CN108300872A - The devices and methods therefor of tin is recycled for circuit board - Google Patents
The devices and methods therefor of tin is recycled for circuit board Download PDFInfo
- Publication number
- CN108300872A CN108300872A CN201810399533.XA CN201810399533A CN108300872A CN 108300872 A CN108300872 A CN 108300872A CN 201810399533 A CN201810399533 A CN 201810399533A CN 108300872 A CN108300872 A CN 108300872A
- Authority
- CN
- China
- Prior art keywords
- tin
- liquid
- circuit board
- electrolytic cell
- stripping liquid
- Prior art date
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 275
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 156
- 230000000153 supplemental effect Effects 0.000 claims abstract description 26
- 238000004064 recycling Methods 0.000 claims abstract description 24
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 24
- 239000010936 titanium Substances 0.000 claims description 24
- 229910052719 titanium Inorganic materials 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000005057 refrigeration Methods 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 238000004070 electrodeposition Methods 0.000 claims description 12
- 239000011814 protection agent Substances 0.000 claims description 12
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 claims description 9
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- 238000011084 recovery Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 6
- 239000012964 benzotriazole Substances 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 claims description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 6
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 3
- 229940018563 3-aminophenol Drugs 0.000 claims description 3
- 150000002460 imidazoles Chemical class 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- RBXVOQPAMPBADW-UHFFFAOYSA-N nitrous acid;phenol Chemical class ON=O.OC1=CC=CC=C1 RBXVOQPAMPBADW-UHFFFAOYSA-N 0.000 claims description 3
- 239000001103 potassium chloride Substances 0.000 claims description 3
- 235000011164 potassium chloride Nutrition 0.000 claims description 3
- 235000007715 potassium iodide Nutrition 0.000 claims description 3
- 235000009518 sodium iodide Nutrition 0.000 claims description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 2
- 239000013589 supplement Substances 0.000 claims 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- 238000005660 chlorination reaction Methods 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 235000015424 sodium Nutrition 0.000 claims 1
- 238000010924 continuous production Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 5
- 229910017604 nitric acid Inorganic materials 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 235000002639 sodium chloride Nutrition 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- -1 Methyl sulphur Chemical compound 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 description 1
- KVBCYCWRDBDGBG-UHFFFAOYSA-N azane;dihydrofluoride Chemical compound [NH4+].F.[F-] KVBCYCWRDBDGBG-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000002552 dosage form Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/06—Obtaining tin from scrap, especially tin scrap
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/04—Obtaining tin by wet processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/14—Electrolytic production, recovery or refining of metals by electrolysis of solutions of tin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of devices and methods therefors recycling tin for circuit board, including the first work nest and the second work nest, first work nest includes moving back molten tin bath and reservoir, second work nest includes supplemental tank and electrolytic cell, cathode plate and anode plate are equipped in the electrolytic cell, liquid is pumped into reservoir by the molten tin bath that moves back by the first liquid pump, liquid is pumped into electrolytic cell by the reservoir by the second liquid pump, liquid is pumped into supplemental tank by the electrolytic cell by third liquid pump, and liquid is pumped by the 4th liquid pump and is moved back in molten tin bath by the supplemental tank.Compact arrangement of equipment involved in the present invention is reasonable, realizes continuous production, operates also more safely controllable, has very strong performance.
Description
Technical field
The present invention relates to tin recycling, and in particular to a kind of devices and methods therefor for circuit board recycling tin.
Background technology
Printed wiring board (PCB) industry is the basis of hyundai electronics and information industry, right with the development of high-tech industry
The demand of wiring board increases year by year.The manufacturing process of PCB has as many as 20 procedures, wherein it includes largely spent solder stripper that will produce
Waste liquid inside.Tin stripping liquid is broadly divided into three types at present：Fluoride type, by hydrofluoric acid, villiaumite (ammonium acid fluoride), peroxidating
The compositions such as object；Nitric acid type tin stripper, by nitric acid, ferric nitrate, corrosion inhibiter, surfactant, nitrogen oxides inhibitor, complexing agent etc.
Composition；The composition of nitric acid-alkyl sulfonic acid type, the dosage form is similar with nitric acid type etching agent, and difference is only that concentration of nitric acid is relatively low,
Generally≤15%；This three classes tin stripping liquid can all cause environment serious pollution, and cause to subsequent recovery tin and be greatly stranded
It is difficult.Currently, the method for recycling tin has distillation recovery method, acidic precipitation agent facture, prepares stannic acid product, electrolysis and ion friendship
Method etc. is changed, but the above method all has following defect：Other a large amount of waste liquids and sludge are generated, secondary pollution is caused, and
Complex process, condition control is stringent, processing cost is high.
Invention content
In order to overcome drawbacks described above, the present invention to provide a kind of device for circuit board recycling tin, which is applied to electricity
Moving back in tin and recycling process of tin for road plate, can realize recycling for tin stripping liquid, not will produce waste liquid and sludge, to avoid
The problem of causing secondary pollution to environment occurs.
The present invention in order to solve its technical problem used by technical solution be：
A kind of device for circuit board recycling tin, including the first work nest and the second work nest, first work nest
Including moving back molten tin bath and reservoir, second work nest includes supplemental tank and electrolytic cell, be equipped in the electrolytic cell cathode plate and
Liquid is pumped into reservoir by anode plate, the molten tin bath that moves back by the first liquid pump, and the reservoir is by the second liquid pump by liquid
It is pumped into electrolytic cell, liquid is pumped into supplemental tank by the electrolytic cell by third liquid pump, and the supplemental tank passes through the 4th liquid pump
Liquid is pumped into and is moved back in molten tin bath.
Preferably, the cathode plate is titanium plate, titanium net, copper coin, sheet tin or stainless steel plate, and the anode plate is titanium plate, titanium
Net or graphite.
Preferably, described to move back molten tin bath and electrolytic cell is respectively equipped with refrigeration system, heating system and circulating pump, the refrigeration system
System and heating system are for controlling the operating temperature moved back in molten tin bath and electrolytic cell.
Preferably, the refrigeration system includes compressor and refrigeration piping, and the heating system includes heating tube.
Preferably, first work nest and the second work nest are all PP plastic channels, and are all double-layer structure, described first
The upper layer of work nest be move back molten tin bath, lower layer is reservoir, the upper layer of second work nest is supplemental tank, lower layer is electrolytic cell.
Preferably, filter screen is equipped between the cathode plate and anode plate, electrolytic cell is isolated into cathode by the filter screen
Room and anode chamber.
The present invention also provides a kind of methods recycling tin for circuit board, it is characterised in that：It is as follows：
Step 1：Original tin stripping liquid is added to and is moved back in molten tin bath, the circuit board cleaned up is immersed in move back molten tin bath move back tin
In liquid, tin 1-6h is moved back into the temperature control of tin stripping liquid at 20-50 DEG C using refrigeration or heating system, moving back tin after the completion will
The circuit board for moving back tin takes out, and is put into next group circuit board；
Step 2：The concentration that tin in tin stripping liquid in molten tin bath is moved back in measurement passes through the first liquid when the concentration of tin reaches 120g/L
The tin stripping liquid part moved back in molten tin bath is pumped into reservoir by pump；
Step 3：After the tin stripping liquid in reservoir reaches certain liquid level, by the second liquid pump by moving back in reservoir
Tin liquor part is pumped into electrolytic cell, using in electrolytic cell cathode plate and anode plate in electrolytic cell tin stripping liquid carry out electrodeposition at
Reason so that metallic tin is adsorbed on cathode plate；
Step 4：The concentration for measuring tin in tin stripping liquid in electrolytic cell stops electrodeposition when tin concentration is reduced to 10g/L, from
Metallic tin is separated on cathode plate, while the tin stripping liquid part in electrolytic cell being pumped into supplemental tank using third liquid pump, and again
The tin stripping liquid part in reservoir is pumped into electrolytic cell by the second liquid pump and persistently carries out tin recovery processing；
Step 5：The tin stripping liquid in supplemental tank is pumped by the 4th liquid pump and moves back moving back for next group circuit board in molten tin bath
Tin so that tin stripping liquid complete to circuit board move back tin and tin reclaimer operation after recycle.
Preferably, each component and its parts by weight are in the original tin stripping liquid：100-200 parts of pyrovinic acid；Pyrovinic acid
100-200 parts of tin；Comprehensive 5-80 parts of agent；5-15 parts of copper-protection agent；200-500 parts of deionized water.
Preferably, the comprehensive agent is at least one of sodium chloride, potassium iodide, potassium chloride, sodium iodide, the copper-protection agent
For benzotriazole (BTA), imidazoles, benzimidazole, methyl benzotriazazole (TTA), phenol, resorcinol, m-aminophenol,
At least one of nitrophenols and sulfamic acid.
Preferably, the cathode plate is titanium plate, titanium net, copper coin, sheet tin or stainless steel plate, and the anode plate is titanium plate, titanium
The condition of net or graphite, electrodeposition is：Current density is 100-450A/m2, temperature be 20-35 DEG C.
The beneficial effects of the invention are as follows：
1) it is equipped in the present invention and moves back molten tin bath, reservoir, electrolytic cell and supplemental tank, when the tin concentration moved back in molten tin bath reaches
When 120g/L, part tin stripping liquid is pumped into reservoir, and the stanniferous tin stripping liquid less than 15g/L in supplemental tank is pumped into and moves back tin
Slot, to ensure that the lasting progress for moving back process of tin；It, will when tin concentration is reduced to 15g/L in electrolytic cell in electrolytic process
Electrolyte in electrolytic cell is pumped into supplemental tank, and the tin stripping liquid by the Theil indices in reservoir higher than 120g/L is pumped into electrolytic cell
It is interior so that electrolytic process is able to continue progress；Therefore the present invention uses and moves back the mutual of molten tin bath, reservoir, electrolytic cell and supplemental tank
Cooperation so that move back process of tin and tin recovery process is able to continue progress, improve production efficiency；
2) do not contain any nitric acid ingredient in the present invention in original tin stripping liquid, therefore not will produce any ammonia nitrogen, total phosphorus etc.
Pollutant is a kind of environmentally friendly product；And the copper-protection agent of addition is used for the copper plate under protection circuit plates are covered by tin, prevents
Only layers of copper is corroded；
3) present invention realizes the cycling and reutilization of tin stripping liquid, and tin is recycled with electrodeposition at the formation of metallic tin,
The purity for recycling tin is high, and the other compositions in tin stripping liquid can recycle infinitely, and the introduction of non-secondary pollution object, subtract
Few harm to the mankind, other biological and environment, and realize recycling for resource；Equipment arrangement involved in the present invention is tight
Reason is gathered together, continuous production is realized, operates also more safely controllable, there is very strong performance.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
In figure：The first work nests of 10-, 11- move back molten tin bath, 12- reservoirs, the second work nests of 20-, 21- supplemental tanks, 22- electricity
Solve slot, 23- cathode plates, 24- anode plates, the first liquid pumps of 31-, the second liquid pumps of 32-, 33- third liquid pumps, the 4th liquid pumps of 34-.
Specific implementation mode
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
As shown in Figure 1, a kind of device for circuit board recycling tin, including the first work nest 10 and the second work nest 20,
First work nest 10 includes moving back molten tin bath 11 and reservoir 12, and second work nest 20 includes supplemental tank 21 and electrolytic cell
22, cathode plate 23 and anode plate 24 are equipped in the electrolytic cell 22, liquid is pumped by the molten tin bath 11 that moves back by the first liquid pump 31
In reservoir 12, liquid is pumped into electrolytic cell 22 by the reservoir 12 by the second liquid pump 32, and the electrolytic cell 22 passes through
Liquid is pumped into supplemental tank 21 by three liquid pumps 33, and liquid is pumped by the 4th liquid pump 34 and is moved back in molten tin bath by the supplemental tank 21.
In the manufacture craft of circuit board, in order to protect the layers of copper of specific region not to be corroded, it is often necessary to will be plated in the layers of copper in the region
Last layer protects tin layers, after corroding the layers of copper in other regions, and needs tin layers stripping will to be protected to fall by moving back process of tin,
So that layers of copper is exposed to carry out subsequent technique again.The present apparatus is exactly that and will be moved back for moving back in process of tin during this
The tin to get off is recycled again.The tin on circuit board is dissolved into tin stripping liquid by tin stripping liquid in moving back molten tin bath, in electrolytic cell
It is middle by containing being adsorbed on cathode plate containing more tin in tin stripping liquid, recycled by scraping the tin layers on cathode plate high-purity
The tin of degree, while so that the concentration of tin is greatly reduced in tin stripping liquid, this tin stripping liquid returned to move back in molten tin bath recycle again；It is logical
Crossing the present apparatus can complete to move back tin and recycling tin twice technique, and realize recycling for tin stripping liquid, it is entirely avoided tradition
The problems such as waste liquid discharging amount present in tin stripping liquid processing procedure is big, the tin rate of recovery is low and environmental pollution is big.
Wherein, the cathode plate 23 be titanium plate, titanium net, copper coin, sheet tin or stainless steel plate, the anode plate 24 be titanium plate,
Titanium net or graphite.It is described to move back molten tin bath 11 and electrolytic cell 22 is respectively equipped with refrigeration system, heating system and circulating pump, the refrigeration system
System and heating system are for controlling the operating temperature moved back in molten tin bath and electrolytic cell.The refrigeration system includes compressor and refrigerator pipes
Road, the heating system include heating tube.First work nest, 10 and second work nest 20 is all PP plastic channels, and is all double
Layer structure, the upper layer of first work nest 10 be move back molten tin bath 11, lower layer is reservoir 12, the upper layer of second work nest 20
It is electrolytic cell 22 for supplemental tank 21, lower layer.Filter screen is equipped between the cathode plate 23 and anode plate 24, the filter screen will be electric
Solution slot 22 is isolated into cathode chamber and anode chamber.
A method of tin being recycled for circuit board, is as follows：
Step 1：Original tin stripping liquid is added to and is moved back in molten tin bath 11, the circuit board cleaned up is immersed in and moves back moving back for molten tin bath
In tin liquor, using refrigeration or heating system tin 1-6h is moved back into the temperature control of tin stripping liquid at 20-50 DEG C, move back tin and after the completion will
The circuit board for having moved back tin takes out, and is put into next group circuit board；Each component and its parts by weight are in the original tin stripping liquid：Methyl sulphur
It is 100-200 parts sour；100-200 parts of tin methane sulfonate；Comprehensive 5-80 parts of agent；5-15 parts of copper-protection agent；200-500 parts of deionized water；
The comprehensive agent is at least one of sodium chloride, potassium iodide, potassium chloride, sodium iodide, and the copper-protection agent is benzotriazole
(BTA), imidazoles, benzimidazole, methyl benzotriazazole (TTA), phenol, resorcinol, m-aminophenol, nitrophenols and amino
At least one of sulfonic acid；The comprehensive agent can promote the tin on circuit board to dissolve, and improve molten tin speed；The copper-protection agent is used
Copper plate under protection circuit plates are covered by tin, prevents layers of copper to be corroded；
Step 2：The concentration that tin in tin stripping liquid in molten tin bath is moved back in measurement passes through the first liquid when the concentration of tin reaches 120g/L
The tin stripping liquid part moved back in molten tin bath is pumped into reservoir 12 by pump 31；
Step 3：It, will be in reservoir by the second liquid pump 32 after the tin stripping liquid in reservoir 12 reaches certain liquid level
Tin stripping liquid part be pumped into electrolytic cell 22, using in electrolytic cell cathode plate 23 and anode plate 24 to the tin stripping liquid in electrolytic cell
Carry out electrodeposition processing so that metallic tin is adsorbed on cathode plate 23；The cathode plate 23 is titanium plate, titanium net, copper coin, sheet tin or not
Become rusty steel plate, and the anode plate 24 is titanium plate, titanium net or graphite, and the condition of electrodeposition is：Current density is 100-450A/m2, temperature
It is 20-35 DEG C；
Step 4：The concentration for measuring tin in tin stripping liquid in electrolytic cell stops electrodeposition when tin concentration is reduced to 10g/L, from
Metallic tin is separated on cathode plate, while the tin stripping liquid part in electrolytic cell being pumped into supplemental tank 21 using third liquid pump 33,
And the tin stripping liquid part in reservoir is pumped into electrolytic cell 22 by the second liquid pump 32 persistently carries out tin recovery processing again；
Step 5：The tin stripping liquid in supplemental tank 21 is pumped into move back by the 4th liquid pump 34 and is used for next group circuit board in molten tin bath
Move back tin so that tin stripping liquid complete to circuit board move back tin and tin reclaimer operation after recycle.
Embodiment 1：
Step 1：Configure original tin stripping liquid：Each component and its parts by weight are：100 parts of pyrovinic acid, tin methane sulfonate
100 parts, comprehensive 5 parts of agent, 5 parts of copper-protection agent, 200 parts of deionized water, mix the above components evenly up to original tin stripping liquid；
Step 2：Original tin stripping liquid is added to and is moved back in molten tin bath 11, the circuit board cleaned up is immersed in and moves back moving back for molten tin bath
In tin liquor, tin 1h is moved back into the temperature control of tin stripping liquid at 20 DEG C using refrigeration or heating system, and will move back by circulating pump
Tin stripping liquid in molten tin bath recycles in carrying out, and ensures the uniformity for moving back tin stripping liquid in molten tin bath；
Step 3：The concentration that tin in tin stripping liquid in molten tin bath is moved back in measurement passes through the first liquid when the concentration of tin reaches 120g/L
The tin stripping liquid part moved back in molten tin bath is pumped into reservoir 12 by pump 31；
Step 4：It, will be in reservoir by the second liquid pump 32 after the tin stripping liquid in reservoir 12 reaches certain liquid level
Tin stripping liquid part be pumped into electrolytic cell 22, using in electrolytic cell cathode plate 23 and anode plate 24 to the tin stripping liquid in electrolytic cell
Carry out electrodeposition processing so that metallic tin is adsorbed on cathode plate 23, current density 250A/m2；Utilize refrigeration or heating system
System controls the temperature of tin stripping liquid at 25 DEG C, and the tin stripping liquid in electrolytic cell is carried out interior cycle by circulating pump, ensures electrolysis
The uniformity of tin stripping liquid in slot；
Step 5：The concentration for measuring tin in tin stripping liquid in electrolytic cell stops electrodeposition when tin concentration is reduced to 15g/L, from
Metallic tin is separated on cathode plate, while the tin stripping liquid part in electrolytic cell being pumped into supplemental tank 21 using third liquid pump 33；
Step 6：The tin stripping liquid in supplemental tank 21 is pumped into move back by the 4th liquid pump 34 and is used for next group circuit board in molten tin bath
Move back tin so that tin stripping liquid complete to circuit board move back tin and tin reclaimer operation after recycle.
Embodiment 2：Difference from Example 1 is as follows：
Step 1：Configure original tin stripping liquid：Each component and its parts by weight are：135 parts of pyrovinic acid, tin methane sulfonate
130 parts, comprehensive 20 parts of agent, 10 parts of copper-protection agent, 300 parts of deionized water, mix the above components evenly up to original tin stripping liquid；
Step 2：Original tin stripping liquid is added to and is moved back in molten tin bath 11, the circuit board cleaned up is immersed in and moves back moving back for molten tin bath
In tin liquor, tin 2h is moved back into the temperature control of tin stripping liquid at 30 DEG C using refrigeration or heating system, and will move back by circulating pump
Tin stripping liquid in molten tin bath recycles in carrying out, and ensures the uniformity for moving back tin stripping liquid in molten tin bath.
Embodiment 3：Difference from Example 1 is as follows：
Step 1：Configure original tin stripping liquid：Each component and its parts by weight are：170 parts of pyrovinic acid, tin methane sulfonate
170 parts, comprehensive 50 parts of agent, 8 parts of copper-protection agent, 350 parts of deionized water, mix the above components evenly up to original tin stripping liquid；
Step 2：Original tin stripping liquid is added to and is moved back in molten tin bath 11, the circuit board cleaned up is immersed in and moves back moving back for molten tin bath
In tin liquor, tin 4.5h is moved back into the temperature control of tin stripping liquid at 30 DEG C using refrigeration or heating system, and will by circulating pump
It moves back the tin stripping liquid in molten tin bath and carries out interior cycle, ensure the uniformity for moving back tin stripping liquid in molten tin bath.
Embodiment 4：Difference from Example 1 is as follows：
Step 1：Configure original tin stripping liquid：Each component and its parts by weight are：200 parts of pyrovinic acid, tin methane sulfonate
200 parts, comprehensive 80 parts of agent, 15 parts of copper-protection agent, 500 parts of deionized water, mix the above components evenly up to original tin stripping liquid；
Step 2：Original tin stripping liquid is added to and is moved back in molten tin bath 11, the circuit board cleaned up is immersed in and moves back moving back for molten tin bath
In tin liquor, tin 6h is moved back into the temperature control of tin stripping liquid at 50 DEG C using refrigeration or heating system, and will move back by circulating pump
Tin stripping liquid in molten tin bath recycles in carrying out, and ensures the uniformity for moving back tin stripping liquid in molten tin bath.
It is obtained by test, by the tin layers on embodiment 1-4 treated circuit boards, 100% can be reached and moved back
The purity of tin rate, the metallic tin of recycling all reaches 98% or more, therefore is handled circuit board by originally moving back tin method, moves back tin
Rate is high, and the metallic tin recycled is quality, can reuse or sell；The device that uses is compact in the present invention simultaneously, operation side
Method is simple, and tin stripping liquid can avoid the problem of traditional spent solder stripper causes seriously to pollute to environment by repeated multiple times use.
It should be pointed out that for those of ordinary skill in the art, without departing from the inventive concept of the premise, may be used also
To make several modifications and improvements, these are all within the scope of protection of the present invention.Therefore, the protection domain of patent of the present invention should be with
Subject to appended claims.
Claims (10)
1. a kind of device for circuit board recycling tin, it is characterised in that：Including the first work nest (10) and the second work nest
(20), first work nest (10) includes moving back molten tin bath (11) and reservoir (12), and second work nest (20) includes supplement
Slot (21) and electrolytic cell (22) are equipped with cathode plate (23) and anode plate (24) in the electrolytic cell (22), described to move back molten tin bath (11)
Liquid is pumped into reservoir (12) by the first liquid pump (31), the reservoir (12) is by the second liquid pump (32) by liquid pump
Enter in electrolytic cell (22), liquid is pumped into supplemental tank (21) by the electrolytic cell (22) by third liquid pump (33), the supplement
Liquid is pumped by the 4th liquid pump (34) and is moved back in molten tin bath by slot (21).
2. the device according to claim 1 for circuit board recycling tin, it is characterised in that：The cathode plate (23) is titanium
Plate, titanium net, copper coin, sheet tin or stainless steel plate, the anode plate (24) are titanium plate, titanium net or graphite.
3. the device according to claim 1 for circuit board recycling tin, it is characterised in that：It is described to move back molten tin bath (11) and electricity
Solution slot (22) is respectively equipped with refrigeration system, heating system and circulating pump, and the refrigeration system and heating system move back tin for controlling
Operating temperature in slot and electrolytic cell.
4. the device according to claim 3 for circuit board recycling tin, it is characterised in that：The refrigeration system includes pressure
Contracting machine and refrigeration piping, the heating system include heating tube.
5. the device according to claim 1 for circuit board recycling tin, it is characterised in that：First work nest (10)
All it is PP plastic channels with the second work nest (20), and is all double-layer structure, the upper layer of first work nest (10) is to move back molten tin bath
(11), lower layer is reservoir (12), and the upper layer of second work nest (20) is supplemental tank (21), lower layer is electrolytic cell (22).
6. the device according to claim 1 for circuit board recycling tin, it is characterised in that：The cathode plate (23) and sun
Filter screen is equipped between pole plate (24), electrolytic cell (22) is isolated into cathode chamber and anode chamber by the filter screen.
7. a kind of method that any one of claim 1-6 described devices are recycled tin for circuit board, it is characterised in that：Specific step
It is rapid as follows：
Step 1：Original tin stripping liquid is added to and is moved back in molten tin bath (11), the circuit board cleaned up is immersed in move back molten tin bath move back tin
In liquid, tin 1-6h is moved back into the temperature control of tin stripping liquid at 20-50 DEG C using refrigeration or heating system, moving back tin after the completion will
The circuit board for moving back tin takes out, and is put into next group circuit board；
Step 2：The concentration that tin in tin stripping liquid in molten tin bath is moved back in measurement passes through the first liquid pump when the concentration of tin reaches 120g/L
(31) the tin stripping liquid part moved back in molten tin bath is pumped into reservoir (12)；
Step 3：It, will be in reservoir by the second liquid pump (32) after the tin stripping liquid in reservoir (12) reaches certain liquid level
Tin stripping liquid part be pumped into electrolytic cell (22), using in electrolytic cell cathode plate (23) and anode plate (24) in electrolytic cell
Tin stripping liquid carries out electrodeposition processing so that metallic tin is adsorbed on cathode plate (23)；
Step 4：The concentration for measuring tin in tin stripping liquid in electrolytic cell stops electrodeposition, from cathode when tin concentration is reduced to 10g/L
Metallic tin is separated on plate, while the tin stripping liquid part in electrolytic cell being pumped into supplemental tank (21) using third liquid pump (33),
And the tin stripping liquid part in reservoir is pumped into electrolytic cell (22) by the second liquid pump (32) persistently carries out tin recovery processing again；
Step 5：The tin stripping liquid in supplemental tank (21) is pumped into move back by the 4th liquid pump (34) and is used for next group circuit board in molten tin bath
Move back tin so that tin stripping liquid complete to circuit board move back tin and tin reclaimer operation after recycle.
8. the method according to claim 7 for circuit board recycling tin, it is characterised in that：It is each in the original tin stripping liquid
Component and its parts by weight are：100-200 parts of pyrovinic acid；100-200 parts of tin methane sulfonate；Comprehensive 5-80 parts of agent；Copper-protection agent 5-
15 parts；200-500 parts of deionized water.
9. the method according to claim 7 for circuit board recycling tin, it is characterised in that：The comprehensive agent is chlorination
At least one of sodium, potassium iodide, potassium chloride, sodium iodide, the copper-protection agent are benzotriazole, imidazoles, benzimidazole, methyl
At least one of benzotriazole, phenol, resorcinol, m-aminophenol, nitrophenols and sulfamic acid.
10. the method according to claim 7 for circuit board recycling tin, it is characterised in that：The cathode plate (23) is
Titanium plate, titanium net, copper coin, sheet tin or stainless steel plate, the anode plate (24) are titanium plate, titanium net or graphite, and the condition of electrodeposition is：Electricity
Current density is 100-450A/m2, temperature be 20-35 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810399533.XA CN108300872A (en) | 2018-04-28 | 2018-04-28 | The devices and methods therefor of tin is recycled for circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810399533.XA CN108300872A (en) | 2018-04-28 | 2018-04-28 | The devices and methods therefor of tin is recycled for circuit board |
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| CN108300872A true CN108300872A (en) | 2018-07-20 |
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| CN201810399533.XA Pending CN108300872A (en) | 2018-04-28 | 2018-04-28 | The devices and methods therefor of tin is recycled for circuit board |
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| CN108950670A (en) * | 2018-08-09 | 2018-12-07 | 昆山雅鑫化工有限公司 | A kind of pcb board electroplate liquid |
| CN108998810A (en) * | 2018-08-09 | 2018-12-14 | 昆山雅鑫化工有限公司 | A kind of device of circuit board recycling tin |
| CN109136988A (en) * | 2018-08-09 | 2019-01-04 | 昆山雅鑫化工有限公司 | A kind of method of circuit board recycling tin |
| CN110373548A (en) * | 2019-08-29 | 2019-10-25 | 云南龙蕴科技环保股份有限公司 | A kind of useless circuit board wet process detin technique |
| CN111515227A (en) * | 2020-04-30 | 2020-08-11 | 清华苏州环境创新研究院 | Tin stripping waste liquid and waste circuit board cooperative treatment equipment and method |
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