）The wiring board of process is put
In the strongly acidic solution, by residual alkaline matter neutralization in the circuit board；
（5）Wiring board after step (4) process is placed in into micro-corrosion liquid carries out microetch, on the borehole wall of the wiring board Jing after microetch
Resin coarse surface is presented；
（6）Borehole wall is soaked using conditioner solvent clean, so as to produce the interface of the easy implantation of operation conductive layer after；
（7）Soak in the oxidant for being placed in permanganate and add borate buffer the wiring board after conditioner is processed,
In the borehole wall Jing after conditioner process, MnO is generated by the resin reaction on permanganate and borehole wall2Oxidation is single
Body, and form electric conductive polymer on the resin of borehole wall；
（8）Using ethene dioxythiophene and sulfonic acids as catalyst, the electric conductive polymer produced in step (7) is carried out
Catalysis, ethene dioxythiophene and sulfonic acids form polymerising ethylene dioxy thiophene with the MnO2 fast reactions on hole wall.
Between the step of the present embodiment (1) (2), between step (2) (3), between step (3) (4), step (4) (5) it
Between, between step (5) (6), between step (6) (7), step is required to wash wiring board between (7) (8).
The present embodiment also needs to carry out ultrasonic wave to wiring board to embathe between step (1) and step (2).
The wiring board that the present embodiment is embathed between step (1) and step (2) by ultrasonic wave also needs to carry out current punching
Hit cleaning, clear water to wash and centering.
Leavening agent in the step of the present embodiment (2) is NAOH solution.
Remove in the step of the present embodiment (3) remain on drilling holes on circuit board hole wall glue residue strong alkali solution be NAOH and
The mixed liquor of KMNO4, the content of NAOH is 35-55g/l, and the content of KMNO4 is 65-95g/l.
Strongly acidic solution in the step of the present embodiment (4) is the H that concentration is 50%2SO4H with 30%2O2, wherein, H2SO4
Content be 80-140ml/g, H2O2Be 4.5-5.5%.
Micro-corrosion liquid uses SPS syndiotatic polystyrenes and H in the step of the present embodiment (5)2SO4Mixed liquor, need
Mixed liquor is heated to into 25-35 DEG C, wiring board is placed in into immersion in the mixed liquor carries out microetch, wherein, H2SO4Content be 3-
The content of 5%, SPS syndiotatic polystyrene is 30-50g/l.
As whole hole liquid, the content of Na2CO3 is 3-8g/l to Na2CO3 solution used in the step of the present embodiment (6).
The content of the step of the present embodiment (7) mesoboric acid is 8-15g/l, also containing 20% phosphoric acid, temperature after oxidant heating
Degree control is at 80-90 DEG C.
Also there is 20% phosphoric acid in the catalyst of the step of the present embodiment (8).
Embodiment described above only expresses embodiments of the present invention, and its description is more concrete and detailed, but can not
Therefore the restriction to the scope of the claims of the present invention is interpreted as, as long as the skill obtained in the form of equivalent or equivalent transformation
Art scheme, all should fall within the scope and spirit of the invention.
Claims (10)
1. a kind of production method of conducting film, the method is comprised the following steps：
（1）The burr after drilling is drilled and removed to wiring board；
（2）Concentration for 90-120g/l bulk agent solution and be heated to 77-88 DEG C, wiring board is put into into bulk agent solution
In soaked, by borehole wall remain glue residue effectively soften, it is bulk；
（3）Prepare strong alkali solution, and strong alkali solution is heated to into 80-88 DEG C, will be through step（2）The wiring board of process is put
In the strong alkali solution, the glue residue remained on drilling holes on circuit board hole wall is removed；
（4）Prepare strongly acidic solution, and strongly acidic solution is heated to into 20-30 DEG C, will be through step（3）The wiring board of process is put
In the strongly acidic solution, by residual alkaline matter neutralization in the circuit board；
（5）By step（4）Wiring board after process is placed in micro-corrosion liquid and carries out microetch, on the borehole wall of the wiring board Jing after microetch
Resin coarse surface is presented；
（6）Borehole wall is soaked using conditioner solvent clean, so as to produce the interface of the easy implantation of operation conductive layer after；
（7）Soak in the oxidant for being placed in permanganate and add borate buffer the wiring board after conditioner is processed,
In the borehole wall Jing after conditioner process, MnO is generated by the resin reaction on permanganate and borehole wall2Oxidation is single
Body, and form electric conductive polymer on the resin of borehole wall；
（8）Using ethene dioxythiophene and sulfonic acids as catalyst, the electric conductive polymer produced in step (7) is carried out
Catalysis, ethene dioxythiophene and sulfonic acids form polymerising ethylene dioxy thiophene with the MnO2 fast reactions on hole wall.
2. the production method of conducting film according to claim 1, it is characterised in that:Between step (1) (2), step (2) (3)
Between, between step (3) (4), between step (4) (5), between step (5) (6), between step (6) (7), step (7) (8) it
Between be required to wash wiring board.
3. the production method of conducting film according to claim 1, it is characterised in that:Also need between step (1) and step (2)
Ultrasonic wave is carried out to wiring board to embathe.
4. the production method of conducting film according to claim 1, it is characterised in that:Pass through between step (1) and step (2)
The wiring board that ultrasonic wave embathes also needs to carry out water impact cleaning.
5. the production method of conducting film according to claim 1, it is characterised in that:Leavening agent in step (2) is that NAOH is molten
Liquid.
6. the production method of conducting film according to claim 1, it is characterised in that:Drilling holes on circuit board hole is removed in step (3)
The strong alkali solution that glue residue is remained on wall is the mixed liquor of NAOH and KMNO4, and the content of NAOH is 35-55g/l, and KMNO4's contains
Amount is 65-95g/l.
7. the production method of conducting film according to claim 1, it is characterised in that:Strongly acidic solution in step (4) is dense
Spend the H for 50%2SO4H with 30%2O2, wherein, H2SO4Content be 80-140ml/g, H2O2Be 4.5-5.5%.
8. the production method of conducting film according to claim 1, it is characterised in that:Micro-corrosion liquid is used in this step (5)
SPS syndiotatic polystyrenes and H2SO4Mixed liquor, need for mixed liquor to be heated to 25-35 DEG C, wiring board is placed in into the mixing
Immersion in liquid carries out microetch, wherein, H2SO4Content be 3-5%, the content of SPS syndiotatic polystyrenes is 30-50g/l.
9. the production method of conducting film according to claim 1, it is characterised in that:Na2CO3 solution used in this step (6)
As whole hole liquid, the content of Na2CO3 is 3-8g/l.
10. the production method of conducting film according to claim 1, it is characterised in that:The content of this step (7) mesoboric acid is 8-
15g/l, temperature after heating is controlled at 80-90 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710170700.9A CN106686911A (en) | 2017-03-21 | 2017-03-21 | Conducting film production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710170700.9A CN106686911A (en) | 2017-03-21 | 2017-03-21 | Conducting film production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106686911A true CN106686911A (en) | 2017-05-17 |
Family
ID=58829053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710170700.9A Pending CN106686911A (en) | 2017-03-21 | 2017-03-21 | Conducting film production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106686911A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109234788A (en) * | 2018-08-03 | 2019-01-18 | 诚亿电子（嘉兴）有限公司 | Except glue regenerating device visual inspection method |
| CN110831335A (en) * | 2019-11-05 | 2020-02-21 | 东莞市科佳电路有限公司 | Drilling deslagging electroplating process for FPC board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101029409A (en) * | 2006-11-24 | 2007-09-05 | 江苏工业学院 | Pretreatment and pretreatment solution for direct porous metallizing printing IC board |
| CN103874344A (en) * | 2012-12-10 | 2014-06-18 | Ymt株式会社 | Vias of a circuit board and method for depositing conducting polymers into through-holes |
| CN104018196A (en) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | Direct plating method for printed circuit board free of chemical plating |
| CN105887053A (en) * | 2016-05-06 | 2016-08-24 | 广东利尔化学有限公司 | Chemical copper plating pretreatment process for printed wiring board |
-
2017
- 2017-03-21 CN CN201710170700.9A patent/CN106686911A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101029409A (en) * | 2006-11-24 | 2007-09-05 | 江苏工业学院 | Pretreatment and pretreatment solution for direct porous metallizing printing IC board |
| CN103874344A (en) * | 2012-12-10 | 2014-06-18 | Ymt株式会社 | Vias of a circuit board and method for depositing conducting polymers into through-holes |
| CN104018196A (en) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | Direct plating method for printed circuit board free of chemical plating |
| CN105887053A (en) * | 2016-05-06 | 2016-08-24 | 广东利尔化学有限公司 | Chemical copper plating pretreatment process for printed wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109234788A (en) * | 2018-08-03 | 2019-01-18 | 诚亿电子（嘉兴）有限公司 | Except glue regenerating device visual inspection method |
| CN110831335A (en) * | 2019-11-05 | 2020-02-21 | 东莞市科佳电路有限公司 | Drilling deslagging electroplating process for FPC board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20170517 |