CN105734571A - Metal surface micro-etching liquid - Google Patents
Metal surface micro-etching liquid Download PDFInfo
- Publication number
- CN105734571A CN105734571A CN201610256157.XA CN201610256157A CN105734571A CN 105734571 A CN105734571 A CN 105734571A CN 201610256157 A CN201610256157 A CN 201610256157A CN 105734571 A CN105734571 A CN 105734571A
- Authority
- CN
- China
- Prior art keywords
- metal surface
- micro
- corrosion liquid
- etching liquid
- hydrogen peroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses metal surface micro-etching liquid and belongs to the technical field of chemical engineering micro-etching liquid. The metal surface micro-etching liquid is prepared from, by mass, 15-25% of dilute sulphuric acid with the mass fraction being 50%, 10-15% of hydrogen peroxide, 2-5% of a stabilizing agent, 0.5-1% of surfactant, 0.2% of an anti-mildew agent and the balance water. The metal surface micro-etching liquid has a quite remarkable effect on solder resist preprocessing and surface chemical treatment of a printed circuit board, the copper face of the circuit board has uniform roughness and cleanness, the binding force between the copper face and an image layer and a pasted film is increased, toxicity is low, pollution is small, use is convenient, metal surface oxide can be fast processed, and metal surface cleanness is improved. The micro-etching liquid product is wide in application range and mainly used for metal surface oxide removing preprocessing and metal coloring preprocessing. The metal surface micro-etching liquid can also be used for super roughening, oxide removing processing, machining, metal deep machining, spraying and other the metallurgical industries of electronic circuit board copper faces.
Description
Technical field
The present invention relates to chemical industry micro-corrosion liquid technical field, particularly relate to a kind of metal surface microetch
Liquid.
Background technology
The simple hydrogen peroxide of metal current surface micro etching liquid employing, the mixing of the timely imidazoles of sulphuric acid
Thing, and PCB industry uses scratch brushing method to carry out at present, i.e. will carry out printing resistance
The plate of layer passes through pickling, nog plate deoxygenation compound, and polish-brush is that the thickness according to different plates grinds brush
Degree of tightness, reaches better quality.Adjusted once every two hours, complex operation, easily make
In pairs microetch workpiece ruggedness, less stable, it is uneven to sting erosion metal covering roughness, easily scrapes
Hindering base material, difficulty is removed oxidation on metal surface thing and is affected the combination of surface of the work and other material
Power.
Summary of the invention
It is an object of the invention to for the deficiencies in the prior art, and a kind of metal (copper metal is provided
Best) micro-corrosion liquid.
Another object of the present invention is to provide a kind of welding resistance pretreatment roughening micro-corrosion liquid, slightly loses
Corrosion copper face, makes copper face reach micro-rough effect, strengthens adhesion between copper face and heavy layers of copper.
Mainly use mineral acid, peroxide agent and some environment-friendly active agent, anti-microbial inoculum.
For achieving the above object, the present invention adopts the following technical scheme that:
The metal surface micro-corrosion liquid of the present invention is made up of the raw material of following mass percent: quality
Mark be 50% dilute sulfuric acid 15-25%, hydrogen peroxide 10-15%, stabilizer 2-5%, surface
Activating agent 0.5-1%, anti-microbial inoculum 0.2%, water surplus.
As preferred technical scheme: the metal surface micro-corrosion liquid of the present invention is by following quality hundred
The raw material composition of proportion by subtraction: mass fraction is the dilute sulfuric acid 20% of 50%, hydrogen peroxide 13%, steady
Determine agent 4%, surfactant 0.8%, anti-microbial inoculum 0.2%, water 62%.
The mass concentration of described hydrogen peroxide is 50%.
Described stabilizer is inorganic ammonia stabilizer.
Described surfactant is polyoxydivinyl ether or fatty glyceride.
Described anti-microbial inoculum is sodium benzoate or multi-chlorophenol sodium.
The preparation method of the metal surface micro-corrosion liquid of the present invention specifically comprise the following steps that first, press
Formula weighs various raw material；The most now add water in material-compound tank；It is slow added into dilute sulfuric acid,
After solution temperature is down to room temperature, be sequentially added into the most in order stabilizer, surfactant,
Hydrogen peroxide, anti-microbial inoculum, stir, and filters, detection fill warehouse-in.The metal prepared
The proportion of surface micro etching liquid finished product is at 1.20-1.30；Wherein the volumetric concentration of hydrogen peroxide is
10-15%；The mass concentration of sulphuric acid is 15-25%.
The using method of the metal surface micro-corrosion liquid of the present invention is as follows: used by metal surface micro-corrosion liquid
Tap water or pure water by volume concentration 10-15% is diluted, and then puts the workpiece in dilution
After solution in, soak at room temperature or spray 40 seconds to 60 seconds after, with from the beginning flushing dry up i.e.
Can.
The positive effect of the present invention is as follows:
The metal surface micro-corrosion liquid of the present invention is to printed circuit board (PCB) welding resistance pre-treatment and surface chemistry
Treatment effect is very notable, makes circuit board copper surface reach uniform roughness and cleanliness factor increases copper
Face and figure layer and the adhesion of pad pasting, have toxicity low, pollutes few, easy to use, can be quickly
Process oxidation on metal surface thing, and improve metal surface cleannes.
The micro-corrosion liquid product purpose of the present invention is relatively wide, locates before being mainly used in metal surface deoxygenation compound
Reason, metal coloring pre-treatment.Can also be used for the super roughening of electronic circuit board copper face, except oxidation processes,
The metallurgical industry such as machining, metal deep processing, spraying.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of untreated metal copper plate.
Fig. 2 is traditional polishing, sandblast process after by the schematic diagram of the copper face under 100 power microscopes.
Fig. 3 is by the signal of the copper face under 100 power microscopes after other micro-etching agent of market processes
Figure.
Fig. 4 is by the schematic diagram of the copper face under 100 power microscopes after the micro-corrosion liquid of the present invention processes.
Detailed description of the invention
The following examples are that the present invention is described in further detail.
Embodiment 1
The metal surface micro-corrosion liquid of the present invention is made up of the raw material of following mass percent: quality
Mark be 50% dilute sulfuric acid 15%, hydrogen peroxide 15%, stabilizer 2%, surfactant 1%,
Anti-microbial inoculum 0.2%, water 66.8%.
The mass concentration of described hydrogen peroxide is 50%.
Described stabilizer is inorganic ammonia stabilizer.
Described surfactant is polyoxydivinyl ether.
Described anti-microbial inoculum is sodium benzoate.
The preparation method of the metal surface micro-corrosion liquid of the present invention specifically comprise the following steps that first, press
Formula weighs various raw material；The most now add water in material-compound tank；It is slow added into dilute sulfuric acid,
After solution temperature is down to room temperature, be sequentially added into the most in order stabilizer, surfactant,
Hydrogen peroxide, anti-microbial inoculum, stir, and filters, the proportion of detection metal surface micro-corrosion liquid finished product
At 1.20-1.30；Wherein the volumetric concentration of hydrogen peroxide is 10-15%；The mass concentration of sulphuric acid is
15-25%, side is qualified, can fill warehouse-in.
Hydrogen peroxide measuring method: draw sample liquid 1ml and put in clean 250ml triangular flask, add pure
Water purification 150ml, adds 20% sulfuric acid solution and shakes up, using 0.5mol/LKMnO4It is titrated to colourless
For terminal and record and determine scale.
Computational methods: volume × 17.01/ sample volume ÷ 1000 × 100%.
Sulphuric acid measuring method: weigh sample liquid 0.5000g and put in clean 250ml triangular flask, adds
Pure water 150ml, drips three methyl oranges, be titrated to 0.1mol/LNaOH faint yellow be
Terminal also records and determines scale.
Computational methods: (molar concentration × 49.01 molal weight of titration volumes × NaOH)/sample weight
÷ 1000 × 100%.
The using method of the metal surface micro-corrosion liquid of the present invention is as follows: used by metal surface micro-corrosion liquid
Tap water or pure water by volume concentration 10-15% is diluted, and then puts the workpiece in dilution
After solution in, soak at room temperature or spray 40 seconds to 60 seconds after, with from the beginning flushing dry up i.e.
Can.
Embodiment 2
The metal surface micro-corrosion liquid of the present invention is made up of the raw material of following mass percent: quality
Mark be 50% dilute sulfuric acid 25%, hydrogen peroxide 10%, stabilizer 5%, surfactant 0.5%,
Anti-microbial inoculum 0.2%, water 59.3%.
The mass concentration of described hydrogen peroxide is 50%.
Described stabilizer is inorganic ammonia stabilizer.
Described surfactant is fatty glyceride.
Described anti-microbial inoculum is multi-chlorophenol sodium.
The preparation method of the metal surface micro-corrosion liquid of the present invention specifically comprise the following steps that first, press
Formula weighs various raw material；The most now add water in material-compound tank；It is slow added into dilute sulfuric acid,
After solution temperature is down to room temperature, be sequentially added into the most in order stabilizer, surfactant,
Hydrogen peroxide, anti-microbial inoculum, stir, and filters, the proportion of detection metal surface micro-corrosion liquid finished product
At 1.20-1.30；Wherein the volumetric concentration of hydrogen peroxide is 10-15%；The mass concentration of sulphuric acid is
15-25%, side is qualified, can fill warehouse-in.
Hydrogen peroxide measuring method: draw sample liquid 1ml and put in clean 250ml triangular flask, add pure
Water purification 150ml, adds 20% sulfuric acid solution and shakes up, using 0.5mol/LKMnO4It is titrated to colourless
For terminal and record and determine scale.
Computational methods: volume × 17.01/ sample volume ÷ 1000 × 100%.
Sulphuric acid measuring method: weigh sample liquid 0.5000g and put in clean 250ml triangular flask, adds
Pure water 150ml, drips three methyl oranges, be titrated to 0.1mol/LNaOH faint yellow be
Terminal also records and determines scale.
Computational methods: (molar concentration × 49.01 molal weight of titration volumes × NaOH)/sample weight
÷ 1000 × 100%.
The using method of the metal surface micro-corrosion liquid of the present invention is as follows: used by metal surface micro-corrosion liquid
Tap water or pure water by volume concentration 10-15% is diluted, and then puts the workpiece in dilution
After solution in, soak at room temperature or spray 40 seconds to 60 seconds after, with tap water rinse dry up
?.
Embodiment 3
The metal surface micro-corrosion liquid of the present invention is made up of the raw material of following mass percent: quality
Mark be 50% dilute sulfuric acid 20%, hydrogen peroxide 13%, stabilizer 4%, surfactant 0.8%,
Anti-microbial inoculum 0.2%, water 62%.
The mass concentration of described hydrogen peroxide is 50%.
Described stabilizer is inorganic ammonia stabilizer.
Described surfactant is polyoxydivinyl ether.
Described anti-microbial inoculum is multi-chlorophenol sodium.
The preparation method of the metal surface micro-corrosion liquid of the present invention specifically comprise the following steps that first, press
Formula weighs various raw material；The most now add water in material-compound tank；It is slow added into dilute sulfuric acid,
After solution temperature is down to room temperature, be sequentially added into the most in order stabilizer, surfactant,
Hydrogen peroxide, anti-microbial inoculum, stir, and filters, the proportion of detection metal surface micro-corrosion liquid finished product
At 1.20-1.30；Wherein the volumetric concentration of hydrogen peroxide is 10-15%；The mass concentration of sulphuric acid is
15-25%, side is qualified, can fill warehouse-in.
Hydrogen peroxide measuring method: draw sample liquid 1ml and put in clean 250ml triangular flask, add pure
Water purification 150ml, adds 20% sulfuric acid solution and shakes up, using 0.5mol/LKMnO4It is titrated to pale red
Color is terminal and records and determine scale.
Computational methods: volume × 17.01/ sample volume ÷ 1000 × 100%.
Sulphuric acid measuring method: weigh sample liquid 0.5000g and put in clean 250ml triangular flask, adds
Pure water 150ml, drips three methyl oranges, be titrated to 0.1mol/LNaOH faint yellow be
Terminal also records and determines scale.
Computational methods: (molar concentration × 49.01 molal weight of titration volumes × NaOH)/sample weight
÷ 1000 × 100%.
The using method of the metal surface micro-corrosion liquid of the present invention is as follows: used by metal surface micro-corrosion liquid
Tap water or pure water by volume concentration 10-15% is diluted, and then puts the workpiece in dilution
After solution in, soak at room temperature or spray 40 seconds to 60 seconds after, with from the beginning flushing dry up i.e.
Can.
Embodiment 4 is the application test in metallic copper in wiring board
Fig. 1 is the schematic diagram of untreated metal copper plate.Fig. 2 is traditional polishing, sandblast place
By the schematic diagram of the copper face under 100 power microscopes after reason.Fig. 3 is other micro-etching agent of market
By the schematic diagram of the copper face under 100 power microscopes after process.Fig. 4 is the micro-corrosion liquid of the present invention
By the schematic diagram of the copper face under 100 power microscopes after process.
By Fig. 1-4 it can be seen that there is certain roughness the metal surface of Fig. 2 and Fig. 3 but uniform
Property is poor；And the metal surface uniformity height that the micro-corrosion liquid of Fig. 4 present invention processes, and give
More firm adhesive force is brought on surface.
Although an embodiment of the present invention has been shown and described, for the ordinary skill of this area
For personnel, it is possible to understand that without departing from the principles and spirit of the present invention can be to this
A little embodiments carry out multiple change, revise, replace and modification, and the scope of the present invention is by appended power
Profit requires and equivalent limits.
Claims (8)
1. a metal surface micro-corrosion liquid, it is characterised in that: described metal surface micro-corrosion liquid is by following quality hundred
Proportion by subtraction raw material composition: mass fraction be 50% dilute sulfuric acid 15-25%, hydrogen peroxide 10-15%, stabilizer
2-5%, surfactant 0.5-1%, anti-microbial inoculum 0.2%, water surplus.
2. metal surface as claimed in claim 1 micro-corrosion liquid, it is characterised in that: described metal surface micro-corrosion liquid
Be made up of the raw material of following mass percent: mass fraction be 50% dilute sulfuric acid 20%, hydrogen peroxide 13%,
Stabilizer 4%, surfactant 0.8%, anti-microbial inoculum 0.2%, water 62%.
3. metal surface as claimed in claim 1 or 2 micro-corrosion liquid, it is characterised in that: described stabilizer is nothing
Machine ammonia stabilizer.
4. metal surface as claimed in claim 1 or 2 micro-corrosion liquid, it is characterised in that: described surfactant
It is polyoxydivinyl ether or fatty glyceride.
5. metal surface as claimed in claim 1 or 2 micro-corrosion liquid, it is characterised in that: described anti-microbial inoculum is benzene
Sodium formate or multi-chlorophenol sodium.
6. the method preparing metal surface as claimed in claim 1 micro-corrosion liquid, it is characterised in that: described side
Method specifically comprise the following steps that first, weigh various raw material by formula；The most now add water in material-compound tank；
It is slow added into dilute sulfuric acid, after solution temperature is down to room temperature, is sequentially added into stabilizer, table the most in order
Face activating agent, hydrogen peroxide, anti-microbial inoculum, stir, and filters, detection fill warehouse-in.
7. preparation method as claimed in claim 6, it is characterised in that: the metal surface micro-corrosion liquid prepared becomes
The proportion of product is at 1.20-1.30；Wherein the volumetric concentration of hydrogen peroxide is 10-15%；The mass concentration of sulphuric acid is
15-25%.
8. the using method of metal surface as claimed in claim 1 micro-corrosion liquid, it is characterised in that: described metal
The using method of surface micro etching liquid is as follows: by metal surface micro-corrosion liquid tap water or pure water by volume concentration
10-15% is diluted, and then puts the workpiece in the solution after dilution, soak at room temperature or spray 40 seconds extremely
After 60 seconds, dry up with rinsing from the beginning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610256157.XA CN105734571A (en) | 2016-04-21 | 2016-04-21 | Metal surface micro-etching liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610256157.XA CN105734571A (en) | 2016-04-21 | 2016-04-21 | Metal surface micro-etching liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105734571A true CN105734571A (en) | 2016-07-06 |
Family
ID=56254881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610256157.XA Pending CN105734571A (en) | 2016-04-21 | 2016-04-21 | Metal surface micro-etching liquid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105734571A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106363774A (en) * | 2016-08-30 | 2017-02-01 | 江苏南山冶金机械制造有限公司 | Fire-resistant treatment method of furnace roller |
| CN106507600A (en) * | 2016-12-28 | 2017-03-15 | 南京高喜电子科技有限公司 | A kind of full-automatic printing process of circuit board and realize the equipment of the method |
| CN112877694A (en) * | 2020-12-31 | 2021-06-01 | 南通赛可特电子有限公司 | Micro-etching solution for treating copper surface |
| CN112981422A (en) * | 2021-02-08 | 2021-06-18 | 珠海市板明科技有限公司 | Copper surface cleaning agent and use method thereof |
| CN115928071A (en) * | 2022-12-02 | 2023-04-07 | 江西荣晖电子有限公司 | Pretreatment method of copper foil for PCB |
| CN117210814A (en) * | 2023-09-18 | 2023-12-12 | 珠海市裕洲环保科技有限公司 | Microetching cleaning agent for copper surface of circuit board and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002266087A (en) * | 2001-03-07 | 2002-09-18 | Hitachi Chem Co Ltd | Etchant for copper and method for manufacturing printed circuit board using the same |
| US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
| CN1730728A (en) * | 2005-08-09 | 2006-02-08 | 广东省石油化工研究院 | Copper or copper alloy surface tiny-etching treatment fluid for smoothing |
| JP2010255063A (en) * | 2009-04-27 | 2010-11-11 | Mitsubishi Materials Corp | Etching solution for structure observation of copper or copper alloy, etching method and structure observation method |
| CN101962775A (en) * | 2010-09-29 | 2011-02-02 | 深圳市洁驰科技有限公司 | Sulfuric acid/hydrogen peroxide microetchant stabilizer and preparation method thereof |
| CN102094201A (en) * | 2009-12-14 | 2011-06-15 | 徐冰 | Micro-etching liquid for copper metal surface treatment |
| CN104947110A (en) * | 2014-03-27 | 2015-09-30 | 浙江德汇电子陶瓷有限公司 | Micro etchant, production method of circuit board and circuit board |
-
2016
- 2016-04-21 CN CN201610256157.XA patent/CN105734571A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
| JP2002266087A (en) * | 2001-03-07 | 2002-09-18 | Hitachi Chem Co Ltd | Etchant for copper and method for manufacturing printed circuit board using the same |
| CN1730728A (en) * | 2005-08-09 | 2006-02-08 | 广东省石油化工研究院 | Copper or copper alloy surface tiny-etching treatment fluid for smoothing |
| JP2010255063A (en) * | 2009-04-27 | 2010-11-11 | Mitsubishi Materials Corp | Etching solution for structure observation of copper or copper alloy, etching method and structure observation method |
| CN102094201A (en) * | 2009-12-14 | 2011-06-15 | 徐冰 | Micro-etching liquid for copper metal surface treatment |
| CN101962775A (en) * | 2010-09-29 | 2011-02-02 | 深圳市洁驰科技有限公司 | Sulfuric acid/hydrogen peroxide microetchant stabilizer and preparation method thereof |
| CN104947110A (en) * | 2014-03-27 | 2015-09-30 | 浙江德汇电子陶瓷有限公司 | Micro etchant, production method of circuit board and circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 朱兴华: ""新型环保硫酸一双氧水微蚀体系前处理工艺研究与应用"", 《印制电路信息》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106363774A (en) * | 2016-08-30 | 2017-02-01 | 江苏南山冶金机械制造有限公司 | Fire-resistant treatment method of furnace roller |
| CN106507600A (en) * | 2016-12-28 | 2017-03-15 | 南京高喜电子科技有限公司 | A kind of full-automatic printing process of circuit board and realize the equipment of the method |
| CN112877694A (en) * | 2020-12-31 | 2021-06-01 | 南通赛可特电子有限公司 | Micro-etching solution for treating copper surface |
| CN112981422A (en) * | 2021-02-08 | 2021-06-18 | 珠海市板明科技有限公司 | Copper surface cleaning agent and use method thereof |
| CN115928071A (en) * | 2022-12-02 | 2023-04-07 | 江西荣晖电子有限公司 | Pretreatment method of copper foil for PCB |
| CN117210814A (en) * | 2023-09-18 | 2023-12-12 | 珠海市裕洲环保科技有限公司 | Microetching cleaning agent for copper surface of circuit board and preparation method thereof |
| CN117210814B (en) * | 2023-09-18 | 2024-05-03 | 珠海市裕洲环保科技有限公司 | Microetching cleaning agent for copper surface of circuit board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105734571A (en) | Metal surface micro-etching liquid | |
| US7427586B2 (en) | Degreasing agent | |
| CN103046052B (en) | The stripping liquid of environment-friendly type titanium-containing film and using method thereof | |
| WO2013071475A1 (en) | Aqueous phase pore sealing agent improving pcb coating oxidation-resistant and corrosion-resistant properties and method for using same | |
| CN108118341A (en) | A kind of environment-friendly type tin copper coating decoating liquid and its strip method | |
| KR101612334B1 (en) | Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil | |
| CN104152962B (en) | The method of electric tinning of printed wiring board | |
| CN107072075A (en) | It is a kind of to improve the method for the copper that breaks in PTFE material pcb board hole | |
| CN102828226B (en) | Recyclable environment friendly electrolytic stripping solution, preparation method and usage method | |
| CN104928661B (en) | A kind of compound ion liquid brown liquid for printed circuit board | |
| CN108300872A (en) | The devices and methods therefor of tin is recycled for circuit board | |
| CN105177545A (en) | Cold-rolled steel sheet surface treatment technique | |
| CN105862042A (en) | Nickel stripping solution and preparation method and application thereof | |
| CN112877694A (en) | Micro-etching solution for treating copper surface | |
| CN104073849B (en) | A kind of technique of Sintered NdFeB magnet electroplating nickel on surface tungsten phosphorus | |
| CN102758193A (en) | Electroless copper plating pretreatment solution used for high-frequency circuit board | |
| CN101845631A (en) | Nickel-removing solution for adverse chemical nickel plating layer of printed circuit board and preparation method thereof and method for removing adverse chemical nickel plating layer | |
| CN104928667B (en) | A kind of printed circuit board processing brown liquid based on functionalized ion liquid | |
| CN104862716B (en) | A kind of Phosphorus-Free Water-Based Cleaning Agent for Metals | |
| CN109957791B (en) | A kind of power battery ultrathin electrolytic copper foil high-temp antioxidizing liquid and preparation method thereof | |
| CN103849876B (en) | A kind of chemically polishing method | |
| CN110195222A (en) | A kind of RTR subtracts copper post-processing copper foil surface passivator and its use and preparation method | |
| CN107254694A (en) | A kind of tin plating electrolyte and the efficient tin plating technique based on the tin plating electrolyte | |
| CN111155152B (en) | Method for reducing production cost in horizontal electroplating process of PCB | |
| KR20170095120A (en) | Composition and method for micro etching of copper and copper alloys |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160706 |