CN110126528A - A kind of embossed technology of Pen nib - Google Patents
A kind of embossed technology of Pen nib Download PDFInfo
- Publication number
- CN110126528A CN110126528A CN201910481163.9A CN201910481163A CN110126528A CN 110126528 A CN110126528 A CN 110126528A CN 201910481163 A CN201910481163 A CN 201910481163A CN 110126528 A CN110126528 A CN 110126528A
- Authority
- CN
- China
- Prior art keywords
- pen nib
- water
- washing
- pen
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
Abstract
The invention discloses a kind of embossed technologies of Pen nib, include the following steps, S1, pretreatment: being removed oxide layer and uniform surface to Pen nib and handle, and Pen nib plates ground and gold-plated, then to Pen nib crack and pen tip at sealing pores are carried out using hole sealing agent, S2, secondary pretreatment is passivated processing to the Pen nib of electroplating processes to pen tip passivation, and the Pen nib after Passivation Treatment is dried goes removing oxide layer and uniform surface to handle with secondary.The present invention by plating, coating film treatment, water plates and coating film treatment technique again, finally by radium-shine embossing, composite plating and water plate multilayered structure, structure superposition is formed on metal layer, it is radium-shine to will form multistage patterned structure, it not will cause the loss of surface strength, it is radium-shine two or more layers plating bits top layer but to injure electroplated layer on the same surface, it can be in the compound pattern and structure for plating out two or more colors on the same surface.
Description
Technical field
The present invention relates to pen production technical field more particularly to a kind of embossed technologies of Pen nib.
Background technique
Pen is the writing implement that people generally use, and invention is in 19 beginnings of the century.Nib is made of metal, and writes circle
It is sliding and flexible, it is quite smooth.At pen cap mouth or nib surfaces, there are apparent trade mark, model.Wherein Pen nib
The part that can be described as the most critical of pen, from carefully to thick, various change has, the general most common Pen nib size is with " B
(Broad is thick), M (thick in Medium), FM (thin in Fine-Medium), F (Fine is thin) and EF (Extra-Fine is special thin) "
Based on, it is B > M > F > EF from thick to thin, can also there be a little difference in the every Jia Bi factory of nib size in specification.
Existing factory can be embossed some information, such as brand, nameplate and model etc. on pen tip, but commonly punching press meeting
So that whole pen tip intensity is affected, other ink printing etc. is easily corroded by ink when using for a long time, and punching press and
The glossiness and aesthetics of printing effect are not most preferably, when embossed technology is used on pen tip, it is also possible to crack to pen tip
It is impacted with nib, influences whole writing.
Summary of the invention
Technical problems based on background technology, the invention proposes a kind of embossed technologies of Pen nib.
A kind of embossed technology of Pen nib proposed by the present invention, comprising the following steps:
S1: pretreatment: oxide layer is removed to Pen nib and uniform surface is handled, Pen nib plates ground and plating
Gold, then to Pen nib crack and pen tip at using hole sealing agent carry out sealing pores；
S2: secondary pretreatment: processing is passivated to the Pen nib of electroplating processes to pen tip passivation, by Passivation Treatment
Pen nib afterwards is dried goes removing oxide layer and uniform surface to handle with secondary；
S3: water plates process: carrying out water plating to secondary pretreated pen tip, cracking for Pen nib is connected with at pen tip
Gum cover carry out water plating, formed multilayered structure, the structure superposition of metal layer, carry out it is subsequent it is radium-shine in, will form multistage embossing
Structure, while the stability of laser molding can be improved, it not will cause the loss of surface strength；
S4: it pre-processes three times: after removal gum cover, repetitive operation being carried out to the step in S2；
S5: radium-shine embossed pattern: laser molding is carried out to the metal cladding of Pen nib, the product that molding is completed is carried out
Rewinding, discharge in mold process film carry heat and film temperature distortion caused by tension it is uneven, prevent film from becoming
Shape, protection laser pattern are injury-free.
S6: it molded surface processing: tests to Pen nib, wire drawing, spray painting, product inspection.
Preferably, removing oxide layer and uniform surface processing and secondary pretreatment are gone, is pre-processed three times in the pretreatment
In secondary to go removing oxide layer and uniform surface to handle include three step of polishing, degreasing and acid-wash activation to metal surface.
Preferably, the water plating process in the S3 is specially upper extension → oil removing → washing 2 times → hydrophilic → roughening 1 → roughening
2 → recycling → washing, 3 times → neutralization → washing, 2 times → preimpregnation → catalysis → washing 3 times → 2 times → chemical nickel of activation → washing →
Washing 2 times → activation → washing, 2 coke-plated coppers → recycling → washing 2 times → activation → light-plated copper water washes 3 times → microetch → washing 2
Secondary → light-plated nickel → recycling → washing 2 times → activation → light-plated copper _ 3 times → microetch of washing washing 2 times → light-plated nickel washing 3 times →
Baking thousand → lower extension → water plating molding that light-plated chromium is washed 4 times → playing sound wave washing → washing pure water to wash 2 times →.
Preferably, it needs just to complete a water plating by about more than 40 times cylinder soaking cycles in the water plating process in the S3
Process, and the specification of runner and mouth of a river design needs and water plating element is adapted during water plating.
Preferably, Pen nib progress hanger is fixed in the water plating requirements of process in the water plating process in the S3, and steel
Pen tip needs hanger plate is fixed to carry out auxiliary water plating.
Preferably, it needs just to complete a water plating by about more than 40 times cylinder soaking cycles in the water plating process in the S3
Process, and the specification of runner and mouth of a river design needs and water plating element is adapted during water plating.
Having the beneficial effect that in the present invention
1. the embossed technology of Pen nib is by plating, coating film treatment, water plates and coating film treatment again, finally by radium-shine
Embossing, by radium-shine processing again after the progress multicoating on pen tip, laser pattern can be more stable, and composite plating and water
The multilayered structure of plating, forms structure superposition on metal layer, it is subsequent it is radium-shine in will form multistage patterned structure, while radium can be improved
The stability of molding is penetrated, not will cause the loss of surface strength.
2. the embossed technology of Pen nib double or multiple plating can consider Radium art to be worth doing on same workpiece, radium can be used
The method penetrated two or more layers plating bits top layer on the same surface of handware does not injure the technique of protocol layer plating bits but,
Technique greatly improves electroplating efficiency, can in the compound pattern and structure for plating out two or more colors on the same surface,
It is more abundant and intuitive in expressing information.
Detailed description of the invention
Fig. 1 is a kind of embossing flow chart of the embossed technology of Pen nib proposed by the present invention；
Fig. 2 is a kind of water coating apparatus structural schematic diagram of the embossed technology of Pen nib proposed by the present invention；
Fig. 3 is a kind of pen tip gum cover interface arrangment schematic diagram of the embossed technology of Pen nib proposed by the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only the present invention → section Example, instead of all the embodiments.
Referring to Fig.1-3, a kind of embossed technology of Pen nib, comprising the following steps:
S1: pretreatment: oxide layer is removed to Pen nib and uniform surface is handled, Pen nib plates ground and plating
Gold, then to Pen nib crack and pen tip at using hole sealing agent carry out sealing pores；
S2: secondary pretreatment: processing is passivated to the Pen nib of electroplating processes to pen tip passivation, by Passivation Treatment
Pen nib afterwards is dried goes removing oxide layer and uniform surface to handle with secondary；
S3: water plates process: carrying out water plating to secondary pretreated pen tip, cracking for Pen nib is connected with at pen tip
Gum cover carry out water plating, formed multilayered structure, the structure superposition of metal layer, carry out it is subsequent it is radium-shine in, will form multistage embossing
Structure, while the stability of laser molding can be improved, it not will cause the loss of surface strength；
S4: it pre-processes three times: after removal gum cover, repetitive operation being carried out to the step in S2；
S5: radium-shine embossed pattern: laser molding is carried out to the metal cladding of Pen nib, the product that molding is completed is carried out
Rewinding, discharge in mold process film carry heat and film temperature distortion caused by tension it is uneven, prevent film from becoming
Shape, protection laser pattern are injury-free.
S6: it molded surface processing: tests to Pen nib, wire drawing, spray painting, product inspection.
In the present invention, in pretreatment go removing oxide layer and uniform surface handle and secondary pretreatment, three times in pretreatment
Secondary to go removing oxide layer and uniform surface to handle include three step of polishing, degreasing and acid-wash activation to metal surface, S3
In water plating process be specially upper extension → oil removing → washing 2 times → hydrophilic → roughening 1 → roughening 2 → recycling → washing 3 times → in
With → washing 2 times → preimpregnation → catalysis → washing 3 times → activation → washing 2 times → chemical nickel → washing 2 times → activation → washing 2
Secondary coke-plated copper → recycling → washing 2 times → activation → light-plated copper water washes 3 times → microetch → washing, 2 times → light-plated nickel → recycling → water
It washes 2 times → activation → light-plated copper _ 3 times → microetch of washing washing 2 times → light-plated nickel washing 3 times → light-plated chromium is washed 4 times → and plays sound
Wave washing → washing plays pure water and washes 2 times → baking thousand → lower extension → water plating molding, needs in the water plating process in S3 by more than 40 times
Cylinder soaking cycle just completes a water plating process up and down, and plates element to runner and mouth of a river design needs and water during water plating
Specification is adapted, and Pen nib progress hanger is fixed in the water plating requirements of process in water plating process in S3, and Pen nib needs
It wants hanger plate is fixed to carry out auxiliary water plating, needs just to complete one by about more than 40 times cylinder soaking cycles in the water plating process in S3
Secondary water plates process, and is adapted during water plating to the specification of runner and mouth of a river design needs and water plating element, and degreasing includes heat
Leaching degreasing, ultrasonic degreasing and electric degreasing it is any or it is multiple combine, electroplating processes successively carry out semi-gloss nickel to metal surface
8min, full light nickel 13min, microporous nickel 2min need to handle with coloring, Anti- tarnishing and sealing of hole to metal in progress before upper extension
Surface hang on thick embryo, and carries out just section with this and be electrolysed 13-16 minutes, and ultrasonication 7-9 minutes, acid was electrolysed 50-53s,
Alkali soak 7-10min, acid activation 20-28 seconds.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of embossed technology of Pen nib, which comprises the following steps:
S1: pretreatment: being removed oxide layer and uniform surface to Pen nib and handle, and Pen nib plates ground and gold-plated, then
To Pen nib crack and pen tip at using hole sealing agent carry out sealing pores；
S2: secondary pretreatment: processing is passivated to the Pen nib of electroplating processes to pen tip passivation, after Passivation Treatment
Pen nib is dried goes removing oxide layer and uniform surface to handle with secondary；
S3: water plates process: carrying out water plating to secondary pretreated pen tip, Pen nib cracks and is connected with gum cover at pen tip
Carry out water plating, formed multilayered structure, the structure superposition of metal layer, carry out it is subsequent it is radium-shine in, will form multistage patterned structure,
The stability that laser molding can be improved simultaneously, not will cause the loss of surface strength；
S4: it pre-processes three times: after removal gum cover, repetitive operation being carried out to the step in S2；
S5: radium-shine embossed pattern: laser molding is carried out to the metal cladding of Pen nib, the product completed to molding is answered
It rolls up, tension caused by the release heat that film carries in mold process and film temperature distortion is uneven, deformation of thin membrane is prevented,
Protect laser pattern injury-free.
S6: it molded surface processing: tests to Pen nib, wire drawing, spray painting, product inspection.
2. a kind of embossed technology of Pen nib according to claim 1, which is characterized in that the removal in the pretreatment
It is equal that oxide layer and uniform surface processing and secondary pretreatment, three times secondary in pretreatment go removing oxide layer and uniform surface to handle
Including three step of polishing, degreasing and acid-wash activation to metal surface.
3. a kind of embossed technology of Pen nib according to claim 1, which is characterized in that the water in the S3 plates process
Specially upper extension → oil removing → washing 2 times → hydrophilic → roughening 1 → roughening 2 → recycling → washing, 3 times → neutralization → washing 2 times →
Preimpregnation → catalysis → washing 3 times → activation → washing 2 times → chemical nickel → washing 2 times → the coke-plated copper of activation → washing 2 times → return
2 times → activation of receipts → washing → light-plated copper water washes 3 times → microetch → washing, 2 times → light-plated nickel → recycling → washing 2 times → activation
→ light-plated copper _ 3 times → microetch of washing washing 2 times → light-plated nickel washing 3 times → light-plated chromium is washed 4 times → plays sound wave washing → washing
It plays pure water and washes 2 times → baking thousand → lower extension → water plating molding.
4. a kind of embossed technology of Pen nib according to claim 1, which is characterized in that the water in the S3 plates process
In need to just complete water by about more than 40 times cylinder soaking cycles and plate process, and water plate during to runner and mouth of a river design
The specification for plating element with water is needed to be adapted.
5. a kind of embossed technology of Pen nib according to claim 1, which is characterized in that the water in the S3 plates process
In water plating requirements of process Pen nib progress hanger is fixed, and Pen nib needs hanger plate is fixed to carry out auxiliary water plating.
6. a kind of embossed technology of Pen nib according to claim 1, which is characterized in that the water in the S3 plates process
In need to just complete water by about more than 40 times cylinder soaking cycles and plate process, and water plate during to runner and mouth of a river design
The specification for plating element with water is needed to be adapted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910481163.9A CN110126528A (en) | 2019-06-04 | 2019-06-04 | A kind of embossed technology of Pen nib |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910481163.9A CN110126528A (en) | 2019-06-04 | 2019-06-04 | A kind of embossed technology of Pen nib |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110126528A true CN110126528A (en) | 2019-08-16 |
Family
ID=67579973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910481163.9A Pending CN110126528A (en) | 2019-06-04 | 2019-06-04 | A kind of embossed technology of Pen nib |
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| Country | Link |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873053A (en) * | 2005-05-31 | 2006-12-06 | 李樟弟 | Technique for plating nickel and phosphor under acidity for lead brass stylus |
| CN105177655A (en) * | 2015-08-20 | 2015-12-23 | 深圳市港鸿信电子有限公司 | Transparent acrylonitrile butadiene styrene (ABS) hydroelectric plating production process method |
| CN105695964A (en) * | 2014-11-28 | 2016-06-22 | 重庆基石机械有限公司 | Copper deposition process |
| JP6039844B1 (en) * | 2016-03-15 | 2016-12-07 | 名古屋メッキ工業株式会社 | Plating decoration, writing instrument, and method of manufacturing plating decoration |
| CN107904632A (en) * | 2017-04-24 | 2018-04-13 | 张碧海 | A kind of electroplating technology and its electroplating device |
| CN108360031A (en) * | 2018-03-12 | 2018-08-03 | 东莞市亿丰钟表有限公司 | Radium art is considered in double or multiple plating to be worth doing on a kind of same workpiece |
| CN208151505U (en) * | 2018-05-03 | 2018-11-27 | 京信通信系统（中国）有限公司 | Protective device is electroplated |
-
2019
- 2019-06-04 CN CN201910481163.9A patent/CN110126528A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873053A (en) * | 2005-05-31 | 2006-12-06 | 李樟弟 | Technique for plating nickel and phosphor under acidity for lead brass stylus |
| CN105695964A (en) * | 2014-11-28 | 2016-06-22 | 重庆基石机械有限公司 | Copper deposition process |
| CN105177655A (en) * | 2015-08-20 | 2015-12-23 | 深圳市港鸿信电子有限公司 | Transparent acrylonitrile butadiene styrene (ABS) hydroelectric plating production process method |
| JP6039844B1 (en) * | 2016-03-15 | 2016-12-07 | 名古屋メッキ工業株式会社 | Plating decoration, writing instrument, and method of manufacturing plating decoration |
| CN107904632A (en) * | 2017-04-24 | 2018-04-13 | 张碧海 | A kind of electroplating technology and its electroplating device |
| CN108360031A (en) * | 2018-03-12 | 2018-08-03 | 东莞市亿丰钟表有限公司 | Radium art is considered in double or multiple plating to be worth doing on a kind of same workpiece |
| CN208151505U (en) * | 2018-05-03 | 2018-11-27 | 京信通信系统（中国）有限公司 | Protective device is electroplated |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190816 |
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| RJ01 | Rejection of invention patent application after publication |