CN117241478A - Horizontal electroplating process for double-sided and multi-layer PCB (printed circuit board) - Google Patents
Horizontal electroplating process for double-sided and multi-layer PCB (printed circuit board) Download PDFInfo
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- CN117241478A CN117241478A CN202311515673.6A CN202311515673A CN117241478A CN 117241478 A CN117241478 A CN 117241478A CN 202311515673 A CN202311515673 A CN 202311515673A CN 117241478 A CN117241478 A CN 117241478A
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- pcb
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000009713 electroplating Methods 0.000 title claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- 238000007747 plating Methods 0.000 claims abstract description 43
- 238000004140 cleaning Methods 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 238000000151 deposition Methods 0.000 claims abstract description 20
- 230000008021 deposition Effects 0.000 claims abstract description 17
- 238000001465 metallisation Methods 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 238000000227 grinding Methods 0.000 claims description 50
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 16
- 229910001431 copper ion Inorganic materials 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 11
- 239000003792 electrolyte Substances 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 5
- 238000005234 chemical deposition Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 50
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000004891 communication Methods 0.000 abstract description 3
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 239000002344 surface layer Substances 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 19
- 238000005303 weighing Methods 0.000 description 13
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 9
- 238000007789 sealing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000010814 metallic waste Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention relates to the technical field of PCB production, in particular to a horizontal electroplating process for double-sided and multi-layer boards of a PCB, which comprises the following steps: a. pretreatment: cleaning the upper and lower plate surfaces of the PCB and a plurality of through holes and blind holes on the PCB; b. metal deposition: copper deposition is carried out on a plurality of through holes and blind holes on the PCB; c. copper plating: electroplating the through holes and the blind holes after copper deposition; d. post-treatment: cleaning the PCB, cleaning the surface layer of the PCB and a plurality of through holes and blind holes on the PCB, removing dirt on the surface of the PCB and in the through holes and the blind holes, avoiding that deposited metal cannot be effectively attached to the hole wall before metal deposition is carried out on the PCB, leading to incomplete deposition of the metal deposition or insufficient adhesive force of the deposition, preventing plating leakage and plating stripping during subsequent electroplating, ensuring the communication of conductive layers between double-sided copper layers or any layers of the PCB, and realizing signal transmission.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a horizontal electroplating process for double-sided and multi-layer boards of a PCB.
Background
Horizontal plating (Horizontal Plating) is a common method of electroplating a PCB board (PCB) to form a metal layer, typically copper, on the surface of the PCB. The horizontal electroplating method has the following characteristics: the process principle is as follows: horizontal plating the PCB is immersed in an electrolyte using a horizontal electrolytic bath. By applying an electric current, metal ions are released from the anode and deposited on the surface of the PCB to form a metal layer. At the same time, the reaction on the cathode generates hydrogen gas, providing an opportunity to uniformly coat the surface of the PCB by the formation of bubbles. Uniformity: horizontal plating can achieve a relatively uniform coating on the PCB surface because stirring and bubbling in the electrolytic cell provide good physical turbulence, helping to uniformly distribute the solution over the PCB surface. Thus, uneven plating thickness or poor plating effect can be avoided. Control of: the horizontal plating process can control the thickness of the plating layer to some extent. By adjusting the current density, temperature, time, etc., the desired thickness can be achieved and uniformity maintained. High-speed coating: horizontal plating generally has a faster plating rate than other plating methods. This makes horizontal plating widely used in high-yield and high-efficiency PCB manufacturing. It should be noted that horizontal plating places certain demands on the surface flatness of the PCB. If the surface of the PCB is uneven or dents exist, uneven plating or structural problems may occur. Thus, prior to horizontal plating, the surface treatment and preparation of the PCB is typically performed to ensure surface finish and flatness.
However, in the prior art, some disadvantages still exist in the use process, for example, patent numbers are as follows: a PCB mask electroplating process of CN201110145077.4, which comprises the following steps: A. drilling: drilling mechanical holes and through holes on the circuit board substrate according to the requirements; B. sticking film: attaching a hole-drilled insulating film on the circuit board substrate with the hole drilled; C. copper plating: thickening electroplating is carried out on the via hole; D. film uncovering: removing the insulating film attached to the circuit board substrate; E. the post-treatment is carried out on the circuit board, copper ions are directly electroplated on the through holes in the process of electroplating, the electroplated copper ions are easily influenced by dirt in the through holes, poor combination of electroplated metal and the through holes is caused, and then quality problems are generated.
Disclosure of Invention
The invention provides a horizontal electroplating process for double-sided and multi-layer boards of a PCB, which is used for solving the problem proposed by the background technology.
In order to achieve the above object, the present invention provides the following technical solutions: a horizontal electroplating process for double-sided and multi-layer boards of a PCB comprises the following steps:
a. pretreatment: cleaning the upper and lower plate surfaces of the PCB and a plurality of through holes and blind holes on the PCB;
b. metal deposition: copper deposition is carried out on a plurality of through holes and blind holes on the PCB;
c. copper plating: electroplating the through holes and the blind holes after copper deposition;
d. post-treatment: and cleaning the PCB.
Preferably, the specific method for cleaning the upper and lower plate surfaces of the PCB and the plurality of through holes and blind holes on the PCB comprises the following steps:
adopting a grinding plate to treat the surface of the PCB and the edges of the through holes and the blind holes on the PCB so as to remove dirt and oxides on the surface of the PCB; removing Kong Bianpi peaks of the through holes and the blind holes;
and cleaning the PCB.
Preferably, step b further comprises: and removing the glue from the PCB.
Preferably, the specific method for cleaning the PCB comprises the following steps:
and removing dirt in the through holes and the blind holes on the PCB by water washing or chemical washing.
Preferably, the specific method for removing the adhesive from the PCB comprises the following steps:
and removing drilling dirt on the walls of the through holes and the blind holes caused by the drilling in a plasma or chemical mode.
Preferably, the specific method for copper deposition of the plurality of through holes and blind holes on the PCB board comprises the following steps:
and depositing a metal copper conducting layer on the inner layer of the wall of the through hole and the blind hole by adopting a chemical deposition method.
Preferably, the specific method for electroplating the through hole and the blind hole after copper deposition comprises the following steps:
placing the PCB in a copper ion electrolyte, taking the PCB as a cathode, placing an infusible anode in the copper ion electrolyte, respectively connecting the cathode and the infusible anode with a pulse rectifier, electrifying the copper ion electrolyte, reducing copper ions into copper on a through hole, a blind hole and a metal copper conducting layer in the PCB, and ending electroplating after the plating layers of the reduced copper layer of the through hole, the blind hole and the metal copper conducting layer in the PCB are uniform.
Preferably, the thickness ratio of the copper plating layer of the metal copper conducting surface to the copper plating layer of the hole walls of the through holes and the blind holes reaches 1:1.
preferably, the specific method for cleaning the PCB comprises the following steps: and cleaning the surface of the PCB and the through holes and blind holes on the PCB, removing chemical components remained on the surface, and preventing the copper layer from being oxidized.
Preferably, the grinding plate comprises a grinding member comprising: grind pipe, power shell, ring gear, discharge shell and spiral abrasive strip, grind pipe one end and discharge shell rotation and be connected, grind the pipe and penetrate the other end that the power shell installs the ring gear, the ring gear passes through the gear and is connected with the motor meshing in the power shell, and the equidistance is equipped with a plurality of spiral abrasive strips on the grind pipe, every spiral abrasive strip and PCB board upper surface friction fit, and the PCB board is installed on the anchor clamps frock, and the anchor clamps frock sets up between power shell and discharge shell.
The beneficial effects of the invention are as follows:
in the scheme of the invention:
1. cleaning the surface layer of the PCB and a plurality of through holes and blind holes on the PCB, removing dirt on the surface of the PCB and in the through holes and the blind holes, avoiding that deposited metal cannot be effectively attached to the hole wall before metal deposition is carried out on the PCB, so that the metal deposition cannot be completely deposited or the deposited adhesion force is insufficient, preventing the phenomena of plating omission and plating removal, uneven plating in holes and the like during subsequent plating, guaranteeing the communication of conductive layers between copper layers or any layers on the two sides of the PCB, and realizing signal transmission;
electroplating the through holes and the blind holes of the PCB after metal deposition, so that electroplated metal copper forms electroplating layers with uniform thickness in the through holes and the blind holes, and the stability of the conducting layers in the holes is realized;
3. through removing oxides and dirt in the through holes and the blind holes, cleaning the through holes and the blind holes before copper plating, providing clean bonding surfaces for metal deposition, and improving the bonding strength of metal in the through holes and the blind holes;
4. removing burrs at the edges of the through holes and the blind holes, avoiding metal from being combined on the surfaces of the burrs during metal deposition, causing metal waste and improving production cost;
5. and removing drilling dirt on the walls of the through holes and the blind holes caused by drilling by adopting a plasma or chemical mode, creating clean and tidy walls for the deposition of metal conducting layers in the subsequent process, improving the binding force, and improving the binding force between metal and the walls of the through holes and the blind holes.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic view of the main structure of the polishing apparatus according to the present invention;
FIG. 3 is a schematic view of the installation position of the toothed ring of the present invention;
FIG. 4 is a schematic view of a second ring gear mounting location according to the present invention;
FIG. 5 is a schematic view of the mounting position of the propeller blade of the present invention;
FIG. 6 is a schematic view of a discharge member according to the present invention;
fig. 7 is a schematic view of the sealing disk mounting location of the present invention.
Wherein: grinding piece 1, fixture 2, grinding pipe 3, power shell 4, positioning tube 5, ring gear 6, intubate 7, second ring gear 8, inserted bar 9, pipe 10, discharge piece 11, discharge shell 12, screw blade 13, spiral grinding strip 14, suction hole 15, discharge tube 16, weighing column 17, rack 18, skewed tooth post 19, sealing disk 20.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Example 1: referring to fig. 1, a horizontal electroplating process for a double-sided and multi-layer board of a PCB includes the steps of:
a. pretreatment: cleaning the upper and lower plate surfaces of the PCB and a plurality of through holes and blind holes on the PCB;
b. metal deposition: copper deposition is carried out on a plurality of through holes and blind holes on the PCB;
c. copper plating: electroplating the through holes and the blind holes after copper deposition;
d. post-treatment: and cleaning the PCB.
The working principle and the beneficial effects of the technical scheme are as follows:
the prepared PCB is preprocessed, the upper and lower surfaces of the PCB and a plurality of through holes and blind holes on the PCB are cleaned, dirt on the surface of the PCB and in the through holes and the blind holes can be removed, the phenomenon that the deposited metal is attached to the dirt before the metal deposition of the PCB, so that the metal deposition cannot be completely deposited or the deposited adhesive force is insufficient, plating leakage and plating stripping occur during subsequent electroplating, uneven plating in holes and the like cannot be realized, the communication of conductive layers between copper layers or any layers on the two sides of the PCB cannot be realized, and finally, signal transmission and functional loss cannot be realized is avoided; the through holes and the blind holes of the PCB board are electroplated after metal deposition, so that electroplated metal copper forms electroplated layers with uniform thickness in the through holes and the blind holes, and the stability of the conducting layers in the holes is realized.
The specific method for cleaning the upper and lower plate surfaces of the PCB and the plurality of through holes and blind holes on the PCB comprises the following steps:
adopting a grinding plate to treat the surface of the PCB and the edges of the through holes and the blind holes on the PCB so as to remove dirt and oxides on the surface of the PCB; removing Kong Bianpi peaks of the through holes and the blind holes;
and cleaning the PCB.
Step b further comprises: and removing the glue from the PCB.
The specific method for cleaning the PCB comprises the following steps:
and removing dirt in the through holes and the blind holes on the PCB by water washing or chemical washing.
The specific method for removing the adhesive from the PCB comprises the following steps:
and removing drilling dirt on the walls of the through holes and the blind holes caused by the drilling in a plasma or chemical mode.
The working principle and the beneficial effects of the technical scheme are as follows:
when drilling the through holes and the blind holes of the PCB, the high-speed rotating drill bit generates heat due to friction with the PCB, so that epoxy resin in the PCB is hot melted, and is condensed on the side walls of the through holes and the blind holes after cooling, so that the solidified epoxy resin is difficult to clean, the plasma or chemical mode is used for cleaning the solidified epoxy resin, the clean hole wall is obtained, a clean bonding surface is provided for metal deposition, and the bonding strength of metal in the through holes and the blind holes is improved; the burrs on the hole edges of the through holes and the blind holes are removed, so that metal is prevented from being combined on the surfaces of the burrs during metal deposition, the waste of the metal is avoided, and the production cost is increased.
The specific method for carrying out copper deposition on the plurality of through holes and blind holes on the PCB board comprises the following steps:
and depositing a metal copper conducting layer on the inner layer of the wall of the through hole and the blind hole by adopting a chemical deposition method.
The working principle and the beneficial effects of the technical scheme are as follows:
and a conducting layer is deposited on the inner layers of the walls of the through holes and the blind holes by adopting a chemical deposition method, so that the interconnection between the two sides of the PCB or multiple layers in the PCB can be realized, the through holes and the blind holes are metallized, and a platable bottom layer is realized for the subsequent copper plating.
The specific method for electroplating the through hole and the blind hole after copper deposition comprises the following steps:
placing the PCB in a copper ion electrolyte, taking the PCB as a cathode, placing an infusible anode in the copper ion electrolyte, respectively connecting the cathode and the infusible anode with a pulse rectifier, electrifying the copper ion electrolyte, reducing copper ions into copper on a through hole, a blind hole and a metal copper conducting layer in the PCB, and ending electroplating after the plating layers of the reduced copper layer of the through hole, the blind hole and the metal copper conducting layer in the PCB are uniform.
Wherein, the thickness ratio of copper plating layers of the metal copper conducting surface copper to the copper plating layers of the through hole and the blind hole wall reaches 1:1.
the working principle and the beneficial effects of the technical scheme are as follows:
the electrochemical mode is adopted to thicken copper layers of the through holes, the blind holes and the surface layer conducting layers of the PCB, the PCB is used as a cathode, an infusible anode is arranged in copper ion electrolyte, copper ions on the surface of the conducting layers are reduced to copper during electroplating, a pulse rectifier is adopted as the cathode and the infusible anode, the plating uniformity of the copper layers is realized, the firm combination of the through holes and the blind holes is realized, and the copper plating layer thickness ratio of the copper on the PCB surface to the copper in the through holes and the blind holes is up to 1:1, the purpose of copper programming is realized, and the cost saving is realized.
The specific method for cleaning the PCB comprises the following steps: and cleaning the surface, the through holes and the blind holes of the PCB, removing the residual chemical components on the surface and preventing the copper layer from being oxidized.
The working principle and the beneficial effects of the technical scheme are as follows:
the surface of the PCB and the through holes and blind holes on the PCB are cleaned, chemical components remained on the surface are removed, the copper layer is prevented from being oxidized before being used, and the yield in the production process is improved;
and cleaning the PCB, recovering the cleaned PCB, and preparing for using the PCB.
Example 2: referring to fig. 2 to 7, the grinding plate includes a grinding member 1, and the grinding member 1 includes: grind pipe 3, power shell 4, ring gear 6, unload shell 12 and spiral grinding strip 14, grind pipe 3 one end and unload shell 12 rotation and be connected, grind pipe 3 and penetrate the other end that power shell 4 and install ring gear 6, ring gear 6 passes through the gear and is connected with the motor meshing in the power shell 4, grind the equidistance on pipe 3 and be equipped with a plurality of spiral grinding strips 14, every spiral grinding strip 14 and PCB board upper surface friction fit, the PCB board is installed on fixture tooling 2, fixture tooling 2 sets up between power shell 4 and unload shell 12.
The working principle and the beneficial effects of the technical scheme are as follows:
the motor rotates to drive the toothed ring 6 that is connected with it in a meshed manner and rotates, toothed ring 6 drives grinding pipe 3 to rotate, a plurality of spiral grinding strips 14 on grinding pipe 3 polish the surface of the PCB on fixture 2, through setting up spiral grinding strips 14, can evenly polish the surface of the PCB, can guide the powder that polishes out between two spiral grinding strips 14 and the lateral wall of grinding pipe 3 simultaneously, has improved the collection effect of polishing the powder, prevents the scattering of powder, has improved job site's cleanliness factor, has reduced the clearance degree of difficulty of device.
The grinding member 1 further comprises: the insert pipe 7 is rotatably arranged on a sealing disk 20 on the inner wall of the grinding pipe 3, a circular mounting groove is formed on one side of the sealing disk 20 and the inner wall of the end part of the grinding pipe 3, a second toothed ring 8 is arranged on the side wall of the circular mounting groove of the insert pipe 7, the second toothed ring 8 is meshed with one side of a planetary gear, the planetary gear is rotatably arranged in a positioning pipe 5 on the inner wall of the power shell 4, the other side of the planetary gear is meshed with the toothed ring on the inner wall of the circular mounting groove of the grinding pipe 3, a spiral groove is formed on the opposite surface of each two spiral grinding strips 14 and the side wall of the grinding pipe 3, a plurality of suction holes 15 are formed in the bottom wall of the spiral groove at equal intervals, the side wall of the insert pipe 7 is connected with one end of a propeller 13, the other end of the propeller 13 is connected with the side wall of the end part of an insert rod 9, the end part of the insert rod 9 is connected with a discharging piece 11, the insert rod 9 is slidably arranged in the insert pipe 7, and the other end of the insert rod 9 penetrates out of the end wall of the positioning pipe 5.
The working principle and the beneficial effects of the technical scheme are as follows:
after the grinding pipe 3 rotates, the second toothed ring 8 on the side wall of the end part of the insertion pipe 7 in the grinding pipe 3 is meshed and connected with the toothed ring on the inner wall of the grinding pipe 3 through planetary teeth which are rotationally connected in the positioning pipe 5, the grinding pipe 3 positively rotates to drive the planetary teeth to positively rotate, the planetary teeth positively rotate to drive the second toothed ring 8 to reversely rotate, the insertion pipe 7 reversely rotates with the grinding pipe 3 through the sealing disc 20, and the sealing disc 20 is arranged to prevent grinding powder from entering the positioning pipe 5, so that the occurrence of faults caused by powder accumulation of the device is avoided, and meanwhile, the sealing disc 20 is rotationally connected with the insertion pipe 7, so that the rotation stability of the insertion pipe 7 in the grinding pipe 3 is improved;
the side wall of the insertion pipe 7 is connected with one end of a propeller blade 13, the other end of the propeller blade 13 is connected with the side wall of the end part of the insertion rod 9, the insertion rod 9 is slidably connected in the insertion pipe 7, the propeller blade 13 rotates in the grinding pipe 3, the air pressure at the suction hole 15 is reduced, the grinding powder collected through the spiral groove is sucked into the grinding pipe 3, the arrangement of the structure in the device is reduced, and the production cost is reduced;
meanwhile, the side wall of the propeller blade 13 and the inner wall of the grinding pipe 3 slide relatively, so that powder sucked into the device can be conveyed, powder accumulation in the device is prevented, the suction effect is reduced, and powder scattering is further prevented;
by arranging the relative rotation of the propeller blades 13 and the grinding pipe 3, the speed of the relative movement of the device in the device is improved, the negative pressure generated in the device is also improved, and the suction efficiency is improved on the basis of no addition of parts.
The discharge member 11 includes: the automatic grinding machine comprises a guide pipe 10, a discharge pipe 16, a weighing column 17, a helical rack 18 and a helical tooth column 19, wherein one end of the guide pipe 10 arranged on the side wall of the discharge shell 12 is rotatably connected with the end part of the grinding pipe 3, the side wall of the guide pipe 10 is connected with the top end of the discharge pipe 16, the weighing column 17 is slidably connected in the discharge pipe 16, the bottom end of the weighing column 17 is connected with the inner bottom wall of the discharge shell 12 through a spring, an inclined plane at the top end of the weighing column 17 is arranged towards the discharge opening of the side wall of the discharge pipe 16, the discharge opening is connected with one end of the conveying pipe, the other end of the conveying pipe is connected with a second discharge opening of the side wall of the discharge shell 12, the second discharge opening is arranged below the discharge opening, the side wall of the weighing column 17 is connected with the helical rack 18 through a connecting rod, the bottom end of the helical rack 18 is slidably connected in the discharge shell 12, the helical rack 18 is in meshed connection with the helical tooth column 19, the helical tooth column 19 is connected with one end of a guide column slidably connected in the guide pipe 10, and the other end of the guide column is rotatably connected with the end of the inserted rod 9.
The working principle and the beneficial effects of the technical scheme are as follows:
after the motor is started, the propeller blades 13 rotate in the grinding tube 3, the grinding tube 3 sucks powder on the surface of the PCB into the grinding tube 3 through the suction holes 15, the powder is conveyed into the guide tube 10 through the propeller blades 13, the powder in the guide tube 10 falls on the inclined plane at the top end of the weighing column 17, the powder is discharged into the recovery device through the discharge opening, the conveying tube and the second discharge opening through the guidance of the inclined plane, and the powder is prevented from scattering; when the grinding pipe 3 works for a long time, the suction hole 15 on the grinding pipe 3 is partially blocked by powder, the weight of the powder on the inclined plane of the top end of the weighing column 17 is reduced, the weighing column 17 moves upwards under the action of the elasticity of the spring at the bottom end of the weighing column 17, the weighing column 17 drives the inclined rack 18 to move upwards through the connecting rod, the inclined tooth column 19 meshed with the inclined rack 18 drives the guide column to move into the guide pipe 10, the guide column extrudes the inserted rod 9, one end of the screw 13 connected with the inserted rod 9 moves synchronously, the other end of the screw 13 is fixed on the side wall of the insertion pipe 7, the inner wall of the screw 13 is in sliding fit with the side wall of the insertion pipe 7, the screw 13 is compressed, the screw pitch of the screw 13 in the grinding pipe 3 is reduced, after the screw pitch of the screw 13 in the grinding pipe 3 is reduced, the negative pressure of the mechanism for sucking the powder is increased, the powder is efficiently removed from the suction hole 15, and the suction effect of the mechanism is prevented from being reduced due to the blocking; meanwhile, the structure is simplified by the linkage of the parts, and the production cost of the device is reduced; by arranging the inclined plane facing the discharge opening at the top end of the weighing column 17, the powder can be guided, and the suction force of the device can be accurately adjusted according to the suction effect;
the bottom end of the weighing column 17 is connected with the inclined rack 18 through a connecting rod, so that the space in the device is fully utilized; meanwhile, the motion precision is improved, the noise during the motion of the device is reduced through the meshing transmission of the helical rack 18 and the helical tooth column 19, the helical tooth column 19 is connected with one end of the guide column, the other end of the guide column is rotationally connected with the end part of the inserted link 9, and the mechanism converts rotation into linear motion of the inserted link 9, so that the arrangement of parts is further reduced.
Although embodiments of the present invention have been disclosed above, it is not limited to the details and embodiments shown and described, it is well suited to various fields of use for which the invention would be readily apparent to those skilled in the art, and accordingly, the invention is not limited to the specific details and illustrations shown and described herein, without departing from the general concepts defined in the claims and their equivalents.
Claims (10)
1. A horizontal electroplating process for double-sided and multi-layer boards of a PCB is characterized by comprising the following steps:
a. pretreatment: cleaning the upper and lower plate surfaces of the PCB and a plurality of through holes and blind holes on the PCB;
b. metal deposition: copper deposition is carried out on a plurality of through holes and blind holes on the PCB;
c. copper plating: electroplating the through holes and the blind holes after copper deposition;
d. post-treatment: and cleaning the PCB.
2. The horizontal electroplating process for the double-sided and multi-layer boards of the PCB according to claim 1, wherein the specific method for cleaning the upper and lower boards of the PCB and the plurality of through holes and blind holes on the PCB is as follows:
adopting a grinding plate to treat the surface of the PCB and the edges of the through holes and the blind holes on the PCB so as to remove dirt and oxides on the surface of the PCB; removing Kong Bianpi peaks of the through holes and the blind holes;
and cleaning the PCB.
3. The horizontal plating process for a double-sided and multi-layer board of a PCB according to claim 2, wherein the step b further comprises: and removing the glue from the PCB.
4. The horizontal electroplating process for the double-sided and multi-layer boards of the PCB according to claim 2, wherein the specific method for cleaning the PCB is as follows:
and removing dirt in the through holes and the blind holes on the PCB by water washing or chemical washing.
5. The horizontal electroplating process for the double-sided and multi-layer boards of the PCB according to claim 3, wherein the specific method for removing the adhesive from the PCB is as follows:
and removing drilling dirt on the walls of the through holes and the blind holes caused by the drilling in a plasma or chemical mode.
6. The horizontal electroplating process of the double-sided and multi-layer PCB of claim 1, wherein the specific method for copper deposition of the plurality of through holes and blind holes on the PCB is as follows:
and depositing a metal copper conducting layer on the inner layer of the wall of the through hole and the blind hole by adopting a chemical deposition method.
7. The horizontal electroplating process for the double-sided and multi-layer boards of the PCB according to claim 1, wherein the specific method for electroplating the through holes and the blind holes after copper deposition is as follows:
placing the PCB in a copper ion electrolyte, taking the PCB as a cathode, placing an infusible anode in the copper ion electrolyte, respectively connecting the cathode and the infusible anode with a pulse rectifier, electrifying the copper ion electrolyte, reducing copper ions into copper on a through hole, a blind hole and a metal copper conducting layer in the PCB, and ending electroplating after the plating layers of the reduced copper layer of the through hole, the blind hole and the metal copper conducting layer in the PCB are uniform.
8. The horizontal electroplating process for the double-sided and multi-layer boards of the PCB according to claim 7, wherein the ratio of the copper plating layer thickness of the metal copper conducting surface copper to the copper plating layer thickness of the through hole and the blind hole wall is up to 1:1.
9. the horizontal electroplating process for double-sided and multi-layer boards of the PCB according to claim 1, wherein the specific method for cleaning the PCB is as follows: and cleaning the surface of the PCB and the through holes and blind holes on the PCB, removing chemical components remained on the surface, and preventing the copper layer from being oxidized.
10. The horizontal electroplating process for double-sided and multi-layer boards of a PCB according to claim 1, wherein the polishing plate comprises a polishing member (1), the polishing member (1) comprising: grind pipe (3), grind pipe (3) one end and discharge shell (12) rotate and be connected, grind the other end that pipe (3) penetrated to power shell (4) and install ring gear (6), ring gear (6) are connected through the motor meshing in gear and power shell (4), equidistance is equipped with a plurality of spiral grinding strips (14) on grinding pipe (3), spiral grinding strip (14) and PCB board upper surface friction fit, the PCB board is installed on fixture (2), fixture (2) set up between power shell (4) and discharge shell (12).
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006057114A (en) * | 2004-08-17 | 2006-03-02 | Stonewell Internatl Corp | Method of combining surface coating and electroplating for hub |
| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| CN104244613A (en) * | 2014-09-11 | 2014-12-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing plated-through holes in HDI plate |
| CN106149018A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of process for pcb board electro-coppering |
| CN106413287A (en) * | 2016-05-27 | 2017-02-15 | 胜宏科技（惠州）股份有限公司 | HDI through and blind hole electroplating method |
| CN112333933A (en) * | 2020-11-03 | 2021-02-05 | 生益电子股份有限公司 | Manufacturing method of mixed pressing plate and mixed pressing plate |
| CN213438688U (en) * | 2020-08-05 | 2021-06-15 | 临安天宇电子有限公司 | Waste collecting device of polishing equipment of circuit board |
-
2023
- 2023-11-15 CN CN202311515673.6A patent/CN117241478B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006057114A (en) * | 2004-08-17 | 2006-03-02 | Stonewell Internatl Corp | Method of combining surface coating and electroplating for hub |
| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| CN104244613A (en) * | 2014-09-11 | 2014-12-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing plated-through holes in HDI plate |
| CN106413287A (en) * | 2016-05-27 | 2017-02-15 | 胜宏科技（惠州）股份有限公司 | HDI through and blind hole electroplating method |
| CN106149018A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of process for pcb board electro-coppering |
| CN213438688U (en) * | 2020-08-05 | 2021-06-15 | 临安天宇电子有限公司 | Waste collecting device of polishing equipment of circuit board |
| CN112333933A (en) * | 2020-11-03 | 2021-02-05 | 生益电子股份有限公司 | Manufacturing method of mixed pressing plate and mixed pressing plate |
Non-Patent Citations (2)
| Title |
|---|
| 夏国伟;王忱;李加余;黄慧;童福生;: "谈铝基双面、多层印制板工艺技术", 印制电路信息, no. 10 * |
| 夏国伟;王忱;李加余;黄慧;童福生;: "谈铝基双面、多层印制板工艺技术", 印制电路信息, no. 10, 10 October 2016 (2016-10-10) * |
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