CN102802364B - Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof - Google Patents
Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof Download PDFInfo
- Publication number
- CN102802364B CN102802364B CN201210332993.3A CN201210332993A CN102802364B CN 102802364 B CN102802364 B CN 102802364B CN 201210332993 A CN201210332993 A CN 201210332993A CN 102802364 B CN102802364 B CN 102802364B
- Authority
- CN
- China
- Prior art keywords
- copper
- layer
- nickel
- palladium
- finished product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention relates to a method for arranging a metal palladium layer in a conducting layer of a printed circuit board and a layered structure thereof. The method comprises the following steps of: firstly, coating copper on an insulating substrate, and baking the substrate; then, sequentially carrying out the processes of drilling, copper precipitation, line manufacturing and insulating layer solder resisting so as to obtain a half-finished product of a board body; and finally, sequentially carrying out the processes of nickel precipitation, palladium precipitation and gold precipitation to the line part of the half-finished product of the board body. In the process of plating soft gold on the printed circuit board, a metal palladium layer is arranged between a nickel layer and a gold layer, so that the thickness of the gold layer can be greatly reduced so as to achieve the effect of lowering the material cost.
Description
Technical field
The present invention relates to a kind of manufacture method and layer structure thereof of printed circuit board (PCB), refer to especially method and layer structure thereof that Metal Palladium layer is set in a kind of process printed circuit board (PCB) being plated to soft gold between nickel dam and gold layer.
Background technology
Printed circuit board, claim again printed circuit board (PCB), be the generator of electronic devices and components electrical connection, the major advantage that adopts printed circuit board (PCB) in concrete enforcement is the mistake that can greatly reduce wiring and assembling, can improve the gentle productive labor efficiency of Automated water.Printed circuit board is to take insulation board as base material, be cut into certain size, on it, at least has a conductive pattern, and the porose position of cloth, such as component hole, fastener hole, plated-through hole etc., it can be used for replacing the chassis in the past installed electronic devices and components, and can realize interconnecting between electronic devices and components.Printed circuit board is very important electronic unit now, is the supporter of electronic devices and components.
Current printed circuit board, is mainly comprised of following part, circuit and figure face portion, and circuit is the instrument as conducting between original paper, can design in addition in design large copper face as ground connection and bus plane.Dielectric layer part, it is for keeping the insulating properties between circuit and each layer, is commonly called as base material.Hole bit position, wherein via can make circuit conductings each other more than two levels, and larger via, as part plug-in unit use, has non-conduction hole to be commonly used to as surface mount location in addition, and during assembling, fixed screw is used.Anti-solder ink part is not that whole copper faces all will be eaten part on tin in concrete enforcement, and therefore non-region of eating tin, can print the material (being generally epoxy resin) that the isolated copper face of one deck is eaten tin, avoids short circuit between the non-circuit of eating tin.Surface treatment, because copper face is in general environment, is easy to oxidation, causes going up tin (solderability is bad), therefore can on the copper face that will eat tin, protect.The mode of protection has spray tin, changes gold, changes silver, changes tin etc.
In order to improve the conductivity of the printed circuit with special purpose, the later stage that generally can make moulding at printed circuit by the mode of non-electrolysis or electrolytic gold plating carries out nickel plating and gold-plated processing, chemistry or electronickelling gold arrange last layer gold after exactly one deck nickel being first set on printed circuit board surface conductor again, nickel dam is mainly the diffusion preventing between gold and copper, due to meeting phase counterdiffusion between gold and copper, and nickel dam can stop the diffusion between it, if there is no the obstruct of nickel dam, gold will be diffused in copper and go within a few hours.In addition chemical nickel plating/soak gold also can stop the dissolving of copper, and this will be of value to pb-free solder.And present electronickelling gold has two classes: plate the hard gold of soft gold and plating, beat gold thread when soft gold is mainly used in chip package; Hard gold is mainly used in the electrical interconnects of non-weld.Under normal circumstances, welding can cause electrogilding to become fragile, and this is reduction of service life, thereby will avoid welding on electrogilding, and chemical nickel plating/soak gold because gold is very thin and consistent, the phenomenon that becomes fragile is rare.
But at present on the market of encapsulation printed substrate, position as soft gold solder contact, the thickness General Requirements of gold layer is minimum more than 0.5um, just can there is good gold thread bonding effect, but metallic gold is more expensive as its material cost of a kind of precious metal, adopt existing method and processing structure to be difficult to reduce golden use amount, thereby make the cost of printed circuit board (PCB) always higher, and this is the major defect for conventional art.
Summary of the invention
The invention provides a kind of method and layer structure thereof that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB), by its method and layer structure, can in the process of printed circuit board (PCB) being plated to soft gold, between nickel dam and gold layer, Metal Palladium layer be set, by the Metal Palladium layer adding, can greatly reduce the thickness of gold layer, thereby reach the effect that reduces material cost, and this is main purpose of the present invention.
The technical solution used in the present invention is: a kind of method that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB), comprises the steps:
The first step, insulated substrate is covered to copper, at the surface of this insulated substrate coating Copper Foil, form copper-clad laminated board.
Second step, the copper-clad laminated board in the first step is carried out to baking sheet, copper-clad laminated board is placed in the environment of 160 ℃ to 190 ℃ of temperature and continues baking sheet 4 hours.
The 3rd step, to the copper-clad laminated board after baking sheet in second step, the operating process of carry out successively Drilling operation, the operation of heavy copper, making circuit, insulating barrier welding resistance obtains semi-finished product plate body.
The 4th step, the circuit pack of the semi-finished product plate body in the 3rd step is sunk to nickel, heavy palladium, turmeric operation successively, in order to improve the conductivity of semi-finished product plate body circuit pack, sink successively nickel, heavy palladium, turmeric operation, specifically production stage is:
Step 1, will semi-finished product plate body drop in cleaning slot and clean, the effect of this step is to remove semi-finished product plate body copper face slight oxidation thing and dirt, the air and the dirt that are adsorbed in copper face are arranged, reduce surface tension of liquid, reach moistening effect, the liquid of subsequent treatment is able to smoothly and copper face effect, use RCOOH to clean, the concentration of RCOOH is 80 to 120ml/L, and cleaning temperature is 40 to 50 ℃, and the processing time is controlled at 3 to 6 minutes.
Step 2, semi-finished product plate body is taken out from cleaning slot, after cleaning with clear water, carry out micro-rotten processing, micro-rotten effect of processing is to remove copper face oxide, make the micro-alligatoring of copper face, make the electroless nickel layer in copper layer and subsequent step have good adherence, in carrying out micro-rotten process of processing, select the mixing material of sodium peroxydisulfate and CP sulfuric acid to carry out micro-corruption, the consumption of sodium peroxydisulfate is 80 to 120g/L, the consumption of CP sulfuric acid is 15 to 25ml/L, temperature is controlled at 20 to 30 ℃, processing time is controlled at 1 to 2 minute, copper face microetch amount is controlled at 20 to 40 μ m, when reaching 15g/l, micro-rotten liquid copper content need to upgrade micro-sanies.
Step 3, semi-finished product plate body is taken out from micro-sanies, after cleaning with clear water, carry out pickling processes, after pickling processes, carry out preimpregnation, wherein, the effect of pickling is the copper face oxide of removing after microetch, the effect of preimpregnation is to maintain the acidity in activated bath in step below, make copper face under oxide-free state, enter below activated bath in step, the concentration of controlling CP sulfuric acid when carrying out pickling processes is 40ml/L, processing time is controlled at 1 to 1.5 minute, the concentration of controlling hydrochloric acid when carrying out preimpregnation is 30ml/L, and the preimpregnation time is controlled at 1 to 2 minute.
Step 4, through the semi-finished product plate body of preimpregnation, directly insert and in activated bath, carry out activation act, activation act is to carry out without the pre-treatment before electrolytic nickel at semi-finished product plate body, catalytic activation is carried out in copper surface, it specifically comprises replaces palladium and copper, make the complete copper surface that is adsorbed on of palladium active nucleus, by activation act, can make palladium catalysis core optionally be adsorbed on copper, allow and be plated in fully on copper surface without electrolytic nickel.
Step 5, to carrying out nickel plating operation through the semi-finished product plate body of activation processing, nickel plating operation is that the semi-finished product plate body copper face after activation plates one deck nickel, as the layer that blocks that blocks migration between Jin Yutong, diffusion,
Step 6, plate palladium operation after the semi-finished product plate body through nickel plating operation is cleaned, plate palladium layer on the nickel dam of semi-finished product plate body, the thickness of palladium layer is between 0.01 to 0.15 μ m.
Step 7, after being cleaned, the semi-finished product plate body through plating palladium operation carries out gold-plated operation, Gold plated Layer on the palladium layer of semi-finished product plate body, and the thickness of gold layer is between 0.03 to 0.05 μ m.
In the first step, at the two sides of this insulated substrate coating Copper Foil, form copper-clad laminated board, and utilize acid solution to subtract copper operation.
In the 3rd step, concrete operation step is, first carry out Drilling operation, after Drilling operation, adopt chemical electroless plating copper mode to process and on Copper Foil, form the first coating, make both sides Copper Foil mutual conduction, to complete heavy copper operation, electrolytic copper plating processing is carried out in the surface of this first coating, on this first coating, form the second coating, for the second coating surface at copper-clad laminated board forms circuit, on this second coating, attach the dry film that contains emulsion, then, by optical treatment operation, expose and video picture, be formed for forming the dry film peristome of circuit, to forming the position of circuit, carry out electrolytic copper plating processing, form copper coating, by stripping process, remove this sensitization dry film of this copper coating periphery, thereby complete the operation of making circuit, obtain circuit, on this circuit, again attach the dry film that contains emulsion, again attach after dry film, in order to form external circuit on this circuit forming by optical treatment operation, through exposure and video picture operation, be formed for forming the etching protective film of external circuit, to by optical treatment operation, form for forming the Copper Foil beyond the etching protective film of external circuit, the first coating, the second coating carries out etching, form after external circuit, by stripping process, remove the Copper Foil of external circuit periphery, the first coating, the second coating, in order to ensure mutually insulated between etched circuit, carry out the printing process that PSR operation or polyimides are insulating material, need to carry out forming insulating barrier between surface treatment region circuit in addition.
In the step 4 of the 4th step, in the process of carrying out activation act, utilize hydrochloric acid palladium and hydrochloric acid to make activating solution and carry out activation act, activating concrete steps is, first in treatment trough, puts into approximately 60% and builds the water of bath amount, then according to the concentration of 20ml/l, adds hydrochloric acid, according to the concentration of 100ml/l, add hydrochloric acid palladium afterwards, then add water to fixed capacity, and fully stir, heating makes fluid temperature to 20 to 30 ℃, process 2 to 5 minutes, to complete activation process.
In the step 5 of the 4th step, when carrying out nickel plating operation, apply following composition, nickelous sulfate is in order to provide nickel ion, inferior sodium phosphate is in order to provide electronics, make nickel ion be reduced to metallic nickel, misfit agent is in order to form the wrong ion of nickel, reduce free nickel ion concentration, prevent that nickel hydroxide and phosphorous acid nickel from generating, increase and bathe stability, pH buffering, pH adjusting agent is in order to maintain proper pH value, stabilization agent reduces on colloidal particle or other particulate in order to prevent nickel, stablize plating solution, prevent that plating solution from decomposing, additive is in order to increase the negative potential on plated body surface, make to open and plate easily and increase reduction efficiency.
Nickel plating step is, first adds deionized water to cell body 2/3 position, then adds 18.75L/100L reducing agent, misfit agent, additive uniform stirring, and the percentage by weight of reducing agent, misfit agent, additive is 1:1:1; Then add 6.25L/100L nickelous sulfate uniform stirring it; After add again 200ml/100L additive uniform stirring; With deionized water adjustment tank liquid body, long-pending ﹐ heats while stirring to 75 to 85 ℃; Open circulating filtration, the control time is at 15 to 25 minutes, thereby completes nickel plating operation, controls all the time pH value and be controlled at 4.5 ± 0.2 in nickel plating step, and rising pH value is with 28% ammonia spirit adjustment, and reduction pH value is with 10% sulfuric acid solution adjustment.
In the step 6 of the 4th step, the plating bath of liquid that plates palladium operation forms with operating condition, the content of metal Pd is controlled at 0.8 to 1.2g/L, temperature is controlled at 50 to 54 ℃, reductant concentration is controlled at 1.5 to 10g/L, and pH value is controlled at 7.3 to 7.9, and electroplating time is controlled at 3 to 10 minutes, it is 94 to 98% that metal Pd is separated out purity, and speed of separating out is 0.4 to 0.8 μ m/hr.
The concrete steps of plating palladium operation are, the 100L of take builds bath condition as example, first in electroplating bath, add pure water 40L, then, 50L is plated to palladium stoste to be joined in electroplating bath, add again 2.5L palladium bulking liquor, confirm that pH value is 7.5 to 7.7, in the time of extraneous, add 10% sulfuric acid and 30% potassium hydroxide to adjust, last, with pure water, liquid measure is adjusted to 100L, liquid temperature is adjusted to 50 to 54 ℃, while stirring, slowly add reducing agent 300g, make it to dissolve completely, through 3 to 10 minutes, complete plating palladium and operate.
In the step 7 of the 4th step, the plating bath of liquid composition that carries out gold-plated operation is that the content of metallic gold is controlled at 1.5 to 2.5g/L with operating condition, temperature is controlled at 80 to 95 ℃, pH value is controlled at 4.7 to 5.3, and speed of separating out is that 0.3 to 0.4 μ m/20 divides, and the time is controlled at 15 to 20 minutes.
The concrete steps of gold-plated operation are that the 100L of take builds bath condition as example, first, 60L pure water is added to electroplating bath, then add 25L gold plating bath, 294g potassium auricyanide (Au metal 2g/L) is added in 5L temperature pure water, dissolve, then add in electroplating bath, with pure water, liquid measure is adjusted to 100L, confirm that pH value is whether in 4.7 to 5.3 scopes, if gone beyond the scope, use 20% potassium hydroxide solution to adjust, after pH adjusts, liquid temperature rises while arriving 90 ℃, can operate.
A kind of Metal Palladium layer structure of printed circuit board (PCB) conductive layer, comprise insulated substrate, circuit layer and conductive layer, this circuit layer is arranged on this insulated substrate, this circuit layer forms the integrated circuit of printed circuit board (PCB), this conductive layer is arranged on this circuit layer, one side of this circuit layer is connected with this insulated substrate, and an other side of this circuit layer is connected with this conductive layer, by this conductive layer and this insulated substrate, this circuit layer is wrapped up.
This conductive layer comprises metal nickel dam, Metal Palladium layer and metallic gold layer, wherein, this metal nickel dam covers on this circuit layer, this Metal Palladium layer covers on this metal nickel dam, and metallic gold layer covers on this Metal Palladium layer, the thickness of this Metal Palladium layer is between 0.01 to 0.15 μ m, and the thickness of this metallic gold layer is between 0.03 to 0.05 μ m.
This circuit layer is only arranged on a side of this insulated substrate, and this circuit layer comprises copper foil layer and top circuit layer, and wherein, this copper foil layer is arranged on this insulated substrate, and this top circuit layer is arranged on this copper foil layer top.
This circuit layer is arranged on upper surface and the lower surface of this insulated substrate simultaneously, this circuit layer comprises copper foil layer, heavy copper layer, coating and top circuit layer, wherein, this copper foil layer is arranged on this insulated substrate, this heavy copper layer is arranged on this copper foil layer, this coating is arranged on this heavy copper layer, and this top circuit layer is arranged on this coating top.
Beneficial effect of the present invention is: technology of the present invention is mainly towards the production management manufacturing process system of PCB industry, and it can be transplanted to production management manufacturing process system and the upgrading of its industry very easily.It is framework that the present invention take that unique production procedure controls, advanced sheet material, ink, chemical medicinal liquid control technology Knowledge Integration are applied to three major parts, consist of in whole PCB production and processing together effectively, be respectively: material selection control system, work flow control system, working process parameter control system.Wherein, material selection control system is mainly for different materials, according to its feature knot, in conjunction with the effect of testing, to reach required supplied materials to control.Work flow control system is by each production stage Optimal scheduling, and the production procedure only in this way reaching of formulating standard can meet production requirement.Working process parameter control system side be each link from the variation standard of many factors to spendable scope in processing do not return back out existing deviation.By method of the present invention and layer structure, can in the process of printed circuit board (PCB) being plated to soft gold, between nickel dam and gold layer, Metal Palladium layer be set, by the Metal Palladium layer adding, can greatly reduce the thickness of gold layer, thereby reach the effect that reduces material cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of copper-clad laminated board in method of the present invention.
Fig. 2 is the structural representation of the first coating and the second coating in method of the present invention.
Fig. 3 is the formation schematic diagram of circuit in method of the present invention.
Fig. 4 is the formation schematic diagram of etching protective film in method of the present invention.
Fig. 5 is the structural representation of method peripheral circuit of the present invention.
Fig. 6 is the structural representation of conductive layer in method of the present invention.
Fig. 7 is the structural representation that in layer structure of the present invention, circuit layer is only arranged on insulated substrate one side.
Fig. 8 is the structural representation that in layer structure of the present invention, circuit layer is arranged on insulated substrate both sides.
Fig. 9 is the structural representation of conductive layer in layer structure of the present invention.
Embodiment
As shown in Figures 1 to 6, a kind of method that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB), is characterized in that, comprises the steps:
The first step, insulated substrate 10 is covered to copper, a side or two sides coating Copper Foil 11 at this insulated substrate 10, form copper-clad laminated board 12.
Specifically can determine it is to cover copper or copper is covered in both sides in a side of this insulated substrate 10 according to need of production.
If two-sided while adopting in the present invention the mode of electroplating to cover copper due to plating, electroplate simultaneously, requiring the layer copper-plated while of thickening, at other one deck, also can be thickened copper facing, if copper facing is too thick, the circuit that will affect is subsequently made, so be necessary copper plate attenuate, so in concrete enforcement, can utilize acid solution to subtract copper operation.
Second step, the copper-clad laminated board 12 in the first step is carried out to baking sheet.
Copper-clad laminated board 12 is placed on and in the environment of 160 ℃ to 190 ℃ of temperature, continues baking sheet 4 hours.
By baking sheet, the stress between Copper Foil 11 and insulated substrate 10 can be reduced, when following process, can not cause distortion and the warpage of sheet material.
The 3rd step, to the copper-clad laminated board after baking sheet 12 in second step, the operating process of carry out successively Drilling operation, the operation of heavy copper, making circuit, insulating barrier welding resistance obtains semi-finished product plate body 30.
Specific operation process in the 3rd step can utilize multiple existing embodiment to implement, and is not repeated here, only a kind of preferably preferred implementation of the present invention is described as follows.
First carry out Drilling operation.
In concrete enforcement, can adopt the mode of laser or machine drilling to carry out Drilling operation, after Drilling operation, adopt chemical electroless plating copper mode to process and on Copper Foil 11, form the first coating 21, make both sides Copper Foil 11 mutual conduction, to complete heavy copper operation.
Electrolytic copper plating processing is carried out in the surface of this first coating 21, on this first coating 21, form the second coating 22.
For the second coating 22 circuit forming surfaces at copper-clad laminated board 12, on this second coating 22, attach the dry film 23 that contains emulsion.
Then, by optical treatment operation, expose and video picture, be formed for forming the dry film peristome 24 of circuit.
To forming the position 24 of circuit, carry out electrolytic copper plating processing, form copper coating 25.
This that remove these copper coating 25 peripheries by the stripping process of prior art dry film 23 for sensitization, thus the operation of making circuit completed, obtain circuit 26.
On this circuit 26, again attach the dry film 27 that contains emulsion.
Again attach after dry film 27, in order to form external circuit on this circuit 26 forming by optical treatment operation, through exposure and video picture operation, be formed for forming the etching protective film 28 of external circuit.
Copper Foil 11, the first coating 21, the second coating 22 for the forming beyond the etching protective film 28 of external circuit that by optical treatment operation, form are carried out to etching; form after external circuit 29, by traditional stripping process, remove Copper Foil 11, the first coating 21, second coating 22 of external circuit 29 peripheries.
In order to ensure mutually insulated between etched circuit, carry out the printing process that PSR operation or polyimides are insulating material, need to carry out forming insulating barrier 41 between surface treatment region circuit in addition.
The 4th step, the circuit 26 of the semi-finished product plate body 30 in the 3rd step and external circuit 29 positions are sunk to nickel, heavy palladium, turmeric operation successively, form conductive layer 42.
In order to improve the conductivity of circuit 26 and external circuit 29, sink successively nickel, heavy palladium, turmeric operation, concrete production stage is:
Step 1, will semi-finished product plate body 30 drop in cleaning slots and clean, the effect of this step is to remove semi-finished product plate body 30 copper face slight oxidation thing and dirts, the air and the dirt that are adsorbed in copper face are arranged, reduce surface tension of liquid, reach moistening effect, the liquid of subsequent treatment is able to smoothly and copper face effect, and its chemical principle is as follows
RCOOH+H
2O→RCOO
-+H
+
CuO+2H
+→Cu
2++H
2O
The concentration of RCOOH is 80 to 120ml/L, and cleaning temperature is 40 to 50 ℃, and the processing time is controlled at 3 to 6 minutes.
Material selection PVC or the P.P. of cleaning slot in concrete enforcement, heater is selected quartz or Teflon heater, when clean buried copper content reaches 500～1000ppm, need to upgrade cleaning fluid.
Step 2, semi-finished product plate body 30 is taken out from cleaning slot, after cleaning with clear water, carry out micro-rotten processing.
Micro-rotten effect of processing is to remove copper face oxide, makes the micro-alligatoring of copper face, makes the electroless nickel layer in copper layer and subsequent step have good adherence.
In carrying out micro-rotten process of processing, select the mixing material of sodium peroxydisulfate and CP sulfuric acid to carry out micro-corruption, its chemical principle is as follows,
H
2SO
4+CuO→CuSO
4+H
2O
Na
2S
2O
8+Cu→Na
2SO
4+CuSO
4
The consumption of sodium peroxydisulfate is 80 to 120g/L, the consumption of CP sulfuric acid is 15 to 25ml/L, and temperature is controlled at 20 to 30 ℃, and the processing time is controlled at 1 to 2 minute, copper face microetch amount is controlled at 20 to 40 μ m, when micro-rotten liquid copper content reaches 15g/l, need to upgrade micro-sanies.
Step 3, semi-finished product plate body 30 is taken out from micro-sanies, after cleaning with clear water, carries out pickling processes, after pickling processes, carry out preimpregnation.
Wherein, the effect of pickling is the copper face oxide of removing after microetch, and the effect of preimpregnation is to maintain the acidity in activated bath in step below, make copper face under oxide-free state, enter below activated bath in step.
The concentration of controlling CP sulfuric acid when carrying out pickling processes is 40ml/L, and the processing time is controlled at 1 to 1.5 minute, and its chemical principle is, CuO+H
2sO
4→ CuSO
4+ H
2o.
The concentration of controlling hydrochloric acid when carrying out preimpregnation is 30ml/L, and the preimpregnation time is controlled at 1 to 2 minute, and its chemical principle is, CuO+HCI → CuCl
2+ H
2o.
Step 4, through the semi-finished product plate body 30 of preimpregnation, directly insert and in activated bath, carry out activation act.
Activation act is to carry out, without the pre-treatment before electrolytic nickel, catalytic activation being carried out in copper surface at semi-finished product plate body 30, and it specifically comprises replaces palladium and copper, makes the complete copper surface that is adsorbed on of palladium active nucleus.
By activation act, can make palladium catalysis core optionally be adsorbed on copper, allow and be plated in fully on copper surface without electrolytic nickel, and make extremely separating out on resin reduce to minimum.
Through activation act, can make copper layer and nickel dam in subsequent step reach perfect adherence.
In the process of carrying out activation act, utilize hydrochloric acid palladium and hydrochloric acid to make activating solution and carry out activation act.
Its operation principle is, at copper face displacement (ionization trend Cu>Pd) last layer palladium, and the catalyst of usining as chemical nickel reaction, the catalytic active center of Pd has the performance of easy sorption hydrogen, and then can bring out chemical nickel reaction, its reaction principle is
Anode reaction Cu → Cu
2++ 2e-(E
0=-0.337V)
Cathode reaction Pd
2++ 2e-→ Pd (E
0=0.987V)
Full response Cu+Pd
2+→ Cu
2++ Pd (E
0=0.65V)
Activation concrete steps are, first in the treatment trough of dry Net, put into approximately 60% and build the water of bath amount, then according to the concentration of 20ml/l, add hydrochloric acid, according to the concentration of 100ml/l, add hydrochloric acid palladium afterwards, then add water to fixed capacity, and fully stir, heating makes fluid temperature to 20 to 30 ℃, process 2 to 5 minutes, to complete activation process.
In order to promote activation effect, can add interfacial agent to promote reaction speed, reaction effect.
Can be through entering again step below after washing and pickling with Improving The Quality of Products through the semi-finished product plate body 30 of activation processing.
Step 5, to carrying out nickel plating operation through the semi-finished product plate body 30 of activation processing.
Nickel plating operation is that semi-finished product plate body 30 copper faces after activation plate layer of Ni/P alloy, as the layer that blocks that blocks migration between Jin Yutong, diffusion.
When carrying out nickel plating operation, apply following composition, nickelous sulfate is in order to provide nickel ion, inferior sodium phosphate is in order to provide electronics, make nickel ion be reduced to metallic nickel, misfit agent is in order to form the wrong ion of nickel, reduce free nickel ion concentration, prevent that nickel hydroxide and phosphorous acid nickel from generating, increase and bathe stability, pH buffering, pH adjusting agent is in order to maintain proper pH value, and stabilization agent reduces on colloidal particle or other particulate in order to prevent nickel, stablize plating solution, prevent that plating solution from decomposing, additive, in order to increase the negative potential on plated body surface, makes to open plating easily and increases reduction efficiency.
Its chemical principle is,
Dehydrogenation H
2pO
2 -→ HPO
2 -+ H (on catalytic surface generation)
Oxidation HPO
2 -+ OH
-→ H
2pO
3 -+ e
-
Again in conjunction with H+H → H
2
Oxidation H+OH
-→ H
2o+e
-
Metal is separated out Ni
2 ++ 2e
-→ Ni
Hydrogen produces 2H
2o+2e
-→ H
2+ 2OH
-
Phosphorus eutectoid mNi
2 ++ H
2pO
2 -+ (2m+1) e
-→ NimP+2OH-
Reaction enclosure H
2o+H
2pO
2 -→ H
2+ H
2pO
3 -(hypophosphorous acid oneself decompose)
Nickel plating step is, first adds deionized water to cell body 2/3 position, then adds 18.75L/100L reducing agent, misfit agent, additive uniform stirring, and the percentage by weight of reducing agent, misfit agent, additive is 1:1:1; Then add 6.25L/100L nickelous sulfate uniform stirring it; After add again 200ml/100L additive uniform stirring; With deionized water adjustment tank liquid body, long-pending ﹐ heats while stirring to 75 to 85 ℃; Open circulating filtration, the control time, at 15 to 25 minutes, operates thereby complete nickel plating.
In nickel plating step, control all the time pH value and be controlled at 4.5 ± 0.2, rising pH value is with the adjustment of ammoniacal liquor (28%) solution, reduces pH value with 10% sulfuric acid solution adjustment.
Above-mentioned reducing agent is inferior sodium phosphate, misfit agent, and stabilization agent, additive can be selected existing product on the market.
Step 6, plate palladium operation after the semi-finished product plate body 30 through nickel plating operation is cleaned, plate palladium layer on the nickel dam of semi-finished product plate body 30, the thickness of palladium layer is between 0.01 to 0.15 μ m.
The plating bath of liquid that plates palladium operation forms with operating condition.
The content of metal Pd is controlled at 0.8 to 1.2g/L, and temperature is controlled at 50 to 54 ℃, and reductant concentration is controlled at 1.5 to 10g/L, pH value is controlled at 7.3 to 7.9, electroplating time is controlled at 3 to 10 minutes, and it is 94 to 98% that metal Pd is separated out purity, and speed of separating out is 0.4 to 0.8 μ m/hr.
The concrete steps of plating palladium operation are that the 100L of take builds bath condition as example.
First in electroplating bath, add pure water 40L, then, 50L is plated to palladium stoste and join in electroplating bath, then add 2.5L palladium bulking liquor, confirm that pH value is 7.5 to 7.7, in the time of extraneous, add 10% sulfuric acid and 30% potassium hydroxide to adjust, last, with pure water, liquid measure is adjusted to 100L, liquid temperature is adjusted to 50 to 54 ℃, while stirring, slowly add reducing agent 300g, make it to dissolve completely, through 3 to 10 minutes, complete plating palladium and operate.
Step 7, after being cleaned, the semi-finished product plate body 30 through plating palladium operation carries out gold-plated operation, Gold plated Layer on the palladium layer of semi-finished product plate body 30, and the thickness of gold layer is between 0.03 to 0.05 μ m.
The plating bath of liquid that carries out gold-plated operation forms with operating condition.
The content of metallic gold is controlled at 1.5 to 2.5g/L, and temperature is controlled at 80 to 95 ℃, and pH value is controlled at 4.7 to 5.3, and speed of separating out is that 0.3 to 0.4 μ m/20 divides, and the time is controlled at 15 to 20 minutes,
The concrete steps of gold-plated operation are that the 100L of take builds bath condition as example.
First, 60L pure water is added to electroplating bath, then add 25L gold plating bath, 294g potassium auricyanide (Au metal 2g/L) is added in 5L temperature pure water, dissolve, then add in electroplating bath, with pure water, liquid measure is adjusted to 100L, confirm that pH value is whether in 4.7 to 5.3 scopes, if gone beyond the scope, use 20% potassium hydroxide solution to adjust, after pH adjusts, liquid temperature rises while arriving 90 ℃, can operate.
As shown in Figs. 7-9, a kind of Metal Palladium layer structure of printed circuit board (PCB) conductive layer, it comprises insulated substrate 100, circuit layer 200 and conductive layer 300.
This circuit layer 200 is arranged on this insulated substrate 100, and this circuit layer 200 forms the integrated circuit of printed circuit board (PCB).
Can be as required in concrete enforcement, in the upper surface of this insulated substrate 100 or lower surface one side, this circuit layer 200 is set, also can be simultaneously in the upper surface of this insulated substrate 100 and lower surface one side, this circuit layer 200. be set
This conductive layer 300 is arranged on this circuit layer 200.
One side of this circuit layer 200 is connected with this insulated substrate 100, and an other side of this circuit layer 200 is connected with this conductive layer 300.
By this conductive layer 300 and 100 pairs of these circuit layers 200 of this insulated substrate, wrap up.
By this conductive layer 300, comprise metal nickel dam 301, Metal Palladium layer 302 and metallic gold layer 303,
Wherein, this metal nickel dam 301 covers on this circuit layer 200, and this Metal Palladium layer 302 covers on this metal nickel dam 301, and metallic gold layer 303 covers on this Metal Palladium layer 302.
That is to say that these Metal Palladium layer 302 isolation are arranged between this metal nickel dam 301 and this metallic gold layer 303.
In concrete enforcement, the thickness of this Metal Palladium layer 302 is between 0.01 to 0.15 μ m, and the thickness of this metallic gold layer 303 is between 0.03 to 0.05 μ m.
In concrete enforcement, 200 of this circuit layers are arranged on a side of this insulated substrate 100, and this circuit layer 200 comprises copper foil layer 201 and top circuit layer 202, wherein, this copper foil layer 201 is arranged on this insulated substrate 100, and this top circuit layer 202 is arranged on this copper foil layer 201 tops.
This circuit layer 200 is arranged on upper surface and the lower surface of this insulated substrate 100 simultaneously, this circuit layer 200 comprises copper foil layer 201, heavy copper layer 203, coating 204 and top circuit layer 202, wherein, this copper foil layer 201 is arranged on this insulated substrate 100, this heavy copper layer 203 is arranged on this copper foil layer 201, this coating 204 is arranged on this heavy copper layer 203, and this top circuit layer 202 is arranged on this coating 204 tops.
Claims (7)
1. a method for Metal Palladium layer is set in the conductive layer of printed circuit board (PCB), it is characterized in that, comprise the steps:
The first step, insulated substrate is covered to copper, at the surface of this insulated substrate coating Copper Foil, forms copper-clad laminated board,
Second step, the copper-clad laminated board in the first step is carried out to baking sheet, copper-clad laminated board is placed in the environment of 160 ℃ to 190 ℃ of temperature and continues baking sheet 4 hours,
The 3rd step, to the copper-clad laminated board after baking sheet in second step, the operating process of carry out successively Drilling operation, the operation of heavy copper, making circuit, insulating barrier welding resistance obtains semi-finished product plate body,
The 4th step, the circuit pack of the semi-finished product plate body in the 3rd step is sunk to nickel, heavy palladium, turmeric operation successively, in order to improve the conductivity of semi-finished product plate body circuit pack, sink successively nickel, heavy palladium, turmeric operation, specifically production stage is:
Step 1, will semi-finished product plate body drop in cleaning slot and clean, the effect of this step is to remove semi-finished product plate body copper face slight oxidation thing and dirt, the air and the dirt that are adsorbed in copper face are arranged, reduce surface tension of liquid, reach moistening effect, the liquid of subsequent treatment is able to smoothly and copper face effect, use RCOOH to clean, the concentration of RCOOH is 80 to 120ml/L, and cleaning temperature is 40 to 50 ℃, processing time is controlled at 3 to 6 minutes
Step 2, semi-finished product plate body is taken out from cleaning slot, after cleaning with clear water, carry out micro-rotten processing, micro-rotten effect of processing is to remove copper face oxide, make the micro-alligatoring of copper face, make the electroless nickel layer in copper layer and subsequent step have good adherence, in carrying out micro-rotten process of processing, select the mixing material of sodium peroxydisulfate and CP sulfuric acid to carry out micro-corruption, the consumption of sodium peroxydisulfate is 80 to 120g/L, the consumption of CP sulfuric acid is 15 to 25ml/L, temperature is controlled at 20 to 30 ℃, processing time is controlled at 1 to 2 minute, copper face microetch amount is controlled at 20 to 40 μ m, when reaching 15g/l, micro-rotten liquid copper content need to upgrade micro-sanies,
Step 3, semi-finished product plate body is taken out from micro-sanies, after cleaning with clear water, carry out pickling processes, after pickling processes, carry out preimpregnation, wherein, the effect of pickling is the copper face oxide of removing after microetch, the effect of preimpregnation is to maintain the acidity in activated bath in step below, make copper face under oxide-free state, enter below activated bath in step, the concentration of controlling CP sulfuric acid when carrying out pickling processes is 40ml/L, processing time is controlled at 1 to 1.5 minute, the concentration of controlling hydrochloric acid when carrying out preimpregnation is 30ml/L, and the preimpregnation time is controlled at 1 to 2 minute
Step 4, through the semi-finished product plate body of preimpregnation, directly insert and in activated bath, carry out activation act, activation act is to carry out without the pre-treatment before electrolytic nickel at semi-finished product plate body, catalytic activation is carried out in copper surface, it specifically comprises replaces palladium and copper, make the complete copper surface that is adsorbed on of palladium active nucleus, by activation act, can make palladium catalysis core optionally be adsorbed on copper, allow and be plated in fully on copper surface without electrolytic nickel
Step 5, to carrying out nickel plating operation through the semi-finished product plate body of activation processing, nickel plating operation is that the semi-finished product plate body copper face after activation plates one deck nickel, as the layer that blocks that blocks migration between Jin Yutong, diffusion,
Step 6, plate palladium operation after the semi-finished product plate body through nickel plating operation is cleaned, on the nickel dam of semi-finished product plate body, plate palladium layer, the thickness of palladium layer between 0.01 to 0.15 μ m,
Step 7, after being cleaned, the semi-finished product plate body through plating palladium operation carries out gold-plated operation, Gold plated Layer on the palladium layer of semi-finished product plate body, and the thickness of gold layer is between 0.03 to 0.05 μ m.
2. a kind of method that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1, is characterized in that: in the first step, at the two sides of this insulated substrate coating Copper Foil, form copper-clad laminated board, and utilize acid solution to subtract copper operation.
3. a kind of method that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 2, it is characterized in that: in the 3rd step, concrete operation step is, first carry out Drilling operation, after Drilling operation, adopt chemical electroless plating copper mode to process and on Copper Foil, form the first coating, make both sides Copper Foil mutual conduction, to complete heavy copper operation, electrolytic copper plating processing is carried out in the surface of this first coating, on this first coating, form the second coating, for the second coating surface at copper-clad laminated board forms circuit, on this second coating, attach the dry film that contains emulsion, then, by optical treatment operation, expose and video picture, be formed for forming the dry film peristome of circuit, to forming the position of circuit, carry out electrolytic copper plating processing, form copper coating, by stripping process, remove this sensitization dry film of this copper coating periphery, thereby complete the operation of making circuit, obtain circuit, on this circuit, again attach the dry film that contains emulsion, again attach after dry film, in order to form external circuit on this circuit forming by optical treatment operation, through exposure and video picture operation, be formed for forming the etching protective film of external circuit, to by optical treatment operation, form for forming the Copper Foil beyond the etching protective film of external circuit, the first coating, the second coating carries out etching, form after external circuit, by stripping process, remove the Copper Foil of external circuit periphery, the first coating, the second coating, in order to ensure mutually insulated between etched circuit, carry out the printing process that PSR operation or polyimides are insulating material, need to carry out forming insulating barrier between surface treatment region circuit in addition.
4. a kind of method that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1, it is characterized in that: in the step 4 of the 4th step, in the process of carrying out activation act, utilize hydrochloric acid palladium and hydrochloric acid to make activating solution and carry out activation act, activation concrete steps are, first in treatment trough, put into 60% and build the water of bath amount, then according to the concentration of 20ml/l, add hydrochloric acid, according to the concentration of 100ml/l, add hydrochloric acid palladium afterwards, then add water to fixed capacity, and fully stir, heating makes fluid temperature to 20 to 30 ℃, process 2 to 5 minutes, to complete activation process.
5. a kind of method that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1, it is characterized in that: in the step 5 of the 4th step, when carrying out nickel plating operation, apply following composition, nickelous sulfate is in order to provide nickel ion, inferior sodium phosphate is in order to provide electronics, make nickel ion be reduced to metallic nickel, misfit agent is in order to form the wrong ion of nickel, reduce free nickel ion concentration, prevent that nickel hydroxide and phosphorous acid nickel from generating, increase and bathe stability, pH buffering, pH adjusting agent is in order to maintain pH value, stabilization agent reduces on colloidal particle or other particulate in order to prevent nickel, stablize plating solution, prevent that plating solution from decomposing, additive is in order to increase the negative potential on plated body surface, make to open and plate easily and increase reduction efficiency,
Nickel plating step is, first adds deionized water to cell body 2/3 position, then adds 18.75L/100L reducing agent, misfit agent, additive uniform stirring, and the percentage by weight of reducing agent, misfit agent, additive is 1:1:1; Then add 6.25L/100L nickelous sulfate uniform stirring it; After add again 200ml/100L additive uniform stirring; With deionized water adjustment tank liquid body, long-pending ﹐ heats while stirring to 75 to 85 ℃; Open circulating filtration, the control time is at 15 to 25 minutes, thereby completes nickel plating operation, controls all the time pH value and be controlled at 4.5 ± 0.2 in nickel plating step, and rising pH value is with 28% ammonia spirit adjustment, and reduction pH value is with 10% sulfuric acid solution adjustment.
6. a kind of method that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1, it is characterized in that: in the step 6 of the 4th step, the plating bath of liquid that plates palladium operation forms with operating condition, the content of metal Pd is controlled at 0.8 to 1.2g/L, temperature is controlled at 50 to 54 ℃, reductant concentration is controlled at 1.5 to 10g/L, pH value is controlled at 7.3 to 7.9, electroplating time is controlled at 3 to 10 minutes, it is 94 to 98% that metal Pd is separated out purity, speed of separating out is 0.4 to 0.8 μ m/hr
The concrete steps of plating palladium operation are, the 100L of take builds bath condition as example, first in electroplating bath, add pure water 40L, then, 50L is plated to palladium stoste to be joined in electroplating bath, add again 2.5L palladium bulking liquor, confirm that pH value is 7.5 to 7.7, in the time of extraneous, add 10% sulfuric acid and 30% potassium hydroxide to adjust, last, with pure water, liquid measure is adjusted to 100L, liquid temperature is adjusted to 50 to 54 ℃, while stirring, slowly add reducing agent 300g, make it to dissolve completely, through 3 to 10 minutes, complete plating palladium and operate.
7. a kind of method that Metal Palladium layer is set in the conductive layer of printed circuit board (PCB) as claimed in claim 1, it is characterized in that: in the step 7 of the 4th step, the plating bath of liquid that carries out gold-plated operation forms with operating condition, the content of metallic gold is controlled at 1.5 to 2.5g/L, temperature is controlled at 80 to 95 ℃, and pH value is controlled at 4.7 to 5.3, and speed of separating out is that 0.3 to 0.4 μ m/20 divides, time is controlled at 15 to 20 minutes
The concrete steps of gold-plated operation are that the 100L of take builds bath condition as example, first, 60L pure water is added to electroplating bath, then add 25L gold plating bath, 294g potassium auricyanide is added in 5L temperature pure water, dissolve, then add in electroplating bath, with pure water, liquid measure is adjusted to 100L, confirm that pH value is whether in 4.7 to 5.3 scopes, if gone beyond the scope, use 20% potassium hydroxide solution to adjust, after pH adjusts, liquid temperature rises while arriving 90 ℃, can operate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210332993.3A CN102802364B (en) | 2012-09-11 | 2012-09-11 | Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210332993.3A CN102802364B (en) | 2012-09-11 | 2012-09-11 | Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102802364A CN102802364A (en) | 2012-11-28 |
| CN102802364B true CN102802364B (en) | 2014-11-05 |
Family
ID=47201291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210332993.3A Active CN102802364B (en) | 2012-09-11 | 2012-09-11 | Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102802364B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103052278A (en) * | 2012-12-27 | 2013-04-17 | 建滔（连州）铜箔有限公司 | Additive for roughening surface of copper foil |
| CN104066273A (en) * | 2013-03-20 | 2014-09-24 | 深南电路有限公司 | Package substrate and manufacturing method thereof, and substrate assembly |
| CN104080274B (en) * | 2013-03-29 | 2016-12-28 | 深南电路有限公司 | A kind of base plate for packaging and preparation method thereof and board unit |
| CN104135825A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Copper reduction process for printed circuit board |
| CN104684266B (en) * | 2015-02-04 | 2018-03-09 | 江门崇达电路技术有限公司 | A kind of preparation method of the mute golden circuit of wiring board |
| CN106435677A (en) * | 2016-11-29 | 2017-02-22 | 延康汽车零部件如皋有限公司 | Electroplating pretreatment technology for components of automobiles |
| CN106793514A (en) * | 2016-12-28 | 2017-05-31 | 东莞联桥电子有限公司 | A kind of preparation method of PCB |
| CN109429442B (en) * | 2017-08-31 | 2020-09-22 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN108513461A (en) * | 2018-04-28 | 2018-09-07 | 珠海智锐科技有限公司 | A kind of FPC plates manufacture craft |
| CN109152234A (en) * | 2018-09-04 | 2019-01-04 | 江门市奔力达电路有限公司 | A kind of turmeric processing method for saving gold |
| CN109661121B (en) * | 2018-12-28 | 2020-10-27 | 广东东硕科技有限公司 | Method for chemically plating metal on copper substrate and printed circuit board and wafer prepared by method |
| JP7431227B2 (en) * | 2019-05-15 | 2024-02-14 | 住友電気工業株式会社 | printed wiring board |
| CN110602889A (en) * | 2019-10-21 | 2019-12-20 | 深圳市中基自动化有限公司 | Contact circuit board process for lithium battery formation |
| CN110565128A (en) * | 2019-10-21 | 2019-12-13 | 深圳市正基电子有限公司 | Treatment method for uniformity of electroplated copper on surface of IC packaging substrate |
| CN110809364A (en) * | 2019-11-15 | 2020-02-18 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method and PCB |
| CN112251783B (en) * | 2020-10-31 | 2022-12-09 | 新恒汇电子股份有限公司 | Process for electroplating in welding hole of smart card module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| CN101151399A (en) * | 2005-04-01 | 2008-03-26 | 日矿金属株式会社 | Plated base material |
| CN101469420A (en) * | 2007-04-16 | 2009-07-01 | 上村工业株式会社 | Electroless gold-plating method and electronic component |
| CN202857129U (en) * | 2012-09-11 | 2013-04-03 | 岳长来 | Structure of metal palladium layer in conducting layer of printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI251920B (en) * | 2003-10-17 | 2006-03-21 | Phoenix Prec Technology Corp | Circuit barrier structure of semiconductor package substrate and method for fabricating the same |
-
2012
- 2012-09-11 CN CN201210332993.3A patent/CN102802364B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| CN101151399A (en) * | 2005-04-01 | 2008-03-26 | 日矿金属株式会社 | Plated base material |
| CN101469420A (en) * | 2007-04-16 | 2009-07-01 | 上村工业株式会社 | Electroless gold-plating method and electronic component |
| CN202857129U (en) * | 2012-09-11 | 2013-04-03 | 岳长来 | Structure of metal palladium layer in conducting layer of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102802364A (en) | 2012-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102802364B (en) | Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof | |
| CN102576693B (en) | Substrate for mounting semiconductor chip and method for producing same | |
| TW525418B (en) | Process for producing printed wiring board | |
| WO2009132581A1 (en) | Method for manufacturing an electro nickel and gold printed circuit board | |
| CN103384448A (en) | Printed circuit board and method for processing surface of printed circuit board | |
| CN202857129U (en) | Structure of metal palladium layer in conducting layer of printed circuit board | |
| US20140076618A1 (en) | Method of forming gold thin film and printed circuit board | |
| CN101965106B (en) | Manufacturing method for printed wiring board | |
| JP2022120813A (en) | Ultrathin copper foil, and method of producing the same | |
| JP2010062517A (en) | Nickel-gold plating method and printed circuit board | |
| US9510446B2 (en) | Printed circuit board and manufacture method thereof | |
| CN101922001B (en) | Method for manufacturing printed circuit board by power triggering electroless plating addition process | |
| CN105489504B (en) | A kind of production method of package substrate | |
| CN104470236A (en) | Post-immersing liquid of circuit board electroless nickel immersion gold and post-immersing method | |
| JP6020070B2 (en) | Covering body and electronic component | |
| JP2013093359A (en) | Semiconductor chip mounting substrate and manufacturing method therefor | |
| CN114190012B (en) | Manufacturing method of chip carrier plate and chip carrier plate | |
| KR101124784B1 (en) | core substrate and method for fabricating the same | |
| KR101034089B1 (en) | core substrate and method for fabricating the same | |
| CN103238204A (en) | Electrolytic gold or gold palladium surface finish application in coreless substrate processing | |
| KR20120031726A (en) | Silver plating solution, printed circuit board and method for manufacturing the same | |
| KR20120048983A (en) | Method for fabricating printed circuit board | |
| JP2008075146A (en) | METHOD FOR PRODUCING Ni THIN FILM | |
| CN112804821A (en) | Selective electrogilding process for PCB (printed circuit board) | |
| KR20140075843A (en) | Gold plating method using Nano Polymer with conductivity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN HEMEIJINGYI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: YUE CHANGLAI Effective date: 20140922 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20140922 Address after: Longgang District of Shenzhen City, Guangdong province 518000 Ping Street Nianfeng community third industrial zone thirteenth A Applicant after: Shenzhen Hemeijingyi Technology Co., Ltd. Address before: Longgang District of Shenzhen City, Guangdong province 518000 Po Ping Street Quartet cattle Mianling Jinniu Industrial Zone Applicant before: Yue Changlai |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 2 / F, No.26, niumianling new village, sifangpu community, Pingdi street, Longgang District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Hemei Jingyi Semiconductor Technology Co.,Ltd. Address before: 518000 a, building 13, No.3 Industrial Zone, Nianfeng community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HEMEI JINGYI TECHNOLOGY Co.,Ltd. |